JPH0575182B2 - - Google Patents

Abstract

PURPOSE:To increase device and wire integration density by a method wherein cooling tubes for LSI chips are separated into some systems electrically independent from each other and every one of the systems carries a different voltage for the supply of a plurality of voltages to a wired substrate. CONSTITUTION:In a package of this design, a cooling system is provided for the removal of heat from LSI chips 20 installed on a ceramic wired substrate 10. Located in the vicinity of cooling tubes 30, 33, and 34, wherein a coolant 31 circulates, the LSI chops 20 are kept at a low temperature. The copper-made cooling tubes 30, 33, and 34 are electrically independent from each other, and serve as power source wires. The power source voltages are applied to the ceramic wired substrate 10 through the intermediary of a copper foil 32. This design does not demand a power source wiring region in the wired substrate 10, allowing for an enhanced integration density.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a multi-chip package, and in particular to an LSI package suitable for use in electronic devices that require high-speed signal processing such as large-sized computers and high-frequency communication devices. Regarding multi-chip packages such as

[Conventional technology]

Conventionally, this type of multi-chip package has been designed to increase the processing capacity of LSI chips in order to achieve high-speed processing performance of equipment, and to increase the packaging density of LSI chips to shorten the interconnection distance between LSI chips. As a result, efforts have been made to increase the density of wiring.

On the other hand, in order to speed up the processing performance of LSI chips, especially LSIs for logic processing, ECL was added to the logic circuit format.
(Emitsuta Katsupurud Rojitsuk) Or,
CML (current mode logic) is widely used. These ECL or CML circuit formats require two or more types of voltage for the power supply, so at least three types of power supply wiring, including a ground wiring, are formed on the LSI mounting wiring board, and these wiring was connected to the external power supply wiring.

[Problem that the invention seeks to solve]

The conventional multi-chip package mentioned above is an LSI
The voltage required for these is as low as 5V or less, and the packaging density is also increasing, so these power supply wiring and grounding wiring, as well as the external connection terminals connected to these wiring, must be able to handle extremely large currents. However, the proportion of these wires and terminals on the wiring board increases, which has the disadvantage of not only compressing the signal wiring area but also compressing the area for arranging external connection terminals of the signal wiring. Furthermore, since these chips with high power consumption are mounted in a high density, it is common to use a liquid cooling method for cooling, and a heat conduction path is required to transfer the low temperature from the coolant to the chips. A second drawback was that the heat conduction path compressed the area where external connection terminals for power supply wiring and signal wiring were arranged.

[Means for solving problems]

The multi-chip package of the present invention divides the cooling pipe line for transmitting low temperature to the LSI chip mounted on the wiring board into a plurality of electrically independent systems, and each system serves as a power supply wiring with a different voltage. It is characterized by supplying power with a voltage value into the wiring board.

〔Example〕

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a first embodiment of the invention. 1st
In the figure, the first embodiment of the present invention has a cooling conduit for transmitting low temperature to an LSI chip 20 etc. mounted on a ceramic wiring board 10. Ceramic wiring board 10 is provided with signal wiring input/output pins 11, electrodes 12, and power supply electrodes 13.
The LSI chip 20 mounted on the ceramic wiring board 10 has its leads 21 glued to the electrodes 12. In addition, the LSI chip 20 has coolant pipes 30 and 3 through which coolant 31 kept at a low temperature circulates.
3 and 34, the temperature is always kept low. and coolant pipes 30,3
3 and 34 are made of copper with good heat conduction efficiency, and each is an electrically independent system, and the coolant pipes 30, 33, and 34 are connected to ground potential, -
It also serves as the power supply wiring corresponding to the 3.3 volt power supply potential and -0.3 volt reference potential. Since the coolant piping is made of copper, which is a good conductor of electricity, it is used as the power supply wiring. A copper foil 3 is placed between each coolant pipe 30, 33, 34 and the power supply electrode 13 on the ceramic wiring board 10.
2 is soldered to the ceramic wiring board 10, and each power supply potential is transmitted to the ceramic wiring board 10 via this copper foil.

FIG. 2 shows a second embodiment of the invention. Second
In the figure, a printed wiring board 40 of the second embodiment
Four types of power supply voltages are supplied through coolant pipes 60, 62, 63, and 64 via an LSI chip carrier 50 mounted thereon. The coolant pipes 60, 63, 64, and 65 are made of copper, and the low temperature of these pipes is maintained by a stud 57 made of copper and iron, which has one end glued to the LSI chip 55 and the other end in contact with the coolant pipe. It is transmitted to the LSI chip via.

Leads 56 of the LSI chip 55 are attached to electrodes 51 provided on the chip carrier 50, and these electrodes are further connected to wiring within the printed wiring board 40 via signal wiring through holes 53.

The coolant pipes 60, 62, 63, and 64 each serve as power wiring for ground potential, -3.3 volt power supply potential, -0.3 volt reference potential, and -2 volt resistance terminal potential, and are supplied from these wirings. The voltage is transmitted to the electrode 58 provided on the chip carrier 50 via the chip carrier case 57 made of copper, and further transmitted to the printed wiring board 40 via the power supply through hole 53 provided in the chip carrier 50. It will be done. Electrical connection between the chip carrier 50 and the printed wiring board 40 is achieved by soldering bumps 59 provided on the chip carrier and electrodes 41 provided on the printed wiring board 40. Therefore, the power supply voltages once supplied to the printed wiring board via the chip carriers are again distributed to the respective chip carriers via these bumps.

〔Effect of the invention〕

As explained above, the present invention allows the coolant piping of an LSI chip to play the role of power supply wiring, thereby eliminating the area in the wiring board where power supply wiring should normally be installed. By allocating the area required for supply to LSI chip mounting, signal wiring, and other wiring areas, the packaging density can be increased.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view showing a first embodiment of the invention, and FIG. 2 is a longitudinal sectional view showing a second embodiment of the invention. 10... Ceramic wiring board, 11... Input/output pin, 12, 13, 41, 51, 58... Electrode, 2
0,55...LSI chip, 21,56...LSI lead, 30,33,34,60,62,63,6
4...Cooling liquid piping, 31, 61...Cooling liquid, 32
...Copper foil, 40...Printed wiring board, 50...Chip carrier, 52, 53...Through hole wiring, 54...Chip carrier case, 57...Heat conductive stud, 59...Bump.

Claims (1)

[Claims] 1. A wiring board, multiple LSI chip carriers or LSI chips mounted on this wiring board,
In order to suppress the temperature rise due to heat generated by these LSI chips, individual LSI chip carriers or LSI
In a multi-chip package having coolant piping arranged in contact with or close to the chip,
These coolant piping systems are divided into a plurality of independent piping systems, each of which is made of a conductive material, and each of the coolant piping systems is connected to a plurality of wiring boards on a wiring board to serve as a power supply wiring system for different voltages. A multi-chip package characterized by supplying a power supply voltage of .