JPH0575707B2 - - Google Patents
Info
- Publication number
- JPH0575707B2 JPH0575707B2 JP61005676A JP567686A JPH0575707B2 JP H0575707 B2 JPH0575707 B2 JP H0575707B2 JP 61005676 A JP61005676 A JP 61005676A JP 567686 A JP567686 A JP 567686A JP H0575707 B2 JPH0575707 B2 JP H0575707B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- transparent
- bonding
- laser light
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、一般に透明体を他の基材に対し高精
度で強固に接合する技術に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention generally relates to a technique for strongly bonding a transparent body to another base material with high precision.
［従来の技術］
一般に、無機材料あるいは有機材料の透明体を
接合する場合、樹脂系の接着材を用いて加熱硬化
させるかあるいは紫外線硬化樹脂を用い紫外光を
照射することにより接着硬化させる方法が簡便な
方法として用いられている。[Prior Art] Generally, when bonding transparent bodies made of inorganic or organic materials, there are methods of curing the adhesive by heating using a resin adhesive or by irradiating ultraviolet light using an ultraviolet curable resin. It is used as a simple method.
［発明が解決しようとする問題点］
上記従来の方法では、使用している間に接着材
層の熱膨張係数が接合物より大きいので環境温度
サイクルの影響を受けて接合物同志が位置ずれし
たり、あるいは使用限界温度に大きな制約がある
（例えば、樹脂系接着剤の場合、通常百数十℃）
といつた問題がある。また接着部の輪郭形状を精
密に制御できない欠点がある。[Problems to be Solved by the Invention] In the above-mentioned conventional method, since the coefficient of thermal expansion of the adhesive layer is larger than that of the bonded objects during use, the bonded objects may shift in position due to the influence of environmental temperature cycles. or there are major restrictions on the operating temperature limit (for example, in the case of resin adhesives, it is usually over 100 degrees Celsius)
There is a problem. Another drawback is that the contour shape of the bonded portion cannot be precisely controlled.
また紫外線硬化型の樹脂接着材でも硬化中に収
縮を生じ、精密な位置合せを必要とする用途に使
用し得ないという問題があつた。 Furthermore, even UV-curable resin adhesives shrink during curing, making them unsuitable for applications requiring precise alignment.
［問題点を解決するための手段］
透明体を他の基材に接合するに当り、透明体の
接合面要所に予め高周波スパツタリング、真空蒸
着等の方法により金属等のレーザ光吸収薄膜を設
け、この薄膜に接合基板面を密着させた後、透明
体を通して上記薄膜にYAGレーザ等の高パワー
のレーザ光ビームを照射する。[Means for solving the problem] When joining a transparent body to another base material, a laser light absorbing thin film of metal or the like is provided in advance at key points on the joining surface of the transparent body by a method such as high frequency sputtering or vacuum deposition. After the surface of the bonded substrate is brought into close contact with this thin film, the thin film is irradiated with a high power laser beam such as a YAG laser through the transparent body.
［作用］
上記レーザ光の照射で接合面に予め設けられた
レーザ光の吸収体膜が急速に加熱されて溶融状態
となり、その後固化することにより両接合物を接
着することになる。[Function] By the laser beam irradiation, the laser beam absorber film provided in advance on the bonding surface is rapidly heated to a molten state, and then solidified, thereby bonding the two bonded objects together.
［実施例］
以下本発明を図面に示した実施例に基づいて詳
細に説明する。[Example] The present invention will be described in detail below based on an example shown in the drawings.
第１図、第２図において１は透明体、一例とし
て光導波路２が形成されたガラス、LiNbO3、
LiTaO3等からなる導波路基板であり、この透明
基板１を金属製ケーシングモジユール３の平坦な
表面３Ａに固着するに当り以下のようにする。ま
ず透明基板１の接合面１Ａの要所、例えば両側縁
付近に帯状にレーザ光吸収薄膜５を予め付着形成
する。この薄膜５は使用するレーザ光の波長域で
充分な吸収係数をもつ材料から成り、且つ膜厚は
充分に薄いことが望ましい。一般には高周波スパ
ツタリングあるいは真空蒸着で付着形成した厚み
数千オングストロームないし数十マイクロメート
ルの金属膜が好適であり、特にガラス部材同志あ
るいはガラスと金属材との接合には薄膜５の材質
としてSUS304ステンレス鋼が好適である。 In FIGS. 1 and 2, 1 is a transparent body, for example, glass on which an optical waveguide 2 is formed, LiNbO 3 ,
The transparent substrate 1 is a waveguide substrate made of LiTaO 3 or the like, and the following steps are taken to fix the transparent substrate 1 to the flat surface 3A of the metal casing module 3. First, a strip-shaped laser light absorbing thin film 5 is deposited in advance at important points on the bonding surface 1A of the transparent substrate 1, for example near both side edges. It is desirable that this thin film 5 be made of a material that has a sufficient absorption coefficient in the wavelength range of the laser beam used, and that the film thickness is sufficiently thin. In general, a metal film with a thickness of several thousand angstroms to several tens of micrometers formed by high-frequency sputtering or vacuum evaporation is suitable. In particular, for joining glass members together or glass and metal materials, the material of the thin film 5 is SUS304 stainless steel. is suitable.
上記のようにして薄膜５を設けた透明基板１の
接合面１Ａをケーシングモジユールの接合面３Ａ
に密着させ、両者を挾持固定具等により仮固定す
る。次に、透明基板１の上方から高パワーのレー
ザ光ビーム６を、基板１を透過させて上記薄膜５
に照射する。一例としてNd−YAGパルスレーザ
により１〜10ジユール、１〜３ミリ秒のパルスを
接合面より若干上部に焦点を合せて照射する。こ
れによりレーザ照射箇所の薄膜５の部分が瞬時に
溶融固着して両接合部材１，３が強固に接着され
る。レーザ光ビーム６を薄膜５に照射する場合、
薄膜５の平面パターンが直線状であれば、パルス
発振あるいは連続発振のYAGレーザのビーム６
を上記薄膜５に沿つて矢符７の方向に走査させる
ことができる。まだ間隔をおいた適宜数の箇所で
薄膜５にレーザ光ビーム６を照射してもよい。第
３図、第４図に本発明の他の実施例を示す。本例
は、液晶、EL、ECDなどのデイスプレイ素子の
基板ガラス１０とネサガラス１１とを全周にわた
り気密に接合する場合に本発明を適用したもので
あり、両ガラス板１０，１１の各接合面に額縁帯
状に例えばステンレスを蒸着して薄膜５Ａ，５Ｂ
を設け、上記両薄膜５Ａ，５Ｂを重ねて両ガラス
板１０，１１を合せ、ネサガラス１１の上面から
接合面に焦点を合せて連続発振またはパルス発振
のYAGレーザビーム６を照射しつつ薄膜５Ａ，
５Ｂの全周に沿つてビーム６を走査７する。本発
明方法は透明無機材料の接合のみならず、レーザ
照射条件および薄膜材質を適当に選択することに
よつて透明有機材料の接合にも用いることができ
る。 The bonding surface 1A of the transparent substrate 1 provided with the thin film 5 as described above is connected to the bonding surface 3A of the casing module.
and temporarily fix the two using clamping fixtures, etc. Next, a high power laser beam 6 is transmitted through the substrate 1 from above the transparent substrate 1 to form the thin film 5.
irradiate. As an example, a Nd-YAG pulse laser is used to irradiate a pulse of 1 to 10 Joules and a duration of 1 to 3 milliseconds with a focus slightly above the bonding surface. As a result, the portion of the thin film 5 at the laser irradiation location is instantly melted and fixed, and both the bonding members 1 and 3 are firmly bonded. When irradiating the thin film 5 with the laser beam 6,
If the planar pattern of the thin film 5 is linear, the pulsed or continuous wave YAG laser beam 6
can be scanned along the thin film 5 in the direction of the arrow 7. The thin film 5 may be irradiated with the laser light beam 6 at an appropriate number of locations spaced apart. FIGS. 3 and 4 show other embodiments of the present invention. In this example, the present invention is applied to the case where the substrate glass 10 of a display element such as a liquid crystal, EL, ECD, etc. and the Nesa glass 11 are airtightly bonded over the entire circumference. For example, stainless steel is vapor-deposited in the frame strip shape to form thin films 5A and 5B.
The thin films 5A, 5B are stacked, the glass plates 10, 11 are combined, and the thin films 5A,
The beam 6 is scanned 7 along the entire circumference of 5B. The method of the present invention can be used not only for bonding transparent inorganic materials, but also for bonding transparent organic materials by appropriately selecting laser irradiation conditions and thin film materials.
［発明の効果］
本発明によれば、透明な被接合物を正確に限定
された所望の箇所で接合することができ、且つ接
着時に接合面の位置ずれを生じることがなく精密
なアライメント接合が可能となるとともに、接着
部領域が極めて限定されている細密な部品でも不
側の箇所で接合されるといつた問題が生じない。
さらに、熱の拡散距離がレーザによるスポツト
（一般に0.2〜1.0mmφ）の数倍以下と小さく、熱
的に弱い部材が接合部近くにあつても何ら悪影響
を与えずに接合できるという利点がある。また、
接合面の周辺部分だけでなく、接合面の全面で接
着することもできる。[Effects of the Invention] According to the present invention, transparent objects to be joined can be joined at precisely limited desired locations, and precise alignment joining can be performed without causing positional shift of the joining surfaces during adhesion. This makes it possible to do this, and also eliminates the problems that would occur if the bonding area is extremely limited and the parts are joined at the wrong side.
Furthermore, the heat diffusion distance is several times smaller than that of a laser spot (generally 0.2 to 1.0 mmφ), and there is an advantage that even if a thermally weak member is located near the joint, it can be joined without any adverse effects. Also,
It is possible to bond not only the peripheral part of the joint surface but also the entire surface of the joint surface.
第１図は本発明の一実施例を示す斜視図、第２
図は同実施例で用いる透明体の接合面を示す斜視
図、第３図は本発明の他の実施例を示す平面図、
第４図は同側断面図である。
１，１０，１１……被接合透明体、５，５Ａ，
５Ｂ……レーザ光吸収薄膜、６……レーザ光ビー
ム、７……走査方向。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing the joint surface of the transparent body used in the same embodiment, and FIG. 3 is a plan view showing another embodiment of the present invention.
FIG. 4 is a sectional view of the same side. 1, 10, 11... Transparent body to be joined, 5, 5A,
5B... Laser light absorption thin film, 6... Laser light beam, 7... Scanning direction.
Claims (1)
セラミツクもしくは金属に接合する方法におい
て、該部品の接合面要所に予めスパツタリング法
によりレーザ光吸収薄膜を設け、この薄膜に基材
接合面を密接させた後、該部品の透明部分を通し
て前記薄膜にレーザ光を照射することを特徴とす
る透明体の接合方法。1 Transparent optical parts, other optical parts, glass,
In the method of bonding to ceramic or metal, a laser light-absorbing thin film is previously provided at key points on the bonding surface of the component by sputtering, and after the bonding surface of the base material is brought into close contact with this thin film, the thin film is bonded through the transparent portion of the component. A method for joining transparent bodies, characterized by irradiating laser light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP567686A JPS62162656A (en) | 1986-01-14 | 1986-01-14 | Joining of transparent body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP567686A JPS62162656A (en) | 1986-01-14 | 1986-01-14 | Joining of transparent body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62162656A JPS62162656A (en) | 1987-07-18 |
| JPH0575707B2 true JPH0575707B2 (en) | 1993-10-21 |
Family
ID=11617701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP567686A Granted JPS62162656A (en) | 1986-01-14 | 1986-01-14 | Joining of transparent body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62162656A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0262699B1 (en) * | 1986-08-18 | 1992-12-16 | Koninklijke Philips Electronics N.V. | Interconnecting a glass or ceramic element and a metal element |
| JP2005209413A (en) * | 2004-01-20 | 2005-08-04 | Sanyo Electric Co Ltd | Display panel manufacturing method and display panel |
| JP4522872B2 (en) * | 2005-01-27 | 2010-08-11 | シャープ株式会社 | Glass substrate repair method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60182191A (en) * | 1984-02-29 | 1985-09-17 | キヤノン株式会社 | Printed wiring board for laser soldering |
| NL8400939A (en) * | 1984-03-23 | 1985-10-16 | Drukker D & Zn Nv | METHOD FOR ATTACHING A DIAMOND PART ON METAL |
-
1986
- 1986-01-14 JP JP567686A patent/JPS62162656A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62162656A (en) | 1987-07-18 |
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