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JPH057572B2 - - Google Patents
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JPH057572B2 - - Google Patents

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Publication number
JPH057572B2
JPH057572B2 JP62139320A JP13932087A JPH057572B2 JP H057572 B2 JPH057572 B2 JP H057572B2 JP 62139320 A JP62139320 A JP 62139320A JP 13932087 A JP13932087 A JP 13932087A JP H057572 B2 JPH057572 B2 JP H057572B2
Authority
JP
Japan
Prior art keywords
spring
molded body
pressure
laser beam
spring pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62139320A
Other languages
Japanese (ja)
Other versions
JPS63303237A (en
Inventor
Naohisa Matsushita
Tadaaki Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62139320A priority Critical patent/JPS63303237A/en
Publication of JPS63303237A publication Critical patent/JPS63303237A/en
Publication of JPH057572B2 publication Critical patent/JPH057572B2/ja
Granted legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16FSPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • F16F15/06Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
    • F16F15/073Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs using only leaf springs

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Springs (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)

Description

【発明の詳細な説明】 〔概要〕 本発明は、磁気デイスクヘツド組立部材とされ
る金属薄板を成形したばね成形体、例えば片持梁
構成のスライダ支持をなす負荷ばね成形体、の圧
力調整方法に係り、レーザ光をばね長さ方向と直
交する方向に走査処理することによつて生ずる熱
応力による曲げ変形(塑性)を利用しこれをばね
圧力の調整に適用するものである。
[Detailed Description of the Invention] [Summary] The present invention provides a pressure adjustment method for a spring molded body formed from a thin metal plate used as a magnetic disk head assembly member, for example, a load spring molded body that supports a slider in a cantilever configuration. According to this method, bending deformation (plasticity) due to thermal stress generated by scanning a laser beam in a direction perpendicular to the length direction of the spring is utilized and applied to adjust the spring pressure.

〔産業上の利用分野〕[Industrial application field]

本発明は、例えば磁気デイスク用磁気ヘツドの
組立部材とされるスライダ支持のヘツド支持ばね
等のばね成形体に適用して有効なレーザ光による
ばね圧力調整方法に関す。
The present invention relates to a method of adjusting spring pressure using a laser beam, which is effective when applied to a spring molded body such as a head support spring for supporting a slider used as an assembly member of a magnetic head for a magnetic disk.

〔従来の技術〕 磁気ヘツドのばね圧力調整方法を第6図の斜視
図により説明する。
[Prior Art] A method of adjusting the spring pressure of a magnetic head will be explained with reference to the perspective view of FIG.

図において、金属薄板より成形されたヘツド支
持ばね25は、ばね板厚が0.3mm前後のステンレ
ス鋼ばねを打ち抜き成形されたもので、その自由
端26は磁気ヘツド27が装着され、また成形さ
れたヘツド支持ばね25の他端は螺子固定端28
である。
In the figure, the head support spring 25 formed from a thin metal plate is a stainless steel spring with a spring plate thickness of about 0.3 mm, which is punched and formed.A magnetic head 27 is attached to the free end 26 of the spring. The other end of the head support spring 25 is a screw fixed end 28
It is.

螺子固定端28はばね圧力調整治具32のブロ
ツク29に固着され、またばね圧力調整治具32
の磁気ヘツド27が当接するばね自由端は、ヘツ
ド支持ばね25の圧力検出用の歪ゲージ30が設
けられる。図中、31はばね圧力を支承する歪ゲ
ージ30の出力表示器である。即ち、ばね圧力治
具32のブロツク29にその一端が固定された片
持梁構成のヘツド支持ばね25は、ばねの自由端
側に装着された歪ゲージ30によつてその圧力が
検出される。
The screw fixed end 28 is fixed to the block 29 of the spring pressure adjustment jig 32, and the spring pressure adjustment jig 32
A strain gauge 30 for detecting the pressure of the head support spring 25 is provided at the free end of the spring that the magnetic head 27 comes into contact with. In the figure, 31 is an output indicator of a strain gauge 30 that supports spring pressure. That is, the pressure of the cantilever-shaped head support spring 25, one end of which is fixed to the block 29 of the spring pressure jig 32, is detected by the strain gauge 30 attached to the free end of the spring.

検出されるばね圧力は、素材ばねの加工条件や
板厚の変動、打ち抜き成形後における寸法上のバ
ラツキに起因して変動する。特に、素材ばねの板
厚が薄くかつばね弾性値が高いステンレス鋼ばね
等のばね成形体にあつては、成形後におけるばね
圧力の変動が大きく、このためヘツド組立の一段
階において、次の如きばね調整がされていた。
The detected spring pressure varies due to variations in processing conditions and plate thickness of the spring material, and dimensional variations after punching and forming. In particular, in the case of formed springs such as stainless steel springs, which have a thin material spring plate thickness and high spring elasticity, the spring pressure fluctuates greatly after forming. The spring had been adjusted.

ばね成形体のばね圧力が所定の値より大きい
時、ばねの螺子固定端28と自由端側のヘツド支
持端26間の適宜位置38において、図示矢印3
3の方向にそつて裏面側からばねを押し上げて強
制的に塑性変形せしめてヘツド支持端側の圧力を
減ずる。
When the spring pressure of the spring molded body is greater than a predetermined value, the arrow 3 shown in FIG.
The spring is pushed up from the back side in the direction 3 to forcibly deform it plastically, thereby reducing the pressure on the head support end side.

これとは反対にばね圧力が所定値より小さい時
は、図示矢印34に沿つてばねを強制形に押し下
げて、ばねを塑性変形させてヘツド支持端のばね
圧力を増加することが行われていた。
On the other hand, when the spring pressure is lower than a predetermined value, the spring is forced down along the arrow 34 shown in the figure to plastically deform the spring and increase the spring pressure at the head support end. .

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

かようなばね成形体25に対するばね圧力調整
方法は、多分に作業者の熟練あるいは勘に頼る部
分が多く、目的とするばね圧力調整の精度が不安
定である他、調整作業の工数が増大するという問
題がある。特に、近時、磁気ヘツドの浮上スライ
ダ負荷ばねとして使用されるばね素材は、ばね弾
性値が高く然も板厚さが極めて薄い素材を用いて
いるため、これを成形するヘツド支持ばね等にあ
つては、過酷な設計基準を満たすべき安定でかつ
信頼度の高い高精度のばね圧力調整方法が要請さ
れていた。
Such a method of adjusting the spring pressure for the spring molded body 25 relies largely on the operator's skill or intuition, and the accuracy of the desired spring pressure adjustment is unstable, and the number of man-hours for adjustment work increases. There is a problem. In particular, recently, spring materials used as floating slider load springs for magnetic heads have a high spring elasticity value but are extremely thin, so it is difficult to mold them into head support springs, etc. Therefore, there was a need for a stable, highly reliable, and highly accurate spring pressure adjustment method that met strict design standards.

〔問題点を解決するための手段〕[Means for solving problems]

第1図は本発明のばね圧力調整方法原理図であ
る。本発明によれば、 金属薄板ばねより成形されたばね成形体1の長
さ方向端部が固定端3とされ、またばね成形体1
の他端の自由端に歪ゲージ10を当接させたばね
圧力調整治具上に配置せしめたばね成形体1の前
記固定端3と自由端2間において、 ばね成形体1の表裏何れか面に長さ方向と直交
する方向にそつて照射する集束された適宜エネル
ギー密度のレーザ光4または4′を走査させて、
走査面側のばね表面を塑性変形させるようにした
ばね圧力の調整方法である。
FIG. 1 is a diagram showing the principle of the spring pressure adjusting method of the present invention. According to the present invention, the longitudinal end portion of the spring molded body 1 formed from a thin metal plate spring is the fixed end 3, and the spring molded body 1
Between the fixed end 3 and the free end 2 of the spring molded body 1, which is placed on a spring pressure adjustment jig with a strain gauge 10 in contact with the other free end, there is a long length on either the front or back side of the spring molded body 1. By scanning a focused laser beam 4 or 4' with an appropriate energy density and irradiating it in a direction perpendicular to the horizontal direction,
This is a spring pressure adjustment method that plastically deforms the spring surface on the scanning surface side.

〔作用〕[Effect]

ばね成形体の長さ方向と直交する方向にそつて
レーザ光を走査するばね圧力調整方法を第2図a
と同図b、及びレーザ光によるばねの塑性変形特
性を示す第3図aと同図bのばね成形体の基本的
ばね曲げ特性によつて説明する。
Figure 2a shows a spring pressure adjustment method in which a laser beam is scanned in a direction perpendicular to the length direction of the spring molded body.
This will be explained with reference to the basic spring bending characteristics of the spring molded body shown in FIG. 3A and FIG.

第2図aは、ばね成形体1に対し線状走査線に
従つて光径φのスポツト4を照射した場合であ
り、走査したばね成形体表面は急激に温度上昇
し、熱膨張が生ずるため、該照射時は上方に凸状
態に曲がる。
Figure 2a shows the case where a spot 4 with a light diameter φ is irradiated onto the spring molded body 1 according to a linear scanning line.The surface of the scanned spring molded body rapidly rises in temperature and thermal expansion occurs , during the irradiation, it bends upward in a convex state.

然し、a図状態のままで照射を止めればばね成
形体表面部は急速に冷却され、周辺よりの熱応力
によりa図とは逆方向の同b図のような塑性変形
を生ずる。同b図に示される角度はθは、レーザ
光の照射停止後のばね成形体の曲がり角度であ
る。
However, if the irradiation is stopped while the state shown in Figure A is maintained, the surface of the spring molded body will be rapidly cooled, and plastic deformation as shown in Figure B, which is in the opposite direction to Figure A, will occur due to thermal stress from the periphery. The angle θ shown in Figure b is the bending angle of the spring molded body after the laser beam irradiation is stopped.

第3図は第2図で説明したレーザ光の走査によ
るばねの塑性変形特性を、ばね圧力調整手段とし
て応用するため行つた総括的実験データである。
但し、計測に併用せるばね素材は、日本工業標準
規格で指定されるステンレス鋼(SUS−304)の
平板状ばねの板厚さ0.3mmの素材を用い、素材表
面を走査する板材の幅部寸法は長さ10mmである。
FIG. 3 shows comprehensive experimental data for applying the plastic deformation characteristics of the spring due to laser beam scanning explained in FIG. 2 as a spring pressure adjusting means.
However, the spring material used for measurement is a stainless steel (SUS-304) flat spring material with a thickness of 0.3 mm specified by the Japanese Industrial Standards, and the width dimension of the plate material that scans the material surface. is 10mm long.

同図aは、ばね成形体の幅方向寸法間を単走査
した時、微細な調整がされた単位面積mm2当たりの
光照射エネルギ密度(図の横軸、Joule/mm2単位)
に対するばねの曲がり角度θ(図の縦軸;degree
単位)の関係特性である。
Figure a shows the finely adjusted light irradiation energy density per unit area mm 2 (horizontal axis of the figure, Joule/mm 2 unit) when a single scan is performed between the widthwise dimensions of the spring molded body.
The bending angle θ of the spring with respect to (vertical axis in the figure; degree
unit) is a relational property.

第3図bは光スポツトの走査回数(図の横軸)
とばねの曲がり角度θ(図の縦軸、単位;
degree)の関係特性図である。
Figure 3b shows the number of times the light spot is scanned (horizontal axis of the figure)
and the bending angle θ of the spring (vertical axis in the figure, unit;
It is a relationship characteristic diagram of degree).

但しb図の各特性に併記する数値は、光照射エ
ネルギのパラメータであり、レーザ光4のスポツ
ト径φ(第2図a)が0.3と0.4mmの二種類、及び、
速度40P/sec.で連続的に照射する単パルスの時
間0.2ms中に含まれる光エネルギの熱換算仕事当
量値とされるジユール(Joule)の熱当量パラメ
ータJ/P(0.144,0.075と0.02の三種類)であ
る。
However, the numerical values written together with each characteristic in Figure b are the parameters of the light irradiation energy, and the spot diameter φ of the laser beam 4 (Figure 2 a) is 0.3 and 0.4 mm, and
Joule's heat equivalent parameter J/P (0.144, 0.075 and 0.02 three types).

〔実施例〕〔Example〕

以下、第1図の原理図ならびに本発明のレーザ
光照射装置実施例とする第4図の装置側面図と、
第5図に示されるばね圧力検出制御のフロートチ
ヤートに従つて本発明を詳細に説明する。
Hereinafter, the principle diagram in FIG. 1 and the side view of the device in FIG. 4 which is an embodiment of the laser beam irradiation device of the present invention,
The present invention will be explained in detail with reference to a float chart of spring pressure detection control shown in FIG.

第1図において、圧力調整治具32に装着され
たばね成形体1の長さ方向端部が固定端3、また
他方の自由端側がヘツド支持端2とされる片持梁
構成ばねは、原理図にあるように該ばね成形体1
を挟み上下両面側に一対の照射ユニツト7と8が
配置される。該照射ユニツト7と8は照射ユニツ
ト駆動部11により矢印21方向に走査(第4図
では、ばねの長さ方向の直交する図の前後方向に
走査)される。
In FIG. 1, the cantilever structure spring in which the longitudinal end of the spring molded body 1 attached to the pressure adjustment jig 32 is the fixed end 3, and the other free end is the head support end 2, is shown in the principle diagram. The spring molded body 1 as shown in
A pair of irradiation units 7 and 8 are arranged on both upper and lower sides with the irradiation unit in between. The irradiation units 7 and 8 are scanned in the direction of the arrow 21 by the irradiation unit drive section 11 (in FIG. 4, they are scanned in the front-rear direction in the drawing perpendicular to the longitudinal direction of the spring).

第4図のレーザ光照射装置は、レーザ光発振器
13と、発振レーザ光を表裏両面に配分するそれ
ぞれの反射器16(ハーフミラー16)と全反射
器17と、これら反射器16,17の光を開閉す
るシヤツタ機構部9,9′よりなる光制御部14
と、及び光制御部14から光ケーブル6を介して
接続された集束レンズ内蔵の照射ユニツト7,8
からなる。
The laser beam irradiation device shown in FIG. 4 includes a laser beam oscillator 13, a reflector 16 (half mirror 16) and a total reflector 17 that distribute the oscillated laser beam to both the front and back surfaces, and the light of these reflectors 16 and 17. A light control section 14 consisting of shutter mechanism sections 9 and 9' that open and close the
and irradiation units 7 and 8 with built-in focusing lenses connected from the light control unit 14 via the optical cable 6.
Consisting of

ハーフミラー16からのレーザ光は、シヤツタ
機構部9、光ケーブル6を経て照射ユニツト7よ
り導出された光スポツト4は、ばね成形体1の表
面側に集束される。
The laser beam from the half mirror 16 passes through the shutter mechanism 9 and the optical cable 6, and is led out from the irradiation unit 7. The light spot 4 is focused on the surface side of the spring molded body 1.

他方、全反射器17、シヤツタ機構部9′、光
ケーブル6を経て接続された照射ユニツト8より
導出された光スポツト4′は、ばね成形体1の裏
面側に集束される。
On the other hand, a light spot 4' led out from the irradiation unit 8 connected via the total reflector 17, the shutter mechanism 9', and the optical cable 6 is focused on the back side of the spring molded body 1.

然して、ばね成形体1の表面もしくは裏面へ照
射する光スポツト4または4′の切替えは、ばね
圧力センサの歪ゲージ10よりの検出圧力レベル
が、大きいか小さいかを判別するばね圧力検出制
御部12によつて行われるが、具体的にはシヤツ
タ9,9′の開閉駆動部18により行われる。
The switching of the light spot 4 or 4' irradiating the front or back surface of the spring molded body 1 is controlled by the spring pressure detection control unit 12 which determines whether the pressure level detected by the strain gauge 10 of the spring pressure sensor is large or small. Specifically, it is performed by the opening/closing drive section 18 of the shutters 9, 9'.

開閉駆動部18によるシヤツタ開閉は、例えば
9側のシヤツタが開の時は9′側シヤツタは閉と
なり、逆に9′側のシヤツタが開の時は9側のシ
ヤツタは閉となるような開閉制御が行われる。
The opening/closing of the shutter by the opening/closing drive unit 18 is such that, for example, when the shutter on the 9th side is open, the shutter on the 9' side is closed, and conversely, when the shutter on the 9' side is open, the shutter on the 9th side is closed. Control takes place.

ばね圧力検出制御部12は、予め、ばね成形体
の圧力基準値を含みその上下に圧力調整の上部許
容限界値と下部許容限界値とが設定され、そし
て、前述の上部ならびに下部の許容限界値を、歪
ゲージ10の検出圧力と比較するためのコンパレ
ータを内蔵する。
The spring pressure detection control unit 12 includes a pressure reference value for the spring molded body, and upper and lower allowable limit values for pressure adjustment are set above and below the reference value, and the above-mentioned upper and lower allowable limit values are set in advance. A comparator is built in to compare the pressure detected by the strain gauge 10.

歪ゲージ10よりの検出圧力が、上部・下部の
許容限界値間にあれば、もちろんばね圧力調整は
完了したことになる。しかし、歪ゲージ10の検
出圧力が、例えば上部許容限界を上回れば、ばね
圧力検出制御部12よりシャツタ開閉の開閉駆動
部18に信号が送られ、シヤツタ9が開放される
と同時に、照射ユニツト7から光スポツト4が照
射されるによつてばね圧力が軽減される。
Of course, if the pressure detected by the strain gauge 10 is between the upper and lower allowable limit values, the spring pressure adjustment has been completed. However, if the detected pressure of the strain gauge 10 exceeds the upper permissible limit, for example, a signal is sent from the spring pressure detection control section 12 to the opening/closing drive section 18 for opening and closing the shutter, and at the same time the shutter 9 is opened, the irradiation unit 7 The spring pressure is reduced as the light spot 4 is irradiated from the spring.

他方、歪ゲージ10の検出圧力が、下部許容限
界を下回れば、ばね成形体1の裏面側の照射ユニ
ツト8による光スポツト4′が照射されることに
なり、その結果としてばね圧力が強められる。
On the other hand, if the detected pressure of the strain gauge 10 is below the lower allowable limit, the light spot 4' from the irradiation unit 8 on the back side of the spring molded body 1 will be irradiated, and as a result, the spring pressure will be increased.

シヤツタ開閉駆動の前記信号は、照射ユニツト
駆動部11にも送られ、ばね成形体1の幅方向ば
ね端間を交互に往復せしめる光スポツト4、また
は4′の走査がされる。
The signal for driving the shutter to open and close is also sent to the irradiation unit drive section 11, and the light spot 4 or 4' is scanned, which causes the light spot 4 or 4' to alternately reciprocate between the spring ends in the width direction of the spring molded body 1.

前述のばね圧力検出制御部12による制御過程
は、第5図に示されるフローチヤートを参照すれ
ば更に明瞭となる。尚、フローチヤートの判断信
号や処理信号に併記された右上の番号は、第4図
実施例図との相対的な比較対応が容易となるよう
に同図の要部制御装置に記されたと同じ引用番号
である。
The control process by the spring pressure detection control section 12 described above will become clearer with reference to the flowchart shown in FIG. In addition, the numbers on the upper right side of the flowchart that are written together with the judgment signals and processing signals are the same as those written on the main control device in the same figure to facilitate relative comparison with the example diagram in Figure 4. This is the citation number.

図示フローチヤートにおいて、調整開始とは、
ばね成形体1に対するばね圧力調整制御のための
初期条件の設定や、レーザ光発振器13に対する
照射パルス幅、パルス繰り返し速度等レーザ光加
工に必要とする照射エネルギ条件の設定をなす段
階である。
In the illustrated flowchart, the start of adjustment means
This is the stage of setting initial conditions for spring pressure adjustment control for the spring molded body 1 and setting of irradiation energy conditions necessary for laser beam processing, such as irradiation pulse width and pulse repetition rate for the laser beam oscillator 13.

初期条件が設定された後は、圧力検出の歪ゲー
ジ10による検出出力が適正になるまで、即ち、
検出圧力が予め設定された上部・下部の許容限界
値の間に入るまで図示“ばね圧力?”に始まりシ
ヤツタの開閉駆動、レーザ照射開始、ユニツト駆
動(照射ユニツトによる光スポツトの走査)
ON,OFF、レーザ照射停止に至るまでの各段階
を単動作サイクルとするレーザ光の走査が繰り返
される。そして、歪ゲージ10による検出出力が
適正となれば、ばね圧力調整が終了したことにな
る。
After the initial conditions are set, the process continues until the detection output by the strain gauge 10 for pressure detection becomes appropriate, that is,
Until the detected pressure falls between the preset upper and lower allowable limit values, the system starts with the "spring pressure?" message shown in the diagram, drives the shutter to open and close, starts laser irradiation, and drives the unit (scans the light spot with the irradiation unit).
Laser light scanning is repeated, with each stage of ON, OFF, and laser irradiation stopping as a single operation cycle. When the detection output from the strain gauge 10 becomes appropriate, it means that the spring pressure adjustment has been completed.

予め設定される上部・下部の許容限界値は、例
えば前記ヘツド支持ばねにおいて、設計基準値が
30〓とすれば、30±2.5%程度の許容限界値が設
定される。
The preset upper and lower allowable limit values are, for example, when the design standard value of the head support spring is
If it is 30〓, an allowable limit value of about 30±2.5% will be set.

〔発明の効果〕〔Effect of the invention〕

以上、本発明のレーザ光照射によるばね圧力調
整方法によれば、ばね圧力調整治具に装着された
ばね成形体に対して、ばね自由端側に当接するよ
うに配置された歪ゲージの検出圧力によつて、成
形ばね体の表裏面に微細なエネルギ制御が容易な
レーザ光を走査することによるばね体の熱変形を
用いるため、ばね圧力の調整が精度よくかつ短時
間に然も、自動的に施行されることになる。
As described above, according to the spring pressure adjustment method using laser beam irradiation of the present invention, the detected pressure of the strain gauge arranged so as to be in contact with the spring free end side with respect to the spring molded body attached to the spring pressure adjustment jig is Therefore, since the thermal deformation of the spring body is used by scanning the front and back surfaces of the molded spring body with a laser beam whose energy can be easily controlled minutely, the spring pressure can be adjusted accurately, quickly, and automatically. It will be enforced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明のばね圧力調整方法原理図、第
2図aはばね成形体に対しレーザ光照射時のばね
変形図、同図bはレーザ光照射後のばね変形図、
第3図はレーザ光によるばね塑性変形特性図、同
図aはエネルギ密度と曲がり角度の関係特性図、
同図bは走査回数と曲がり角度の関係特性図、第
4図は本発明のレーザ光照射装置実施例図(装置
側面図)、第5図はばね圧力検出制御のフローチ
ヤート、第6図は従来のばね圧力調整方法を説明
する図(斜視図)である。 図中、1と25はばね成形体、2と26はばね
自由端(ヘツド支持端)、3と28は固定端、4
はレーザ光または光スポツト、6は光ケーブル、
7と8はばね成形体1の表面または裏面側の照射
ユニツト、9と9′はシヤツタ、10と30は歪
ゲージ、11は7,8の駆動部、12は圧力検出
制御部、14は光制御部、及び32はばね圧力調
整治具である。
FIG. 1 is a diagram of the principle of the spring pressure adjustment method of the present invention, FIG. 2a is a diagram of spring deformation when a spring molded body is irradiated with laser light, and FIG.
Figure 3 is a characteristic diagram of spring plastic deformation caused by laser light, and figure a is a characteristic diagram of the relationship between energy density and bending angle.
Figure b is a characteristic diagram of the relationship between the number of scans and the bending angle, Figure 4 is an embodiment of the laser beam irradiation device of the present invention (device side view), Figure 5 is a flowchart of spring pressure detection control, and Figure 6 is a diagram of the relationship between the number of scans and the bending angle. FIG. 2 is a diagram (perspective view) illustrating a conventional spring pressure adjustment method. In the figure, 1 and 25 are spring molded bodies, 2 and 26 are spring free ends (head support ends), 3 and 28 are fixed ends, 4
is a laser beam or optical spot, 6 is an optical cable,
7 and 8 are irradiation units on the front or back side of the spring molded body 1, 9 and 9' are shutters, 10 and 30 are strain gauges, 11 is a drive unit for 7 and 8, 12 is a pressure detection control unit, and 14 is a light The control section and 32 are spring pressure adjustment tools.

Claims (1)

【特許請求の範囲】[Claims] 1 金属薄板ばね素材より成形されたばね成形体
1の長さ方向の一端を固定端3としてばね圧力調
整治具32上に固定され、また他端側のばね自由
端2に歪ゲージ10を当接せしめたばね成形体1
の固定端3とばね自由端2の間に表裏何れか面に
長さ方向と直交する方向にそつて集束された適宜
エネルギ密度のレーザ光4を走査し、該走査の面
を塑性変形せしめることを特徴とするレーザ光に
よるばね圧力調整方法。
1 One lengthwise end of a spring molded body 1 formed from a thin metal spring material is fixed on a spring pressure adjustment jig 32 with a fixed end 3, and a strain gauge 10 is brought into contact with the spring free end 2 on the other end side. Tightened spring molded body 1
Scanning a focused laser beam 4 of an appropriate energy density along the direction orthogonal to the length direction on either the front or back surface between the fixed end 3 and the spring free end 2, and plastically deforming the scanned surface. A method of adjusting spring pressure using laser light.
JP62139320A 1987-06-03 1987-06-03 Spring pressure adjusting method by laser beam Granted JPS63303237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62139320A JPS63303237A (en) 1987-06-03 1987-06-03 Spring pressure adjusting method by laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62139320A JPS63303237A (en) 1987-06-03 1987-06-03 Spring pressure adjusting method by laser beam

Publications (2)

Publication Number Publication Date
JPS63303237A JPS63303237A (en) 1988-12-09
JPH057572B2 true JPH057572B2 (en) 1993-01-29

Family

ID=15242563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62139320A Granted JPS63303237A (en) 1987-06-03 1987-06-03 Spring pressure adjusting method by laser beam

Country Status (1)

Country Link
JP (1) JPS63303237A (en)

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* Cited by examiner, † Cited by third party
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JP2623817B2 (en) * 1989-02-20 1997-06-25 富士通株式会社 Bending method and bending apparatus using laser beam
JPH07105020B2 (en) * 1991-04-09 1995-11-13 松下電器産業株式会社 Magnetic head and manufacturing method thereof
JPH0772932B2 (en) * 1991-04-09 1995-08-02 松下電器産業株式会社 Magnetic head height adjustment method for rotary head device
JPH07105021B2 (en) * 1991-04-15 1995-11-13 松下電器産業株式会社 Magnetic head and method of adjusting height of magnetic head
JPH0772933B2 (en) * 1991-04-17 1995-08-02 松下電器産業株式会社 Magnetic head positioning method
JPH07105024B2 (en) * 1991-04-17 1995-11-13 松下電器産業株式会社 Magnetic head height adjustment method by flat beam shape irradiation
JPH07105023B2 (en) * 1991-04-17 1995-11-13 松下電器産業株式会社 Magnetic head gap position adjustment method
JPH07105022B2 (en) * 1991-04-17 1995-11-13 松下電器産業株式会社 Magnetic head and magnetic head azimuth adjustment method
JPH07105025B2 (en) * 1991-09-02 1995-11-13 松下電器産業株式会社 Magnetic head positioning device
US6388842B1 (en) * 1999-05-12 2002-05-14 Seagate Technology Llc Disc drive suspension bend section and method
JP4176968B2 (en) 2001-02-14 2008-11-05 富士通株式会社 Laser bending method and laser bending apparatus
JP2002260358A (en) 2001-02-28 2002-09-13 Tdk Corp Method and apparatus for adjusting load of suspension
JP4088121B2 (en) 2002-08-14 2008-05-21 富士通株式会社 Contactor manufacturing method
JP5082425B2 (en) * 2006-12-19 2012-11-28 富士通株式会社 Laser processing method, laser processing apparatus, and spring arm manufacturing method
JP2008203434A (en) 2007-02-19 2008-09-04 Fujitsu Ltd Scanning mechanism, workpiece processing method and processing apparatus
JP6367058B2 (en) * 2014-09-08 2018-08-01 学校法人同志社 Laser forming method and laser forming apparatus
JP2023172461A (en) * 2022-05-24 2023-12-06 信介 平塚 Longitudinal member, and processing method and processing device of the same

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