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JPH0576549B2 - - Google Patents
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JPH0576549B2 - - Google Patents

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Publication number
JPH0576549B2
JPH0576549B2 JP16012786A JP16012786A JPH0576549B2 JP H0576549 B2 JPH0576549 B2 JP H0576549B2 JP 16012786 A JP16012786 A JP 16012786A JP 16012786 A JP16012786 A JP 16012786A JP H0576549 B2 JPH0576549 B2 JP H0576549B2
Authority
JP
Japan
Prior art keywords
substrate
discharge
electrodes
electrode plates
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP16012786A
Other languages
Japanese (ja)
Other versions
JPS6314876A (en
Inventor
Masayoshi Murata
Takashi Yamamoto
Yoshio Ieyumi
Hiroshi Fujama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP61160127A priority Critical patent/JPS6314876A/en
Priority to DE3750349T priority patent/DE3750349T2/en
Priority to EP87106535A priority patent/EP0244842B1/en
Priority to KR1019870004508A priority patent/KR910002819B1/en
Priority to CA000536654A priority patent/CA1279411C/en
Priority to US07/047,328 priority patent/US4901669A/en
Publication of JPS6314876A publication Critical patent/JPS6314876A/en
Priority to KR1019900021941A priority patent/KR910010168B1/en
Publication of JPH0576549B2 publication Critical patent/JPH0576549B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/517Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Chemical Vapour Deposition (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、太陽電池、燃料電池、薄膜半導体、
電子写真感光体や光センサなどの各種電子デバイ
スに使用される非晶質薄膜の形成装置に関するも
のである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to solar cells, fuel cells, thin film semiconductors,
The present invention relates to an apparatus for forming amorphous thin films used in various electronic devices such as electrophotographic photoreceptors and optical sensors.

〔従来の技術〕[Conventional technology]

第2図には、従来より用いられている半導体薄
膜の製造装置を示してあり、たとえば、特開昭57
−47710号公報などに記載されている公知の技術
である。
FIG. 2 shows a conventional semiconductor thin film manufacturing apparatus, for example,
This is a known technique described in, for example, Japanese Patent No. 47710.

図において、気密の反応容器01内に放電空間
を形成するための電極02,03が上下方向に設
けてあり、この電極02,03は高周波電源04
に電気的に接続されている。上記反応容器01の
外周には、上記放電空間内の電界方向と平行な磁
界を発生させるためのコイル05が水平に配置さ
れており、交流電源06と電気的に接続されてい
る。排気孔07は図示しない真空ポンプに連通し
ており、反応ガス導入管08は、モノシラン
(SiH4)と水素ガス(H2)のボンベにそれぞれ連
通している。なお、09はヒータで、基板010
を加熱するものである。
In the figure, electrodes 02 and 03 are provided vertically to form a discharge space in an airtight reaction vessel 01, and these electrodes 02 and 03 are connected to a high frequency power source 04.
electrically connected to. A coil 05 for generating a magnetic field parallel to the direction of the electric field in the discharge space is horizontally arranged around the outer periphery of the reaction vessel 01, and is electrically connected to an AC power source 06. The exhaust hole 07 communicates with a vacuum pump (not shown), and the reaction gas introduction pipe 08 communicates with monosilane (SiH 4 ) and hydrogen gas (H 2 ) cylinders, respectively. In addition, 09 is a heater, and the board 010
It is used to heat.

さて、電極03上に基板010を載せ、反応容
器01内を1mmHg程度に減圧した後、モノシラ
ンと水素ガスとの混合ガスを反応ガス導入管08
より供給しつつ、電極02,03間に13.5MHzの
高周波電圧を印加する。
Now, after placing the substrate 010 on the electrode 03 and reducing the pressure inside the reaction vessel 01 to about 1 mmHg, a mixed gas of monosilane and hydrogen gas is introduced into the reaction gas introduction pipe 08.
A high frequency voltage of 13.5 MHz is applied between the electrodes 02 and 03 while supplying the same voltage.

一方、コイル05には、50あるいは60Hzの商業
用交流電圧を印加し、電極02,03間に約100
ガウスの磁界を発生させる。なお、基板010
は、ヒータ09により300℃程度に加熱しておく。
On the other hand, a commercial AC voltage of 50 or 60 Hz is applied to the coil 05, and about 100 Hz is applied between the electrodes 02 and 03.
Generates a Gaussian magnetic field. Note that the board 010
is heated to about 300°C using heater 09.

反応ガス導入管08より導入されたシノシラン
等のガスは、電極02,03間の放電空間で分解
され、コイル05により発生された変動する磁界
により撹拌されつつ基板010の表面に付着し、
非晶質薄膜を形成する。
A gas such as sinosilane introduced from the reaction gas introduction pipe 08 is decomposed in the discharge space between the electrodes 02 and 03, and is attached to the surface of the substrate 010 while being stirred by the fluctuating magnetic field generated by the coil 05.
Forms an amorphous thin film.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記した従来の装置では、2枚の電極02,0
3間に発生する電界の方向と平行にコイル05で
発生させた変動磁界を印加するので、電極02,
03間の放電空間に存在するシリコン等のイオン
が撹拌され、基板010上に比較的均一な非晶質
薄膜が形成される。
In the conventional device described above, two electrodes 02, 0
Since the variable magnetic field generated by coil 05 is applied parallel to the direction of the electric field generated between electrodes 02 and 3,
Ions such as silicon existing in the discharge space between the electrodes 03 are stirred, and a relatively uniform amorphous thin film is formed on the substrate 010.

しかし、 基板010が置かれる場所は、電極03の上
であり、電極02,03間の放電空間内に位置
することになる。このため、基本的に高エネル
ギーをもつイオンの直撃を受けることになる。
However, the substrate 010 is placed above the electrode 03 and is located within the discharge space between the electrodes 02 and 03. As a result, they are basically directly hit by high-energy ions.

すなわち、電極02,03間の電界Eにより
電荷qのイオンにはクーロン力F1=qEが働き、
イオン粒子が基板010を直撃して形成されつ
つある非晶質薄膜に損傷を与えることになる。
That is, Coulomb force F 1 =qE acts on ions with charge q due to the electric field E between electrodes 02 and 03,
The ion particles will directly hit the substrate 010 and damage the amorphous thin film that is being formed.

コイル05により発生される変動磁界Bの方
向が、放電空間に発生した電界Eに平行なた
め、放電空間内にあるイオン、および電子は
Larmor運動により旋回運動を引き起こされる
が、その旋回運動による撹拌作用は余り大きく
なく極めて大きな電力を必要とする。
Since the direction of the varying magnetic field B generated by the coil 05 is parallel to the electric field E generated in the discharge space, ions and electrons in the discharge space
Larmor motion causes a swirling motion, but the stirring effect of the swirling motion is not very large and requires an extremely large amount of electric power.

基板010の一方の電極03の上に載せられ
るので、一度に処理される基板010の大きさ
も限定されることになり、電極03より面積の
大きな基板に非晶質薄膜を形成することができ
ないし、一度に基板010の両面へ非晶質薄膜
を形成することもできない。
Since it is placed on one electrode 03 of the substrate 010, the size of the substrate 010 that can be processed at one time is limited, and it is not possible to form an amorphous thin film on a substrate that has a larger area than the electrode 03. Also, it is not possible to form an amorphous thin film on both sides of the substrate 010 at the same time.

基板010が一方の電極03の上に載せられ
るので、放電持続に必要な二次電子の供給が本
質的となる直流放電や低周波放電では大面積基
板上に均一な成膜を行うことが困難である。従
つて、高価な高周波電源がどうしても必要とな
る。
Since the substrate 010 is placed on one of the electrodes 03, it is difficult to form a uniform film on a large-area substrate in direct current discharge or low-frequency discharge, where the supply of secondary electrons necessary for sustaining the discharge is essential. It is. Therefore, an expensive high frequency power source is absolutely necessary.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、グロー放電プラズマを用いて基板に
非晶質薄膜を形成する装置において、非晶質薄膜
を形成する基板を収納する反応容器と、同反応容
器内に複数枚の電極板を平行にかつ端縁が上記基
板の一表面に臨むように配置される第1の放電用
電極と、上記反応容器内に複数枚の電極板を平行
にかつ端縁が上記基板の他表面に臨むように配置
される第2の放電用電極と、これら第1と第2の
放電用電極の電極板間に放電用電圧を供給する電
源と、上記反応容器を囲繞し上記一対の放電用電
極板間に発生された電界と直交する向きの磁界を
発生させるコイルおよび交流電源と、上記反応容
器内を減圧すると共に反応ガスを供給するガス供
給装置とを有するものである。
The present invention provides an apparatus for forming an amorphous thin film on a substrate using glow discharge plasma. and a first discharge electrode disposed with an edge facing one surface of the substrate, and a plurality of electrode plates arranged in parallel in the reaction vessel with an edge facing the other surface of the substrate. A second discharge electrode arranged, a power source that supplies a discharge voltage between the electrode plates of the first and second discharge electrodes, and a power source that surrounds the reaction vessel and is connected between the pair of discharge electrode plates. It has a coil and an AC power source that generate a magnetic field in a direction perpendicular to the generated electric field, and a gas supply device that reduces the pressure inside the reaction vessel and supplies a reaction gas.

〔作用〕[Effect]

本発明では、平行に配置される複数枚の電極板
で構成されるグロー放電プラズマ発生用の電極を
2組準備し、基板を挾みその電極板の端縁を臨ま
せてそれぞれ配置させている。
In the present invention, two sets of electrodes for glow discharge plasma generation consisting of a plurality of electrode plates arranged in parallel are prepared, and the substrates are sandwiched and the edges of the electrode plates are placed facing each other. .

また、各組の電極板間に発生する放電用電界と
直交する方向にコイルおよび交流電源により磁界
を発生させた。
Further, a magnetic field was generated by a coil and an AC power source in a direction perpendicular to the electric discharge field generated between each set of electrode plates.

荷電粒子は、電極板間の放電電界より与えられ
たクーロン力と磁界により与えられたローレンツ
力との初速を与えられた形で電界と直交する方向
にドリフトするが、電界を出た所、すなわち、電
極板の端縁から基板の表面に向かう所でクーロン
力が弱まりローレンツ力によるサイクロトロン運
動によりLarmor軌道を描いて飛んでいく。
A charged particle drifts in a direction perpendicular to the electric field given the initial velocity of the Coulomb force given by the discharge electric field between the electrode plates and the Lorentz force given by the magnetic field, but when it leaves the electric field, , the Coulomb force weakens from the edge of the electrode plate toward the surface of the substrate, and the cyclotron movement caused by the Lorentz force causes the particles to fly in a Larmor orbit.

一方、電気的に中性であるラジカル粒子は荷電
粒子群の軌道からそれて直進しようとするが、荷
電粒子(特にイオン)と衝突しその進路を修正さ
せられる。しかも、この磁界は変動しており、ラ
ジカル粒子は均一に飛散する。
On the other hand, electrically neutral radical particles deviate from the trajectory of the charged particle group and try to travel straight, but they collide with charged particles (especially ions) and are forced to correct their course. Moreover, this magnetic field is fluctuating, and the radical particles are scattered uniformly.

従つて、放電電界空間外に支持された基板の両
面には、均一な非晶質薄膜が形成されることにな
る。
Therefore, uniform amorphous thin films are formed on both sides of the substrate supported outside the discharge electric field space.

〔実施例〕〔Example〕

以下、本発明を第1図に示す一実施例の装置に
基づき説明する。
The present invention will be explained below based on an embodiment of the apparatus shown in FIG.

1は反応容器で、その中にグロー放電プラズマ
を発生させるための第1と第2の電極2,3が対
向して収納されている。これらの電極2(あるい
は3)は、長尺な電極板を複数枚平行に並べたも
ので後述の低周波電源4へ隣合うもの同士の極を
変えてそれぞれ接続されている。
Reference numeral 1 denotes a reaction vessel in which first and second electrodes 2 and 3 for generating glow discharge plasma are housed facing each other. These electrodes 2 (or 3) are a plurality of long electrode plates arranged in parallel, and are connected to a low frequency power source 4, which will be described later, with adjacent electrodes having different poles.

低周波電源4は、例えば、60Hzの商用周波数を
用い上記電極2と3の各々の電極板に接続されて
いる。コイル5は、上記反応容器1を囲繞するも
ので、交流電源6に接続されている。7は反応ガ
ス導入管で、図示しないボンベに連通し、モノシ
ランとアルゴンの混合ガスを上記反応容器1に供
給するものである。排気孔8は、真空ポンプ9に
連通しており、反応容器1内のガスを排気するも
のである。
A low frequency power source 4 is connected to each electrode plate of the electrodes 2 and 3 using a commercial frequency of 60 Hz, for example. The coil 5 surrounds the reaction vessel 1 and is connected to an AC power source 6. Reference numeral 7 denotes a reaction gas introduction pipe, which communicates with a cylinder (not shown) and supplies a mixed gas of monosilane and argon to the reaction vessel 1. The exhaust hole 8 communicates with a vacuum pump 9 to exhaust the gas inside the reaction vessel 1.

さて、基板10を図示のように電極2と3の間
であつて、その端縁2A,3Aが基板10のそれ
ぞれの面に臨み間隙が等しくなるように適宜手段
で支持する。真空ポンプ9を駆動して反応容器1
内を排気した後、反応ガス導入管7からモノシラ
ンとアルゴンの混合ガスを供給する。上記混合ガ
スを反応容器1内に充満させて圧力を0.05ないし
0.5Torrに保ち、低周波電源4から電極2,3に
電圧を印加するグロー放電プラズマが電極2,3
の各電極板間に発生する。
Now, as shown in the figure, the substrate 10 is supported by appropriate means between the electrodes 2 and 3 so that the edges 2A and 3A face each surface of the substrate 10 and the gaps are equal. Drive the vacuum pump 9 to remove the reaction vessel 1.
After evacuating the inside, a mixed gas of monosilane and argon is supplied from the reaction gas introduction pipe 7. Fill the reaction vessel 1 with the above mixed gas and increase the pressure to 0.05 or more.
Glow discharge plasma is maintained at 0.5 Torr and a voltage is applied to the electrodes 2 and 3 from the low frequency power source 4.
occurs between each electrode plate.

一方、コイル5には、例えば100Hzの交流電圧
を印加し、電極2,3のそれぞれの電極板間に発
生する電界Eと直交する方向の磁界Bを発生させ
る。なお、その磁束密度は10ガウス程度で良い。
On the other hand, an AC voltage of, for example, 100 Hz is applied to the coil 5 to generate a magnetic field B in a direction perpendicular to the electric field E generated between the electrode plates of the electrodes 2 and 3, respectively. Note that the magnetic flux density may be about 10 Gauss.

反応ガス導入管7から供給されたガスのうちモ
ノシランガスは、電極2,3それぞれの電極板の
間に生じるグロー放電プラズマでラジカルSiに分
解され、基板10の表面に付着し薄膜を形成す
る。
Among the gases supplied from the reaction gas introduction pipe 7, monosilane gas is decomposed into radical Si by the glow discharge plasma generated between the electrode plates of the electrodes 2 and 3, and adheres to the surface of the substrate 10 to form a thin film.

このとき、アルゴンイオン等の荷電粒子は、電
極2あるいは3の各電極板間で電界Eによるクー
ロン力F1=qEとローレンツ力F2=q(v×B)に
よつていわゆるE×Bドリフトの運動を起こす。
At this time, charged particles such as argon ions undergo so-called E×B drift due to Coulomb force F 1 = qE due to electric field E and Lorentz force F 2 = q (v×B) between each electrode plate of electrode 2 or 3. cause a movement.

なお、Vは荷電粒子の速度である。 Note that V is the speed of charged particles.

すなわち、E×Bドリフトにより初速を与えら
れた形で、電極2,3と直交する方向に飛び出
し、基板10に向けて飛んでいく。しかし、電極
2,3それぞれの電極板の間に生じる電界の影響
が小さい放電空間の外側では、コイル6により生
じた磁界Bによるサイクロトロン運動により
Larmor軌道を描いて飛んでいく。
That is, it flies out in a direction perpendicular to the electrodes 2 and 3 and flies toward the substrate 10 with an initial velocity given by the ExB drift. However, outside the discharge space where the influence of the electric field generated between the electrode plates of electrodes 2 and 3 is small, the cyclotron movement due to the magnetic field B generated by the coil 6 causes
It flies in a Larmor orbit.

従つて、アルゴンイオン等の荷電粒子が基板1
0を直撃することはなくなる。
Therefore, charged particles such as argon ions are absorbed into the substrate 1.
It will no longer hit 0 directly.

一方、電気的に中性であるラジカルSiは磁界B
の影響を受けず、上記荷電粒子群の軌道よりそれ
て基板10に至り、その表面に非晶質薄膜を形成
する。この時、ラジカルSiはLarmor軌道を飛ん
でゆく荷電粒子と衝突するため、電極2や3の前
方だけでなく左あるいは右に広がつた形で非晶質
薄膜が形成される。しかも、磁界Bを変動させて
いるので、基板10の両面に均一に非晶質薄膜を
形成させることが可能となる。
On the other hand, the electrically neutral radical Si is exposed to the magnetic field B
The particles deviate from the trajectory of the charged particles and reach the substrate 10, forming an amorphous thin film on the surface thereof. At this time, the radical Si collides with the charged particles flying in the Larmor orbit, so that an amorphous thin film is formed not only in front of the electrodes 2 and 3 but also spread to the left or right. Moreover, since the magnetic field B is varied, it is possible to uniformly form an amorphous thin film on both sides of the substrate 10.

また、この実施例では、基板10を垂直に配置
してあるので、反応容器10や電極2や3の内面
などに付着した非晶質のカスなどが落ちてその表
面を汚すことが少なくなる。
Further, in this embodiment, since the substrate 10 is arranged vertically, it is less likely that amorphous debris adhering to the reaction vessel 10 or the inner surfaces of the electrodes 2 and 3 will fall and contaminate the surfaces thereof.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、太陽電池・燃料電池・電子写
真感光体などの各種デイバイスの製造において、
基板の両面に均一な非晶質薄膜が、しかも、大面
積のものが形成されることになるので、産業上き
わめて価値がある。
According to the present invention, in the production of various devices such as solar cells, fuel cells, and electrophotographic photoreceptors,
Since a uniform amorphous thin film with a large area can be formed on both sides of the substrate, it is extremely valuable industrially.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る一実施例を示す装置の横
断面図である。第2図は従来の装置を示す縦断面
図である。 1……反応容器、2,3……電極、4……低周
波電源、5……コイル、6……交流電源、7……
反応ガス導入管、8……排気孔、9……真空ポン
プ、10……基板。
FIG. 1 is a cross-sectional view of an apparatus showing one embodiment of the present invention. FIG. 2 is a longitudinal sectional view showing a conventional device. 1... Reaction container, 2, 3... Electrode, 4... Low frequency power supply, 5... Coil, 6... AC power supply, 7...
Reaction gas introduction pipe, 8...exhaust hole, 9...vacuum pump, 10...substrate.

Claims (1)

【特許請求の範囲】[Claims] 1 非晶質薄膜を形成する基板を収納する反応容
器と、同反応容器内に複数枚の電極板を平行にか
つ端縁が上記基板の一表面に臨むように配置され
る第1の放電用電極と、上記反応容器内に複数枚
の電極板を平行にかつ端縁が上記基板の他表面に
臨むように配置される第2の放電用電極と、これ
ら第1と第2の放電用電極の電極板間に放電用電
圧を供給する電源と、上記反応容器を囲繞し上記
一対の放電用電極板間に発生された電界と直交す
る向きの磁界を発生させるコイルおよび交流電源
と、上記反応容器内を減圧して反応ガスを供給す
るガス供給装置とを具備することを特徴とする非
晶質薄膜形成装置。
1. A reaction container that houses a substrate on which an amorphous thin film is to be formed, and a first discharge device in which a plurality of electrode plates are arranged in parallel so that their edges face one surface of the substrate. an electrode, a second discharge electrode in which a plurality of electrode plates are arranged in parallel in the reaction vessel with their edges facing the other surface of the substrate; and these first and second discharge electrodes. a power supply that supplies a discharge voltage between the electrode plates of the reactor, a coil and an AC power supply that surround the reaction vessel and generate a magnetic field orthogonal to the electric field generated between the pair of discharge electrode plates; 1. An amorphous thin film forming apparatus comprising: a gas supply device that reduces pressure inside a container and supplies a reaction gas.
JP61160127A 1986-05-09 1986-07-08 Amorphous thin film forming device Granted JPS6314876A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP61160127A JPS6314876A (en) 1986-07-08 1986-07-08 Amorphous thin film forming device
DE3750349T DE3750349T2 (en) 1986-05-09 1987-05-06 Arrangement for the production of thin layers.
EP87106535A EP0244842B1 (en) 1986-05-09 1987-05-06 Apparatus for forming thin film
KR1019870004508A KR910002819B1 (en) 1986-05-09 1987-05-08 Forming method and device of amorphous thin film
CA000536654A CA1279411C (en) 1986-05-09 1987-05-08 Method and apparatus for forming thin film
US07/047,328 US4901669A (en) 1986-05-09 1987-05-08 Method and apparatus for forming thin film
KR1019900021941A KR910010168B1 (en) 1986-05-09 1990-12-27 Amorphous thin film manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61160127A JPS6314876A (en) 1986-07-08 1986-07-08 Amorphous thin film forming device

Publications (2)

Publication Number Publication Date
JPS6314876A JPS6314876A (en) 1988-01-22
JPH0576549B2 true JPH0576549B2 (en) 1993-10-22

Family

ID=15708451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61160127A Granted JPS6314876A (en) 1986-05-09 1986-07-08 Amorphous thin film forming device

Country Status (1)

Country Link
JP (1) JPS6314876A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2628529B2 (en) * 1988-02-24 1997-07-09 東京エレクトロン株式会社 Plasma CVD equipment
FR2731370B1 (en) * 1995-03-07 1997-06-06 Cie Generale D Optique Essilor PROCESS FOR THE PLASMA ASSISTED DEPOSITION OF AT LEAST ONE THIN FILM ON A TWO-SIDED SUBSTRATE, AND CORRESPONDING REACTOR

Also Published As

Publication number Publication date
JPS6314876A (en) 1988-01-22

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