JPH0577472B2 - - Google Patents
Info
- Publication number
- JPH0577472B2 JPH0577472B2 JP60107525A JP10752585A JPH0577472B2 JP H0577472 B2 JPH0577472 B2 JP H0577472B2 JP 60107525 A JP60107525 A JP 60107525A JP 10752585 A JP10752585 A JP 10752585A JP H0577472 B2 JPH0577472 B2 JP H0577472B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- pin
- substrate
- container
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は接着剤供給装置に係り、詳しくは、電
子部品をボンデイングするための接着剤を基板に
面塗布するための転写方式の接着剤供給装置に関
する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an adhesive supply device, and more specifically, a transfer-type adhesive supply device for surface-coating an adhesive for bonding electronic components onto a substrate. Regarding equipment.
（従来の技術）
電子部品を基板にボンデイングする手段とし
て、基板の所定位置に予め接着剤を塗布し、この
接着剤に電子部品を接着することが知られてい
る。第５図は、従来の接着剤塗布装置の平面図、
第６図はその展開断面図を示している。図中、２
は円盤状の容器であつて、リング状の溝部３４が
形成されており、この溝部３４に接着剤３０が貯
溜されている。３３は接着剤３０の注入器であ
り、その注入口３２から接着剤３０が注入され
る。容器２は図示しない駆動手段に駆動されて矢
印Ａ方向に水平回転する。(Prior Art) As a means for bonding electronic components to a substrate, it is known to apply an adhesive to a predetermined position of the substrate in advance and adhere the electronic component to this adhesive. FIG. 5 is a plan view of a conventional adhesive application device;
FIG. 6 shows a developed sectional view thereof. In the figure, 2
is a disc-shaped container in which a ring-shaped groove 34 is formed, and the adhesive 30 is stored in the groove 34 . 33 is a syringe for the adhesive 30, and the adhesive 30 is injected from the injection port 32 of the syringe. The container 2 is driven by a drive means (not shown) and horizontally rotates in the direction of arrow A.
２９は塗布ピンであつて、ポイント２７におい
て下降することによりその下端部が接着剤３０中
に没入し、次いで上昇することにより、その下面
に接着剤３０を付着せしめる。次いでこの塗布ピ
ン２９は基板３９上へ移動し、そこで下降、上昇
することにより、接着剤３０を基板３９に転写す
る。塗布ピン２９への接着剤３０の付着量は、容
器２内の接着剤３０の深さＤに左右される。また
塗布ピン２９の下面は、基板３９に接着剤３０を
面塗布できるように、フラツトな面塗布面２９ａ
になつている。Ｐは接着剤３０に接着されて基板
３９にボンデイングされた電子部品である。 Reference numeral 29 is an applicator pin, which lowers at point 27 so that its lower end is immersed in the adhesive 30, and then rises to apply the adhesive 30 to its lower surface. Next, the applicator pin 29 moves onto the substrate 39 and transfers the adhesive 30 onto the substrate 39 by lowering and raising there. The amount of adhesive 30 that adheres to application pin 29 depends on the depth D of adhesive 30 within container 2 . Further, the lower surface of the application pin 29 has a flat application surface 29a so that the adhesive 30 can be applied onto the substrate 39.
It's getting old. P is an electronic component adhered to an adhesive 30 and bonded to a substrate 39.
（発明が解決しようとする課題）
上述のようにポイント２７において、塗布ピン
２９を昇降させて、溝部３４内の接着剤３０を付
着させると、接着剤３０は塗布ピン２９にえぐり
取られて凹部ｂが生じる。(Problem to be Solved by the Invention) As described above, when the application pin 29 is raised and lowered at point 27 to deposit the adhesive 30 in the groove 34, the adhesive 30 is scooped out by the application pin 29 and left in the recess. b occurs.
ところが接着剤３０は、基板３９に電子部品Ｐ
を接着するものであるから、その粘性はきわめて
大きく、したがつてこの凹部ｂは直ちには埋まら
ず、塗布ピン２９に繰り返しえぐり取られる間
に、第６図に示すように接着剤３０の液面はこの
凹部ｂのために次第に荒れる。殊に塗布ピン２９
は、基板３９に接着剤３０を面塗布できるように
その下面はフラツトな面塗布面２９ａとなつてい
るので、接着剤３０がえぐり取られた結果生じる
凹部ｂはかなり大きく、液面の荒れは甚だしいも
のとなる。 However, the adhesive 30 does not attach the electronic component P to the board 39.
Since the adhesive is adhesive, its viscosity is extremely high, so the recess b is not filled immediately, and while it is repeatedly gouged out by the applicator pin 29, the liquid level of the adhesive 30 drops as shown in FIG. gradually becomes rough due to this recess b. Especially the applicator pin 29
Since the bottom surface is a flat application surface 29a so that the adhesive 30 can be applied surface-coated to the substrate 39, the concave portion b resulting from the adhesive 30 being scooped out is quite large, and the liquid surface is rough. It will be terrible.
このように液面が荒れると、塗布ピン２９への
付着量は次第にばらつくようになり、ひいては基
板３９への塗布量もばらついて、電子部品Ｐを良
好にボンデイングできなくなる問題点があつた。 When the liquid surface becomes rough in this manner, the amount of coating applied to the coating pins 29 gradually varies, which in turn causes the amount of coating applied to the substrate 39 to vary, resulting in a problem that the electronic component P cannot be bonded well.
因みに、基板３９への接着剤３０の転写量が少
ないと、電子部品Ｐをしつかりボンデイングでき
ず、また多すぎると、接着剤３０は電子部品Ｐか
らはみ出してしまう。 Incidentally, if the amount of the adhesive 30 transferred to the substrate 39 is small, the electronic component P cannot be firmly bonded, and if it is too large, the adhesive 30 will protrude from the electronic component P.
また基板３９への接着剤３０の塗布量は、電子
部品Ｐの品種（寸法の大小）によつて変えること
が望ましいのであるが、上記従来手段では、電子
部品Ｐの品種変更に応じて、塗布ピン２９への接
着剤３０の付着量を加減しにくいものであつた。 Furthermore, it is desirable to change the amount of adhesive 30 applied to the substrate 39 depending on the type (size) of the electronic component P. It was difficult to adjust the amount of adhesive 30 attached to pin 29.
そこで本発明は、上記従来手段の問題点を解消
できる接着剤供給装置を提供することを目的とす
る。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an adhesive supply device that can solve the problems of the conventional means described above.
（課題を解決するための手段）
本発明は、容器の溝部に貯溜された接着剤中に
没入してこの接着剤の液面を平滑する上下動自在
な平滑子と、この平滑子を上下動させることによ
り、その没入深さを調整する上下動手段を設けて
いる。(Means for Solving the Problem) The present invention provides a vertically movable smoothing element that is immersed in adhesive stored in a groove of a container to smooth the liquid surface of the adhesive, and A vertical movement means is provided for adjusting the depth of immersion by moving the hole.
（作用）
上記構成によれば、容器の水平回転にともな
い、接着剤の液面は平滑子に平滑され、その深さ
は一定になるので、常に一定量の接着剤を塗布ピ
ンに付着させることができる。またこの平滑子を
上下動させて接着剤への没入深さを調整すれば、
接着剤の深さが変わるので、これにより、電子部
品の品種変更に応じて、塗布ピンへの接着剤の付
着量を加減することができる。(Function) According to the above configuration, as the container rotates horizontally, the liquid surface of the adhesive is smoothed by the smoother and its depth is constant, so that a constant amount of adhesive can always be applied to the application pin. I can do it. Also, by moving this smoother up and down to adjust the depth of immersion into the adhesive,
Since the depth of the adhesive changes, the amount of adhesive applied to the applicator pin can be adjusted depending on the type of electronic component.
（実施例）
次に、図面を参照しながら本発明の実施例を説
明する。(Example) Next, an example of the present invention will be described with reference to the drawings.
第４図は本発明に係る接着剤供給装置が組み込
まれる電子部品ボンデイング装置の斜視図であ
る。図中、３９は基板であり、リフター３５側の
ストツカ４２から、リフター４４側のストツカ４
２へ、コンベア４０により搬送される。３６は基
板３９の押し出し装置、４６は基板３９を位置決
めする基板ホルダーである。この基板ホルダー４
６の後方に、第１図に示す接着剤供給装置１が設
けられている。 FIG. 4 is a perspective view of an electronic component bonding apparatus incorporating an adhesive supply apparatus according to the present invention. In the figure, 39 is a board, and the stocker 42 on the lifter 35 side, the stocker 4 on the lifter 44 side
2 by a conveyor 40. 36 is a device for extruding the substrate 39, and 46 is a substrate holder for positioning the substrate 39. This board holder 4
6, an adhesive supply device 1 shown in FIG. 1 is provided.
第１図において、２は円盤状の容器であり、リ
ング状の溝部３が形成されている。この容器２
は、本体ブロツク１３上に設けられている。２７
は塗布ピン２９（後述）に接着剤を付着させるポ
イントである。２０はプレート、２１はこのプレ
ート２０の下面に装着されたモータであり、プー
リ１９、タイミングベルト１８を介して、容器２
を矢印Ａ方向に水平回転させる。 In FIG. 1, 2 is a disc-shaped container, and a ring-shaped groove 3 is formed therein. This container 2
is provided on the main body block 13. 27
is the point at which adhesive is applied to the applicator pin 29 (described later). 20 is a plate, 21 is a motor attached to the lower surface of this plate 20, and the motor is connected to the container 2 via a pulley 19 and a timing belt 18.
horizontally rotate in the direction of arrow A.
１６は本体ブロツク１３の下方に設けられた台
板であり、支柱１７が立設されている。１４は支
柱１７から容器２のセンターへ延出するアームで
あり、容器２はこのアーム１４の先端部により上
方から押さえられている。１５はアーム１４の付
勢用弾性体である。また本体ブロツク１３上には
接着剤の注入器２６が設けられている。 Reference numeral 16 denotes a base plate provided below the main body block 13, on which a column 17 is erected. Reference numeral 14 denotes an arm extending from the support column 17 to the center of the container 2, and the container 2 is held down from above by the tip of the arm 14. 15 is an elastic body for urging the arm 14. An adhesive syringe 26 is also provided on the main body block 13.
本体ブロツク１３上にはブラケツト８が設けら
れており、このブラケツト８には、平滑子５がシ
ヤフト７を中心に上下方向に回転自在に装着され
ている。１０は平滑子５の上面に設けられたピ
ン、９はこのピン１０を弾発する弾性体であり、
その弾性力により、平滑子５は下方へ弾発されて
いる。 A bracket 8 is provided on the main body block 13, and a smooth element 5 is mounted on the bracket 8 so as to be freely rotatable in the vertical direction about the shaft 7. 10 is a pin provided on the upper surface of the smooth element 5, 9 is an elastic body that rebounds this pin 10,
Due to its elastic force, the smooth element 5 is pushed downward.
１１は上下動手段としてのマイクロメータであ
つて、そのシヤフトは平滑子５の後端部に結合さ
れている。このシヤフトが上方（方向）に上昇
してこの後端部を押し上げることにより、平滑子
５をシヤフト７を中心に回転させて平滑子５の先
端部を上下動させ、平滑子５の接着剤３０への没
入深さを変える。２２，２３は２段シリンダであ
り、容器２が載置された本体ブロツク１３の高さ
を調整する。２５はシリンダ２３が載置されたベ
ース板、２４はベース板２５上にあつて、上記台
板１６を支持する支持ブロツクである。 Reference numeral 11 denotes a micrometer as a vertical moving means, the shaft of which is connected to the rear end of the smooth element 5. This shaft rises upward (direction) and pushes up this rear end, thereby rotating the smoothing element 5 around the shaft 7 and moving the tip of the smoothing element 5 up and down. Change the depth of immersion. 22 and 23 are two-stage cylinders, which adjust the height of the main body block 13 on which the container 2 is placed. 25 is a base plate on which the cylinder 23 is placed, and 24 is a support block that is placed on the base plate 25 and supports the base plate 16.
第３図ａにおいて、２９は塗布ピンであり、そ
の下面は、基板３９に接着剤３０を面塗布できる
ように、フラツトな面塗布面２９ａになつてい
る。 In FIG. 3a, reference numeral 29 denotes a coating pin, the lower surface of which is a flat coating surface 29a so that the adhesive 30 can be coated on the substrate 39.
本装置は上記のような構成より成り、次に第３
図ａ，ｂを参照しながら動作を説明する。 This device consists of the above-mentioned configuration, and then the third
The operation will be explained with reference to Figures a and b.
塗布ピン２９はポイント２７の上方に到来し
（第３図ａイ）、次いで下降することにより、その
下端部はポイント２７の接着剤３０中に没入し
（同図ロ）、次いで上昇することにより、その下端
部に接着剤３０が付着する。次いで塗布ピン２９
は基板３９の上方へ移動し（同図ハ）、そこで下
降することにより、基板３９の所定位置に接着剤
３０を転写し（同図ニ）、次いで再びイ位置に移
動して、上記動作を繰り返す。基板３９に転写さ
れた接着剤３０上には、図示しない手段により電
子部品Ｐがボンデイングされる。 The applicator pin 29 arrives above the point 27 (FIG. 3, a), and then descends, so that its lower end is immersed in the adhesive 30 at the point 27 (FIG. 3, b), and then rises. , adhesive 30 is attached to its lower end. Next, apply pin 29
moves above the substrate 39 (FIG. 3C) and descends there to transfer the adhesive 30 to a predetermined position on the substrate 39 (FIG. 2D), then moves to position A again and performs the above operation. repeat. An electronic component P is bonded onto the adhesive 30 transferred to the substrate 39 by means not shown.
ところで、第３図ａにおいて、容器２内の接着
剤３０は、影線ａ部分が塗布ピン２９に付着する
が、塗布ピン２９にａ部分が付着することによ
り、接着剤３０はえぐられて凹部ｂが生じる。殊
に、塗布ピン２９の下面は、接着剤３０を基板３
９に面塗布できるように、フラツツトな面塗布面
２９ａになつているので、液面は大きくえぐられ
て大きな凹部ｂが生じ、しかも接着剤３０は粘性
が大きいため、この凹部ｂは直ちに埋まらない。
したがつて接着剤３０の液面は次第に荒れ、再度
この凹部ｂがポイント２７に来た場合には、塗布
ピン２９が上述のように昇降しても、接着剤３０
は塗布ピン２９の面塗布面２９ａに十分に付着し
ないこととなる。そこで本手段では、平滑子５に
より接着剤３０の液面を平滑し、接着剤の深さＤ
を一定にして、常に一定量の接着剤３０が塗布ピ
ン２９の面塗布面２９ａに付着するようにしてい
る。 By the way, in FIG. 3a, the adhesive 30 in the container 2 has a shaded portion a attached to the applicator pin 29, but as the portion a adheres to the applicator pin 29, the adhesive 30 is gouged out and forms a recess. b occurs. In particular, the lower surface of the applicator pin 29 applies the adhesive 30 to the substrate 3.
Since the adhesive 30 has a flat application surface 29a so that the adhesive 30 can be applied on the same surface, the liquid level is greatly scooped out, creating a large recess b.Moreover, since the adhesive 30 has a high viscosity, this recess b cannot be filled immediately. .
Therefore, the liquid surface of the adhesive 30 gradually becomes rough, and when this concave portion b comes to the point 27 again, even if the applicator pin 29 moves up and down as described above, the adhesive 30
This results in insufficient adhesion to the coating surface 29a of the coating pin 29. Therefore, in this means, the liquid surface of the adhesive 30 is smoothed by the smoother 5, and the depth D of the adhesive is
is kept constant so that a constant amount of adhesive 30 always adheres to the surface application surface 29a of the application pin 29.
また上述したように、塗布ピン２９に付着する
接着剤３０の付着量は、接着剤３０の深さＤによ
り変わる。そこで第３図ｂに示すように、マイク
ロメータ１１を駆動して、平滑子５をシヤフト７
を中心に上下方向に回転させることにより、平滑
子５の先端部を上下動させてその接着剤３０への
没入深さを調整すれば、接着剤３０の深さを変え
ることができる。 Further, as described above, the amount of the adhesive 30 that adheres to the applicator pin 29 varies depending on the depth D of the adhesive 30. Therefore, as shown in FIG. 3b, the micrometer 11 is driven to move the smoother 5 onto the shaft 7.
The depth of the adhesive 30 can be changed by rotating the tip of the smoothing element 5 in the vertical direction around , moving the tip of the smoothing element 5 up and down and adjusting the depth of immersion into the adhesive 30.
因みに、電子部品Ｐの寸法が大きく、基板３９
への接着剤３０の塗布量を増大したい場合は、第
３図ｂ鎖線に示すように、マイクロメータ１１の
シヤフトを引き込ませて平滑子５の先端部を上昇
させれば、接着剤３０の液面は上昇して、その深
さはD1からD2に増大し、塗布ピン２９への付着
量も、ａからa′へ増大する。 Incidentally, the dimensions of the electronic component P are large, and the board 39
If you want to increase the amount of adhesive 30 applied to the surface, as shown by the chain line in FIG. The surface rises, its depth increases from D1 to D2, and the amount of coating applied to the applicator pin 29 also increases from a to a'.
（発明の効果）
以上説明したように本発明によれば、接着剤の
液面を平滑して接着剤の深さを一定にし、常に一
定量の接着剤を塗布ピンに付着させることがで
き、また接着剤の深さを変えて、付着量を加減す
ることができる。(Effects of the Invention) As explained above, according to the present invention, the liquid surface of the adhesive can be smoothed, the depth of the adhesive can be made constant, and a constant amount of adhesive can always be attached to the applicator pin. Also, by changing the depth of the adhesive, the amount of adhesion can be adjusted.
しかも本発明によれば、１つの部材（平滑子）
により、荒れた液面の平滑と、接着剤の塗布量の
調整という２つの作用効果が得られるものであ
り、殊に電子部品の品種変更に応じて、簡単迅速
に塗布量を調整できるので、電子部品の品種変更
にともなうロスタイムが殆ど無く、したがつて多
数枚の基板への多品種の電子部品の高速度、高能
率のボンデイングが実現できる。 Moreover, according to the present invention, one member (smooth element)
This provides the two effects of smoothing rough liquid surfaces and adjusting the amount of adhesive applied.In particular, the amount of applied adhesive can be adjusted easily and quickly in response to changes in the type of electronic components. There is almost no loss time due to changes in the type of electronic components, and therefore high-speed, high-efficiency bonding of various types of electronic components to a large number of boards can be realized.
図は本発明の実施例を示すものであつて、第１
図は接着剤供給装置の斜視図、第２図は容器の平
面図、第３図ａ，ｂは要部の展開断面図、第４図
は電子部品ボンデイング装置の斜視図、第５図は
従来の容器の平面図、第６図は要部の展開断面図
である。
１……接着剤供給装置、２……容器、３……溝
部、５……平滑子、１１……上下動手段、２１…
…モータ、２９……塗布ピン、２９ａ……面塗布
面、３０……接着剤。
The figure shows an embodiment of the present invention.
The figure is a perspective view of the adhesive supply device, FIG. 2 is a plan view of the container, FIGS. FIG. 6 is a plan view of the container, and FIG. 6 is a developed cross-sectional view of the main parts. DESCRIPTION OF SYMBOLS 1... Adhesive supply device, 2... Container, 3... Groove, 5... Smooth element, 11... Vertical movement means, 21...
...Motor, 29...Applying pin, 29a...Surface coating surface, 30...Adhesive.
Claims (1)
基板に面塗布する塗布ピンの面塗布面に接着剤を
付着させる接着剤供給装置であつて、リング状の
溝部が形成された容器と、この容器を水平回転さ
せるモータと、この溝部に貯溜された接着剤中に
没入してこの接着剤の液面を平滑する上下動自在
な平滑子と、この平滑子を上下動させることによ
り、上記接着剤に対する没入深さを調整する上下
動手段とから成ることを特徴とする接着剤供給装
置。1. An adhesive supply device for applying adhesive to the surface application surface of a coating pin for surface application of adhesive for bonding electronic components to a substrate, which comprises a container in which a ring-shaped groove is formed, and a container formed with a ring-shaped groove. A horizontally rotating motor, a vertically movable smoothing element that immerses into the adhesive stored in this groove and smoothes the surface of the adhesive, and by moving this smoothing element up and down, An adhesive supply device comprising a vertical movement means for adjusting the immersion depth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107525A JPS61268376A (en) | 1985-05-20 | 1985-05-20 | adhesive supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107525A JPS61268376A (en) | 1985-05-20 | 1985-05-20 | adhesive supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61268376A JPS61268376A (en) | 1986-11-27 |
| JPH0577472B2 true JPH0577472B2 (en) | 1993-10-26 |
Family
ID=14461400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60107525A Granted JPS61268376A (en) | 1985-05-20 | 1985-05-20 | adhesive supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61268376A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015141931A (en) * | 2014-01-27 | 2015-08-03 | 三菱電機株式会社 | Resin feeder |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111992449A (en) * | 2020-08-21 | 2020-11-27 | 山东大学 | A kind of high-precision scraping coating equipment and method with adjustable scraping angle |
-
1985
- 1985-05-20 JP JP60107525A patent/JPS61268376A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015141931A (en) * | 2014-01-27 | 2015-08-03 | 三菱電機株式会社 | Resin feeder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61268376A (en) | 1986-11-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |