JPH0579753B2 - - Google Patents
Info
- Publication number
- JPH0579753B2 JPH0579753B2 JP13394890A JP13394890A JPH0579753B2 JP H0579753 B2 JPH0579753 B2 JP H0579753B2 JP 13394890 A JP13394890 A JP 13394890A JP 13394890 A JP13394890 A JP 13394890A JP H0579753 B2 JPH0579753 B2 JP H0579753B2
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- plasma
- generation chamber
- plasma generation
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 17
- 238000005192 partition Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000007769 metal material Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はマイクロ波プラズマ処理装置に係り、
特に低温プラズマを用いて金属膜を形成するのに
好適なマイクロ波プラズマ処理装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a microwave plasma processing apparatus,
In particular, the present invention relates to a microwave plasma processing apparatus suitable for forming metal films using low-temperature plasma.
マイクロ波発生器から導波管によつて導かれて
くるマイクロ波を真空仕切り窓を通してプラズマ
生成室に導入して電子サイクロトロン共鳴法によ
り低温プラズマを生成し、この低温プラズマを被
膜材料、例えば被膜材料ガスに作用させて試料に
膜を形成するマイクロ波プラズマ処理装置が特開
昭56−155535号公報に記載されている。
Microwaves guided by a waveguide from a microwave generator are introduced into a plasma generation chamber through a vacuum partition window to generate low-temperature plasma by electron cyclotron resonance, and this low-temperature plasma is applied to coating materials, e.g. A microwave plasma processing apparatus that forms a film on a sample by acting on a gas is described in JP-A-56-155535.
ところがこのようなマイクロ波プラズマ処理装
置は、金属膜を形成しようとして金属被膜材料、
例えば金属材料ガスを用いてこれを低温プラズマ
を作用させると、金属被膜材料が導波管側に拡散
してプラズマ生成室に隣接する導波管部分に位置
する真空仕切り窓に付着し、該金属被膜材料の付
着量がマイクロ波の表皮効果以上の厚みに達する
とマイクロ波がプラズマ生成室に導入されなくな
つてプラズマが生成されなくなる問題があつた。
However, in order to form a metal film, such a microwave plasma processing apparatus uses a metal coating material,
For example, when low-temperature plasma is applied to a metal material gas, the metal coating material diffuses to the waveguide side and adheres to the vacuum partition window located in the waveguide section adjacent to the plasma generation chamber, and the metal When the amount of coating material deposited reaches a thickness that exceeds the skin effect of microwaves, there is a problem that microwaves are no longer introduced into the plasma generation chamber and no plasma is generated.
従つて本発明の目的は、金属被膜材料が真空仕
切り窓に付着するのを防止することにある。 It is therefore an object of the present invention to prevent metal coating materials from adhering to vacuum partition windows.
本発明はこの目的を達成するために、マイクロ
波をプラズマ生成室に導く通路を折り曲げ、この
通路のマイクロ波発生器側の折り曲げ部分にマイ
クロ波導入用真空仕切り窓を設けたことを特徴と
する。
In order to achieve this object, the present invention is characterized in that the passage leading the microwave to the plasma generation chamber is bent, and a vacuum partition window for introducing the microwave is provided at the bent part of this passage on the side of the microwave generator. .
前記の如き構成としたので、金属被膜材料が導
波管側に拡散されてもその直進性により前記通路
の折り曲げ角部に大部分が付着し、前記通路のマ
イクロ波発生器側の折り曲げ部分、すなわち死角
部分に位置するマイクロ波導入用真空仕切り窓ま
では殆ど侵入しない。
With the above configuration, even if the metal coating material is diffused to the waveguide side, most of it will adhere to the bent corner of the passage due to its straightness, and the bent part of the passage on the microwave generator side, In other words, the microwave hardly penetrates to the vacuum partition window for introducing microwaves located in the blind spot.
以下、本発明の一実施例を図面を参照して説明
する。この実施例は金属被膜材料として金属材料
ガスを用い、反応室をプラズマ生成室と別個に構
成したマイクロ波プラズマ処理装置に適用した例
である。
Hereinafter, one embodiment of the present invention will be described with reference to the drawings. This embodiment is an example in which a metal material gas is used as the metal coating material, and the present invention is applied to a microwave plasma processing apparatus in which a reaction chamber is configured separately from a plasma generation chamber.
マグネトロン1の発振により発生されたマイク
ロ波2は、反射波吸収用アイソレータ3、入反射
波電力モニタ用のパワーモニタ4、自動整合装置
5を備えた整合器6を介して出力される。負荷側
インピーダンスの変化は反射波電力の増加として
パワーモニタ4により検出され、増幅器7を介し
て自動整合装置5に帰還されて整合器6によるイ
ンピーダンス整合が行われ、更に入射波電力と設
定値の差を増幅器7を介してマイクロ波発振用マ
グネトロン電源8の出力電流回路に帰還してマグ
ネトロン1の発振力を制御することにより常に一
定のマイクロ波電力がプラズマ生成室へ伝送され
るようにする。 The microwave 2 generated by the oscillation of the magnetron 1 is outputted via a matching device 6 including an isolator 3 for absorbing reflected waves, a power monitor 4 for monitoring the power of input reflected waves, and an automatic matching device 5. Changes in the load-side impedance are detected by the power monitor 4 as an increase in reflected wave power, which is fed back to the automatic matching device 5 via the amplifier 7, where impedance matching is performed by the matching device 6, and further between the incident wave power and the set value. The difference is fed back to the output current circuit of the magnetron power supply 8 for microwave oscillation via the amplifier 7 to control the oscillation power of the magnetron 1 so that a constant microwave power is always transmitted to the plasma generation chamber.
以上のようにして出力されたマイクロ波2は真
空仕切り窓9を通してほぼ直角に折り曲げられた
導波管10a内に導入され、コーナ用金属メツシ
ユ11での反射によつて90度方向転換されて導波
管10b,10c内を伝播してプラズマ生成室1
2に伝送される。すなわち、マイクロ波2をプラ
ズマ生成室12へ導く通路は導波管10a部分で
ほぼ直角に折り曲げられており、真空仕切り窓9
は前記通路のマグネトロン1側の折り曲げ部分に
おいて整合器6に隣接して配置されている。導波
管10a〜10c内には石英やセラミツクス等の
誘電体あるいは金属で作られたインピーダンス窓
兼用の真空コンダクタンス調整用絞り板13a〜
13cが配置される。 The microwave 2 output as described above is introduced into the waveguide 10a bent at an almost right angle through the vacuum partition window 9, and is reflected by the corner metal mesh 11 to change its direction by 90 degrees and is guided. Plasma generation chamber 1 propagates through wave tubes 10b and 10c.
2. That is, the passage that guides the microwave 2 to the plasma generation chamber 12 is bent at a substantially right angle at the waveguide 10a, and the passage that guides the microwave 2 to the plasma generation chamber 12 is bent at a substantially right angle at the waveguide 10a.
is arranged adjacent to the matching device 6 at the bent portion of the passage on the magnetron 1 side. Inside the waveguides 10a to 10c are aperture plates 13a to 13a for vacuum conductance adjustment that also serve as impedance windows and are made of dielectric material such as quartz or ceramics or metal.
13c is placed.
バルブ14を介して供給されるプラズマ生成用
ガスはスパツタ防止用放電管を兼ねたガス注入筒
15からプラズマ生成室12内に注され、磁界発
生用電磁石コイル16により発生した磁界とマイ
クロ波2によつて電子サイクロトロン共鳴を起こ
して低温プラズマを生成する。この低温プラズマ
は予め排気17によつて高真空にされた反応室1
8内に拡散され、バルブ19を介して供給されガ
ス注入管20によつて該反応室18内に注入され
た金属材料ガスと衝突してこれを励起、電離し、
該反応室18内の試料ホルダ21に保持された試
料22の表面に金属薄膜を生成する。 The plasma generation gas supplied through the valve 14 is injected into the plasma generation chamber 12 from a gas injection tube 15 which also serves as a spatter prevention discharge tube, and is mixed with the magnetic field generated by the magnetic field generation electromagnetic coil 16 and the microwave 2. This causes electron cyclotron resonance and generates low-temperature plasma. This low-temperature plasma is introduced into the reaction chamber 1 which has been made into a high vacuum by the exhaust gas 17.
8 and collides with the metal material gas supplied through the valve 19 and injected into the reaction chamber 18 through the gas injection pipe 20 to excite and ionize it;
A thin metal film is generated on the surface of the sample 22 held in the sample holder 21 in the reaction chamber 18 .
補助排気ポンプ23は導波管10a,10b,
10c内に拡散されてきた金属材料ガスを補助排
気速度調整バルブ24を介して吸い込んでバルブ
25を介して排気する。パージ用ガス注入管26
はバルブ27を介して供給されたプラズマ生成用
ガスを真空仕切り窓9の内側へパージ用として注
入する。 The auxiliary exhaust pump 23 has waveguides 10a, 10b,
The metal material gas diffused into 10c is sucked in through the auxiliary exhaust speed adjusting valve 24 and exhausted through the valve 25. Purge gas injection pipe 26
The plasma generating gas supplied through the valve 27 is injected into the vacuum partition window 9 for purging.
以上のようなマイクロ波プラズマ処理装置によ
れば、真空仕切り窓9がプラズマ生成室12側の
通路に対してほぼ直角に折れ曲がつたマグネトロ
ン1側の通路、すなわち死角部分に位置している
ので、金属材料ガスが導波管側に拡散してもその
直進性によりほぼ直角に折れ曲がつた位置にある
真空仕切り窓9まで侵入しにくくなる。また、導
波管10a〜10c内には真空コンダクタンス調
整絞り板13a〜13cがあるので金属材料ガス
は拡散しにく、拡散されても補助排気ポンプ23
によつて排気されてしまうので金属材ガスが真空
仕切り窓9へ付着する機会が大幅に低減される。
更に真空仕切り窓9の内側へはガス注入管26に
よつてプラズマ生成用ガスがパージ用として注入
されているので、該部の圧力が高、従つて金属材
料ガスが真空仕切り窓9に達する機会は更に低減
される。 According to the microwave plasma processing apparatus as described above, the vacuum partition window 9 is located in the passage on the magnetron 1 side that is bent almost at right angles to the passage on the plasma generation chamber 12 side, that is, in the blind spot. Even if the metal material gas diffuses toward the waveguide, its straightness makes it difficult for it to penetrate to the vacuum partition window 9, which is bent at an approximately right angle. Furthermore, since the vacuum conductance adjustment aperture plates 13a to 13c are provided in the waveguides 10a to 10c, metal material gas is difficult to diffuse, and even if it is diffused, the auxiliary exhaust pump 23
Since the metal gas is exhausted by the vacuum partition window 9, the chances of the metal gas adhering to the vacuum partition window 9 are greatly reduced.
Furthermore, since plasma generation gas is injected into the vacuum partition window 9 for purging by the gas injection pipe 26, the pressure in this area is high, and therefore there is no chance for the metal material gas to reach the vacuum partition window 9. is further reduced.
以上のように本発明は、マイクロ波導入用真空
仕切り窓をマイクロ波をプラズマ生成室に導く通
路のマイクロ波発生器側の折り曲げ部分に設けた
ので、導波管側に拡散される金属被膜材料がこの
マイクロ波導入用真空仕切り窓に付着するのを防
止することができ、従つて金属被膜材料を用いた
マイクロ波プラズマ処理装置においてプラズマを
安定して生成することができる。
As described above, in the present invention, the vacuum partition window for introducing microwaves is provided at the bent part on the microwave generator side of the passage leading the microwave to the plasma generation chamber, so that the metal coating material is diffused toward the waveguide side. can be prevented from adhering to this vacuum partition window for introducing microwaves, and therefore plasma can be stably generated in a microwave plasma processing apparatus using a metal coating material.
図は本発明の一実施例を示すマイクロ波プラズ
マ処理装置の縦断側面図である。
1…マグネトロン、2…マイクロ波、9…真空
仕切り窓、10a〜10c…導波管、12…プラ
ズマ生成室。
The figure is a longitudinal sectional side view of a microwave plasma processing apparatus showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Magnetron, 2... Microwave, 9... Vacuum partition window, 10a-10c... Waveguide, 12... Plasma generation chamber.
Claims (1)
波管を介してプラズマ生成室に導いて電子サイク
ロトロン共鳴法により低温プラズマを生成し、こ
の低温プラズマを金属被膜材料に作用させて試料
に金属膜を形成するマイクロ波プラズマ処理装置
において、前記マイクロ波を前記プラズマ生成室
に導く通路を折り曲げ、この通路のマイクロ波発
生器側の折り曲げ部分にマイクロ波導入用真空仕
切り窓を設けたことを特徴とするマイクロ波プラ
ズマ処理装置。1 Microwaves generated by a microwave generator are guided to a plasma generation chamber via a waveguide to generate low-temperature plasma using electron cyclotron resonance, and this low-temperature plasma is applied to the metal coating material to form a metal film on the sample. In the microwave plasma processing apparatus to be formed, a passage leading the microwave to the plasma generation chamber is bent, and a vacuum partition window for introducing microwaves is provided at the bent part of the passage on the side of the microwave generator. Microwave plasma processing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13394890A JPH0317273A (en) | 1990-05-25 | 1990-05-25 | Microwave plasma treating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13394890A JPH0317273A (en) | 1990-05-25 | 1990-05-25 | Microwave plasma treating device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28306486A Division JPS63137168A (en) | 1986-11-29 | 1986-11-29 | Microwave plasma processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0317273A JPH0317273A (en) | 1991-01-25 |
| JPH0579753B2 true JPH0579753B2 (en) | 1993-11-04 |
Family
ID=15116814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13394890A Granted JPH0317273A (en) | 1990-05-25 | 1990-05-25 | Microwave plasma treating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317273A (en) |
-
1990
- 1990-05-25 JP JP13394890A patent/JPH0317273A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0317273A (en) | 1991-01-25 |
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