JPH0580839B2 - - Google Patents
Info
- Publication number
- JPH0580839B2 JPH0580839B2 JP59115968A JP11596884A JPH0580839B2 JP H0580839 B2 JPH0580839 B2 JP H0580839B2 JP 59115968 A JP59115968 A JP 59115968A JP 11596884 A JP11596884 A JP 11596884A JP H0580839 B2 JPH0580839 B2 JP H0580839B2
- Authority
- JP
- Japan
- Prior art keywords
- cabinet
- printed wiring
- wiring board
- heat sink
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント配線基板および、プリント
配線基板上に取付けられた電子部品等の取付装置
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed wiring board and a mounting device for electronic components and the like mounted on the printed wiring board.
従来例の構成とその問題点
第1図は、従来のプリント配線基板とキヤビネ
ツトとの取付装置を示すものであり、1はプリン
ト配線基板、2はプリント配線基板上に取付けら
れた放熱板、3は取付アングル、4はねじ、5は
キヤビネツトで、5aはキヤビネツト内部を仕切
る仕切板でキヤビネツト5に固定されている。電
子部品および放熱板2を取付けたプリント配線基
板1に取付アングル3が、ねじ4で取付けられ、
取付アングル3は仕切板5aにねじ4で固定され
ている。第2図は第1図の側面図である。Configuration of conventional example and its problems Figure 1 shows a conventional mounting device for a printed wiring board and a cabinet, in which 1 is a printed wiring board, 2 is a heat sink mounted on the printed wiring board, and 3 is a mounting device for mounting a printed wiring board and a cabinet. 4 is a mounting angle, 4 is a screw, 5 is a cabinet, and 5a is a partition plate that partitions the inside of the cabinet, and is fixed to the cabinet 5. A mounting angle 3 is attached to a printed wiring board 1 on which electronic components and a heat sink 2 are attached with screws 4,
The mounting angle 3 is fixed to the partition plate 5a with screws 4. FIG. 2 is a side view of FIG. 1.
しかし上記の構成では、プリント配線基板1と
キヤビネツト5との固定のために、ねじ4とねじ
4の締付け作業を必要とし、機器内部の構成、キ
ヤビネツト5および締付工具の条件により、締付
作業方向が制限され、取付アングル3と仕切板5
aとのねじ4の締付作業方向が仕切板5aの下側
から行なわなければならず、作業困難という問題
を有していた。 However, in the above configuration, it is necessary to tighten the screws 4 and 4 in order to fix the printed wiring board 1 and the cabinet 5. Direction is limited, mounting angle 3 and partition plate 5
The tightening operation of the screw 4 with the partition plate 5a had to be performed from the bottom side of the partition plate 5a, which posed a problem in that the operation was difficult.
発明の目的
本発明は、上記従来の問題点を解消するもの
で、機器内部の電子部品およびプリント配線基板
をキヤビネツトに固定するねじ止め工数を削減
し、かつ機器の組立作業を容易にして作業能率を
向上させることを目的とする。Purpose of the Invention The present invention solves the above-mentioned conventional problems by reducing the number of screws required for fixing electronic components and printed wiring boards inside equipment to a cabinet, and by facilitating equipment assembly work and improving work efficiency. The purpose is to improve
発明の構成
本発明は、電子部品またはプリント配線基板を
はさみ込む部分と、キヤビネツトの一部分をはさ
み込む部分とを一体的に形成した固定金具を用い
て、電子部品またはプリント配線基板と、キヤビ
ネツトの一部とを同じにはさみ込むことによりね
じおよびねじの締付作業なしに相互に取付固定が
できるものである。Structure of the Invention The present invention uses a fixture that integrally forms a part for sandwiching an electronic component or a printed wiring board and a part for sandwiching a part of a cabinet, to attach an electronic component or a printed wiring board to a cabinet. By sandwiching the parts together, it is possible to attach and fix them to each other without having to tighten screws.
実施例の説明
第3図は本発明の第1の実施例における電子部
品等の取付装置の構成を示す斜視図、第4図はそ
の側面図である。第3図、第4図において、6は
プリント配線基板、7は放熱板、8は固定金具、
9はねじ、10はキヤビネツト、11は機器の後
板、12は放熱板7にねじ9で固定された放熱半
導体である。放熱板7は、プリント配線基板6に
ねじ9で取付けられてあり、キヤビネツト10の
内部に組込まれた状態で、放熱板底部7bがキヤ
ビネツト内の仕切板10aの上面に密着してい
る。DESCRIPTION OF EMBODIMENTS FIG. 3 is a perspective view showing the configuration of a mounting device for electronic components, etc. in a first embodiment of the present invention, and FIG. 4 is a side view thereof. In FIGS. 3 and 4, 6 is a printed wiring board, 7 is a heat sink, 8 is a fixture,
9 is a screw, 10 is a cabinet, 11 is a rear plate of the device, and 12 is a heat dissipation semiconductor fixed to the heat dissipation plate 7 with screws 9. The heat sink 7 is attached to the printed wiring board 6 with screws 9, and when it is assembled inside the cabinet 10, the bottom portion 7b of the heat sink is in close contact with the upper surface of the partition plate 10a inside the cabinet.
次に固定金具8の突出部(第3の曲げ部)と放
熱板底部7bの切欠部7aとを係合させながら、
放熱板底部7bと仕切板10aとを同時に固定金
具8ではさみ込む。はさみ込み作業を容易にする
ため固定金具8には、プリント配線基板6に保持
された放熱板7をキヤビネツト10側に弾性的に
保持するガイド部8b(第1の曲げ部)と、キヤ
ビネツト10を放熱板7側へ弾性的に保持するガ
イド部8d(第2の曲げ部)とを設けている。 Next, while engaging the protruding part (third bent part) of the fixture 8 and the notch part 7a of the heat sink bottom part 7b,
The heat dissipation plate bottom 7b and the partition plate 10a are sandwiched between the fixing fittings 8 at the same time. In order to facilitate the sandwiching operation, the fixture 8 has a guide part 8b (first bent part) that elastically holds the heat sink 7 held on the printed wiring board 6 toward the cabinet 10, and a guide part 8b (first bent part) that holds the cabinet 10. A guide portion 8d (second bent portion) that is elastically held toward the heat sink 7 side is provided.
次にキヤビネツト10に後板11をねじ9で締
付け固定して固定金具8を固定する。このように
すれば固定金具8を後板11とキヤビネツト10
との間に保持する際に、放熱板底部7bの切欠部
7aによつて固定金具8は位置決めされ、キヤビ
ネツト10に後板11をねじ9で締付け固定して
固定金具8を固定する時に非常に作業が容易にな
る。 Next, the rear plate 11 is tightened and fixed to the cabinet 10 with the screws 9, and the fixing fittings 8 are fixed. In this way, the fixing bracket 8 can be connected to the rear plate 11 and the cabinet 10.
The fixing bracket 8 is positioned by the notch 7a of the bottom part 7b of the heat dissipation plate. Work becomes easier.
以上のように本実施例によれば、固定金具にキ
ヤビネツトの一部とプリント配線基板またはプリ
ント配線基板に取付けられた部品を同時にはさみ
込む部分と、はさみ込み部分より外側へ傾斜した
ガイド部と、固定される部分の一部切欠部に対応
して嵌合する突出部とを一体に設けることによ
り、キヤビネツトとプリント配線基板またはプリ
ント配線基板上の部品とをねじおよびねじの締付
作業なしに取付固定することができる。 As described above, according to this embodiment, the fixing fitting has a part in which a part of the cabinet and a printed wiring board or a component attached to the printed wiring board are simultaneously sandwiched, and a guide part that is inclined outward from the sandwiching part. By integrally providing a protrusion that fits in a partial cutout of the part to be fixed, the cabinet and printed wiring board or components on the printed wiring board can be attached without screws or screw tightening work. Can be fixed.
第5図、第6図は本発明の第2の実施例を示す
電子部品取付装置の斜視図と側面図である。第5
図、第6図において、13はプリント配線基板、
14は放熱板、15は固定金具、16はねじ、1
7aはキヤビネツト内部の仕切板、18は後板、
19は放熱半導体で、以上は第1の実施例の構成
と同様なものであるが、異なる点は、放熱板14
に放熱板底部がないことと、固定金具15に突出
部15c(第4の曲げ部)を設けた点である。 5 and 6 are a perspective view and a side view of an electronic component mounting apparatus showing a second embodiment of the present invention. Fifth
In FIG. 6, 13 is a printed wiring board;
14 is a heat sink, 15 is a fixture, 16 is a screw, 1
7a is a partition plate inside the cabinet, 18 is a rear plate,
Reference numeral 19 denotes a heat dissipation semiconductor, which has the same structure as that of the first embodiment, except that the heat dissipation plate 14
The two features are that there is no bottom part of the heat dissipation plate, and that the fixture 15 is provided with a protrusion 15c (fourth bent part).
上記のように構成された第2の実施例によれ
ば、放熱板14およびプリント配線基板13が、
仕切板17aに密着していなくても、プリント配
線基板13と仕切板17aとの間隙に嵌合する突
出部15cを固定金具15に一体に設けることに
より、プリント配線基板とキヤビネツトとを固定
することができ、より確実、強固に保持可能であ
る。 According to the second embodiment configured as described above, the heat sink 14 and the printed wiring board 13 are
Even if the printed wiring board 13 and the partition plate 17a are not in close contact with each other, the protrusion 15c that fits into the gap between the printed wiring board 13 and the partition plate 17a is integrally provided on the fixing metal fitting 15, thereby fixing the printed wiring board and the cabinet. can be held more reliably and firmly.
なお、第1、第2の実施例において、はさみ込
まれる部品は放熱板7としたが、プリント配線基
板上に取付けられたその他の部品でもよく、ま
た、第2の実施例では、放熱板14とプリント配
線基板13とを密着させて、固定金具15に、は
さみ込んだが、プリント配線基板13のみのはさ
み込みでも固定できる。 In the first and second embodiments, the heat sink 7 is used as the sandwiched component, but other components mounted on the printed wiring board may also be used. Although the printed wiring board 13 and the printed wiring board 13 are brought into close contact with each other and sandwiched between the fixing fittings 15, it is also possible to fix the printed wiring board 13 by sandwiching only the printed wiring board 13.
発明の効果
本発明は、金具の一部にプリント基板もしくは
放熱板等の電子部品と仕切板をはさみ込んで保持
するとともに仕切板の切欠き部によつて金具を位
置決めし、仕切板に後板を固定するねじを利用し
て金具を固定するように構成したことにより、ね
じ本数の削減に伴うねじ止め工数の大幅削減と仕
切板の下側からのねじ止め作業廃止に伴う作業性
の大幅向上とが実現可能となり電子部品等の取付
装置としては大きな産業上の効果を発揮するもの
である。Effects of the Invention The present invention holds electronic components such as a printed circuit board or a heat sink and a partition plate in a part of the metal fitting, positions the metal fitting by the notch of the partition plate, and attaches a rear plate to the partition plate. By using screws to fix the metal fittings, the number of screws is reduced, resulting in a significant reduction in screw tightening man-hours, and workability is greatly improved due to the elimination of screw tightening work from the bottom of the partition plate. This makes it possible to realize this and has great industrial effects as a mounting device for electronic parts, etc.
第1図は従来の電子部品等の取付装置の斜視
図、第2図は第1図の側面図、第3図は本発明の
第1の実施例における電子部品等の取付装置の斜
視図、第4図は第3図の側面図、第5図は第2の
実施例における電子部品等の取付装置の斜視図、
第6図は第5図の側面図である。
6,13……プリント配線基板、7,14……
放熱板、8,15……固定金具、9,16……ね
じ、10,17……キヤビネツト、11,18…
…後板、12,19……放熱半導体。
FIG. 1 is a perspective view of a conventional mounting device for electronic components, etc., FIG. 2 is a side view of FIG. 1, and FIG. 3 is a perspective view of a mounting device for electronic components, etc. according to the first embodiment of the present invention. FIG. 4 is a side view of FIG. 3, FIG. 5 is a perspective view of a mounting device for electronic components, etc. in the second embodiment,
FIG. 6 is a side view of FIG. 5. 6,13...Printed wiring board, 7,14...
Heat sink, 8, 15... Fixing metal fittings, 9, 16... Screws, 10, 17... Cabinet, 11, 18...
...Rear plate, 12, 19... Heat dissipation semiconductor.
Claims (1)
ビネツト側へ弾性的に保持せしめる第1の曲げ部
と、前記キヤビネツトを前記放熱板側へ弾性的に
保持せしめる第2の曲げ部と、前記放熱板の切欠
部に係合して相互に位置決めを行う第3の曲げ部
を一体的に形成してなる固定金具を前記キヤビネ
ツトとそのキヤビネツトにねじ止めされた後板と
の間に保持せしめたことを特徴とする電子部品等
の取付装置。 2 固定金具の両端に第4の曲げ部を設け、放熱
板を第1および第4の曲げ部間に保持し、キヤビ
ネツトを第2および第4の曲げ部間に保持せしめ
たことを特徴とする特許請求の範囲第1項記載の
電子部品等の取付装置。[Scope of Claims] 1. A first bent portion that elastically holds the heat sink held on the printed wiring board toward the cabinet, and a second bent portion that elastically holds the cabinet toward the heat sink. and a fixing fitting integrally formed with a third bent portion that engages with the notch of the heat sink for mutual positioning, between the cabinet and the rear plate screwed to the cabinet. A mounting device for electronic parts, etc., characterized by being held in place. 2. A fourth bent part is provided at both ends of the fixture, the heat sink is held between the first and fourth bent parts, and the cabinet is held between the second and fourth bent parts. A mounting device for electronic components, etc., as set forth in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59115968A JPS60260196A (en) | 1984-06-06 | 1984-06-06 | Mounting equipment for electronic parts, etc. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59115968A JPS60260196A (en) | 1984-06-06 | 1984-06-06 | Mounting equipment for electronic parts, etc. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60260196A JPS60260196A (en) | 1985-12-23 |
| JPH0580839B2 true JPH0580839B2 (en) | 1993-11-10 |
Family
ID=14675591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59115968A Granted JPS60260196A (en) | 1984-06-06 | 1984-06-06 | Mounting equipment for electronic parts, etc. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60260196A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527903Y2 (en) * | 1976-03-09 | 1980-07-03 |
-
1984
- 1984-06-06 JP JP59115968A patent/JPS60260196A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60260196A (en) | 1985-12-23 |
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