JPH0582080B2 - - Google Patents
Info
- Publication number
- JPH0582080B2 JPH0582080B2 JP59051319A JP5131984A JPH0582080B2 JP H0582080 B2 JPH0582080 B2 JP H0582080B2 JP 59051319 A JP59051319 A JP 59051319A JP 5131984 A JP5131984 A JP 5131984A JP H0582080 B2 JPH0582080 B2 JP H0582080B2
- Authority
- JP
- Japan
- Prior art keywords
- bracket
- lever
- electronic component
- cylinder
- right end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品をプリント基板上に実装する
時の衝撃を緩衝するため、衝撃緩衝機構を具備し
た電子部品実装装置の実装ヘツド装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mounting head device for an electronic component mounting apparatus that is equipped with a shock absorbing mechanism to absorb shock when electronic components are mounted on a printed circuit board.
従来の構成とその問題点
従来の電子部品実装装置において、その実装ヘ
ツドは、第1図にその具体構成を示す。Conventional Structure and Its Problems In a conventional electronic component mounting apparatus, the specific structure of the mounting head is shown in FIG.
図示のように、ヘツド駆動装置からシヤフト1
を介して伝達された駆動力により、レバー2か反
時計回りに回転することにより、レバー2の先端
に設けられたローラー3が連結ブロツク4を介し
て電子部品の吸着ピンセツト5を押し上げ、吸着
ピンセツト5の下端に吸着された電子部品6をプ
リント基板7に実装するものである。 As shown, from the head drive to the shaft 1
When the lever 2 rotates counterclockwise due to the driving force transmitted through the lever 2, the roller 3 provided at the tip of the lever 2 pushes up the electronic component suction tweezers 5 via the connecting block 4, and the suction tweezers The electronic component 6 sucked to the lower end of the electronic component 5 is mounted on a printed circuit board 7.
しかしながら、前記のような構成では、ヘツド
駆動装置の速度に吸着ピンセツト5の降下速度が
比例するので、電子部品6がプリント基板7に実
装される速度を任意に設定することができなかつ
た。このため、電子部品6がプリント基板7に実
装させる時に発生する衝撃により電子部品6がプ
リント基板の所定の位置からずれたり、さらには
電子部品6そのものが割れたりする欠点があつ
た。 However, with the above configuration, the speed at which the electronic components 6 are mounted on the printed circuit board 7 cannot be arbitrarily set because the speed at which the suction tweezers 5 descend is proportional to the speed of the head drive device. For this reason, there is a drawback that the electronic component 6 may be displaced from a predetermined position on the printed circuit board due to the impact generated when the electronic component 6 is mounted on the printed circuit board 7, and furthermore, the electronic component 6 itself may be broken.
発明の目的
本発明は前記欠点に鑑み、プリント基板上への
電子部品実装における、位置ずれ、部品割れなど
の問題点をなくし、信頼性、実装品質の向上を図
つた電子部品実装装置を提供することを目的とす
る。Purpose of the Invention In view of the above-mentioned drawbacks, the present invention provides an electronic component mounting apparatus that eliminates problems such as misalignment and component cracking when mounting electronic components on a printed circuit board, and improves reliability and mounting quality. The purpose is to
発明の構成
本発明は、中央を回転自在に軸支したレバーを
設け、前記レバーの左端は垂直に上下動できるよ
う構成した先端に吸着ピンセツトを具備する上下
シヤフト上部に、右端は右端より内側をシリンダ
ーAに連結し、前記シリンダーAの上下動で前記
上下シヤフトが上下できるよう構成し、一方、作
動用先端ピンを具備するシヨツクアブソーバーを
ブラケツトに装着し、前記ブラケツトの下端を実
装ヘツドブラケツトに回転自在に軸支し、前記ブ
ラケツトとシリンダーBをブラケツトの軸支部と
シヨツクアブソーバーの中間において回転できる
よう軸支し、前記ブラケツトに検出板を、検出器
実装ヘツドブラケツトに固定し、電子部品を供
給、位置決めする電子部品供給装置から電子部品
を前記吸着ピンセツトに吸着し、前記吸着ピンセ
ツトがプリント基板上の所定高に達するとシリン
ダーBを作動し、ブラケツトを左方に回転し、前
記検出器で前記検出板の位置を検出し、前記検出
信号でシリンダーAを作動し、レバーの右端を押
し上げ、レバー右端をアブソーバーの作動用端子
ピンに当接させ、吸着ピンセツトの降下速度を減
少させ、電子部品のプリント基板への装着時降下
速度をゼロとなるよう構成したことを特徴とし、
本発明は前記構成により、電子部品実装における
電子部品の位置ずれ、部品の割れなどの問題など
を解消し、高信頼性、高実装品質という効果を生
ずる。Structure of the Invention The present invention provides a lever whose center is rotatably supported, the left end of the lever is configured to be able to move up and down vertically, and the right end is located at the top of a vertical shaft which is equipped with suction tweezers at the tip, and the right end is located on the inside of the right end. The bracket is connected to a cylinder A so that the vertical shaft can be moved up and down by the vertical movement of the cylinder A, and a shock absorber having an operating tip pin is attached to the bracket, and the lower end of the bracket is rotated by the mounting head bracket. The bracket and cylinder B are rotatably supported between the shaft support of the bracket and the shock absorber, a detection plate is fixed to the bracket, a detector mounting head bracket is fixed to the bracket, and electronic components are supplied. An electronic component is picked up by the suction tweezers from the positioning electronic component supply device, and when the suction tweezers reach a predetermined height above the printed circuit board, the cylinder B is actuated, the bracket is rotated to the left, and the detector detects the electronic component. The position of the plate is detected, the cylinder A is activated by the detection signal, the right end of the lever is pushed up, the right end of the lever is brought into contact with the operating terminal pin of the absorber, the descending speed of the suction tweezers is reduced, and the electronic parts are printed. It is characterized by being configured so that the descending speed is zero when attached to the board,
With the above configuration, the present invention eliminates problems such as misalignment of electronic components and cracking of components during electronic component mounting, and produces effects of high reliability and high mounting quality.
実施例の説明 以下本発明の実施例を図面について説明する。Description of examples Embodiments of the present invention will be described below with reference to the drawings.
第2図は本発明の電子部品実装装置の実装ヘツ
ドの側面断面図、第3図は第2図の平面図、を示
す。 FIG. 2 shows a side sectional view of the mounting head of the electronic component mounting apparatus of the present invention, and FIG. 3 shows a plan view of FIG. 2.
第2図、第3図において、8は下端に吸着ピン
セツト21を有する上下シヤフト、9は上下シヤ
フトに上下駆動力を伝達するレバー、10はレバ
ー9の支点ピンA、11は上下駆動力を発生する
駆動源であるシリンダーA、12は衝撃を吸収す
るシヨツクアブソーバで、その先端のピン13が
レバー9に当接する。14はストツパーブロツ
ク、15はシヨツクアブソーバを支えるブラケツ
ト、16は検出板、17は検出器、18は支点ピ
ンB、19はブラケツト15の駆動源であるシリ
ンダーB、20は実装ヘツドブラケツト、11A
はシリンダーA11とレバー9との回転軸、15
Aはブラケツト15とシリンダーB19との回転
軸、を示す。 In FIGS. 2 and 3, 8 is a vertical shaft having a suction pin set 21 at the lower end, 9 is a lever that transmits vertical driving force to the vertical shaft, 10 is a fulcrum pin A of lever 9, and 11 is a vertical driving force that generates vertical driving force. The cylinders A and 12, which are the driving sources, are shock absorbers that absorb shock, and the pin 13 at the tip abuts against the lever 9. 14 is a stopper block, 15 is a bracket that supports the shock absorber, 16 is a detection plate, 17 is a detector, 18 is a fulcrum pin B, 19 is a cylinder B which is a driving source for the bracket 15, 20 is a mounting head bracket, 11A
is the rotation axis of cylinder A11 and lever 9, 15
A indicates the rotation axis of the bracket 15 and cylinder B19.
本発明の電子部品実装装置の実装ヘツド及び衝
撃緩衝機構について以下その動作を説明する。 The operation of the mounting head and shock absorbing mechanism of the electronic component mounting apparatus of the present invention will be explained below.
まず、吸着ピンセツト21が電子部品を供給、
位置決めする電子部品供給装置から電子部品22
を吸着し、プリント基板23上の任意の所定位置
にくると、ブラケツト15の初期位置よりシリン
ダーB19が作動しブラケツト15を支点ピンB
18を中心に回転し左方へ押す。ブラケツト15
の動きはブラケツト15に取り付けた検出板16
が検出器17に検出されることにより確認され、
その検出信号によりシリンダーA11が作動す
る。支点ピンA10を中心にレバー9はシリンダ
ーA11により回転軸11Aにおいて押し上げら
れる。レバー9の右端がシヨツクアブソーバー1
2の先端ピン13に当たるまではシリンダーA1
1の速度に上下シヤフト8及び吸着ピンセツト2
1の速度は比例するが、レバー9の右端が先端ピ
ン13に当たるとシヨツクアブソーバー12の働
きにより吸着ピンセツト21の速度は徐々に減少
していき、電子部品22をプリント基板23に実
装する時の衝撃の発生を減少させる。レバー9が
シヨツクアブソーバー12の先端部に設けられた
ストツパー14に当たると、レバー9及び上下シ
ヤフト8が停止するため吸着ピンセツト21の降
下速度はゼロとなる。なお、ストツパー14の取
付け位置をずらすことによりレバー9と当たる高
さを変えることができ、吸着ピンセツト21の下
降限の位置を変更でき、基板の厚さ、部品の高さ
の変化に対応することができる。 First, the suction tweezers 21 supply electronic components,
Electronic component 22 from the electronic component supply device for positioning
When the bracket 15 is attracted to a predetermined position on the printed circuit board 23, the cylinder B19 operates from the initial position of the bracket 15, and the bracket 15 is moved to the fulcrum pin B.
Rotate around 18 and push to the left. bracket 15
The movement is detected by the detection plate 16 attached to the bracket 15.
is confirmed by being detected by the detector 17,
The detection signal causes the cylinder A11 to operate. The lever 9 is pushed up on the rotating shaft 11A by the cylinder A11 around the fulcrum pin A10. The right end of lever 9 is the shock absorber 1.
Cylinder A1 until it hits the tip pin 13 of 2.
The upper and lower shafts 8 and the suction tweezers 2 are set at a speed of 1.
1 is proportional to the speed, but when the right end of the lever 9 hits the tip pin 13, the speed of the suction tweezers 21 gradually decreases due to the action of the shock absorber 12, and the impact when mounting the electronic component 22 on the printed circuit board 23 is reduce the occurrence of When the lever 9 hits the stopper 14 provided at the tip of the shock absorber 12, the lever 9 and the upper and lower shafts 8 stop, so that the descending speed of the suction tweezers 21 becomes zero. By shifting the mounting position of the stopper 14, the height at which it contacts the lever 9 can be changed, and the position of the lowering limit of the suction tweezers 21 can be changed to accommodate changes in the thickness of the board and the height of the component. I can do it.
発明の効果
以上のように本発明の実施例によれば、電子部
品の実装装置において、プリント基板上の任意の
高さより、実装ヘツドの降下速度を減少させるた
めの衝撃緩衝機構を備えることにより、プリント
基板上に電子部品が装着される時の降下速度をほ
とんどゼロに設定できるため装着時の衝撃を非常
に小さくすることができる。このように衝撃を小
さくできるため部品にかかる力が減少し、部品割
れ、位置ずれなどの問題を解消し、高信頼性、高
実装品質の電子部品を得ることができる効果を生
ずる。Effects of the Invention As described above, according to the embodiments of the present invention, an electronic component mounting apparatus is provided with a shock absorbing mechanism for reducing the descending speed of the mounting head from an arbitrary height above the printed circuit board. Since the descending speed when electronic components are mounted on the printed circuit board can be set to almost zero, the shock at the time of mounting can be extremely reduced. Since the impact can be reduced in this way, the force applied to the components is reduced, problems such as component cracking and misalignment are eliminated, and electronic components with high reliability and high mounting quality can be obtained.
第1図は従来の電子部品実用装置の実装ヘツド
装置の側面断面図、第2図は本発明の電子部品実
装装置の実装ヘツド装置の側面断面図、第3図は
第2図の平面図を示す。
8:上下シヤフト、9:レバー、10:支点ピ
ンA、11:シリンダーA、11A:回転軸、1
2:シヨツクアブソーバ、13:シヨツクアブソ
ーバの先端ピン、14:ストツパーブロツク、1
5:ブラケツト、16:検出板、17:検出器、
18:支点ピンB、19:シリンダーB、20:
実装ヘツドブラケツト、21:吸着ピンセツト、
22:電子部品、23:プリント基板。
FIG. 1 is a side sectional view of a mounting head device of a conventional electronic component practical equipment, FIG. 2 is a side sectional view of a mounting head device of an electronic component mounting device of the present invention, and FIG. 3 is a plan view of FIG. show. 8: Upper and lower shaft, 9: Lever, 10: Fulcrum pin A, 11: Cylinder A, 11A: Rotating shaft, 1
2: Shock absorber, 13: Shock absorber tip pin, 14: Stopper block, 1
5: bracket, 16: detection plate, 17: detector,
18: Fulcrum pin B, 19: Cylinder B, 20:
Mounting head bracket, 21: Suction tweezers,
22: Electronic components, 23: Printed circuit board.
Claims (1)
記レバーの左端は、垂直に上下動できるよう構成
した先端に吸着ピンセツトを具備する上下シヤフ
トの上部に、右端は右端より内側をシリンダーA
に連結し、前記シリンダーAの上下動で前記上下
シヤフトが上下できるよう構成し、一方、作動用
先端ピンを具備するシヨツクアブソーバーをブラ
ケツトに装着し、前記ブラケツトの下端を実装ヘ
ツドブラケツトに回転自在に軸支し、前記ブラケ
ツトとシリンダーBをブラケツトの軸支部とシヨ
ツクアブソーバーの中間において回転できるよう
軸支し、前記ブラケツトに検出板を、検出器を実
装ヘツドブラケツトに固定し、電子部品を供給、
位置決めする電子部品供給装置から電子部品を前
記吸着ピンセツトに吸着し、前記吸着ピンセツト
がプリント基板上の所定高に達するとシリンダー
Bを作動し、ブラケツトを左方に回転し、前記検
出器で前記検出板の位置を検出し、前記検出信号
でシリンダーAを作動し、レバーの右端を押し上
げ、レバー右端をアブソーバーの作動用端子ピン
に当接させ、吸着ピンセツトの降下速度を減少さ
せ、電子部品のプリント基板への装着時降下速度
をゼロとなるよう構成した電子部品実装装置の実
装ヘツド装置。1. A lever is rotatably supported in the center, and the left end of the lever is attached to the upper part of a vertical shaft which is configured to move up and down vertically and has suction tweezers at the tip, and the right end is attached to the cylinder A on the inside from the right end.
A shock absorber having an operating tip pin is attached to the bracket, and the lower end of the bracket is rotatably attached to the mounting head bracket. the bracket and the cylinder B are rotatably supported between the shaft support of the bracket and the shock absorber, a detection plate is fixed to the bracket, a detector is fixed to the mounting head bracket, and electronic components are supplied;
An electronic component is picked up by the suction tweezers from the positioning electronic component supply device, and when the suction tweezers reach a predetermined height above the printed circuit board, the cylinder B is actuated, the bracket is rotated to the left, and the detector detects the electronic component. The position of the plate is detected, the cylinder A is activated by the detection signal, the right end of the lever is pushed up, the right end of the lever is brought into contact with the operating terminal pin of the absorber, the descending speed of the suction tweezers is reduced, and the electronic parts are printed. A mounting head device for an electronic component mounting system configured so that the descending speed is zero when mounting onto a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59051319A JPS60195998A (en) | 1984-03-17 | 1984-03-17 | Mounting head unit for electronic part mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59051319A JPS60195998A (en) | 1984-03-17 | 1984-03-17 | Mounting head unit for electronic part mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60195998A JPS60195998A (en) | 1985-10-04 |
| JPH0582080B2 true JPH0582080B2 (en) | 1993-11-17 |
Family
ID=12883593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59051319A Granted JPS60195998A (en) | 1984-03-17 | 1984-03-17 | Mounting head unit for electronic part mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60195998A (en) |
-
1984
- 1984-03-17 JP JP59051319A patent/JPS60195998A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60195998A (en) | 1985-10-04 |
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