JPH0582976B2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a soldering device for, for example, a hybrid IC, and particularly to a DIP (Dual In-line Package).
The present invention relates to a device for soldering a hybrid IC substrate and leads temporarily clamped thereto.

(Prior Art) The configuration of a conventional soldering device of this type will be explained with reference to FIG. As shown in FIG. 1A, a substrate 2 with leads 1 sandwiched along both side edges is held by a chuck 3 of a soldering device. The chuck 3 is configured to be swingable around a horizontal axis, and holds the held substrate 2 at a predetermined angle. In this position, the chuck 3 and the substrate 2 are lowered relative to the solder bath 4 as shown in FIG. Further, by swinging the chuck 3 in the same direction at a certain angle, the entire lead sandwiched portion is immersed in the solder liquid, and the lead sandwiched portion is soldered.

(Problems to be Solved by the Invention) However, the conventional soldering device described above has the following problems.

That is, during soldering, since the lead 1 is immersed in solder liquid from the tip to the base, a large amount of flux adhering to the lead tip is rapidly heated, causing flux and solder particles to scatter and damage the board or the solder. As a result of the flux adhering to the leads, mounted electronic components or leads may become contaminated with flux.
This caused problems such as short circuits due to solder particles.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a soldering device that is less likely to cause problems such as contamination, oxidation, or short circuits of electronic components and leads mounted on a board. The purpose is

(Means for solving the problems) In order to achieve such an object, the present invention has the following features:
A soldering device is provided with a shaft disposed in a horizontal direction, a board that is swingably supported on the shaft, and a lead is sandwiched between the edges of the board on which an electronic component is mounted, and the lead. The integrated product is held by its lead portion, and is turned upside down by swinging from an upper swinging position in which the clamped part of the lead to the edge of the board is positioned upward, and then tilted at the reversed lower swinging position. The present invention is configured to include a swinging arm that positions the clamping portion at the lowermost end when the solder is in the lowermost position, and a solder tank that maintains the solder liquid level at a level that immerses the clamping portion located at the lowermost end.

(Function) The swing arm is tilted in the lower swing position, and the part of the lead that is clamped to the board is immersed in the solder liquid with the part that is clamped to the board as the lowest end, so that only that part of the lead is immersed in the solder liquid. It is avoided that the entire lead is immersed in the liquid.

(Example) Hereinafter, the present invention will be described in detail based on an example shown in the drawings. FIG. 1 is an explanatory diagram schematically showing the main parts of a soldering device according to an embodiment of the present invention.

In the figure, 10 is a DIP-type board to be soldered by the soldering apparatus of the present invention, and is made of, for example, a ceramic board, and has electronic components 11 and 1 on the front and back sides.
1' is implemented. Leads 12 and 12' are sandwiched in advance on this board 10 along both side edges in a board insertion step which is a step before the soldering step. That is, bifurcated clamping pieces are formed at the bases of the leads 12 and 12', and these clamping pieces sandwich the contacts provided along both side edges of the substrate 10.

On the other hand, 20 is a swing arm included in the soldering device according to this embodiment. The swinging arm 20 can swing vertically around a horizontal axis, and receives one of the left and right leads 12' of the board on one side 21 in the swinging direction, and swings the board with the leads in the left and right direction. Perform positioning. The swinging arm 20 is a plate-shaped body having a substantially rectangular shape, and its base is fitted onto a horizontal swinging shaft 22.

Reference numeral 30 denotes a lead receiver that receives the tips of both the left and right leads of the board and positions the leaded board in the height direction. This lead receiver 30 has a rectangular shape and is fixed to the side surface of the swing arm 20 so as to be perpendicular to the side surface thereof. By placing one lead on the lead receiver 30, it is possible to prevent the lead sandwiched between the substrates from falling out.

40 is a presser, and this presser 40 is
Swing arm 2 with lead receiver 30 attached
0 and the pin 41 at its base.
It is swingably supported with respect to the swing arm 20 by a bearing 42 and a bearing 42 . A tension coil spring 43 is provided between the presser 40 and the swing arm 20.
is interposed. The distal end of the presser 40 extends upward from a notch formed in the base of the lead receiving plate 30 and has a height substantially equal to the distal end of the swing arm 20 . The presser 40 is rotated around a pin 41 against a tension coil spring 43 by a rotation mechanism (not shown) such as a solenoid.
away from the swing arm 20.

50 is a so-called pumping type solder tank.
The height of the elevating container 51 of the solder tank 50 is set so that the lead clamping portion of the lowered board 10 is immersed in the solder liquid at its top dead center. has been done.

Next, the operation of the soldering device described above will be explained.

The substrate 10, whose lead clamping portions have been previously coated with flux, is placed on the lead receiver 30 with the leads facing downward so that one lead is sandwiched between the swinging arm 20 and the presser 40. . Board 1
0 is pressed against the side surface of the swing arm 20 by the urging force of the presser 40, thereby fixing the substrate 10 and positioning the substrate. One lead is placed on the swing arm 20 while standing up on the lead receiver 30.
Since the lengths of the leads 12 and 12' are constant, the position of the lead clamping portion with respect to the swing arm 20 is determined at a predetermined position.

After the substrate 10 is fixed, the swinging arm 20 starts and stops after traveling through a predetermined angle. The chain line in FIG. 1 indicates the stopped state, and in this state, the lead clamping portion on one side of the substrate 10 is located at the lowest end.

When the swinging arm 20 stops, the elevating container 51 of the solder tank 50 fills the container with the solder solution in the solder tank and rises. The lifting container 51 is stopped at the top dead center for a certain period of time, and during this period, the lead clamping portion of the board 10 is immersed in the solder liquid.

After the elevating container 51 is lowered, the swinging arm 20 swings in the opposite direction, returns to its original position, and then stops. In this way, soldering of one lead clamping portion of the board 10 is completed.

Soldering of the other lead clamping portion can be performed in the same manner as described above by placing the board 10 on the lead receiver 30 with the left and right directions reversed. Alternatively, another solder tank may be provided, and the other lead may be soldered by reversing the swinging arm.

In the above-described embodiments, the solder tank is described as being a pumped type solder tank, but the present invention is not limited to this, and other types of solder tanks may be used as long as the liquid level height can be accurately controlled. A solder bath can also be used.

Furthermore, as another example of application of the apparatus according to the present invention, by installing a flux tank in place of the solder tank, it is possible to realize a flux coating apparatus that can apply an appropriate amount of flux only to the lead clamping portion.

(Effects of the Invention) As described above, according to the soldering device according to the present invention, the swing arm is in an inclined state at the lower swing position, and the clamping position of the lead to the board is set at the lowermost end. Since the lead is immersed in the solder liquid, only that part of the lead is immersed in the solder liquid, avoiding immersion of the entire lead, compared to conventional equipment where the entire lead is immersed in the solder liquid. As a result, there is less scattering of flux and solder particles, and contamination and short circuits of electronic components, leads, etc. caused by this can be reduced.

In addition, since the entire lead is not immersed in the solder liquid, the amount of solder used can be reduced, and the solder liquid level required for soldering is small, so the solder tank can be made smaller. becomes possible.

[Brief explanation of the drawing]

FIG. 1 shows a hybrid system according to an embodiment of the present invention.
Explanatory diagram schematically showing the main parts of an IC soldering device, Part 2
The figure is an explanatory diagram of a conventional soldering device. 10... Board, 12, 12'... Lead, 20
...Swinging arm, 30...Lead receiver, 40...
... Holder, 50 ... Solder tank.

Claims (1)

[Scope of Claims] 1. A shaft disposed in a horizontal direction; a board that is swingably supported on the shaft and that has leads sandwiched between the edges of the board on which electronic components are mounted; and the leads. The integrated product is held by its lead portion, and the part that is clamped to the edge of the board is rotated upward from the upper swinging position, and the part is flipped from the upper swinging position to the reversed lower swinging position. a swinging arm that is tilted to position the clamping part at the lowest end; and a solder bath that maintains a solder liquid level at a height that immerses the clamping part located at the lowest end. Characteristic soldering equipment.