JPH0584038B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for welding and fixing a large number of contact pins to an electrical connection device in one process.

In order to improve the processing power of computers, semiconductor devices such as LSIs and ICs are becoming larger in capacity by making the unit elements smaller, but at the same time, the mounting methods are also being improved.

In other words, until now, semiconductor devices such as LSIs have had a package structure in which each chip is mounted on a small ceramic substrate with multilayer wiring and hermetically sealed. The mounting method used was to attach it to a through-hole in the hole.

However, in the future, a mounting method will be used in which multiple LSI chips are mounted on a multilayer wiring board made of ceramic or the like to create an LSI module, and then this is mounted as a replacement unit on a printed wiring board via an electrical connection device. .

In this case, the electrical connection device is fixed by a method such as soldering, while the LSI module is removable.

[Conventional technology]

The inventors are currently applying for an electrical connection device. (Application No. 58, Patent Application No. 64737 JP-A-59-
(No. 205170, request for examination filed June 11, 1959) Figure 2 shows a state in which an LSI module 2 is mounted on the electrical connection device 1 and the electrical connection device 1 is inserted and fixed into the printed wiring board 3. FIG.

That is, the electrical connection device (hereinafter simply referred to as the connection device) 1 according to the application has a large number of guide holes 4, each of which is filled with a low melting point metal 5, and a contact pin 6 is embedded in the lower part. The contact pin 6 is inserted into a through hole 7 of a printed wiring board and fixed by a method such as soldering.

On the other hand, the connecting pin 8 of the LSI module 2 is inserted into the guide hole 4 of the connecting device 1, and interconnected with the contact pin 6 via the low melting point metal 5.

In addition, the low melting point metal 5 filled in the guide hole 4
As a mechanism for melting the guide hole 4, a heater 9 is embedded surrounding the guide hole 4, and is configured to heat the guide hole 4 by supplying current through current terminals provided on both sides of the connecting device.

By energizing the heater 9 only when inserting or removing the LSI module 2 and melting the low melting point metal 5, insertion or removal can be performed with almost zero insertion or removal force.

Here, the contact pin 6 is connected to the second
The method of connecting to the connection board is to use contact pin 6.
After inserting the solder material for joining, for example, the melting point is
Methods such as injecting a gold-tin alloy (Au-20%Sn by weight) at 280°C in the form of solder paste, or forming it into a washer shape or ring shape and inserting it into the guide hole 4 are used. was.

However, in this embodiment, the guide holes 4 provided in the connecting device 1 have a small hole diameter of about 0.6 mm, and several thousand guide holes 4 are arranged in a matrix at a pitch of 1.27 mm.

Therefore, it is not easy to inject solder paste using a syringe, and it is necessary to consider the amount of solvent evaporation during the injection process in order to maintain a constant viscosity of solder paste in all guide holes. In addition, a special jig was used to insert the specially shaped solder, and the process took a long time.

For the above reasons, in the manufacturing process of connection devices, the pin-setting work of contact pins is the biggest bottleneck.
There was a need to streamline this work.

[Problem that the invention seeks to solve]

As described above, when forming a connecting device, there is a problem in that a large number of steps are required to fuse and fix a large number of contact pins to the connecting device.

[Means for solving problems]

The problem mentioned above is that the LSI is a combination of a first connection board and a second connection board equipped with contact pins.
In an electrical connection device used to attach a module to a printed wiring board while maintaining it in a state where it can be inserted and removed, the contact pins are fixed to a second connection board between the first connection board and the second connection board. After bonding, a contact pin is inserted into the metallized hole of the second connection board through the guide hole of the first connection board, and a solder ball and flux for bonding are supplied to the guide hole, and the solder for bonding is This problem can be solved by a contact pin welding method for an electrical connection device, which is characterized in that the ball is heated and melted to penetrate between the contact pin and the metallized hole.

[Effect]

The present invention uses a solder ball smaller than the diameter of the guide hole as a method to easily pin the pin to the connecting device, fills the guide hole by swinging the connecting device, and after filling, flux is applied to the surface of the connecting device. By applying the flux and then heating it, the flux flows down into the guide hole, producing the same effect as if it were injected.

In other words, the guide hole provided in the connecting device has a hole diameter of about 0.6 mm, as explained earlier, and this
The flux easily flows into the guide holes because they are arranged in a matrix with a pitch of 1.27 mm.

〔Example〕

FIG. 1 is an enlarged sectional view of a connecting device 1 for explaining the contact pin welding method according to the present invention, and the structure is the same as that in the application.

That is, the connecting device 1 has a first connection device made of ceramic.
The first connection board 11 and the second connection board 10 are connected by an adhesive layer 13, and the heater 9 is embedded in the adhesive layer 13.

Further, the guide hole 4 is provided through the first connection board 11, the adhesive layer 13, and the second connection board 10, and the second connection board 10 is provided with a hole as shown in the figure so that the contact pin 6 can be fixed by welding. The contact pin 6 has a T-shaped cross section and has a diameter of 0.3 mm in this example.
It is shaped so that it can be inserted.

Further, in the second adhesive board 10, a metallized layer 14 is provided around the guide hole 4 to enable solder fusion.

The method of implementing the present invention will be described as follows.

After bonding the first connection board 11 and the second connection board 10 via the adhesive layer 13 to form a substrate of the connection device, the contact pin 6 is inserted through the guide hole 4 and connected to the solder ball supply device. Set to .

Next, using this feeding device, a diameter of 0.4mm Au-
When solder balls 15 containing 20% Sn are poured onto the substrate, all the guide holes 4 are filled with the solder balls 15 by the swinging of the supply device, and unnecessary solder balls can be removed by sweeping the top.

FIG. 1 shows the state in which the guide holes 14 are filled with solder balls 15 in this manner.

Next, after applying rosin-based flux to the surface of the board of the connecting device, nitrogen (N ₂ ) was applied using a conveyor furnace.
When heated to 330 DEG C. in an air stream, the flux flows into the guide hole 4, and the Au--Sn alloy having a melting point of 280 DEG C. diffuses and permeates along the metallized layer 14, thereby performing solder welding.

According to experiments, the metallized layer 14 can be evenly coated with solder by applying vibration to the board of the connecting device held in a jig while it is being heated in a conveyor furnace.

As described above, according to the present invention, it is possible to easily perform the pin setting operation on the connecting device.

〔Effect of the invention〕

As described above, by carrying out the present invention, it is possible to easily perform the pin-setting work on the connecting device, which conventionally required a large number of man-hours, thereby making it possible to reduce the number of man-hours.

[Brief explanation of the drawing]

FIG. 1 is a partial cross-sectional view of a connecting device for explaining the present invention, and FIG. 2 is a partial cross-sectional view for explaining the attached state of the connecting device. In the figure, 1 is an electrical connection device, 4 is a guide hole, 5 is a low melting point metal, 6 is a contact pin, 9 is a heater, 10 is a second connection board, 11 is a first connection board, and 13 is an adhesive layer , 14 is a metallized layer, 1
5 is a solder ball.

Claims (1)

[Claims] 1. An electrical connection device consisting of a joined body of a first connection board and a second connection board equipped with contact pins and used to attach an LSI module to a printed wiring board while holding it in an insertable/removable state, After the contact pins are fixed to the second connection board by bonding the first connection board and the second connection board, the contact pins are fixed to the second connection board through the guide holes of the first connection board.
After inserting the contact pin into the metallized hole of the connection board, a bonding solder ball and flux are supplied to the guide hole, and the bonding solder ball is heated and melted to penetrate between the contact pin and the metallized hole. A method for welding contact pins of an electrical connection device, the method comprising: