JPH0585274B2 - - Google Patents
Info
- Publication number
- JPH0585274B2 JPH0585274B2 JP60094837A JP9483785A JPH0585274B2 JP H0585274 B2 JPH0585274 B2 JP H0585274B2 JP 60094837 A JP60094837 A JP 60094837A JP 9483785 A JP9483785 A JP 9483785A JP H0585274 B2 JPH0585274 B2 JP H0585274B2
- Authority
- JP
- Japan
- Prior art keywords
- output
- laser
- pulse
- workpiece
- constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
- H01S3/104—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation in gas lasers
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はレーザ加工装置に関し、特にレーザ加
工に最適なパルスレーザ光を得る構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a laser processing apparatus, and particularly to a structure for obtaining pulsed laser light optimal for laser processing.
従来のこの種の装置を操作するには、加工対象
物に応じてオペレータがレーザ出力値を所定値に
設定して加工するようにしていた。
To operate this type of conventional apparatus, an operator sets a laser output value to a predetermined value depending on the object to be processed.
この出力値を設定するには、レーザ光の平均出
力値、パルス周波数、パルス巾及び加工速度など
の諸因子を加工対象物に応じてその都度設定しな
ければならなかつた。 In order to set this output value, various factors such as the average output value of the laser beam, pulse frequency, pulse width, and machining speed must be set each time depending on the workpiece.
従来の装置では、加工対象物ごとにオペレータ
が経験と勘によつてレーザ加工装置の諸因子を所
定値に設定するようにしていたため、一旦諸因子
を設定すると、加工中、所定のエネルギ値をもつ
たパルスレーザ光によつて終始加工せざるを得
ず、加工部位の変化、外乱の影響などがあつても
これに対処することができず、良好な仕上精度を
得ることが困難であつた。
With conventional equipment, operators set the various factors of the laser processing device to predetermined values for each workpiece based on their experience and intuition, so once the various factors are set, the predetermined energy value is maintained during processing. Processing had to be done with a sluggish pulsed laser beam from start to finish, making it impossible to deal with changes in the machined area or the effects of external disturbances, making it difficult to obtain good finishing accuracy. .
本発明は叙上の問題点を解決するためになされ
たもので、加工対象物に応じてレーザ出力を設定
するとともに、加工途上の外乱に影響されること
なく最適なエネルギ値をもつたレーザ光を照射し
て加工することができるレーザ加工装置を得るこ
とを目的としている。 The present invention has been made to solve the above-mentioned problems, and it is possible to set the laser output according to the workpiece and to emit laser light with an optimal energy value without being affected by disturbances during processing. The objective is to obtain a laser processing device that can process by irradiating.
本発明は、加工対象物の加工速度に応じてパル
スレーザ光のパルス周波数を決定する手段を設け
るとともに、加工対象物の材質、板厚等のデータ
値によりパルスレーザ光のエネルギ値を最適値に
制御する手段を設けてレーザ加工装置を構成した
ものである。
The present invention provides means for determining the pulse frequency of the pulsed laser beam according to the processing speed of the workpiece, and also optimizes the energy value of the pulsed laser light based on data values such as the material and plate thickness of the workpiece. A laser processing apparatus is constructed by providing a control means.
本発明によれば、作業者が加工対象物の材質、
板厚等のデータ値と加工速度を設定することによ
つて加工に最適なエネルギ値をもつたパルスレー
ザ光を照射するとともに、外乱などの影響に対し
て、自動的にエネルギ値を補正制御して省エネル
ギ上優れた加工をすることができる。
According to the present invention, an operator can determine the material of the workpiece,
By setting data values such as plate thickness and machining speed, it irradiates pulsed laser light with the optimal energy value for machining, and also automatically corrects and controls the energy value in response to the effects of external disturbances. This enables superior machining in terms of energy savings.
以下実施第1図、第2図に示した実施例に基づ
いて本発明を説明する。図は本発明に係るレーザ
加工装置の要部を示す構成図で、図において、1
は加工対象物の加工速度指令信号Vf(第2図a)
を入力し、演算増幅回路IC1を用いた積分回路で
加工速度指令信号Vfを積分し、この積分電圧が
ある一定電圧になるとNゲートサイリスタが導通
しパルスを発生するようにして加工速度をパルス
周波数に変換しこれをパルス周波数指令信号V2
(第2図c)として出力するV/F変換回路、2
は加工対象物の材質、板厚等のデータ値に応じた
パルスレーザ光の出力値を設定指令する出力設定
指令信号VPとして入力し、この入力信号と出力
レーザ光の出力帰還量信号VPFとを比較して出力
帰還量の方が大なるとき定出力値信号|V3|(第
2図d)を小さくし、逆に出力設定指令信号VP
の方が大なるとき定出力値信号|V3|を大きく
して出力する比較器を備えた定出力演算回路、3
はV/F変換回路1の周波数指令信号V2がフリ
ツプフロツプのセツト信号として入力されかつパ
ルス巾制御回路4の出力電圧V6によりフリツプ
フロツプをリセツトすることによりパルス出力信
号を出力するパルス発生回路、4はパルス発生回
路3からのパルス出力信号V4(第2図e)を受け
一定の立上り時定数をもつた三角波信号V5(第2
図f)を発生するとともに、定出力演算回路2か
らの定出力信号V3の入力によつて決定されるタ
イミングでNゲートサイリスタを導通させフリツ
プフロツプにリセツト信号を送出させるパルス巾
制御回路である。かくしてパルス巾制御回路4か
らのリセツト信号の入力によつてパルス発生回路
3に発生したパルスは所定のパルス巾に制御され
て所定のエネルギ値をもつたパルスレーザ光とし
てパルス発生回路3から出力されるように構成さ
れている。
The present invention will be explained below based on the embodiment shown in FIGS. 1 and 2. The figure is a configuration diagram showing the main parts of the laser processing apparatus according to the present invention.
is the machining speed command signal V f of the workpiece (Fig. 2 a)
is input, the machining speed command signal V f is integrated by an integrating circuit using the operational amplifier circuit IC 1 , and when this integrated voltage reaches a certain voltage, the N-gate thyristor conducts and generates a pulse to control the machining speed. Convert it to a pulse frequency and convert it into a pulse frequency command signal V 2
(Figure 2 c) V/F conversion circuit outputs as 2
is input as the output setting command signal V P that commands the setting of the output value of the pulsed laser light according to data values such as the material and plate thickness of the workpiece, and this input signal and the output feedback amount signal V PF of the output laser light are input. When the output feedback amount is larger compared to
constant output arithmetic circuit equipped with a comparator that increases and outputs a constant output value signal |V 3 | when |V 3 |
4 is a pulse generation circuit which outputs a pulse output signal by inputting the frequency command signal V 2 of the V/F conversion circuit 1 as a set signal of the flip-flop and resetting the flip-flop with the output voltage V 6 of the pulse width control circuit 4; receives the pulse output signal V 4 (Fig. 2 e) from the pulse generation circuit 3 and receives the triangular wave signal V 5 (second wave signal) having a constant rising time constant.
This is a pulse width control circuit which generates the signal shown in FIG. In this way, the pulse generated in the pulse generation circuit 3 by inputting the reset signal from the pulse width control circuit 4 is controlled to have a predetermined pulse width, and is outputted from the pulse generation circuit 3 as a pulsed laser beam having a predetermined energy value. It is configured to
以上の構成を有するレーザ加工装置を用いて鋼
板を切断する場合について説明すると、鋼板の切
断速度を切断速度指令信号VfとしてV/F変換
回路1に入力するとともに、鋼板の材質、板厚等
のデータ値を出力設定指令信号VPとして定出力
演算回路2に入力する。するとV/F変換回路1
は切断速度に応じたパルス周波数指令信号V2と
してパルス発生回路3に対して出力すると、この
信号V2はフリツプフロツプのセツト信号として
入力し、パルス発生回路3においてパルスを発生
するとともに、パルス巾制御回路4に対してパル
ス出力信号V4を出力する。この出力信号V4はパ
ルス巾制御回路4で三角波信号V5となり、定出
力演算回路2から入力した定出力値信号V3によ
つてリセツト信号としてパルス発生回路3のフリ
ツプフロツプに送出される。パルス発生回路3に
発生したパルスは所定エネルギ値に制御された矩
形のパルスレーザ光として鋼板に照射されて、鋼
板を切断することになる。またこのとき、パルス
レーザ光は定出力演算回路2に出力帰還量信号
VPFとしてフイードバツクされ、定出力演算回路
2によつて出力設定指令信号VPと比較し、鋼板
の切断に最適なエネルギ値に補正されて定出力値
信号|V3|としてパルス巾制御回路4に送出す
ることになる。 To explain the case of cutting a steel plate using the laser processing device having the above configuration, the cutting speed of the steel plate is input to the V/F conversion circuit 1 as a cutting speed command signal V f , and the material, thickness, etc. The data value is input to the constant output calculation circuit 2 as the output setting command signal V P. Then, V/F conversion circuit 1
is output to the pulse generation circuit 3 as a pulse frequency command signal V 2 corresponding to the cutting speed. This signal V 2 is inputted as a flip-flop set signal, generates a pulse in the pulse generation circuit 3, and controls the pulse width. A pulse output signal V 4 is output to the circuit 4. This output signal V 4 becomes a triangular wave signal V 5 in the pulse width control circuit 4, and is sent to the flip-flop of the pulse generation circuit 3 as a reset signal in response to the constant output value signal V 3 inputted from the constant output calculation circuit 2. The pulses generated by the pulse generation circuit 3 are irradiated onto the steel plate as a rectangular pulsed laser beam whose energy is controlled to a predetermined energy value, thereby cutting the steel plate. Also, at this time, the pulsed laser beam sends an output feedback amount signal to the constant output calculation circuit 2.
It is fed back as V PF , compared with the output setting command signal V P by the constant output calculation circuit 2, corrected to the optimal energy value for cutting the steel plate, and sent as a constant output value signal |V 3 | to the pulse width control circuit 4. It will be sent to
また、加工速度指令信号Vfは、可変抵抗器等
の加工速度設定信号、あるいはタコジエネレータ
等の加工速度の帰還信号を用いても良いことは明
らかである。 Furthermore, it is clear that the machining speed command signal V f may be a machining speed setting signal from a variable resistor or the like, or a machining speed feedback signal from a tachogenerator or the like.
また各回路の構成については必ずしも上記実施
例に限定されるものではなく、同一の機能を有し
ておれば同効を奏し得られることは言うまでもな
い。 Further, the configuration of each circuit is not necessarily limited to the above embodiment, and it goes without saying that the same effect can be achieved as long as the circuit has the same function.
なお、上記実施例ではレーザ出力をフイードバ
ツクするものについて説明したが、放電電流を制
御するようにしてもよい。 In the above embodiment, the laser output is fed back, but the discharge current may also be controlled.
以上本発明に係るレーザ加工装置によれば、作
業者が加工対象物の材質、板厚等のデータ値と、
加工速度とを設定すれば、外乱の影響を受けるこ
となく、常に最適なエネルギ値と、加工速度に対
応した一定パルス周波数に設定されたパルスレー
ザ光を加工対象物に照射すると、加工速度に拘り
なく常に一定の加工精度を維持し、かつ、省エネ
ルギ上優れた効果を奏し得る。
As described above, according to the laser processing apparatus according to the present invention, the operator inputs data values such as the material and plate thickness of the workpiece,
If you set the machining speed, the workpiece will always be irradiated with a pulsed laser beam that is set to the optimal energy value and a constant pulse frequency that corresponds to the machining speed without being affected by disturbances, regardless of the machining speed. It is possible to maintain a constant machining accuracy at all times, and to achieve excellent energy saving effects.
第1図は本発明に係るレーザ加工装置を示す要
部構成図、第2図は各素子からの出力電圧波形を
示す図である。
図中、1はV/F変換回路、2は定出力演算回
路、3はパルス発生回路、4はパルス巾制御回路
である。
FIG. 1 is a block diagram of a main part of a laser processing apparatus according to the present invention, and FIG. 2 is a diagram showing output voltage waveforms from each element. In the figure, 1 is a V/F conversion circuit, 2 is a constant output calculation circuit, 3 is a pulse generation circuit, and 4 is a pulse width control circuit.
Claims (1)
を加工するレーザ加工装置において、上記対象物
の加工速度によりパルス周波数を決定指令する周
波数指令手段と、該対象物の材質、板厚等のデー
タ値によりレーザ光の出力値を演算し設定指令す
る定出力設定手段と、上記周波数指令手段の指令
と定出力設定手段の指令とにより、1パルス当り
のレーザ出力を一定にした状態で、加工速度の変
化に対応してパルス周波数とレーザ光の出力値
(平均値)を制御するパルス制御手段とを備えた
ことを特徴とするレーザ加工装置。 2 上記周波数指令手段をV/F変換回路として
構成したことを特徴とする特許請求の範囲1項記
載のレーザ加工装置。 3 上記定出力設定手段としてレーザ出力値のフ
イードバツク信号と加工対象物に即した演算出力
とを比較してレーザ出力値を補正制御する比較器
を備えたことを特徴とする特許請求の範囲第1項
又は第2項に記載のレーザ加工装置。[Scope of Claims] 1. A laser processing device that processes a workpiece by irradiating laser light as a pulse wave, comprising: a frequency command means for determining and commanding a pulse frequency based on a processing speed of the workpiece; a material of the workpiece; A constant output setting means for calculating and setting the output value of the laser beam based on data values such as plate thickness, and a command from the frequency command means and a command from the constant output setting means to keep the laser output per pulse constant. 1. A laser processing device comprising: pulse control means for controlling a pulse frequency and an output value (average value) of a laser beam in response to changes in processing speed. 2. The laser processing apparatus according to claim 1, wherein the frequency command means is configured as a V/F conversion circuit. 3. Claim 1, characterized in that the constant output setting means includes a comparator that compares a feedback signal of the laser output value with a calculation output according to the workpiece to correct and control the laser output value. The laser processing device according to item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60094837A JPS61253877A (en) | 1985-05-02 | 1985-05-02 | Laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60094837A JPS61253877A (en) | 1985-05-02 | 1985-05-02 | Laser processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61253877A JPS61253877A (en) | 1986-11-11 |
| JPH0585274B2 true JPH0585274B2 (en) | 1993-12-06 |
Family
ID=14121155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60094837A Granted JPS61253877A (en) | 1985-05-02 | 1985-05-02 | Laser processing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61253877A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992190A (en) * | 1982-11-15 | 1984-05-28 | Amada Co Ltd | Laser working device |
-
1985
- 1985-05-02 JP JP60094837A patent/JPS61253877A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61253877A (en) | 1986-11-11 |
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