JPH0586313B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a processing device for attaching an IC package to a printed wiring board using high-heat wires emitted from a heat source lamp. Furthermore, during processing, the IC leads are properly aligned with the leads of the printed wiring board, and the IC package is evenly pressed against the printed wiring board so that the leads can be soldered in an appropriate state without shifting their positions. The present invention relates to an IC package pressing device that enables attachment of IC packages.

Conventional technology As LSIs become larger every year, the number of ICs with many leads is rapidly increasing. For example, processing equipment that uses lasers is known as a soldering processing equipment for connecting smaller flat-type IC packages (hereinafter sometimes referred to as flat ICs) to printed wiring boards. [Light Metal Welding Vol. 17 (1979) No. 1] Problems to be Solved by the Invention However, since the above-mentioned device requires optical equipment, the device is large and extremely expensive. Furthermore, soldering a small flat IC with an extremely large number of leads and narrow lead spacing is extremely troublesome, and when the laser beam is irradiated onto the processed area, a slight external impact is applied to the processed area. However, the problem was that the alignment between the leads of the flat IC and the leads of the printed wiring board was misaligned, which had a significant negative effect on the connection. Furthermore, since the thermal energy of laser beams is very high, printed wiring boards are limited to heat-resistant materials. However, recently,
In order to reduce costs, printed wiring boards are made of paper phenol material, etc., so the printed wiring boards cannot withstand the high temperatures caused by the laser beam as described above, and the entire board deforms, causing damage to the board. It had the drawback of losing functionality.

As mentioned above, in order to enable anyone to easily perform soldering with an extremely large number of leads and narrow lead spacing without requiring special skill, the present invention utilizes the hot rays of a heat source lamp. This allows soldering to be carried out using the following method. The purpose of the present invention is to prevent the leads of the printed wiring board and the leads of the IC package from being misaligned once they are aligned with each other to be connected to each other.
To provide an IC package pressing device which enables reliable soldering by automatically and evenly pressurizing the entire IC package against a printed wiring board.

Another object of the present invention is to prevent deterioration of performance of a printed wiring board by preventing it from being adversely affected by heat, even if the printed wiring board is made of paper phenolic material or other similar materials of relatively poor quality. An object of the present invention is to provide an IC package pressing device that can press an IC package.

Means for Solving the Problems In order to solve the various problems as described above, according to the present invention, a holder is attached to the first element that is moved up and down by the first actuation mechanism, and a holding arm is attached to the holder. A heat source unit consisting of a heat source lamp is suspended so that it can be adjusted and held at any angle via the heat source lamp, and the high heat rays emitted from the heat source lamp are irradiated from an inclined direction onto the workpiece part to solder the workpiece part. The device comprises: an air rod that moves relatively vertically within the holder; a compressor that supplies air to the air rod; a second actuation mechanism that moves the holder up and down together with a second element; a plate whose center portion is removably attached to the air rod; a plurality of guide tubes provided on the plate; and a pressing rod housed in each of these guide tubes so as to be movable up and down and subjected to a spring action; It is an object of the present invention to provide an IC package pressing device for a soldering processing device, which is characterized in that these pressing rods are configured to apply pressure evenly to appropriate locations on a processed part.

Embodiment FIG. 1 shows the main parts of a soldering processing device partially in cross section. In the figure, 1 is a first actuating mechanism, and the mechanism 1 is comprised of pneumatic or hydraulic means, and in this example is pneumatic means. The first actuation mechanism 1 is fixed to a fixed plate 2. The cylinder rod 3 of the first actuating mechanism 1 is fixed to one end of the first element 4 actuated by the first actuating mechanism 1. 1st
A holder 5 is fixed to the other end of the element 4. The holder 5 has a substantially concave cross section, and a guide tube 6 is fitted inside the holder 5.
A guide hole 7 is formed through the center of the guide tube 6 along the axial direction. At the lower end of the holder 5, there is a pair of holding arms 8, which are spaced apart by 180°.
9 is attached diagonally downward. Heat source units 12 and 13 are attached to the free ends of arms 8 and 9 by holding shafts 10 and 11, respectively, so that they can be adjusted to arbitrary angles. The heat source units 12 and 13 include heat source bodies 14 and 15,
The bodies 14, 15 have reflective surfaces 16, 17 inside thereof.
It is equipped with 18 and 19 are heat source lamps;
20 and 21 are the hot wires. These hot wires 2
0 and 21 to solder the workpiece. In this example, the workpiece is printed wiring board 2.
2 and IC package 23. heat rays 20, 21
The focal width W can be freely changed around the holding shafts 10 and 11. The focal width W is changed according to the width of the part to be soldered. The distance between the pair of heat source units 12 and 13 is easily adjusted by an adjusting element 24.
That is, when the heat source units 12 and 13 come into contact with the outer peripheral surface of the adjusting element 24, the distance between them is determined. Therefore, by appropriately selecting adjusting elements 24 having different outer diameters, the focal width W can also be changed appropriately. The adjusting element 24 is detachably attached to the intermediate cylinder 25 by screw connection. The adjusting element 24 has a through hole 26 in its center, and an air rod 27 passes through the through hole 26 so as to be able to move up and down relatively. The intermediate cylinder 25 is detachably attached to the holder 5 by screw connection. The air rod 27 is formed hollow inside, and cooling air is passed through the hollow passage 28. A nozzle 29 is detachably attached to the lower end of the air rod 27 by means of a screw connection. A plate 30 is screwed into the nozzle 29 and is attached by a nut 31. The plate 30 has a square plane,
The upper ends of the housing tubes 32 are attached to each of its four corners. Inside these housing tubes 32, a large diameter housing portion 33 and a through hole 34 communicating with the housing portion 33 are formed. A presser bar 35 is housed in the housing portion 33 and extends to the outside from the through hole 34. The heads 36 of the presser rods 35 are each pressed by a presser spring 37 housed in the accommodating portion 33. The upper end of the presser spring 37 is located at the housing portion 33
The strength of the spring force is adjusted by a spring adjustment screw 38 screwed into the opening. The four presser bars 35 are arranged at equal intervals with the nozzle 29 at the center (see FIG. 3). By arranging the presser bars 35 at equal intervals in this way, the presser bars 35
Each part of the IC package 23 can be equally pressurized, so that the leads of the IC package 23 are pressed against the leads of the printed wiring board with equal pressure.

The upper end of the air rod 27 is connected to the first branch pipe 3.
9 is airtightly attached. The first branch tube 39 is provided in the connection tube 40 . A second branch pipe 41 is provided on the connection pipe 40, and one end of an air supply pipe 42 is airtightly attached to the second branch pipe 41.
The other end is connected to a compressor (not shown). The air sent from the compressor can also be cooled if necessary. The supply pipe 42 and the air rod 27 are communicated via a communication path 43. The connecting tube 40 is provided with a mounting tube 44.
An actuating rod 46 of a second actuating mechanism 45 is attached to. The second actuation mechanism 45 also has the same configuration as the first actuation mechanism 1 described above. The second actuation mechanism 45 is fixed to the second element 47. Therefore, by moving the actuation rod 46 up and down, the air rod 27 is also moved up and down together with it.

Operation The operation of connecting the leads 22a of the printed wiring board 22 and the leads 23a of the IC package 23 using the above device will be explained. First, the IC package 23 to be connected is placed on the printed wiring board 22, and its leads 22a and 23a are aligned. That is, the leads of the IC package are aligned over the leads of the printed wiring board to be connected. Once the respective leads to be connected to each other have been aligned in this way, the second actuating mechanism 45 lowers the actuating rod 46. Then, the connecting tube 40 is also lowered, and the air rod 27 is lowered within the guide hole 7 and the adjusting element 24. As the rod 27 is lowered, the plate 30 is also lowered at the same time. Therefore, the lower end of the presser bar 35 is connected to the IC package cage 23.
The corners of each are pressurized against the force of the spring 37. This pressure is applied to each lead 22a because the spring force applied to the presser bar 35 is automatically adjusted according to the pressure conditions of the pressure section.
and 23a are evenly pressed together. In this state, the rod 3 of the first actuating mechanism 1 is lowered.
Then, the first element 4 is lowered and the holder 5
is also lowered. This lowering causes heat source unit 1 to
2 and 13 were also lowered at the same time. In this case, the corner portions 12a and 13a of the heat source units 12 and 13 are brought into contact with the circumferential surface of the adjusting element 24. Thereby, the width "W" of the hot wires 20, 21 emitted from the heat source units 12, 13 is made to match the processing width "W1" (see FIG. 3) to be connected to each other. Therefore, by changing the outer diameter dimension of the adjusting element 24, the above-mentioned hot wire width "W" can be changed. From this, it can be understood that
The outer diameter dimension and processing width "W1" of the adjusting element 24 are determined in advance, and the heating wire width is adjusted by selecting the adjusting element 24. Therefore, when the heat source lamps 18 and 19 are turned on, the heat rays are reflected by the reflective surfaces 16 and 17 and become strong heat rays 20 and 21, which are irradiated onto the processing part. The processed parts to be connected to each other are instantaneously connected by the hot wires 20 and 21. With the termination of this connection, air is supplied from the compressor,
It is introduced from the air rod 27 into the nozzle 29 and sprayed onto the upper surface of the IC package 23 from the nozzle. This forces the IC package to cool down. After a certain period of time has elapsed, the air supply may be stopped. In this way, the connection processing of the processed parts may be sequentially performed.

Further, in the present invention, the holding device can also be configured as shown in FIGS. 4 and 5. That is, the holding cylinder 48 is removably fitted into the nozzle 29 and attached to the nozzle 29 with screws 49. The plate 30 is fixed to the holding cylinder 48. The plate 30 is formed into a rectangular shape, and the above-mentioned holding cylinder 48 is provided in the center between both ends thereof. The upper end of a housing cylinder 32 is fitted and attached to both ends of the plate 30. A spring 37 is installed inside the housing cylinder 32.
is accommodated, and the spring 37 is in a state of applying an acting force to the presser bar 35. In the case of this embodiment, the height position of the presser bar 35 can be freely changed by changing the mounting position of the holding cylinder 48 with respect to the nozzle 29. Furthermore, since there are two presser bars 35 in this embodiment, this is used when a workpiece has leads in two directions. That is, the printed wiring board 22B has leads 22c at the upper and lower ends in FIG. 5, and the IC package 23B has leads 23c at the upper and lower ends in FIG. Further, since the operation of this embodiment can be easily inferred from the previous embodiment, the explanation thereof will be omitted.

Effects of the Invention As explained above, the present invention includes an air rod that moves relatively vertically within a holder;
A compressor that supplies air to the air rod, a second operating mechanism that moves the holder up and down together with the second element, a plate whose center portion is removably attached to the air rod, and a The structure includes a plurality of guide tubes, a presser rod that is housed in each of these guide tubes so as to be able to move up and down and receives a spring action, and these presser rods apply pressure evenly to appropriate parts of the workpiece, so the lead Even in the case of a soldering process in which there are a large number of leads and the lead spacing is narrow, anyone can easily perform the soldering process without requiring any special skill. In addition, once the leads of the printed wiring board and the leads of the IC package that are to be connected to each other have been aligned, the entire IC package is automatically and evenly pressed against the printed wiring board using a holding bar to prevent the leads from shifting. Since soldering is performed with the pressurized leads in close contact, a reliable connection can be made without any connection defects. Furthermore,
Even if the printed wiring board is made of paper phenolic material or similar relatively poor quality material,
Unlike laser beams, it is also possible to prevent performance deterioration due to adverse thermal effects caused by hot rays.

[Brief explanation of the drawing]

The drawings show embodiments of the present invention.
The figure is a longitudinal sectional view of the device, FIG. 2 is a partially enlarged sectional view of the main part of the device, FIG. 3 is an explanatory diagram showing the relationship between the presser bar and the workpiece, and FIG. 4 is a modification of the presser bar. FIG. 5 is a plan view thereof. Explanation of symbols, 1...first operating mechanism, 4...first
Element, 5... Holder, 8, 9... Holding arm, 12, 13... Heat source unit, 18, 19
... Heat source lamp, 22, 23 ... Processed parts, 27
...Airrod, 30...Plate, 32...
Guide tube, 33...accommodating section, 35...presser bar,
37... Holder spring, 45... Second actuation mechanism, 4
7...Second element.

Claims (1)

[Claims] 1. A holder is attached to the first element that is moved up and down by the first actuation mechanism, and a heat source unit consisting of a heat source lamp is suspended from the holder via a holding arm so that it can be adjusted and held at any angle. An apparatus for soldering a processed part by irradiating the emitted high-heat rays onto the processed part of the processed part from an inclined direction, and an air rod that moves relatively vertically within the holder;
A compressor that supplies air to the air rod, a second operating mechanism that moves the holder up and down together with the second element, a plate whose center portion is removably attached to the air rod, and a a plurality of guide tubes, a pressing rod that is accommodated in each of these guide tubes so as to be able to move up and down and is subjected to a spring action;
An IC package pressing device for a soldering processing device, characterized in that these pressing rods are configured to apply pressure evenly to appropriate locations on a processed part.