JPH05863B2 - - Google Patents

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention relates to a semiconductor module and its manufacturing method, and is particularly applicable to the structure of an electrode terminal plate from which electrode pads of a circuit board are led out and its manufacturing method. It is something that will be done.

(Prior Art) Conventionally, there is a semiconductor module having a structure shown in a top view in FIG. 3 and in a sectional view in FIG. 4. In the figure, 101 is a case molded with synthetic resin such as epoxy resin and forms the side surface of the envelope, 102 is a heat dissipation plate, such as a chrome-plated copper plate, which is attached to the case and forms the bottom surface, and 103 is a case made of chrome-plated copper plate. A terminal holding plate made of, for example, epoxy resin is disposed on the top surface of the main electrode terminal plate 104a and a sub-electrode terminal plate 104b, and these terminal plates are disposed on the bottom surface with their ends protruding into the envelope. Electrode lead pad 105a on the circuit board 105,
It is soldered to 105b. Each of the electrode terminal plates 104a and 104b has a structure in which the electrode terminal plates 104a and 104b penetrate through the terminal holding plate 102 and are sealed, and one in which only an opening into which the electrode terminal plate is inserted is provided.

Note that a filling resin 106 such as a fluid epoxy resin containing a hardening agent is sealed in the envelope, and is further hardened by heating to form a semiconductor module product.

(Problem to be Solved by the Invention) Each of the electrode terminal plates sealed to the terminal holding plate is formed in advance so as to be soldered to correspond to the electrode lead-out pads on the circuit board in the envelope. Since the electrode terminal plates are arranged in a predetermined arrangement and then resin molded, it is quite difficult to maintain the orientation of the electrode terminal plates at this time. Furthermore, it becomes even more difficult when the number of terminals increases, the wiring becomes complicated, and there are parts where circuits intersect, resulting in serious problems such as frequent bending and deformation of the terminals.

Note that the method of fixing the electrode terminal plate in the fixed position in advance by soldering it to the electrode lead-out pad of the circuit board without sealing the electrode terminal plate to the terminal holding plate is to fix the electrode terminal plate in the fixed position on the terminal holding plate. There are many problems in fitting a terminal holding plate provided with an opening for insertion, and there is also a problem of airtightness due to the gap in the insertion part. Furthermore, the flatness of the soldered joint portion of the electrode terminal plate may be difficult to obtain due to the gap.

The present invention relates to a structure of a terminal holding plate and an electrode terminal plate in a semiconductor module and a method for manufacturing the same in order to improve the above-mentioned conventional problems. The purpose is to facilitate the assembly of objects with intersecting shapes.

[Structure of the invention]

(Means for Solving the Problems) A semiconductor module according to the present invention has a terminal holding plate forming a part of an envelope of the semiconductor module, which is sealed by penetrating the terminal holding plate, and one end thereof is outside the envelope. The main electrode terminal board is connected to the main electrode pad of the circuit board at the other end inside the envelope, and the main electrode terminal board is sealed by penetrating the terminal holding plate and one end is outside the envelope. A first terminal plate of a sub-electrode is formed so that it becomes a sub-electrode terminal and the other end protrudes into the inside of the envelope, and a connection portion with a connecting rod protrudes, and one end is formed into an opening shallower than the thickness of the terminal holding plate. The second terminal plate of the sub-electrode is inserted and fixed, and the connecting portion with the connecting rod is made to protrude, and the other end is connected to the sub-electrode pad of the circuit board, and the sub-electrode second terminal plate is conductively connected to each of the connecting portions of the two sub-electrode terminal plates. It is characterized by comprising a sub-electrode terminal plate consisting of a connecting rod. Next, the method for manufacturing a semiconductor module according to the present invention is characterized in that a plurality of sub-electrode terminal plates are connected by a connecting rod.
When connecting the connecting rod in the semiconductor module with the connecting part protruding from the sub-electrode terminal plate, the connecting rod is inserted into the opening provided in the connecting part of the sub-electrode terminal plate and "crimped", and then soldered. It is characterized by including a step of applying.

(Function) Regarding the structure of the terminal holding plate and the electrode terminal plate, the semiconductor module according to the present invention does not forcefully seal all the electrode terminal plates at once when the lead terminals intersect on a plane in a complex circuit. , only the electrode terminal plate that can be easily molded is sealed, and for other terminals, a hole is provided in the terminal holding plate that does not penetrate this, and only the portion of the terminal that will be soldered to the semiconductor holding board later is inserted through this hole, A sealed and molded terminal is one that is applied with a connecting rod. As a result, a terminal holding plate for a semiconductor module having a complicated and intersecting circuit can be obtained easily and at low cost. That is, the shape of the terminal forming part is simple, there is little bending or deformation during molding, and the height dimension of the terminal board can be easily obtained.

(Example) Next, an example of the first invention will be described with reference to FIGS. 1 to 3. In addition, in the explanation,
Portions that are the same as those of the prior art are shown with the same reference numerals in the drawings, and their explanation will be omitted.

FIG. 3, which shows a top view of this semiconductor module, is unchanged from the conventional one, and the main electrode terminal plate is also the same as the conventional sealed one.
The sub-electrode terminal plate 1 shown in the figures and FIG. 2 will now be described. This sub-electrode terminal plate is
It consists of parts.

First, 2 in the figure is the sub-electrode first terminal plate, the part that penetrates the terminal holding plate 103 and is sealed and protrudes to the outside of the envelope is the sub-electrode terminal 2a, and the part that protrudes into the inside of the envelope. A connecting portion 2b for connection with a connecting rod 4, which will be described next, is provided protruding from the side. Further, 3 in the figure is a sub-electrode second terminal plate, one end 3a of which is fitted and fixed into an opening 103a that is shallower than the thickness of the terminal holding plate 103, that is, at a depth that does not penetrate through it. The other end 3b is soldered to the sub-electrode pads 105a, 105b, . Further, the connecting rod 4 connecting between the first and second sub-electrode terminal plates 2 and 3 has one end 4a connected to the connecting portion 2b of the first sub-electrode terminal plate 2.
, the connection portion 3c of the second sub-electrode terminal plate 3 is connected to the other end 4b.
They are each "crimped" and then soldered together.

Next, an embodiment of the second invention will be described with reference to the drawings. For example, as shown in FIGS. 1 to 3, the sub-electrode first terminal plate 2 to be electrically connected
Both ends 4a and 4b of the connecting rod 4 are inserted into the notch-shaped openings of the connecting portions 2b and 3c provided in a protruding manner on the second terminal plate 3 of the sub-electrode, respectively, and ``crimped''. Next, a strong conductive connection is achieved between both sub-electrode terminal plates by performing solder joints including the caulked portions.

〔Effect of the invention〕

According to the present invention, a terminal holding plate for a semiconductor module having a complicated circuit and terminals crossing each other can be provided at low cost.
And it's easy to do. Therefore, no matter how complex the circuit is, it can be formed as long as there is an opening for insertion into the terminal holding plate, and there are fewer parts with complicated terminal shapes, which has the advantage of reducing bending and deformation during molding and improving yield. . Furthermore, since the terminal plate is fitted into the opening, the height dimension can be increased easily, and there is no problem with airtightness. Furthermore, since the shape of the terminal can be easily made, press costs and mold costs are low, and
It also has the advantage of reducing deformation due to plating and the like.

Next, in the manufacturing method of the present invention, when making a conductive connection between both sub-electrode terminal plates using a connecting rod, the end of the connecting rod is first ``caulked'' onto the connecting portion provided on the sub-electrode terminal plate. '' has the advantage of being easier to work with and stronger than the conventional simple solder connection.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a semiconductor module according to an embodiment of the present invention, FIG. 2 is a perspective view showing the configuration of the sub-electrode terminal plate of FIG. 1, FIG. 3 is a top view of the semiconductor module, and FIG. 4 is a top view of the semiconductor module. FIG. 2 is a cross-sectional view of a conventional semiconductor module. 1 ... Sub-electrode terminal plate, 2... Sub-electrode first terminal plate, 3... Sub-electrode second terminal plate, 4... Connection rod, 2b, 3c... Connection portion, 103... Terminal holding plate, 105 ...Circuit board.

Claims (1)

[Claims] 1. A terminal holding plate forming a part of the envelope of the semiconductor module is sealed by penetrating the terminal holding plate, with one end being outside the envelope and serving as the main electrode terminal, and the other end being a main electrode terminal. A main electrode terminal plate is connected to the main electrode pad of the circuit board inside the envelope, and a main electrode terminal plate is sealed through the terminal holding plate, with one end serving as a sub-electrode terminal outside the envelope, and the other end being outside the envelope. A sub-electrode first terminal plate having a protruding connection portion with a connection rod protruding inside the enclosure and one end thereof are inserted into an opening shallower than the plate thickness of the terminal holding plate and fixed, and the connection rod is connected with the connection rod. A sub-electrode second terminal plate having a protruding connection part and connected to a sub-electrode pad of a circuit board at the other end, and a sub-electrode terminal plate comprising a connecting rod conductively connected to each connection part of both sub-electrode terminal plates. A semiconductor module characterized by: 2. In the semiconductor module according to claim 1, in which a plurality of sub-electrode terminal plates are connected by a connecting rod, the connecting rod and the connecting portion of the sub-electrode terminal plate are connected,
A method for manufacturing a semiconductor module, comprising the steps of inserting a connecting rod into an opening provided in a connecting portion protruding from a sub-electrode terminal plate, ``caulking'' the connecting rod, and then performing soldering.