JPH058735B2 - - Google Patents
Info
- Publication number
- JPH058735B2 JPH058735B2 JP2251085A JP2251085A JPH058735B2 JP H058735 B2 JPH058735 B2 JP H058735B2 JP 2251085 A JP2251085 A JP 2251085A JP 2251085 A JP2251085 A JP 2251085A JP H058735 B2 JPH058735 B2 JP H058735B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- resin
- water
- bis
- hydroxyphenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001225 polyester resin Polymers 0.000 claims description 25
- 239000004645 polyester resin Substances 0.000 claims description 25
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 17
- 150000005846 sugar alcohols Polymers 0.000 claims description 14
- SCBGJZIOPNAEMH-UHFFFAOYSA-N 2,2-bis(4-hydroxyphenyl)acetic acid Chemical class C=1C=C(O)C=CC=1C(C(=O)O)C1=CC=C(O)C=C1 SCBGJZIOPNAEMH-UHFFFAOYSA-N 0.000 claims description 11
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 37
- 239000011347 resin Substances 0.000 description 37
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 23
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 12
- IHFQGEDFEXGPFR-UHFFFAOYSA-N 5-[4-(4-heptylbenzoyl)phenyl]pentanoic acid Chemical compound C1=CC(CCCCCCC)=CC=C1C(=O)C1=CC=C(CCCCC(O)=O)C=C1 IHFQGEDFEXGPFR-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 150000007519 polyprotic acids Polymers 0.000 description 8
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical group C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- -1 durability Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000003513 alkali Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- XQXPVVBIMDBYFF-UHFFFAOYSA-M 4-hydroxyphenylacetate Chemical compound OC1=CC=C(CC([O-])=O)C=C1 XQXPVVBIMDBYFF-UHFFFAOYSA-M 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- FQORROGUIFBEFC-UHFFFAOYSA-N OC(=O)C1=CC([Na])=CC(C(O)=O)=C1S(O)(=O)=O Chemical compound OC(=O)C1=CC([Na])=CC(C(O)=O)=C1S(O)(=O)=O FQORROGUIFBEFC-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- JQRRFDWXQOQICD-UHFFFAOYSA-N biphenylen-1-ylboronic acid Chemical compound C12=CC=CC=C2C2=C1C=CC=C2B(O)O JQRRFDWXQOQICD-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- LNGJOYPCXLOTKL-UHFFFAOYSA-N cyclopentane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C1 LNGJOYPCXLOTKL-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- JARIJYUQOKFVAJ-UHFFFAOYSA-M sodium;4-carboxy-2-sulfobenzoate Chemical compound [Na+].OC(=O)C1=CC=C(C([O-])=O)C(S(O)(=O)=O)=C1 JARIJYUQOKFVAJ-UHFFFAOYSA-M 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- ORTVZLZNOYNASJ-UPHRSURJSA-N (z)-but-2-ene-1,4-diol Chemical compound OC\C=C/CO ORTVZLZNOYNASJ-UPHRSURJSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GBURUDXSBYGPBL-UHFFFAOYSA-N 2,2,3-trimethylhexanedioic acid Chemical compound OC(=O)C(C)(C)C(C)CCC(O)=O GBURUDXSBYGPBL-UHFFFAOYSA-N 0.000 description 1
- FQXGHZNSUOHCLO-UHFFFAOYSA-N 2,2,4,4-tetramethyl-1,3-cyclobutanediol Chemical compound CC1(C)C(O)C(C)(C)C1O FQXGHZNSUOHCLO-UHFFFAOYSA-N 0.000 description 1
- GZZLQUBMUXEOBE-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diol Chemical compound OCCC(C)CC(C)(C)CO GZZLQUBMUXEOBE-UHFFFAOYSA-N 0.000 description 1
- JHSWSKVODYPNDV-UHFFFAOYSA-N 2,2-bis(prop-2-enoxymethyl)propane-1,3-diol Chemical compound C=CCOCC(CO)(CO)COCC=C JHSWSKVODYPNDV-UHFFFAOYSA-N 0.000 description 1
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 1
- PFHTYDZPRYLZHX-UHFFFAOYSA-N 2-(2,5-dihydroxyphenyl)benzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=2C(=CC=C(O)C=2)O)=C1 PFHTYDZPRYLZHX-UHFFFAOYSA-N 0.000 description 1
- YATYDCQGPUOZGZ-UHFFFAOYSA-N 2-(2-hydroxypropoxy)propan-1-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(O)COC(C)CO YATYDCQGPUOZGZ-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- BUYHVRZQBLVJOO-UHFFFAOYSA-N 2-ethyl-2,4-dimethylhexane-1,3-diol Chemical compound CCC(C)C(O)C(C)(CC)CO BUYHVRZQBLVJOO-UHFFFAOYSA-N 0.000 description 1
- QNKRHLZUPSSIPN-UHFFFAOYSA-N 2-ethyl-2-(2-methylpropyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CC(C)C QNKRHLZUPSSIPN-UHFFFAOYSA-N 0.000 description 1
- LZDXRPVSAKWYDH-UHFFFAOYSA-N 2-ethyl-2-(prop-2-enoxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)COCC=C LZDXRPVSAKWYDH-UHFFFAOYSA-N 0.000 description 1
- IGDCJKDZZUALAO-UHFFFAOYSA-N 2-prop-2-enoxypropane-1,3-diol Chemical compound OCC(CO)OCC=C IGDCJKDZZUALAO-UHFFFAOYSA-N 0.000 description 1
- RAADBCJYJHQQBI-UHFFFAOYSA-N 2-sulfoterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(S(O)(=O)=O)=C1 RAADBCJYJHQQBI-UHFFFAOYSA-N 0.000 description 1
- RGUZWBOJHNWZOK-UHFFFAOYSA-N 3,6-dimethylbenzene-1,2-diol Chemical compound CC1=CC=C(C)C(O)=C1O RGUZWBOJHNWZOK-UHFFFAOYSA-N 0.000 description 1
- FYRWKWGEFZTOQI-UHFFFAOYSA-N 3-prop-2-enoxy-2,2-bis(prop-2-enoxymethyl)propan-1-ol Chemical compound C=CCOCC(CO)(COCC=C)COCC=C FYRWKWGEFZTOQI-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- RBWZNZOIVJUVRB-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-3-bicyclo[2.2.1]heptanyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C(C2)CCC2C1 RBWZNZOIVJUVRB-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XDODWINGEHBYRT-UHFFFAOYSA-N [2-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCCC1CO XDODWINGEHBYRT-UHFFFAOYSA-N 0.000 description 1
- LUSFFPXRDZKBMF-UHFFFAOYSA-N [3-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCC(CO)C1 LUSFFPXRDZKBMF-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- YGCOKJWKWLYHTG-UHFFFAOYSA-N [[4,6-bis[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]-(hydroxymethyl)amino]methanol Chemical compound OCN(CO)C1=NC(N(CO)CO)=NC(N(CO)CO)=N1 YGCOKJWKWLYHTG-UHFFFAOYSA-N 0.000 description 1
- GPDWNEFHGANACG-UHFFFAOYSA-L [dibutyl(2-ethylhexanoyloxy)stannyl] 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)O[Sn](CCCC)(CCCC)OC(=O)C(CC)CCCC GPDWNEFHGANACG-UHFFFAOYSA-L 0.000 description 1
- KJVBXWVJBJIKCU-UHFFFAOYSA-N [hydroxy(2-hydroxyethoxy)phosphoryl] prop-2-enoate Chemical compound OCCOP(O)(=O)OC(=O)C=C KJVBXWVJBJIKCU-UHFFFAOYSA-N 0.000 description 1
- 150000001243 acetic acids Chemical class 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- HDLHSQWNJQGDLM-UHFFFAOYSA-N bicyclo[2.2.1]heptane-2,5-dicarboxylic acid Chemical compound C1C2C(C(=O)O)CC1C(C(O)=O)C2 HDLHSQWNJQGDLM-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- ITMIAZBRRZANGB-UHFFFAOYSA-N but-3-ene-1,2-diol Chemical compound OCC(O)C=C ITMIAZBRRZANGB-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 229940011182 cobalt acetate Drugs 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- LNGAGQAGYITKCW-UHFFFAOYSA-N dimethyl cyclohexane-1,4-dicarboxylate Chemical compound COC(=O)C1CCC(C(=O)OC)CC1 LNGAGQAGYITKCW-UHFFFAOYSA-N 0.000 description 1
- GYUVMLBYMPKZAZ-UHFFFAOYSA-N dimethyl naphthalene-2,6-dicarboxylate Chemical compound C1=C(C(=O)OC)C=CC2=CC(C(=O)OC)=CC=C21 GYUVMLBYMPKZAZ-UHFFFAOYSA-N 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 1
- HPGJOUYGWKFYQW-UHFFFAOYSA-N diphenyl benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OC=2C=CC=CC=2)C=CC=1C(=O)OC1=CC=CC=C1 HPGJOUYGWKFYQW-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- KUQWZSZYIQGTHT-UHFFFAOYSA-N hexa-1,5-diene-3,4-diol Chemical compound C=CC(O)C(O)C=C KUQWZSZYIQGTHT-UHFFFAOYSA-N 0.000 description 1
- TZMQHOJDDMFGQX-UHFFFAOYSA-N hexane-1,1,1-triol Chemical compound CCCCCC(O)(O)O TZMQHOJDDMFGQX-UHFFFAOYSA-N 0.000 description 1
- AAYGSSGHJGVNSK-UHFFFAOYSA-N hexane-1,3,6-triol Chemical compound OCCCC(O)CCO AAYGSSGHJGVNSK-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- GKFFBAQBFJBIDR-UHFFFAOYSA-N methyl 2,2-bis(4-hydroxyphenyl)acetate Chemical compound C=1C=C(O)C=CC=1C(C(=O)OC)C1=CC=C(O)C=C1 GKFFBAQBFJBIDR-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- GUAWMXYQZKVRCW-UHFFFAOYSA-N n,2-dimethylaniline Chemical compound CNC1=CC=CC=C1C GUAWMXYQZKVRCW-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical group 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polyesters Or Polycarbonates (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は水溶性のポリエステル樹脂の製造法に
関するものである。
[従来の技術]
ポリエステル樹脂は従来より、塗料、接着剤、
アンカーコート剤、その他の各種方面で広汎に使
用されているが、有機溶剤を使用する系のポリエ
ステル樹脂は近年溶剤臭による作業環境の問題
や、該溶剤への引火の危険性などが指摘されてお
り、このため水を溶媒とできる水溶性のポリエス
テル樹脂の需要が急速に伸びているものである。
[発明が解決しようとする問題点]
かかるポリエステル樹脂の水溶性化は主として
該樹脂中にスルホン酸基やカルボン酸基を導入す
ることによりなされているが、従来の樹脂は乾
燥・硬化後の耐水性、耐アルカリ性、耐熱密着
性、塗膜硬度などの塗料・接着剤として欠かせな
い性能を満足するものが少く、用途に応じて何等
かの性能を犠牲にせざるを得ないのが実状であ
る。
[問題点を解決するための手段]
しかるに本発明者らは上記の如き水溶性ポリエ
ステル樹脂の欠点を解消し、諸物性に優れた性能
を有する樹脂を製造するために鋭意研究を重ねた
結果、スルホン酸基又はカルボン酸基を含有する
水溶性ポリエステル樹脂を製造するに当り、下記
一般式
(但し式中R1は水素、アルキル基、アルカリ金
属又はアンモニウムイオンを示す)で表わされる
ビス(4−ヒドロキシフエニル)酢酸類を多価ア
ルコール成分の10〜100モル%使用する際には、
耐水性、耐アルカリ性、耐熱密着性、塗膜硬度の
いずれにも非常に優れた樹脂となり得ることを見
出し、本発明を完成するに到つたものである。
本発明におけるスルホン酸基又はカルボン酸基
を含有するポリエステル樹脂とは、通常公知のポ
リエステル樹脂の縮合成分であるジカルボン酸を
主とする多塩基酸成分、グリコールを主とする多
価アルコール成分の他にスルホン酸基を有する多
塩基酸又は多価アルコールを使用したり、あるい
は3価以上の多塩基酸の少くとも1個のカルボン
酸基が樹脂中に残るように縮合反応させたもので
あるが、本発明ではかかる手段ばかりでなく、本
発明の特徴である前記ビス(4−ヒドロキシフエ
ニル)酢酸類の中にもカルボン酸基が存在する場
合があるのでかかる際は該基を利用することも可
能である。
上記においてスルホン酸塩基を有する多塩基酸
としては、5−ソジオスルホイソフタル酸、5−
カリウムスルホイソフタル酸、2−ソジオスルホ
テレフタル酸、2−カリウムスルホテレフタル酸
等、又スルホン酸塩基を有する多価アルコールと
しては、通常、不飽和多価アルコールと酸性亜硫
酸塩を反応させたものが使用され、かかる不飽和
多価アルコールとしては3−ブテン−1,2−ジ
オール、2−ブテン−1,4−ジオール、2,5
−ジメチル−3−ヘキセン−2,5−ジオール等
のオレフイングリコール等の他、1,5−ヘキサ
ジエン−3,4−ジオール等のジオレフイン系グ
リコールも使用可能である。これらの化合物の中
で2−ソジオスルホテレフタル酸、5−ソジオス
ルホイソフタル酸の使用が最も好ましい。3価以
上の多塩基酸としてはトリメリツト酸、無水トリ
メリツト酸、ピロメリツト酸、4−メチルシクロ
ヘキセン−1,2,3トリカルボン酸無水物、ト
リメシン酸等が挙げられる。
スルホン酸基又はカルボン酸基の樹脂中の含有
量は水溶性という観点から樹脂の酸価が少くとも
20KOHmg/g、より好ましくは20〜200KOH
mg/gとなるように導入することが必要である。
但し本願にいう酸価とはスルホン酸塩又はカルボ
ン酸塩基として樹脂中に導入されたものもフリー
の基として計算したものである。
以下本発明のポリエステル樹脂をビス(4−ヒ
ドロキシフエニル)酢酸類、多価アルコール成
分、多塩基酸成分各々に分けて具体的に説明す
る。
まず本発明においては上記水溶性ポリエステル
樹脂の縮合成分として下記一般式で現わされるビ
ス(4−ヒドロキシフエニル)酢酸類を使用する
ことが最大の特徴である。
但し式中R1は水素、アルキル基、アルカリ金
属又はアンモニウムイオンを示す。アルキル基の
炭素数は特に限定するものではないが、通常1〜
10であり、直鎖状、分岐状の任意のアルキル基で
ある。アルカリ金属としてはナトリウム、カリウ
ム、アンモニウムイオンとしては第四アンモニウ
ム塩も使用可能である。
以上に示される化合物の中でも特に実用的なも
のの例としてはビス(4−ヒドロキシフエニル)
酢酸、ビス(4−ヒドロキシフエニル)酢酸メチ
ル、ビス(4−ヒドロキシフエニル)酢酸エチ
ル、ビス(4−ヒドロキシフエニル)酢酸n−プ
ロピル、ビス(4−ヒドロキシフエニル)酢酸n
−ブチル、等が挙げられるが、必ずしもこれらに
限定されるものではない。
かかるビス(4−ヒドロキシフエニル)酢酸類
はグリオキシル酸と対応するフエノール類とを鉱
酸又は強酸性イオン交換樹脂の存在下で反応さ
せ、更に必要に応じてそれをエステル化したり、
あるいはグリオキシル酸エステルと対応するフエ
ノール類とを反応させれば容易に調製できる。
上記ビス(4−ヒドロキシフエニル)酢酸類の
樹脂中における含有量としては多価アルコール成
分全体の10〜100モル%、より好ましくは30〜80
モル%使用する。かかる範囲以外、例えばビス
(4−ヒドロキシフエニル)酢酸類が少いと耐水
性、耐アルカリ性などの諸物性の改良効果が充分
が低下し、実用的でなくなる。但し、かかる範囲
内であつても、樹脂全体の酸価は前述した範囲内
であることが必要であるので樹脂製造の際は仕込
み組成及びビス(4−ヒドロキシフエニル)酢酸
類のR1の選択には充分注意が必要である。
次に前記ビス(4−ヒドロキシフエニル)酢酸
類以外に用いられる多価アルコール成分としては
エチレングリコール、ジエチレングリコール、プ
ロピレングリコール、1,3−プロパンジオー
ル、2,4−ジメチル−2−エチルヘキサン−
1,3−ジオール、2,2−ジメチル−1,3−
プロパンジオール(ネオペンチルグリコール)、
2−エチル−2−ブチル−1,3−プロパンジオ
ール、2−エチル−2−イソブチル−1,3−プ
ロパンジオール、1,3−ブタンジオール、1,
4−ブタンジオール、1,5−ペンタンジオー
ル、1,6−ヘキサンジオール、2,2,4−ト
リメチル−1,6−ヘキサンジオール、1,2−
シクロヘキサンジメタノール、1,3−シクロヘ
キサンジメタノール、1,4−シクロヘキサンジ
メタノール、2,2,4,4−テトラメチル−
1,3−シクロブタンジオール、4,4′−チオジ
フエノール、4,4′−メチレンジフエノール、
4,4′−(2−ノルボルニリデン)ジフエノール、
4,4′−ジヒドロキシビフエノール、o−,m−
及びp−ジヒロドキシベンゼン、4,4′−イソプ
ロピリデンジフエノール、4,4′−イソプロピリ
デンビス(2,6−ジクロロフエノール)、2,
5−ナフタレンジオール及びp−キシレンジオー
ルが挙げられる。
以上の他に少量ならば3価以上の多価アルコー
ル、例えばペンタエリスリトール、ジペンタエリ
スリトール、トリペンタエリスリトール、グリセ
リン、トリメチロールプロパン、トリメチロール
エタン、1,3,6−ヘキサントリオール等も使
用可能である。
多塩基酸成分としてはテレフタル酸、イソフタ
ル酸、マロン酸、ジメチルマロン酸、こはく酸、
グルタール酸、アジピン酸、トリメチルアジピン
酸、ピメリン酸、2,2−ジメチルグルタール
酸、アゼライン酸、セバシン酸、フマール酸、マ
レイン酸、イタコン酸、1,3−シクロペンタン
ジカルボン酸、1,2−シクロヘキサンジカルボ
ン酸、1,3−シクロペンタンジカルボン酸、
1,4−シクロヘキサンジカルボン酸、2,5−
ノルボルナンジカルボン酸、1,4−ナフタール
酸、ジフエニン酸、4,4′−オキシ安息香酸、ジ
グリコール酸、チオジプロピオン、及び2,5−
ナフタレンジカルボン酸等が挙げられる。
これらは酸無水物、エステル、クロライド等で
あつても良く、例えば1,4−シクロヘキサンジ
カルボン酸ジメチル、2,6−ナフタレンジカル
ボン酸ジメチル、イソフタル酸ジメチル、テレフ
タル酸ジメチル、テレフタル酸ジメチル及びテレ
フタル酸ジフエニルを含む。
しかして本発明の水溶性ポリエステル樹脂を製
造する場合、上記ビス(4−ヒドロキシフエニ
ル)酢酸類及びその他のグリコールを主とする多
価アルコールの合計量が多塩基酸1モルに対し、
0.8〜2.0モルの割合となるように各々の縮合成分
を仕込み、通常公知のの方法でエステル化・縮合
反応を行う。反応条件は特に限定されないが、一
般に温度180〜250℃でエステル化・縮合反応を行
い、その後必要に応じて220〜280℃、5〜0.1mm
Hg程度の減圧下で縮合反応を継続して行うのが
効率的である。該反応は必要に応じてトリクレ
ン、トルエン、キシレン等の有機溶媒系で行わ
れ、又反応を促進する目的でジブチルスズラウレ
ート、ジブチルスズジ−2−エチルヘキソエー
ト、鉄アセチルアセトネート等の有機金属化合
物、塩化第一スズ、塩化第二鉄等の金属塩化物、
N,N′−ジメチルアニリン、トリエタノールア
ミン等の第3級アミン等の触媒を用いることがで
きる。
かくして得られる水溶性ポリエステル樹脂には
水溶性の性質を失わない範囲でならば、更にラジ
カル硬化性を付与する目的で水酸基又はカルボン
酸基等の官能基を有するエチレン性不飽和単量
体、あるいはそのオリゴマー、ポリマーを、又空
気硬化性を付与する目的でアリルエーテル基を有
する多価アルコールを前記以外の第3の縮合成分
として使用したり、あるいはポリエステル樹脂の
製造後に後反応により、樹脂中のカルボン酸基等
の該化合物と反応しうる基に付加させることも有
用な手段である。該化合物の樹脂中における含有
量としては樹脂中の官能基当り0.1〜0.3モル程度
が好ましい範囲である。エチレン性不飽和単量体
としては2−ヒドロキシ(メタ)アクリレート、
2−ヒドロキシプロピル(メタ)アクリレート、
2−ヒドロキシエチルアクリロイルフオスフエー
ト、N−メチロール(メタ)アクリルアミド、エ
チレングリコールモノアクリレート、ジプロピレ
ングリコールモノアクリレート等が用いられる。
又アリルエーテル基を有する多価アルコールとし
ては、ペンタエリスリトールトリアリルエーテ
ル、ペンタエリスリトールジアリルエーテル、ペ
ンタエリスリトールモノアリルエーテル、トリメ
チロールプロパンジアリルエーテル、トリメチロ
ールプロパンモノアリルエーテル、トリメチロー
ルエタンジアリルエーテル、トリメチロールエタ
ンモノアリルエーテル、グリセリンジアリルエー
テル、グリセリンモノアリルエーテル、ヘキサン
トリオールジアリルエーテル、ヘキサメチロール
メラミンテトラアリルエーテル等が用いられる。
以上の方法によつて製造される水溶性のポリエ
ステル樹脂は水系溶媒に溶解して用いられる。水
系溶媒としては通常水が一般的であるが、この他
水と相溶性のある溶媒、低級アルコール等も混合
して使用可能である。溶液濃度はその目的に応じ
て適宜調製すれば良いが、通常樹脂固形分換算で
5〜50重量%の範囲で使用する。溶解する際、樹
脂中のスルホン酸基又はカルボン酸基がフリーで
ある場合には樹脂を予めアルカリ水溶液又はアン
モニア水溶液中で中和し、樹脂中のスルホン酸
基・カルボン酸基を塩の形とすることが必要であ
る。
該水溶液には目的に応じて、あるいはポリエス
テル樹脂の樹脂組成に応じて従来公知の任意の可
塑剤、顔料、充填剤、安定化剤、希釈剤、緑化防
止剤、架橋性モノマー、架橋促進剤、重合開始剤
を添加することができる。又本発明の効果を妨げ
ない範囲でならば他の公知の樹脂とブレンドして
使用することも勿論可能である。
[効果]
しかして本発明によつて得られる水溶性ポリエ
ステル樹脂は水性塗料、水性接着剤、アンカーコ
ート剤、建築資材、フイルム、成型物、繊維糊剤
等の種々の用途に使用でき、得られる製品はいず
れも耐水性、耐アルカリ性、耐熱密着性、硬度な
ど諸物性に非常に優れたものである。
[実施例]
以下、実施例を挙げて本発明を更に具体的に説
明する。
例中「部」又は「%」とあるのは特に断わりの
ない限り重量基準である。
又簡略のために以下「ビス(4−ヒドロキシフ
エニル)酢酸類」を「BHPA」と記し、例えば
「BHPA(R1:H)」とあるのは本文中のBHPAの
一般式においてR1が水素であることを示す。
例中、酸価、水酸基価、数平均分子量は次式よ
り算出したが、酸価はカルボン酸塩基あるいはス
ルホン酸塩基となつているものはフリーの基と見
なした場合の酸価を〓に併せて示した。
●酸価(AV)
AV(KOHmg/g)=(a−b)×5.611×f/w
a(mg):試料(樹脂)の滴定量
b(mg):ブランクの滴定量
w(g):試料の重量
f:使用した0.1N KOH規定液の力価
●水酸基価(OHV)
OHV(KOHmg/g)=5.611×(b−a)×f/w+
AV
a、b、f、wは上記に同じ
●数平均分子量(Mn)
Mn=56.11×1000/OHV×m
m:樹脂1分子量中のカルボン酸基と水酸基の総
数
実施例 1
撹拌機、精留塔、窒素導入管、真空装置を付し
た反応器にテレフタル酸/イソフタル酸/エチレ
ングリコール/BHPA(R1:Na)=0.5/0.5/
0.9/0.6(モル比、以下仕込比はすべてモル比)
の割合で仕込み、更にジブチル錫ラウレート0.1
部を触媒として添加し、160〜230℃で5時間エス
テル化反応を行つた後、5〜0.1mmHg、220〜280
℃で5時間縮合を行つて、AV2(90)、OHV6、
Mn18000の水溶性ポリエステル樹脂を得た。
得られた樹脂を水に溶解して樹脂固形分濃度30
%、粘度40cps/20℃の樹脂液(以下樹脂液の条
件は同じ)を調製した。
これをアクリル製プラスチツク板(厚さ3mm)
上に乾燥後の膜厚が20μとなるようにロールコー
タで塗布し、温度120℃で20分乾燥した。
得られた塗膜について耐水性、耐アルカリ性、
耐熱密着性、硬度を評価した。評価方法、結果を
表に示す。
実施例 2〜4
実施例1において原料の種類及びその仕込比を
下記の如く変更して樹脂を製造し、その性能を評
価した。但し、実施例2の樹脂はこれを5%の水
酸化ナトリウム水溶液で中和後、性能の評価に供
した。
実施例2の樹脂
テレフタル酸/イソフタル酸/エチレングリコ
ール/BHPA(R1:H)=0.5/0.5/0.7/0.4
AV90、OHV65、Mn1200
実施例3の樹脂
テレフタル酸/イソフタル酸/5−ソジオスル
ホイソフタル酸/エチレングリコール/ジエチレ
ングリコール/BHPA(R1:NH4)=0.48/0.45/
0.07/1.0/0.3/0.2
AV1.5(20)、OHV25、Mn4500
実施例4の樹脂
テレフタル酸/イソフタル酸/5−ソジオスル
ホイソフタル酸/エチレングリコール/BHPA
(R1:CH3)=0.45/0.45/0.10/0.9/0.6
AV2.1(22)、OHV15、Mn7500
実施例2〜4の結果をまとめて表に記す。
比較例
実施例4においてBHPAの代わりにエチレン
グリコールを使用して水溶性ポリエステル樹脂を
製造し、同例に準じて性能を評価した。
結果を表に記す。
実施例 5
実施例2に準じて樹脂組成がテレフタル酸/イ
ソフタル酸/エチレングリコール/BHPA(R1:
H)=0.5/0.5/0.8/0.3のカルボン酸基含有ポリ
エステル樹脂(AV81、OHV62、Mn1200)を製
造しキシレンで希釈した後、更に2−ヒドロキシ
エチルアクリレートをカルボン酸基1モルに対し
0.4モルの割合で仕込み、温度90℃で時間付加反
応を行つた。得られた樹脂はAV50、OHV60、
Mn1300でこれを2%のアンモニア水に溶解して
カルボン酸基を中和して水溶性ポリエステル樹脂
の樹脂液を得た。
該樹脂液100重量部に対し、促進剤として酢酸
コバルト(コバルト含量5%)を0.5部加え、更
に硬化剤として過酸化水素5%水溶液を30部仕込
み、以下実施例1と同様にしてプラスチツク板に
塗布し、60℃で硬化させた。硬化速度は非常に良
好で指触試験で20分であつた。
得られた塗膜について性能の評価を行つた。結
果を表に示す。
実施例 6
実施例5において2−ヒドロキシエチルアクリ
レートの代わりにトリメチロールプロパンジアリ
ルエーテルをカルボン酸基1モルに対し0.2モル
の割合で仕込み、実施例5と同様の反応を行つ
た。得られた樹脂はAV57、OHV61、Mn1400で
これを4%の水酸化ナトリウム水溶液で中和して
水溶性ポリエステル樹脂の樹脂液を得た。
以下、該樹脂液を用いて実施例1と同様にして
プラスチツク板に塗布し、60℃で硬化させたとこ
ろ、約25分で完全に硬化した。
得られた塗膜について性能の評価を行つた。結
果を表に示す。
【表】DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for producing a water-soluble polyester resin. [Conventional technology] Polyester resin has traditionally been used in paints, adhesives,
Polyester resins that use organic solvents are widely used as anchor coating agents and in a variety of other fields, but in recent years it has been pointed out that polyester resins that use organic solvents pose problems in the working environment due to solvent odor and that the solvents may catch fire. Therefore, the demand for water-soluble polyester resins that can use water as a solvent is rapidly increasing. [Problems to be Solved by the Invention] Water solubility of such polyester resins is mainly achieved by introducing sulfonic acid groups or carboxylic acid groups into the resin, but conventional resins have poor water resistance after drying and curing. The reality is that there are few products that meet the essential properties of paints and adhesives, such as durability, alkali resistance, heat-resistant adhesion, and coating hardness, and the reality is that some performance has to be sacrificed depending on the application. . [Means for Solving the Problems] However, as a result of intensive research by the present inventors in order to eliminate the above-mentioned drawbacks of water-soluble polyester resins and to produce resins with excellent performance in various physical properties, In producing a water-soluble polyester resin containing a sulfonic acid group or a carboxylic acid group, the following general formula (However, in the formula, R 1 represents hydrogen, an alkyl group, an alkali metal, or an ammonium ion.) When using 10 to 100 mol% of bis(4-hydroxyphenyl) acetic acids based on the polyhydric alcohol component,
The present invention was completed based on the discovery that the resin can be made into a resin with excellent water resistance, alkali resistance, heat-resistant adhesion, and coating hardness. In the present invention, the polyester resin containing a sulfonic acid group or a carboxylic acid group refers to a polybasic acid component mainly containing dicarboxylic acid, which is a condensation component of commonly known polyester resins, a polyhydric alcohol component mainly containing glycol, etc. A polybasic acid or a polyhydric alcohol having a sulfonic acid group is used in the resin, or a polybasic acid with a valence of 3 or more is subjected to a condensation reaction so that at least one carboxylic acid group remains in the resin. In the present invention, not only such means but also a carboxylic acid group may exist in the bis(4-hydroxyphenyl)acetic acid, which is a feature of the present invention, so in such a case, it is necessary to utilize such a group. is also possible. In the above, the polybasic acids having a sulfonic acid group include 5-sodiosulfoisophthalic acid, 5-
Potassium sulfoisophthalic acid, 2-sodiosulfoterephthalic acid, 2-potassium sulfoterephthalic acid, etc., and polyhydric alcohols having sulfonic acid groups are usually those obtained by reacting unsaturated polyhydric alcohols with acidic sulfites. Such unsaturated polyhydric alcohols include 3-butene-1,2-diol, 2-butene-1,4-diol, 2,5
In addition to olefin glycols such as -dimethyl-3-hexene-2,5-diol, diolefin glycols such as 1,5-hexadiene-3,4-diol can also be used. Among these compounds, 2-sodiosulfoterephthalic acid and 5-sodiosulfoisophthalic acid are most preferably used. Examples of trivalent or higher polybasic acids include trimellitic acid, trimellitic anhydride, pyromellitic acid, 4-methylcyclohexene-1,2,3 tricarboxylic anhydride, trimesic acid, and the like. From the viewpoint of water solubility, the content of sulfonic acid groups or carboxylic acid groups in the resin should be such that the acid value of the resin is at least
20KOHmg/g, more preferably 20-200KOH
It is necessary to introduce it so that it becomes mg/g.
However, the acid value referred to in this application is calculated based on free groups including those introduced into the resin as sulfonate or carboxylic acid bases. Hereinafter, the polyester resin of the present invention will be specifically explained by dividing it into bis(4-hydroxyphenyl)acetic acids, polyhydric alcohol component, and polybasic acid component. First, the most important feature of the present invention is that bis(4-hydroxyphenyl)acetic acids represented by the following general formula are used as the condensation component of the water-soluble polyester resin. However, in the formula, R 1 represents hydrogen, an alkyl group, an alkali metal or an ammonium ion. The number of carbon atoms in the alkyl group is not particularly limited, but is usually 1 to 1.
10, and is any linear or branched alkyl group. As the alkali metal, sodium and potassium ions can be used, and as the ammonium ion, quaternary ammonium salts can also be used. Among the compounds shown above, a particularly practical example is bis(4-hydroxyphenyl).
Acetic acid, methyl bis(4-hydroxyphenyl) acetate, ethyl bis(4-hydroxyphenyl) acetate, n-propyl bis(4-hydroxyphenyl) acetate, n-bis(4-hydroxyphenyl) acetate
-butyl, etc., but are not necessarily limited to these. Such bis(4-hydroxyphenyl)acetic acids can be obtained by reacting glyoxylic acid with the corresponding phenols in the presence of a mineral acid or a strongly acidic ion exchange resin, and further esterifying it as necessary.
Alternatively, it can be easily prepared by reacting glyoxylic acid ester with the corresponding phenol. The content of the above-mentioned bis(4-hydroxyphenyl)acetic acids in the resin is 10 to 100 mol%, more preferably 30 to 80 mol% of the entire polyhydric alcohol component.
Use mole%. If the content of bis(4-hydroxyphenyl)acetic acids is too small outside this range, the effect of improving various physical properties such as water resistance and alkali resistance will be insufficient, making it impractical. However, even within this range, the acid value of the entire resin needs to be within the range mentioned above, so when manufacturing the resin, the charging composition and the R 1 of bis(4-hydroxyphenyl)acetic acids should be adjusted. Care must be taken in selection. Next, polyhydric alcohol components other than the above-mentioned bis(4-hydroxyphenyl)acetic acids include ethylene glycol, diethylene glycol, propylene glycol, 1,3-propanediol, 2,4-dimethyl-2-ethylhexane-
1,3-diol, 2,2-dimethyl-1,3-
Propanediol (neopentyl glycol),
2-ethyl-2-butyl-1,3-propanediol, 2-ethyl-2-isobutyl-1,3-propanediol, 1,3-butanediol, 1,
4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 2,2,4-trimethyl-1,6-hexanediol, 1,2-
Cyclohexane dimethanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 2,2,4,4-tetramethyl-
1,3-cyclobutanediol, 4,4'-thiodiphenol, 4,4'-methylene diphenol,
4,4′-(2-norbornylidene)diphenol,
4,4'-dihydroxybiphenol, o-,m-
and p-dihydroxybenzene, 4,4'-isopropylidene diphenol, 4,4'-isopropylidene bis(2,6-dichlorophenol), 2,
Mention may be made of 5-naphthalenediol and p-xylene diol. In addition to the above, trivalent or higher polyhydric alcohols such as pentaerythritol, dipentaerythritol, tripentaerythritol, glycerin, trimethylolpropane, trimethylolethane, 1,3,6-hexanetriol, etc. can also be used in small amounts. be. Polybasic acid components include terephthalic acid, isophthalic acid, malonic acid, dimethylmalonic acid, succinic acid,
Glutaric acid, adipic acid, trimethyladipic acid, pimelic acid, 2,2-dimethylglutaric acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, itaconic acid, 1,3-cyclopentanedicarboxylic acid, 1,2- Cyclohexanedicarboxylic acid, 1,3-cyclopentanedicarboxylic acid,
1,4-cyclohexanedicarboxylic acid, 2,5-
Norbornanedicarboxylic acid, 1,4-naphthalic acid, diphenic acid, 4,4'-oxybenzoic acid, diglycolic acid, thiodipropion, and 2,5-
Examples include naphthalene dicarboxylic acid. These may be acid anhydrides, esters, chlorides, etc., such as dimethyl 1,4-cyclohexanedicarboxylate, dimethyl 2,6-naphthalene dicarboxylate, dimethyl isophthalate, dimethyl terephthalate, dimethyl terephthalate, and diphenyl terephthalate. including. Therefore, when producing the water-soluble polyester resin of the present invention, the total amount of the above-mentioned bis(4-hydroxyphenyl)acetic acids and other polyhydric alcohols mainly composed of glycols per mole of polybasic acid,
Each condensation component is charged in a proportion of 0.8 to 2.0 moles, and the esterification/condensation reaction is carried out by a commonly known method. The reaction conditions are not particularly limited, but generally the esterification/condensation reaction is carried out at a temperature of 180 to 250°C, and then, if necessary, the temperature is 220 to 280°C and 5 to 0.1 mm.
It is efficient to carry out the condensation reaction continuously under a reduced pressure of about Hg. The reaction is carried out in an organic solvent system such as trichlene, toluene, xylene, etc. as necessary, and an organic solvent such as dibutyltin laurate, dibutyltin di-2-ethylhexoate, iron acetylacetonate, etc. is used to accelerate the reaction. compounds, metal chlorides such as stannous chloride and ferric chloride,
Catalysts such as tertiary amines such as N,N'-dimethylaniline and triethanolamine can be used. The water-soluble polyester resin thus obtained may contain an ethylenically unsaturated monomer having a functional group such as a hydroxyl group or a carboxylic acid group for the purpose of imparting radical curability, as long as the water-soluble property is not lost. For the purpose of imparting air curability to the oligomer or polymer, a polyhydric alcohol having an allyl ether group may be used as a third condensation component other than the above, or a post-reaction may be carried out after the production of the polyester resin. Addition to a group capable of reacting with the compound, such as a carboxylic acid group, is also a useful means. The preferred content of the compound in the resin is about 0.1 to 0.3 mol per functional group in the resin. As the ethylenically unsaturated monomer, 2-hydroxy (meth)acrylate,
2-hydroxypropyl (meth)acrylate,
2-hydroxyethyl acryloyl phosphate, N-methylol (meth)acrylamide, ethylene glycol monoacrylate, dipropylene glycol monoacrylate, etc. are used.
Further, as the polyhydric alcohol having an allyl ether group, pentaerythritol triallyl ether, pentaerythritol diallyl ether, pentaerythritol monoallyl ether, trimethylolpropane diallyl ether, trimethylolpropane monoallyl ether, trimethylolethane diallyl ether, trimethylol Ethane monoallyl ether, glycerin diallyl ether, glycerin monoallyl ether, hexanetriol diallyl ether, hexamethylol melamine tetraallyl ether, etc. are used. The water-soluble polyester resin produced by the above method is used after being dissolved in an aqueous solvent. Water is generally used as the aqueous solvent, but other solvents that are compatible with water, lower alcohols, etc. can also be used in combination. The concentration of the solution may be adjusted as appropriate depending on the purpose, but it is usually used in a range of 5 to 50% by weight in terms of resin solid content. When dissolving, if the sulfonic acid groups or carboxylic acid groups in the resin are free, the resin is neutralized in advance in an alkaline aqueous solution or ammonia aqueous solution, and the sulfonic acid groups and carboxylic acid groups in the resin are converted into salt form. It is necessary to. Depending on the purpose or the resin composition of the polyester resin, the aqueous solution may contain any conventionally known plasticizers, pigments, fillers, stabilizers, diluents, anti-greening agents, crosslinking monomers, crosslinking accelerators, A polymerization initiator can be added. It is of course also possible to blend the resin with other known resins as long as the effects of the present invention are not impaired. [Effects] The water-soluble polyester resin obtained by the present invention can be used for various purposes such as water-based paints, water-based adhesives, anchor coating agents, construction materials, films, molded products, fiber glues, etc. All products have excellent physical properties such as water resistance, alkali resistance, heat-resistant adhesion, and hardness. [Example] Hereinafter, the present invention will be explained in more detail with reference to Examples. In the examples, "parts" or "%" are based on weight unless otherwise specified. For simplicity, "bis(4-hydroxyphenyl)acetic acids" will be referred to as "BHPA" below. For example, "BHPA(R 1 :H)" means that R 1 is in the general formula of BHPA in the text. Indicates hydrogen. In the examples, the acid value, hydroxyl value, and number average molecular weight were calculated using the following formulas. For acid values, carboxylic acid groups or sulfonic acid groups are considered to be free groups. Also shown. ●Acid value (AV) AV (KOHmg/g) = (a-b) x 5.611 x f/wa a (mg): Titration amount of sample (resin) b (mg): Titration amount of blank w (g): Weight of sample f: Potency of 0.1N KOH normal solution used ● Hydroxyl value (OHV) OHV (KOHmg/g) = 5.611 x (ba-a) x f/w + AV a, b, f, w are as above Same Number average molecular weight (Mn) Mn=56.11×1000/OHV×m m: Total number of carboxylic acid groups and hydroxyl groups in one molecular weight of resin Example 1 Equipped with a stirrer, rectification column, nitrogen introduction tube, and vacuum device In the reactor, terephthalic acid/isophthalic acid/ethylene glycol/BHPA (R 1 :Na) = 0.5/0.5/
0.9/0.6 (molar ratio, all preparation ratios below are molar ratios)
In addition, dibutyltin laurate 0.1
% as a catalyst and carried out the esterification reaction at 160 to 230°C for 5 hours, followed by 5 to 0.1 mmHg, 220 to 280
Condensation was carried out at ℃ for 5 hours to obtain AV2 (90), OHV6,
A water-soluble polyester resin with Mn 18000 was obtained. The obtained resin was dissolved in water to a resin solid content concentration of 30
%, and a viscosity of 40 cps/20°C (the conditions for the resin liquid are the same below) was prepared. This is made of acrylic plastic board (3mm thick)
It was coated on top using a roll coater so that the film thickness after drying was 20μ, and dried at a temperature of 120°C for 20 minutes. The resulting coating film has water resistance, alkali resistance,
Heat resistant adhesion and hardness were evaluated. The evaluation method and results are shown in the table. Examples 2 to 4 In Example 1, resins were produced by changing the types of raw materials and their charging ratios as shown below, and their performance was evaluated. However, the resin of Example 2 was subjected to performance evaluation after being neutralized with a 5% aqueous sodium hydroxide solution. Resin of Example 2 Terephthalic acid/Isophthalic acid/Ethylene glycol/BHPA (R 1 :H)=0.5/0.5/0.7/0.4 AV90, OHV65, Mn1200 Resin of Example 3 Terephthalic acid/Isophthalic acid/5-Sodiosulfo Isophthalic acid/ethylene glycol/diethylene glycol/BHPA (R 1 :NH 4 )=0.48/0.45/
0.07/1.0/0.3/0.2 AV1.5(20), OHV25, Mn4500 Resin of Example 4 Terephthalic acid/Isophthalic acid/5-Sodiosulfoisophthalic acid/Ethylene glycol/BHPA
(R 1 :CH 3 )=0.45/0.45/0.10/0.9/0.6 AV2.1 (22), OHV15, Mn7500 The results of Examples 2 to 4 are summarized in the table. Comparative Example In Example 4, a water-soluble polyester resin was produced using ethylene glycol instead of BHPA, and its performance was evaluated according to the same example. Record the results in the table. Example 5 According to Example 2, the resin composition was terephthalic acid/isophthalic acid/ethylene glycol/BHPA (R 1 :
H)=0.5/0.5/0.8/0.3 carboxylic acid group-containing polyester resin (AV81, OHV62, Mn1200) was produced and diluted with xylene, and then 2-hydroxyethyl acrylate was added per mole of carboxylic acid group.
The mixture was charged at a ratio of 0.4 mol, and the addition reaction was carried out at a temperature of 90°C. The obtained resin has AV50, OHV60,
Mn1300 was dissolved in 2% aqueous ammonia to neutralize the carboxylic acid groups to obtain a resin liquid of water-soluble polyester resin. To 100 parts by weight of the resin liquid, 0.5 part of cobalt acetate (5% cobalt content) was added as an accelerator, and 30 parts of a 5% aqueous hydrogen peroxide solution was added as a hardening agent, and a plastic board was prepared in the same manner as in Example 1. and cured at 60°C. The curing speed was very good, taking 20 minutes by touch test. The performance of the resulting coating film was evaluated. The results are shown in the table. Example 6 In Example 5, trimethylolpropane diallyl ether was charged in place of 2-hydroxyethyl acrylate at a ratio of 0.2 mole per mole of carboxylic acid group, and the same reaction as in Example 5 was carried out. The resulting resins were AV57, OHV61, and Mn1400, and were neutralized with a 4% aqueous sodium hydroxide solution to obtain a resin liquid of water-soluble polyester resin. Thereafter, the resin liquid was applied to a plastic board in the same manner as in Example 1 and cured at 60°C, and was completely cured in about 25 minutes. The performance of the resulting coating film was evaluated. The results are shown in the table. 【table】
Claims (1)
溶性ポリエステル樹脂を製造するに当たり、下記
一般式(式中R1は水素、アルキル基、アルカリ
金属又はアンモニウムイオンを示す)で表される
ビス(4−ヒドロキシフエニル)酢酸類を多価ア
ルコール成分の10〜100モル%使用することを特
徴とする水溶性ポリエステル樹脂の製造法。 [Scope of Claims] 1. In producing a water-soluble polyester resin containing a sulfonic acid group or a carboxylic acid group, the following general formula (wherein R 1 represents hydrogen, an alkyl group, an alkali metal, or an ammonium ion) is used. 1. A method for producing a water-soluble polyester resin, which comprises using bis(4-hydroxyphenyl)acetic acids in an amount of 10 to 100 mol% based on the polyhydric alcohol component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2251085A JPS61181822A (en) | 1985-02-06 | 1985-02-06 | Manufacturing method of water-soluble polyester resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2251085A JPS61181822A (en) | 1985-02-06 | 1985-02-06 | Manufacturing method of water-soluble polyester resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61181822A JPS61181822A (en) | 1986-08-14 |
| JPH058735B2 true JPH058735B2 (en) | 1993-02-03 |
Family
ID=12084752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2251085A Granted JPS61181822A (en) | 1985-02-06 | 1985-02-06 | Manufacturing method of water-soluble polyester resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61181822A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6156902B2 (en) * | 2012-05-24 | 2017-07-05 | 互応化学工業株式会社 | Resist agent for lift-off method and method for forming conductor pattern |
-
1985
- 1985-02-06 JP JP2251085A patent/JPS61181822A/en active Granted
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| Publication number | Publication date |
|---|---|
| JPS61181822A (en) | 1986-08-14 |
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| LAPS | Cancellation because of no payment of annual fees |