JPH0588320B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) This invention relates to a method for manufacturing a thin plate-like metal sticker made of a metal material.

(Prior art) Conventionally, as a manufacturing method of this type,
The one disclosed in Japanese Patent No. 20979 is known.

To explain this manufacturing method, as shown in FIG. 11a, first, a resin layer 2 is formed on the surface of a conductive metal plate 1, and recesses 2a having a predetermined pattern are formed in the resin layer 2. After exposing the metal plate 1 within 2a, a peeling film 5 is formed on the exposed portion.

Next, as shown in FIG. 11b, the metal plate 1 with the resin layer 2 formed thereon is immersed in a predetermined electrolytic solution 7, and the exposed portion of the peeling layer 5 of the metal plate 1 is electroformed. Then, an electrodeposition layer 9 is formed.

Subsequently, as shown in FIG. 11c, an adhesive film 10 is attached to the electroformed surface side of the metal plate 1 on which the electrodeposited layer 9 has been formed, and then this is electroplated as shown in FIG. 11d. A decorative piece 11 that constitutes a metal sticker is formed by peeling off from the metal plate 1 together with the adhesive layer 9.

Finally, as shown in FIG. 12, the decorative piece 11 is pasted on the release paper 13 together with the adhesive film 10.
Complete the metal sticker product.

By applying the above-described manufacturing method, it is possible to accurately form the decorative pieces 11 with fine line patterns and the like that make up the metal sticker, and also to form the separated decorative pieces 11 with the patterns in a desired state. It was possible to place them accurately, thus making it possible to manufacture an unprecedented metal sticker.

(Problems to be Solved by the Invention) However, in the conventional manufacturing method, as shown in FIG. 11b, the surface 9a of the electrodeposited layer 9 is
Since the electrodeposited layer 9 was formed flush with the surface 2b, the edge 9b of the surface 9a of the electrodeposited layer 9 has a sharp corner. Therefore, when a decorative piece 11 is formed from the electrodeposited layer 9 and the decorative piece 11 is adhered to a desired surface, the surface 11a of the decorative piece 11 is caught and feels good to the touch. Nakatsuta. Furthermore,
Since the surface 11a of the decorative piece 11 is simply flat, there is little diffused reflection of light, and there is little metallic luster with a three-dimensional effect.

As shown in FIG. 11d, during the peeling process of the electrodeposited layer 9, the electrodeposition layer 9 is pulled out from the recess 2a of the resin layer 2, and extra peeling resistance is generated, causing the electrodeposition layer 9 to peel off. There was a fear that the project would not be able to be carried out smoothly.

(Object of the Invention) This invention was made in view of the above-mentioned circumstances, and it is possible to improve the texture of the surface of a decorative piece, and also to increase the three-dimensional metallic luster. A further object of the present invention is to provide a method for manufacturing a metal sticker that allows the process of peeling off the electrodeposited layer to be carried out smoothly.

(Means for Solving the Problems) In order to achieve the above object, in the present invention, a non-conductive layer is partially formed on a conductive metal plate, and a part of the metal plate is decorated with a predetermined decoration. a step of exposing the pattern, a step of forming an electrodeposited layer on the exposed portion of the conductive metal plate by electroforming so as to bulge outward from the non-conductive layer after the decorative pattern forming step; After that, there is a step of dissolving and removing only the non-conductive layer from the conductive metal plate, and after the dissolving and removing process of the non-conductive layer, an adhesive film is attached to the electroformed surface side of the conductive metal plate, and this is A structure is adopted which consists of a step of peeling off the electrodeposited layer from the conductive metal plate to form a decorative piece, and a step of pasting the decorative piece together with an adhesive film onto a release paper after this peeling step.

(Function) Therefore, by forming the electrodeposited layer on the exposed portion of the conductive metal plate so as to bulge outward from the non-conductive layer, at least the side edges of the electrodeposition layer are formed to be rounded. be done.

Furthermore, the peeling resistance during the peeling process of the electrodeposited layer is reduced.

(Embodiment) Hereinafter, an embodiment embodying the present invention will be described in detail with reference to FIGS. 1 to 10.

As shown in FIG. 1c, a conductive metal plate 1 made of a copper plate, a stainless steel plate, etc. has a recess 2a in which a part of the metal plate 1 is exposed in a predetermined decorative pattern 4 (see FIG. 2). A resin layer 2 as a non-conductive layer is formed.

To explain the process of forming the recesses 2a of the decorative pattern 4, first, a photosensitive liquid synthetic resin material is applied and dried on the metal plate 1, and then the entire surface of the metal plate 1 is coated as shown in FIG. 1a. A resin layer 2 is formed.

Next, as shown in FIG. 1b, a positive film 3 for black and white photography is placed on the resin layer 2. As shown in FIG. 2, the positive film 3 in this case is one in which a decorative pattern 4 is photographed in advance and then developed.

After placing the positive film 3 on the resin layer 2, the film 3 is exposed to strong light such as an arc lamp or a mercury lamp from above. In this exposure process, light emitted from an arc lamp or the like is transmitted to the transparent part (the part where the emulsion is fixed) 3 of the positive film 3.
It passes through a and reaches the resin layer 2, and is blocked by the opaque area (the area where the emulsion has been washed away) 3b, so that it does not reach the resin layer 2. Therefore, in the resin layer 2, exposed areas and unexposed areas are formed corresponding to the transparent areas 3a and opaque areas 3b of the positive film 3.

Thereafter, the positive film 3 is removed from the resin layer 2, and the resin layer 2 is treated with a solvent such as white kerosene or trichlorotyrene to dissolve and remove only the unexposed portion of the resin layer 2. As a result, a recess 2a is formed in the resin layer 2, as shown in FIGS. part is exposed.

Next, the metal plate 1 on which the decorative pattern 4 is formed by the concave portions 2a of the resin layer 2 as described above is immersed in a 2% solution of chromic acid for a predetermined period of time, and then washed with water. As a result, as shown in FIG. 4, the thin chromium peeling film 5 is fixed on the metal plate 1 exposed in the recess 2a of the resin layer 2. This film forming step is performed to facilitate peeling off of the electrodeposited layer 9 formed on the metal plate 1 in the electroforming process described later.

After forming the peeling film 5 on the exposed portion of the metal plate 1, the next step is an electroforming process.

That is, as shown in FIG. 5a, the metal plate 1 having the resin layer 2 is electroformed in an electrolytic solution 7 in an electrolytic solution tank 6. As shown in FIG. The electrolytic solution 7 is a mixed solution of copper sulfate (240 g/), sulfuric acid (90 g/), and a brightener (in this case, Caparacid 210 manufactured by Okuno Pharmaceutical Co., Ltd.). and,
Electroformed material 8 made of copper immersed in the electrolyte 7
and the metal plate 1 (in this case, the current density
1A/dm ² ). The other side surface of the metal plate 1 that is exposed on the opposite side of the surface of the metal plate 1 on which the resin layer 2 is formed is as follows:
A lacquer or the like is applied in advance to make it non-electrodepositable.

As a result, as shown in FIG.
is deposited. At this time, by adjusting the electroforming treatment time, the electrodeposited layer 9 is formed so as to bulge outward from the resin layer 2, so that at least the edge 9b on the surface 9a side of the electrodeposited layer 9 becomes rounded. This will lead to growth.

Next, after confirming that the electrodeposited layer 9 has been formed on the metal plate 1, the metal plate 1 is taken out from the electrolyte bath 6 as shown in FIG. is dissolved and removed using an organic solvent. As a result, as shown in FIG. 7, a coating 5 is formed on the metal plate 1.
Only the electrodeposited layer 9 remains. After removing the resin layer 2 from the metal plate 1, the metal plate 1, electrodeposition layer 9, etc. are completely dried by hot air drying.

After drying of the metal plate 1, electrodeposition layer 9, etc. is completed,
Next, the process moves on to the step of peeling off the electrodeposited layer 9.

That is, as shown in FIG. 8, a translucent synthetic resin adhesive film 10 is once attached to the electroformed surface of the metal plate 1, and then, as shown in FIG. It peels off from the metal plate 1 together with 9. At this time, the electrodeposited layer 9 on the metal plate 1 is simply a peeling film 5.
The electrodeposited layer 9 is only attached on top of the metal plate 1, and there is no extra peeling resistance other than the peeling resistance between it and the coating 5, which reduces the peeling resistance and allows the electrodeposited layer 9 to be peeled off smoothly from the metal plate 1. be able to. Moreover, the electrodeposition layer 9
can be easily peeled off from the metal plate 1 together with the action of the peeling film 5.

As a result, the decorative piece 11 can be attached to the adhesive film 10 in a state corresponding to the decorative pattern 4. In particular, even when a plurality of electrodeposited layers 9 are formed on the metal plate 1 in a state where they are separated from each other, since the electrodeposited layers 9 are attached to the adhesive film 10 and transferred, each electrodeposited layer 9 can be separated from each other. The decorative pieces 11 can be placed in the desired arrangement without breaking the arrangement relationship.
can be obtained. Moreover, at least the edge 11b of the surface 11a of the decorative piece 11 is rounded.

After peeling the adhesive film 10 from the metal plate 1,
As shown in FIG. 10, a predetermined adhesive 12 is applied to the back surface of the decorative piece 11, and the decorative piece 11 is adhered to the surface of the release paper 13 together with the adhesive film 10. The surface of the release paper 13 is waxed or siliconized so that it can be easily peeled off from the decorative piece 11 and the adhesive film 10 later.

Therefore, when using the decorative piece 11 as a sticker by pasting it on a desired surface, the release paper 1
3, the adhesive film 10 is peeled off together with the decorative piece 11, and the side of the decorative piece 11 coated with the adhesive 12 is adhered to the surface to be adhered. Then, adhesive film 1
0 only needs to be peeled off from the surface to be adhered.

As described above, since the electroforming process is adopted in this embodiment, even the decorative piece 11 having a design having fine lines can be accurately formed.

Moreover, during the electroforming process, the electrodeposition layer 9 is formed so as to bulge outward from the resin layer 2, and at least the edge 9b of the surface 9a of the electrodeposition layer 9 is rounded. When the surface 11a of the decorative piece 11 obtained from the layer 9 is touched, it does not feel like it sticks to the skin, and the touch can be improved.

Furthermore, since at least the edge 11b of the surface 11a of the decorative piece 11 is rounded, light hitting the edge 11b is diffusely reflected, creating a three-dimensional effect with metallic luster. In particular, a plurality of decorative pieces 1 made of fine lines
1 are adjacent to each other, each decorative piece 11
The diffused reflection of light in the decorative pieces 11 interferes with each other, or a part of the light reflected by each decorative piece 11 is reflected again by other decorative pieces 11, thereby increasing the three-dimensional metallic luster. As a result, a fresh and luxurious impression can be given to the metal sticker made of the decorative piece 11.

Note that the present invention is not limited to the above-mentioned embodiments. For example, it is possible to use a non-conductive material other than synthetic resin as the non-conductive layer, or to use electroforming to change the color or luxury of the decorative piece 11. After forming the copper electrodeposited layer 9 during the process, a nickel layer is formed on the electrodeposited layer 9 by electroplating, and a pure gold layer or a black chrome layer is further formed on top of the nickel layer. It is also possible to modify a part of the configuration as appropriate without departing from the spirit of the invention.

(Effects of the Invention) As detailed above, according to the present invention, at least the edges of the electrodeposited layer are formed rounded, so that the surface of the decorative piece can have a good texture and a three-dimensional effect. It is possible to increase a certain metallic luster, and furthermore, since the electrodeposited layer is peeled off from the metal plate after the non-conductive layer is dissolved and removed from the conductive metal plate, the electrodeposited layer is peeled off when the electrodeposited layer is peeled off. Only the peeling resistance between the layer and the peeling film acts, and an excellent effect is exhibited in that the electrodeposited layer can be peeled off smoothly with little peeling resistance.

[Brief explanation of drawings]

1 to 10 are drawings showing an embodiment embodying the present invention, in which FIGS. 1a to 1c are cross-sectional views illustrating the decorative pattern forming process, and FIG. 2 is a decorative pattern forming process. FIG. 3 is an enlarged cross-sectional view of the main part showing a state in which a decorative pattern is formed, FIG. 4 is an enlarged cross-sectional view of the main part showing a state in which a release film is formed, and FIG. Figure 5a is an explanatory diagram showing the state of electroforming, Figure 5b is an enlarged sectional view of the main part, Figure 6 is an enlarged sectional view of the main part after the electroforming process, and Figure 7 is the state with the resin layer removed. Fig. 8 is an enlarged sectional view of the main part showing the state in which the adhesive film is attached in the peeling process, and Fig. 9 is an enlarged sectional view of the main part showing the state in which the adhesive film is attached in the peeling process. An enlarged sectional view of the main part showing the location, Part 1
Figure 0 is an enlarged cross-sectional view of the main part showing a state in which release paper is pasted on the back side of the decorative piece. 11a to 11d are enlarged sectional views of essential parts showing each step of a conventional manufacturing method, and FIG. 12 is a sectional view of a completed sticker according to the conventional example. DESCRIPTION OF SYMBOLS 1... Metal plate, 2... Resin layer as a non-conductive layer, 2a... Recessed part, 3... Positive film, 9...
Electrodeposition layer, 10... Adhesive film, 11... Decorative piece, 13... Release paper.

Claims (1)

[Claims] 1. A non-conductive layer 2 is partially formed on a conductive metal plate 1, and a part of the metal plate 1 is patterned into a predetermined decorative pattern 4.
a step of forming an electrodeposited layer 9 on the exposed portion of the conductive metal plate 1 by electroforming so as to bulge outward from the non-conductive layer 2 after the decorative pattern 4 forming step; After this electroforming step, a step of dissolving and removing only the non-conductive layer 2 from above the conductive metal plate 1; and a step of dissolving and removing only the non-conductive layer 2 from above the conductive metal plate 1; adhesive film 10
and peeling it together with the electrodeposited layer 9 from the conductive metal plate 1 to form a decorative piece 11. After this peeling process, the decorative piece 11 is attached to a release paper 13 together with the adhesive film 10. A method for manufacturing a metal sticker, comprising the step of pasting. 2 The decorative pattern forming step is performed on the conductive metal plate 1.
Forming a resin layer 2 made of photosensitive synthetic resin on top,
A positive film 3 for black and white photography is placed on the resin layer 2 and exposed, and after separating the positive film 3, the resin layer 2 is treated with a solvent to form recesses 2a in a predetermined pattern. 2. The method of manufacturing a metal sticker according to claim 1, wherein the conductive metal plate 1 is exposed inside the sticker 2a.