JPH0588335B2 - - Google Patents
Info
- Publication number
- JPH0588335B2 JPH0588335B2 JP61077473A JP7747386A JPH0588335B2 JP H0588335 B2 JPH0588335 B2 JP H0588335B2 JP 61077473 A JP61077473 A JP 61077473A JP 7747386 A JP7747386 A JP 7747386A JP H0588335 B2 JPH0588335 B2 JP H0588335B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- core material
- plate
- board
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 239000011162 core material Substances 0.000 claims description 25
- 239000004566 building material Substances 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Finished Plywoods (AREA)
- Veneer Processing And Manufacture Of Plywood (AREA)
- Panels For Use In Building Construction (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、建造物の室屋の間仕切り等に用いる
建材用ボード、更に詳しくは、芯材の表面に接着
剤によつて表面板を装着した建材用ボードに関す
る。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a board for building materials used for partitioning rooms in buildings, and more specifically, to a board for use as a building material used for partitioning rooms in buildings, and more specifically, a surface board is attached to the surface of a core material using an adhesive. Regarding boards for building materials.
（従来の技術）
この種建材用ボードは、合板等からなる芯材の
表面にエポキシ系樹脂等の接着剤によつて金属板
等の表面板を接合している。芯材と表面板との接
合は、先ず、芯材の表面に接着剤を塗布し、次に
該接着剤上に表面板を装着した後、プレス装置に
よつて両者を圧締することによつてなされる。(Prior Art) This type of board for building materials has a surface plate such as a metal plate bonded to the surface of a core material such as plywood using an adhesive such as an epoxy resin. The core material and the top plate are joined by first applying an adhesive to the surface of the core material, then attaching the top plate onto the adhesive, and then pressing the two together using a press device. I am treated well.
（発明が解決しようとする問題点）
前述のようにして芯材の表面に表面板を接着剤
により接合しても、接着剤が乾燥するまでは両者
は完全に接合された状態とはならず、接着剤が完
全に乾燥するまでに数日間要した。このように接
着剤の乾燥に多大な時間を要するため、量産化が
難しく、また、乾燥している間の在庫量が増大す
るという問題があつた。(Problem to be Solved by the Invention) Even if the top plate is bonded to the surface of the core material using an adhesive as described above, the two will not be completely bonded until the adhesive dries. , it took several days for the adhesive to completely dry. Since it takes a long time to dry the adhesive, it is difficult to mass produce the adhesive, and the amount of inventory increases during drying.
本発明の目的は、芯材と表面板とを接合する接
着剤の乾燥を短時間で行なうことができるこの種
建材用ボードを提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a board for building materials of this type, which allows the adhesive used to bond the core material and the surface plate to dry in a short time.
（問題点を解決するための手段）
本発明によれば、芯材と、該芯材の表面に接着
剤によつて接合する表面板とからなる建材用ボー
ドにおいて、前記芯材の表面両側部に電極板を配
設するとともに、前記接着剤に導電性物質を混入
せしめたことを特徴とする建材用ボードが提供さ
れる。(Means for Solving the Problems) According to the present invention, in a building board comprising a core material and a surface plate bonded to the surface of the core material with an adhesive, both sides of the surface of the core material are provided. There is provided a board for building materials, characterized in that an electrode plate is disposed on the board, and a conductive substance is mixed in the adhesive.
（作用）
芯材の表面に接着剤を塗布し、該接着剤上に表
面板を装着した後、プレス装置によつて両部材を
圧締しつつ芯材の表面両側部に配設された電極板
間に通電すると、該両電極板間に介在する接着剤
には導電性物質が混入されているので、一方の電
極板から前記導電性物質を通して他方の電極板へ
電流が流れる。接着剤に混入された導電性物質に
電流が流れることにより、該導電性物質が発熱す
るため、該熱によつて前記接着剤は早期に乾燥せ
しめられる。(Function) After applying an adhesive to the surface of the core material and mounting a face plate on the adhesive, both members are pressed together using a press device, and electrodes are placed on both sides of the surface of the core material. When electricity is applied between the plates, since a conductive substance is mixed in the adhesive interposed between the two electrode plates, a current flows from one electrode plate to the other electrode plate through the conductive substance. When a current flows through the conductive substance mixed in the adhesive, the conductive substance generates heat, and the adhesive is quickly dried by the heat.
（実施例）
以下、本発明を図示の実施例に基づいて具体的
に説明する。(Examples) Hereinafter, the present invention will be specifically described based on illustrated examples.
第１図は本発明による建材用ボードの一実施例
を示す断面図である。同図において、１は合板等
からなる芯材、２は該芯材１の表面に接合される
表面板で、例えば鋼板等の金属板からなつてお
り、その裏面には塗装等により絶縁層３が形成さ
れている。４，４は前記芯材１の表面両側部に
各々接着剤等によつて装着された電極板で、例え
ば、0.05mm程度の銅箔からなつており、第２図に
示すように芯材１の一端側に突出して設けられて
いる。５は芯材１の表面に塗布され表面板２と芯
材１とを接合する接着材で、エポキシ系樹脂から
なりこの中には例えばカーボン粉末等の導電性物
質が混入されている。 FIG. 1 is a sectional view showing one embodiment of a board for building materials according to the present invention. In the figure, 1 is a core material made of plywood or the like, 2 is a surface plate bonded to the surface of the core material 1, and is made of a metal plate such as a steel plate, and an insulating layer 3 is coated on the back surface by painting or the like. is formed. Reference numerals 4 and 4 denote electrode plates attached to both sides of the surface of the core material 1 with adhesive or the like, and are made of copper foil of about 0.05 mm, for example.As shown in FIG. It is provided so as to protrude from one end side. An adhesive 5 is applied to the surface of the core material 1 to join the surface plate 2 and the core material 1, and is made of epoxy resin and contains a conductive substance such as carbon powder mixed therein.
本実施例による建材用ボードは以上のように構
成されており、以下その製作手順について説明す
る。 The building material board according to this embodiment is constructed as described above, and the manufacturing procedure thereof will be explained below.
先ず、芯材１の表面両側部に電極板４，４を接
着剤等によつて装着しておく。次に、芯材１の表
面に接着３を塗布し、その上に表面板２を装着す
る。このようにして、芯材１の表面に表面板２を
装着したら、これを第３図に示すように、プレス
装置６のベツド６ａ上に載置し、油圧シリンダ６
ｂによつて作動せしめられる押圧部材６ｃにより
圧締する。この状態で、前記電極板４，４の突出
部に第２図に示すように通電用の取付具７，７を
装着し、スイツチ８を閉路する。これにより、電
源８から一方の電極板７、接着剤５中に混入され
た導電性物質を通して他方の電極板７に電流が流
れる。このため、接着剤５中に混入された導電性
物質は発熱し、接着剤５を乾燥せしめる。 First, electrode plates 4, 4 are attached to both sides of the surface of the core material 1 with adhesive or the like. Next, adhesive 3 is applied to the surface of core material 1, and surface plate 2 is attached thereon. After the surface plate 2 is attached to the surface of the core material 1 in this way, it is placed on the bed 6a of the press device 6, as shown in FIG.
It is pressed by the pressing member 6c actuated by b. In this state, the energizing fixtures 7, 7 are attached to the protruding parts of the electrode plates 4, 4 as shown in FIG. 2, and the switch 8 is closed. As a result, current flows from the power source 8 to one electrode plate 7 and the other electrode plate 7 through the conductive substance mixed in the adhesive 5. Therefore, the conductive substance mixed into the adhesive 5 generates heat and dries the adhesive 5.
以上、本発明を図示の実施例に基づいて説明し
たが、本発明は実施例に示されたもののみに限定
されるものではなく、例えば、実施例においては
表面板の裏面に絶縁層を形成したものを示した
が、表面板が非導電部材によつて構成する場合
は、絶縁層を形成する必要はなく、また、電極板
への通電をプレスしつつ行なう例を示したが、プ
レス後に通電して乾燥作業を行なつてもよく、本
発明の主旨の範囲で種々の変形は可能であり、こ
れら本発明の範囲から排除するものではない。 Although the present invention has been described above based on the illustrated embodiments, the present invention is not limited to those shown in the embodiments. For example, in the embodiments, an insulating layer is formed on the back surface of the top plate. However, if the surface plate is made of a non-conductive material, there is no need to form an insulating layer, and although we have shown an example in which the electrode plate is energized while pressing, The drying work may be performed by applying electricity, and various modifications are possible within the spirit of the present invention, and these are not excluded from the scope of the present invention.
（発明の効果）
以上、説明したように、本発明は芯材の表面両
側部に電極板を配設するとともに、芯材の表面に
表面板を接合する接着材に導電性部質を混入せし
めたので、前記電極板間に通電することにより、
接着材中に混入されている導電性部質が発熱し、
この熱によつて接着剤を短時間で乾燥させること
ができる。従つて、ボードの製作時間を著しく短
縮することができ、量産化を図ることができる。(Effects of the Invention) As explained above, the present invention provides electrode plates on both sides of the surface of the core material, and mixes a conductive material into the adhesive that joins the surface plate to the surface of the core material. Therefore, by passing current between the electrode plates,
The conductive material mixed in the adhesive generates heat,
This heat can dry the adhesive in a short time. Therefore, the manufacturing time of the board can be significantly shortened and mass production can be achieved.
第１図は本発明による建材用ボードの断面図、
第２図は第１図における−矢視図、第３図は
本発明による建材用ボード製作過程のプレス行程
を示す説明図である。
１……芯材、２……表面板、３……絶縁層、４
……電極板、５……接着材。
FIG. 1 is a cross-sectional view of a board for building materials according to the present invention;
FIG. 2 is a view taken along the - arrow in FIG. 1, and FIG. 3 is an explanatory diagram showing a pressing process in the manufacturing process of a board for building materials according to the present invention. 1...Core material, 2...Surface plate, 3...Insulating layer, 4
...Electrode plate, 5...Adhesive material.
Claims (1)
する表面板とからなる建材用ボードにおいて、前
記芯材の表面両側部に電極板を配設するととも
に、前記接着剤に導電性物質を混入せしめたこと
を特徴とする建材用ボード。1. A building material board consisting of a core material and a surface plate bonded to the surface of the core material with an adhesive, in which electrode plates are disposed on both sides of the surface of the core material, and the adhesive is conductive. A building material board characterized by being mixed with a substance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61077473A JPS62233201A (en) | 1986-04-03 | 1986-04-03 | Board for building materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61077473A JPS62233201A (en) | 1986-04-03 | 1986-04-03 | Board for building materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62233201A JPS62233201A (en) | 1987-10-13 |
| JPH0588335B2 true JPH0588335B2 (en) | 1993-12-21 |
Family
ID=13634953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61077473A Granted JPS62233201A (en) | 1986-04-03 | 1986-04-03 | Board for building materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62233201A (en) |
-
1986
- 1986-04-03 JP JP61077473A patent/JPS62233201A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62233201A (en) | 1987-10-13 |
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