JPH059032B2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a method for connecting an EL display panel or a liquid crystal display panel to a wiring lead extending from an electrode of a semiconductor element (LSI, IC) that drives the panel. It is.

BACKGROUND ART In recent years, the number of devices that display images and characters using liquid crystal display panels and EL display panels has increased. Although these display panels have the feature that they can be made thinner, in order to display clear images or high-definition characters, it is necessary to increase the number of scanning lines formed on the display panel. This is essential for liquid crystal displays and EL displays to approach the display performance of CRTs and increase added value. However, if the number of scanning lines is increased, the number of electrodes of the display panel will also increase proportionally. An increase in the number of electrodes results in an increase in the number of driving LSIs for driving the electrodes.

Therefore, if you are trying to improve the performance of LCD display panels or EL display panels,
Inevitably, the number of connection points between the driving LSI and the electrodes of the display panel increases, which not only causes a decrease in reliability, but also significantly increases the implementation cost, hindering practical application. .

A conventional configuration will be explained with reference to FIG. For example, the electrode 21 formed on the liquid crystal display 20 and the driving
When bonding the film lead 22 on which the LSI is mounted, a photocuring resin 23 is applied onto the electrodes on the liquid crystal display 20 (FIG. 3a), and the pressure jig 24 is lowered 25 to apply pressure. At the same time, ultraviolet rays are irradiated 26 from the back side of the display 20, and the photocurable resin 23 on the film leads 22 and electrodes 21 is partially removed by pressure, and the resin is cured (FIG. 3b).

Next, when the resin hardens, the pressurizing jig 24 is raised and pulled up, allowing connection to be made as shown in FIG. 3c.

Problems to be Solved by the Invention However, in this conventional connection method, the pressure jig gets in the way, and the light can only be irradiated from the opposite side of the display, that is, the face of the pressure jig. I couldn't do it.

For this purpose, the film lead 22 on the pressure jig side is
Even when the resin existing on the surface of the display 20, the resin raised along the wall of the pressurizing jig, or the opposite side of the display 20 is irradiated, there is a shadow area where the light is not irradiated. For this purpose, after removing the pressure jig 24, light irradiation was performed again from the side on which the pressure jig was installed. For this reason, the process becomes significantly complicated and the mounting cost becomes high.

In view of these conventional problems, it is an object of the present invention to obtain a more reliable connection when bonding lead groups of a display panel and a circuit board using a photocurable resin.

Means for Solving the Problems The present invention provides a connection method in which an insulating resin is interposed between the electricity of a display panel, etc. and a group of leads, and ultraviolet rays are irradiated while applying pressure, in which the pressing jig transmits light. It is made of a material and irradiates light through a pressurizing jig during pressurization, increasing connection reliability and reducing mounting costs.

Effects According to the present invention, there is no generation of uncured areas of the insulating resin, light irradiation can be performed simultaneously with pressurization, and it is also possible to shorten the time required for the process.

Embodiment An embodiment of the connection method of the present invention will be explained with reference to FIG. An electrode 21 formed of an ITO film is provided on the liquid crystal display 20, and a photocurable insulating resin 23 is applied onto the electrode 21. Next for driving
The film lead group 22 connected to the ISI and the electrode 21 are aligned, and the pressing jig 14 is lowered (FIG. 1a). At this time, the pressing jig 14, which is a feature of the present invention, is made of a material that does not transmit light, such as quartz glass, pyrex glass, etc., and has an optical path 3 for introducing light at least on the opposite side of the pressing surface 29.
This is a configuration in which 0 is provided. On the other hand, the insulating resin coated on the electrode is a photocurable resin such as epoxy, acrylic, silicone, butadiene, or polyimide, and the curing is mainly caused by ultraviolet rays, but the thermosetting resin is It is also possible to use a resin used in combination. Further, the insulating resin may be applied on the electrodes of the display or on the film lead group 22 side. Furthermore, if the film lead group 22 is made of Cu foil with Au plating, for example,
Remarkably high reliability can be obtained.

Next, as shown in FIG. 1b, the back surface 8 of the display panel 20 and the pressure jig 1 are
The light irradiation 7 from the optical path 30 of 4 accelerates curing at least simultaneously. When finished, raise the pressure jig 14 26
When the light irradiation is stopped (FIG. 1c), the lead group 22 and the electrodes 21 of the display 20 are electrically connected. Further, the film lead group 2
The surface of the second display panel 20 in contact with the electrode 21 has at least some unevenness, and the insulating resin is present in the recess formed by the electrode 21 surface and the unevenness of the film lead group 22. It acts to fix the electrode, and the convex portion comes into contact with the electrode surface, thereby making electrical connection possible.

Another embodiment of the pressure jig will be described with reference to FIG. 2. A material 32 such as Teflon to which the insulating resin does not easily adhere is formed on the surface of the pressurizing portion 14' made of quartz glass, Pyrex glass, or the like. If such a pressure jig is used, the film lead group 22 and the electrode 21 of the display panel 20 can be
By interposing the insulating resin 23 in between, the light-hardened resin will not adhere to the side and bottom surfaces of the pressing jig 14 when pressurized. For this reason, the pressure jig and the film lead are bonded together, and there is no phenomenon of the film lead and electrode coming apart or the occurrence of electrical bond failures caused by this, and the bonding process is not only easy, but also a high bonding rate. You can gain reliability.

Effects of the Invention Since light irradiation can be performed through a pressurizing jig, it is possible to prevent the occurrence of uncured areas of the insulating resin, and high reliability can be achieved. In addition, in the past, it was necessary to remove the pressure jig and then irradiate the light with another light source again, but with the present invention, it can be performed while applying pressure, which significantly reduces the time required for the process. Not only is it much shorter, but it also has the effect of reducing implementation costs.

[Brief explanation of drawings]

Figure 1 is a connection process diagram of one embodiment of the present invention, Figure 2
The figure is a front view of another embodiment of the pressing jig used in the present invention, and FIG. 3 is a diagram of a conventional connection process. 14... Pressure jig, 20... Display panel, 21... Electrode, 22... Film lead, 2
3... Insulating resin, 7, 8... Light irradiation.

Claims (1)

[Scope of Claims] 1. In a method of interposing an insulating resin between a wiring lead and a substrate electrode and applying pressure and irradiating light to connect the wiring lead and the substrate electrode, a jig for pressurizing the wiring lead and the substrate electrode may A method for connecting a group of leads, characterized in that light for curing the plastic resin is transmitted therethrough, and light is irradiated through the pressure jig during pressurization. 2. The lead group according to claim 1, characterized in that when pressurized by a pressurizing jig, light is irradiated through the pressurizing jig and at the same time, light is irradiated from the opposite side of the pressurizing jig. How to connect.