JPH059195B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a laser processing apparatus capable of performing taper processing on a workpiece.

[Technical background of the invention and its problems] Conventionally, when cutting a thick plate using a laser processing device, the laser cutting surface is always perpendicular to the surface of the workpiece W, as shown in FIG. Become. However, in the case of cutting a thick plate, as shown in FIG.
In some cases, it is desired to perform taper cutting so as to form an angle of (n→ in the figure represents a normal vector to the surface of the workpiece W). However, there is still no laser processing apparatus that directly satisfies these requirements.

[Object of the Invention] The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a laser processing apparatus that can perform taper processing on a workpiece.

[Structure of the Invention] The present invention provides a laser processing apparatus including a laser oscillation device, a laser beam focusing device for a workpiece, and an
Laser processing characterized in that a work table equipped with a precession mechanism is provided on a Y positioning device, and a distance adjustment device is provided to adjust the relative distance between the work table and the laser beam focusing device. This apparatus laser cuts a workpiece with a taper of a predetermined angle in any direction of 360 degrees around a vertical axis by rotating a precession mechanism by a predetermined angle.

[Embodiment of the Invention] Fig. 1 shows the entire laser processing device according to an embodiment of the present invention, in which a laser power supply section 1, an NC control device 3, an arm section 5, a desk 7, and a work area support 9 are integrated. It is assembled exactly.

A laser oscillation device 11 is built in the arm portion 5, and a laser beam bending device 13 is attached to the tip of the laser oscillation device 11. Further, a laser processing head 15 is provided below the bending device 13, and a focusing device (not shown) for focusing a laser beam onto the workpiece W is housed here.

Desk 7 is provided here for workers to perform NC programming work,
A heat exchanger (not shown) for water cooling the laser oscillation device 11 is housed inside.

Work area 1 is on work area support 9.
7 is installed. Further, an air filter (not shown) is built in the work area support 9 to filter the metal mist generated in the work area 17 and exhaust it as clean air.

The work area 17 is provided with a work handling mechanism and a laser beam transmission mechanism depending on the type of processing inside the laser beam ceiling cover 19. Workpiece X as a workpiece handling mechanism
- A Y positioning device 21 and a taper processing device 23 for supporting the workpiece W are provided.

To explain the details of the work area 17 based on FIG. 2, the laser beam guided by the laser beam guide bar 25 from the laser oscillation device 11 is bent downward at right angles by the bending device 13, and the laser beam is bent downward at a right angle by the bending device 13. You will be led to head 15.
A nozzle 27 for ejecting auxiliary gas is attached to the lower end of the processing head 15. The laser processing head 15 and nozzle 27 are inserted into the laser beam shield cover 19 so as to face each other above the taper processing device 23.

An X-axis table 29 is provided inside the laser beam ceiling cover 19.
The axis stage 31 is driven by a motor 33 in the X-axis direction. A Y-axis table 35 is mounted on this X-axis stage 31. A Y-axis stage 37 is provided within the Y-axis table 35 and is driven by a motor 39 in the Y-axis direction. Furthermore, a plate 41 is attached on the Y-axis stage 37. The X-axis table 29, the Y-axis table 35, and the plate 41 constitute an X-Y positioning device 21.

A taper processing device 23 including a furnace 43 is mounted on the plate 41. A more detailed explanation of this taper processing device 23 will be given based on FIGS. 3 and 4. A base plate 45 is attached to the plate 41 in FIG. 2, and a worm 47 is provided on the base plate 45.
Rotationally driven by. A casing 51 is provided on the side of the worm 47, and a worm wheel 53 that meshes with the worm 47 is housed within the casing 51. Worm wheel 5
A female screw is provided on the inside of 3, and the screw 55 meshes with the female screw. Therefore, the rotational movement of the worm 47 driven by the motor 49 is converted into the vertical movement of the screw 55 in the Z-axis direction.

A block 57 is attached to the upper part of the screw 55, and a plate 59 is attached to the top of this block 57. A worm 61 is further provided on the plate 59 and is rotationally driven by a motor 63. A worm wheel 67 housed in a casing 65 is provided on the side of the worm 61 and meshes with the worm 61.

A rotor 69 is mounted on the worm wheel 67. The upper surface of the rotor 69 is configured to be a surface inclined by a predetermined angle θ, and supports a slide bush 71 provided at the center of the bottom surface of the furnace 43 in a freely slidable manner.

A conical cone 73 having an apex angle of 2θ is attached to the side surface of the furnace 43, and is inserted into a cylindrical hole 77 of a block 75 attached to the plate 59.

In this way, the taper processing device 23 including the furnace 43 is constructed on the XY positioning device 21.

The taper processing operation by the laser processing apparatus having the above configuration will be described next. X in work area 17
-The operation of the Y positioning device 21 will be explained first.
By driving the motors 33 and 39, the X-axis stage 31 and the Y-axis stage 37 are moved in the X-axis direction, respectively.
By driving in the Y-axis direction, the upper plate 41 can be moved in the two XY-axis directions.
In this way, the workpiece W on the furnace 43 can be moved two-dimensionally with respect to the machining head 15 by movement in the two XY axes, and the desired machining position can be brought directly below the machining head 15.

In order to tilt the workpiece W with respect to the laser optical axis and give the cut surface a taper θ, the worm 61 is rotated by driving the motor 63, and the rotor 69 on the worm wheel 67 is rotated around the Z axis. The work W is precessed and rotated by a predetermined angle, and the cut surface of the workpiece W at a predetermined position is set at an angle of θ with respect to the normal direction n→.

At the same time as this operation, or before or after this operation, the motor 49 is driven to rotate the worm 47 so that the laser beam irradiated from the laser processing head 15 maintains a predetermined distance from the processing position of the workpiece W.
The screw 5 is rotated by the rotation of the worm wheel 53.
5 up and down by a predetermined distance.

By the above operation, a predetermined portion of the workpiece W can be laser cut with a taper of θ. In addition, when performing taper cutting of each part of this workpiece W, the adjustment of the X-axis and Y-axis, the vertical position of the furnace 43, the adjustment of the inclination direction, etc. are made in advance.
Programming is done in the NC control device 3, and the motors 33, 39,
The rotations of 49 and 63 are controlled and automatically adjusted.

When tapering the workpiece W as described above, the furnace 43 moves in a undulating manner due to the rotation of the rotor 69, but the conical cone 73 is placed along the inner circumference of the hole 77 to restrict this movement. Moving.

To further explain this operation based on FIGS. 5 and 6, for example, when machining a disk-shaped product with a _radius r shown in FIG. It is necessary to always maintain the incident angle of the laser beam at θ with respect to the normal vector n→. As shown in FIG. 6, the X-Y positioning device 21 positions six points a ₁ , a ₂ ,...a on the workpiece W as processing points _{P 0 (} r, o).
When laser processing is performed continuously while sequentially positioning, processing trajectories as shown at T ₁ , T ₂ , ...T ₆ are sequentially obtained. Therefore, in order to precess so that the incident angle with respect to the normal vector n→ at each point a ₁ , a ₂ , ... a ₆ becomes θ, the position coordinates of the machining start point Pn of the workpiece W must be (x ₁ , y ₁ ), (x ₂ , y ₂ ),...
When moving as (x ₆ , x ₆ ), the rotation speed ψ of the rotor 69 is controlled by the formula ψn=tan ⁻¹ [yn/(2r−xn)].

FIG. 7 shows another embodiment, and shows means for continuously changing the taper angle. In FIG. 3, the furnace 43 is used to process the workpiece W at the position of the maximum inclination angle θ, but it is used by changing the inclination angle at the processing point within the range of -θ to +θ. In other words, when the posture of the workpiece W is fixed at an angle θ with respect to the It is.
Therefore, taper processing can be performed by setting the angle of the cut surface at the processing point P ₀ to any angle between −θ and +θ.

[Effects of the Invention] Since the present invention has a work table equipped with a precession mechanism, the work can be supported at a predetermined angle with respect to the laser optical axis, and the work can be laser cut while tapering the work. Can be processed.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a laser processing apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of a work area in the above embodiment, and FIG. 3 is a partially cutaway front view of a work table in the above embodiment. FIG. 4 is a plan view of the work table of the above embodiment, FIGS. 5 and 6 are explanatory diagrams of the laser cutting operation of the above embodiment, and FIG.
The figure is a plan view of a work table of another embodiment, No. 8
FIG. 9 is a perspective view of a workpiece in a cutting state according to a conventional example, and FIG. 9 is a perspective view showing a workpiece in a taper processing state according to the above embodiment. 1... Laser power supply unit, 3... NC control device, 5
... Arm section, 7 ... Desk, 9 ... Work area support, 11 ... Laser oscillation device, 13 ...
Bending device, 15... Processing head, 17...
... Work area, 19 ... Laser beam ceiling cover, 21 ... Work drive mechanism, 23 ... Taper processing device, 25 ... Beam guide bar, 27
... Nozzle, 29 ... X-axis table, 31 ...
X-axis stage, 33...Motor, 35...Y-axis table, 37...Y-axis stage, 39...
Motor, 41... Plate, 43... Furnace, 45... Base plate, 47... Worm, 49... Motor, 51... Casing, 53
... Wormwheel, 55 ... Screw, 5
7...Block, 59...Plate, 61...Worm, 63...Motor, 65...Casing,
67...Worm wheel, 69...Rotor, 7
1...Slide button, 73...Circle, 75
...Block, 77...hole.

Claims (1)

[Claims] 1. In a laser processing device equipped with a laser oscillation device, a laser beam focusing device for a workpiece, and an X-Y positioning device for the workpiece, a work table equipped with a precession mechanism is provided on the X-Y positioning device, and A laser processing apparatus characterized in that a distance adjusting device is provided for adjusting a relative distance between the work table and the laser beam focusing device.