JPH06102478B2 - Semiconductor wafer packaging container - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging container for transporting and storing semiconductor materials, devices, and the like, and is particularly preferably used for transporting and storing wafers. The present invention relates to a packaging container to be obtained.

2. Description of the Related Art Conventional techniques and problems Semiconductor materials such as wafers, devices, etc. are extremely fragile and easily damaged, and are easily contaminated by the atmosphere. Therefore, careful handling is required during their transportation and storage.

Conventionally, as a packaging container for transporting and storing such wafers, those shown in FIGS. 7 and 8 have been widely used.

The packaging container shown in FIG. 7 has lower and upper cases 2 and 6 connected to each other by hinges 4 so that they can be opened and closed, and a wafer 10 for holding a wafer is arranged in the lower case 2. The film 10 is fixed to the lower case 2 with an adhesive 10c provided on one side, and a silicon oxide gel layer 10b is provided on the side facing the upper case 6.

When the wafer to be transported or stored is placed on the surface of the film 10, the wafer is adhered in place by the silicon oxide gel layer 10b formed on the film 10 and held in the lower case 2. On the other hand, when the wafer is taken out if necessary, the desired wafer can be picked up by using a pin set and the wafer can be peeled from the silicon oxide gel layer 10b and taken out.

However, wafers that can be handled in such packaging containers have a side of 1 mm, that is, 1 mm square wafers are the limit, and in the case of 10 mm square wafers or more, due to the pinching action by the pin set when removing the wafer from the container. The wafer is easily broken, or even if it is not broken, the edge portion of the wafer is chipped, or the internal force is generated in the material due to the clamping force, which causes deterioration of the quality of the product.

The packaging container shown in FIG. 8 has a circular lower case 2.
The bottom surface 2a of the is formed into a concave shape, and a large circular wafer A
Is placed on the bottom surface 2a, and the wafer A is pressed by the holding means 12.
It is for holding by holding the outer peripheral part between both cases for packaging, and it is not possible to package wafers other than circular wafers, and even for circular wafers it is impossible to package small wafers. .

OBJECT OF THE INVENTION It is an object of the present invention to provide a semiconductor wafer packaging container for efficiently transporting and storing wafers of various shapes and sizes, even rectangular or small semiconductor wafers.

Another object of the present invention is a semiconductor wafer packaging container in which wafers of various shapes and sizes can be easily taken out without damaging them even if they are rectangular or small semiconductor wafers or causing internal stress. Is to provide.

Means for Solving the Problems The above object is achieved by the packaging container according to the present invention. SUMMARY OF THE INVENTION The present invention is summarized as a packaging container for transporting and storing semiconductor wafers, which are openably and closably connected to each other by hinge means, and when closed, engage in a sealed manner to form a space inside. First and second configured to form
And a film having an adhesive layer which is arranged in the first case to be removable so as to be capable of temporarily adhering a wafer on the side facing the second case, and the both cases are closed. And a film pressing means for pressing the film when it is engaged in a closed state and holding the film in the first case. According to a preferred embodiment of the invention, the adhesive is a silicon oxide gel.

Next, the packaging container according to the present invention will be described in more detail with reference to the drawings.

1 to 3, a packaging container 1 according to the present invention
Is the first case, the lower case 2 in this embodiment, and the first case.
Second hinged means 4 pivotally connected to the case of
And the upper case 6 in this embodiment. The first and second cases 2 and 6 are formed in a box shape such that their open portions are engaged with each other in a sealed manner to form a space inside, but the overall shape may be rectangular or circular. You can also do it. Further, it is preferable that both cases 2 and 6 are made of transparent plastic.

In the first case 2, a film 10 for holding a packaged article A such as a wafer is arranged. According to the present invention, the film 10 comprises a base film 10a and an adhesive layer 10b, and does not have an adhesive layer to be adhered to the first case 2 as in the conventional case. Therefore, the film is not fixed to the first case but can be taken out from the case.

The base film 10a of the film 10 preferably has a film thickness.
The adhesive layer 10b made of a flexible material of about 0.1 mm and provided on the side facing the second case 6 is preferably a gel of silicon oxide.

The adhesive layer 10b has a property of temporarily adhering the article A such as a wafer, but easily peeling the article A by applying a certain amount of force.

On the other hand, as shown in FIG. 3, the second case 6 pushes the film 10 toward the first case 2 when the two cases 2 and 6 are engaged in a sealed state, and the film 10 is pressed. The first
Means for holding the film that acts to hold it in the case 2
12 are formed. In this embodiment, the film holding means 12
Are projections formed at the corners of the second case 6.

The film pressing means 12 does not have to be a protrusion as shown in FIG. 2, and for example, as shown in FIGS. 4 and 5, a rectangular annular rubber packing which is arranged between the second case 6 and the upper surface of the film. It is also possible to use an elastic member such as.
In this embodiment, the rubber packing 12 is formed to be slightly larger than the first case 2, and when it is accommodated in the first case 2, it is curved as shown in FIG. Therefore,
The curved portion is pressed by the second case 6, so that the film 10 can be fixedly held in the container.

With the above structure, an article A such as a wafer is placed on the adhesive layer 10b of the film 10 and temporarily fixed by adhesion, as shown in FIG. 1, and placed in the first case 2. . Next, when the second case 6 is engaged with the first case 2, both cases are engaged with each other in a sealed state, and at the same time, the film holding means 12 holds the film 10 having the wafer in the packaging container. Therefore, even if the packaging container is turned upside down, even if the film 10 may bend due to the weight of the wafer, the wafer is
It does not hit the case 6 and therefore the wafer is not damaged. When removing the wafer, remove the film that holds the wafer from the packaging container,
The film is curved, as shown in FIG. By this operation, the wafer A can be easily moved to the film 10
Stripped from. Such a series of separating operations can be performed without contacting the wafer A, and the wafer A is not subjected to a strong gripping force due to the use of a pin set as in the conventional case, so that the wafer A is damaged or No internal stress is generated in the wafer A.

Effects of the Invention The packaging container according to the present invention configured as described above can efficiently transport and store wafers of various shapes and sizes, and can be used as a pin set or the like when taking out an article such as a wafer as in the conventional case. Therefore, it has an effect that the wafer can be easily taken out without damaging the wafer and causing no internal stress in the article.

The packaging container of the present invention is particularly effective for packaging wafers other than the conventional circular shape and wafers having a side of 10 mm or more.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of a packaging container according to the present invention, showing both cases in an open state. 2 is a plan view of the container of FIG. 1 in a closed condition. FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. 2, showing both cases in a closed condition. FIG. 4 is a cross-sectional view of another embodiment of the packaging container according to the present invention, showing a cross section taken along line 4-4 in FIG. FIG. 5 is a plan view of the container of FIG. FIG. 6 is a side view of the film for explaining how to take out the article to be packaged. 7 and 8 are cross-sectional views of a conventional packaging container. 2: First case 6: Second case 10: Film 10a: Base film 10b: Adhesive layer 12: Film pressing means

Claims (4)

[Claims] 1. A packaging container for transporting and storing a semiconductor wafer, wherein the packaging container is openably and closably connected to each other by hinge means, and when closed, engages in a sealed manner to form a space therein. And first and second cases configured as described above, and arranged so as to be removable in the first case,
A film having an adhesive layer capable of temporarily adhering a wafer on the side facing the second case, and pressing the film when both cases are closed and engaged in a hermetically sealed state. A semiconductor wafer packaging container, comprising: a film pressing means held in a first case. 2. The semiconductor wafer packaging container according to claim 1, wherein the adhesive is a gel of silicon oxide. 3. The semiconductor wafer packaging container according to claim 1 or 2, wherein the film pressing means is a protrusion formed on the second case. 4. The film pressing means is an elastic means provided between the film and the second case.
The semiconductor wafer packaging container according to item 2 or item 3.