JPH0611778B2 - Method for producing resol type phenolic resin composition for laminated plate - Google Patents
Method for producing resol type phenolic resin composition for laminated plateInfo
- Publication number
- JPH0611778B2 JPH0611778B2 JP59111681A JP11168184A JPH0611778B2 JP H0611778 B2 JPH0611778 B2 JP H0611778B2 JP 59111681 A JP59111681 A JP 59111681A JP 11168184 A JP11168184 A JP 11168184A JP H0611778 B2 JPH0611778 B2 JP H0611778B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- phenolic resin
- resol
- type phenolic
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title claims description 13
- 239000011134 resol-type phenolic resin Substances 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 24
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 12
- -1 fatty acid ester Chemical class 0.000 claims description 12
- 239000003063 flame retardant Substances 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 6
- 239000000194 fatty acid Substances 0.000 claims description 6
- 229930195729 fatty acid Natural products 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 150000004665 fatty acids Chemical class 0.000 claims description 4
- 238000006757 chemical reactions by type Methods 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 239000003921 oil Substances 0.000 description 7
- 235000019198 oils Nutrition 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000031709 bromination Effects 0.000 description 6
- 238000005893 bromination reaction Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001879 gelation Methods 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- 238000004080 punching Methods 0.000 description 5
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000002383 tung oil Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- VIHUMJGEWQPWOT-UHFFFAOYSA-N 1,2,3-tribromo-4-(3-bromophenoxy)benzene Chemical compound BrC1=CC=CC(OC=2C(=C(Br)C(Br)=CC=2)Br)=C1 VIHUMJGEWQPWOT-UHFFFAOYSA-N 0.000 description 1
- CJWNFAKWHDOUKL-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 CJWNFAKWHDOUKL-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- HDECRAPHCDXMIJ-UHFFFAOYSA-N 2-methylbenzenesulfonyl chloride Chemical compound CC1=CC=CC=C1S(Cl)(=O)=O HDECRAPHCDXMIJ-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- ISTRSBTYMRJTQN-UHFFFAOYSA-N dibromo(phenyl)methanol Chemical compound OC(Br)(Br)C1=CC=CC=C1 ISTRSBTYMRJTQN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- YFDSDPIBEUFTMI-UHFFFAOYSA-N tribromoethanol Chemical compound OCC(Br)(Br)Br YFDSDPIBEUFTMI-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Description
【発明の詳細な説明】 [発明の技術分野] 本発明は耐燃性、優れた加工性および電気特性を有する
積層板用レゾール型フェノール樹脂組成物の製造方法に
関する。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for producing a resol-type phenolic resin composition for a laminate, which has flame resistance, excellent processability, and electrical characteristics.
[発明の技術的背景とその問題点] 近年、電子工業の著しい発達により印刷配線板の使用条
件が苛酷になり、基板に要求される特性が益々厳しいも
のとなってきている。特に部品のチップ化、自動挿入
化、高密度パターン化等により優れた電気特性、物理特
性、加工性を有し、かつ安全性重視の点から難燃性を有
することが不可欠な条件となってきている。[Technical Background of the Invention and Problems Thereof] In recent years, due to the remarkable development of the electronic industry, the usage conditions of printed wiring boards have become severe, and the characteristics required for substrates have become more and more severe. In particular, it has become an indispensable condition to have excellent electrical properties, physical properties, workability due to chipping of parts, automatic insertion, high density patterning, etc., and flame retardance from the viewpoint of safety. ing.
従来より、積層板に打抜き加工性と難燃性を兼ね備えさ
せる方法が種々検討されており、難燃化という観点から
みれば、打抜き加工性改良のために使用する乾性油等の
変性剤は、難燃化を困難かつ複雑化させている。Conventionally, various methods have been studied to combine punching workability and flame retardancy in a laminated plate, and from the viewpoint of flame retardancy, modifiers such as drying oil used for improving punching workability are: Flame retardation is difficult and complicated.
難燃化はハロゲンあるいはリン化合物を樹脂中に添加さ
せる添加型難燃剤を使用するものと、樹脂中に化学的に
結合させる反応型難燃剤を使用するものがあり、それぞ
れ一長一短がある。There are advantages and disadvantages in flame retarding, that is, using an addition type flame retardant in which a halogen or phosphorus compound is added to the resin and using a reaction type flame retardant that is chemically bonded to the resin.
前者は難燃剤が製品中に未反応で残存するため、耐熱
性、耐溶剤性等の特性低下、さらには打抜き加工時発生
する粉が多い等の欠点がある。The former has the drawbacks that the flame retardant remains unreacted in the product, resulting in deterioration of properties such as heat resistance and solvent resistance, and more powder generated during punching.
従って、特性低下を起こさせないためには、反応型難燃
剤が好ましいが、低温側での打抜き加工性がやや劣る欠
点がある。Therefore, a reactive flame retardant is preferable in order not to cause deterioration of properties, but there is a drawback that the punching workability at the low temperature side is slightly inferior.
[発明の目的] 本発明は以上のような問題点を改善することを目的とし
たもので、打抜き加工性および難燃性に優れ、かつ積層
板の特性低下を起さない反応型難燃剤を用いた積層板用
レゾール型フェノール樹脂組成物の製造方法を提供する
ことを目的とする。[Object of the Invention] The present invention is intended to solve the above problems, and to provide a reactive flame retardant which is excellent in punching workability and flame retardancy and which does not cause deterioration of the properties of a laminate. It is an object of the present invention to provide a method for producing the used resol-type phenolic resin composition for laminated plates.
[発明の概要] すなわち本発明の積層板用レゾール型フェノール樹脂組
成物の製造方法は、乾性油または半乾性油の脂肪酸また
は脂肪酸エステルとハロゲン化化合物とに反応により合
成される反応型難燃剤を酸性触媒の存在下でフェノール
類と反応させた後、塩基性触媒の存在下でホルムアルデ
ヒドと反応させることを特徴としている。[Summary of the Invention] That is, the method for producing a resol-type phenolic resin composition for laminated plates of the present invention comprises a reaction type flame retardant synthesized by a reaction between a fatty acid or a fatty acid ester of a drying oil or a semi-drying oil and a halogenated compound. It is characterized by reacting with phenols in the presence of an acidic catalyst and then with formaldehyde in the presence of a basic catalyst.
本発明で用いられる乾性油としては桐油、アマニ油、大
豆油等があり、半乾性油としてナタネ油、ゴマ油等があ
る。またハロゲン化化合物としては2,2,2−トリブ
ロモエタノール、パラブロモフェネチルアルコール、ジ
ブロモベンジルアルコール等が挙げられる。The drying oil used in the present invention includes tung oil, linseed oil, soybean oil and the like, and the semi-drying oil includes rapeseed oil, sesame oil and the like. Examples of the halogenated compound include 2,2,2-tribromoethanol, para-bromophenethyl alcohol, dibromobenzyl alcohol and the like.
本発明による反応型難燃剤の合成における脂肪酸類とハ
ロゲン化化合物との配合比は任意に選択し得るが、生成
物が以下に述べるハロゲン含有率を有するように選択す
るのが適当である。すなわち、生成するハロゲン化エス
テル化合物はハロゲン含有率10〜50%、平均分子量
300〜1000のものが適当であり、より好ましくは
ハロゲン含有率15〜30%、平均分子量400〜60
0のものが適当である。またハロゲン化エステル化合物
としては臭素化エステル化合物や塩素化エステル化合物
が好ましい。このような臭素化エステル化合物のうち市
販のものとしては、例えば第一工業製薬社製GX−60
25(臭素化率27%)およびGX−6026(臭素化
率16%)(いずれも商品名)があげられる。The blending ratio of the fatty acid and the halogenated compound in the synthesis of the reactive flame retardant according to the present invention can be arbitrarily selected, but it is suitable to select so that the product has the halogen content described below. That is, the halogenated ester compound to be produced preferably has a halogen content of 10 to 50% and an average molecular weight of 300 to 1000, more preferably a halogen content of 15 to 30% and an average molecular weight of 400 to 60.
A value of 0 is suitable. As the halogenated ester compound, a brominated ester compound or a chlorinated ester compound is preferable. Among such brominated ester compounds, commercially available compounds include, for example, GX-60 manufactured by Daiichi Kogyo Seiyaku Co., Ltd.
25 (bromination rate 27%) and GX-6026 (bromination rate 16%) (both are trade names).
本発明に使用するフェノール類としては、フェノール、
クレゾール、キシレノール等のようなアルキルフェノー
ル類、フェニルフェノール類、クミルフェノール等のア
リールフェノール類、さらにはハロゲン化フェノール
類、ビスフェノールA等の多価フェノール類も用いるこ
とができる。The phenols used in the present invention include phenol,
Alkylphenols such as cresol and xylenol, arylphenols such as phenylphenol and cumylphenol, and polyhydric phenols such as halogenated phenols and bisphenol A can also be used.
本発明に使用する酸性触媒としては、ベンゼンスルホン
酸、トルエンスルホン酸のような有機スルホン酸類、ト
ルエンスルホン酸クロライドのような有機スルホン酸塩
類、塩化錫、塩化亜鉛のような金属塩類の他にリン酸、
塩酸、硫酸のような無機酸やギ酸、シュウ酸のような有
機酸を含む。Examples of the acidic catalyst used in the present invention include organic sulfonic acids such as benzenesulfonic acid and toluenesulfonic acid, organic sulfonic acid salts such as toluenesulfonic acid chloride, metal salts such as tin chloride and zinc chloride, and phosphorus. acid,
It includes inorganic acids such as hydrochloric acid and sulfuric acid, and organic acids such as formic acid and oxalic acid.
本発明に使用する塩基性触媒としては、アンモニア、ヘ
キサメチレンテトラミン、トリエタノールアミン、モノ
メチルアミン、エチレンジアミンのようなアミン類、水
酸化ナトリウム、水酸化カリウム、水酸化カルシウム、
水酸化マグネシウムのようなアルカリ金属やアルカリ土
類金属の水酸化物や炭酸ナトリウム等の無機塩類があげ
られる。As the basic catalyst used in the present invention, ammonia, hexamethylenetetramine, triethanolamine, monomethylamine, amines such as ethylenediamine, sodium hydroxide, potassium hydroxide, calcium hydroxide,
Examples thereof include hydroxides of alkali metals and alkaline earth metals such as magnesium hydroxide, and inorganic salts such as sodium carbonate.
本発明に使用するホルムアルデヒドとしては、ホルマリ
ン液あるいはパラホルムアルデヒドがあげられる。Examples of formaldehyde used in the present invention include formalin solution and paraformaldehyde.
本発明においては、まず、乾性油または半乾性油脂肪酸
のハロゲン化エステル化合物とフェノール類とに酸性触
媒を添加し、強酸性下で80〜150℃の温度で0.5
〜3時間反応させる。得られた反応物に塩基性触媒を添
加して中和し、pH5〜9程度の領域でホルムアルデヒド
と1〜6時間反応させてレゾール化させる。ここでハロ
ゲン化エステル化合物とフェノール類の使用割合はフェ
ノール類100重量部に対してハロゲン化エステル化合
物80〜200重量部であり、これらの反応物とホルム
アルデヒドとの使用割合は反応物1モルに対し、ホルム
アルデヒド1.1〜1.9モルである。In the present invention, first, an acidic catalyst is added to a halogenated ester compound of a drying oil or a semi-drying oil fatty acid and a phenol, and the mixture is subjected to 0.5 at a temperature of 80 to 150 ° C. under strong acidity.
Allow to react for ~ 3 hours. A basic catalyst is added to the resulting reaction product to neutralize it, and the reaction product is reacted with formaldehyde in a pH range of about 5 to 9 for 1 to 6 hours to form a resol. Here, the usage ratio of the halogenated ester compound and the phenol is 80 to 200 parts by weight of the halogenated ester compound to 100 parts by weight of the phenol, and the usage ratio of these reaction products and formaldehyde is 1 mol of the reaction product. , Formaldehyde 1.1 to 1.9 mol.
次に反応液を減圧脱水することにより本発明に係わる積
層板用レゾール型フェノール樹脂組成物が得られる。Next, the reaction solution is dehydrated under reduced pressure to obtain the resol-type phenol resin composition for laminated plates according to the present invention.
なお、本発明においては、この積層板用レゾール型フェ
ノール樹脂組成物に相溶性の難燃剤を適宜添加すること
もできる。In addition, in the present invention, a compatible flame retardant may be appropriately added to the resol-type phenol resin composition for laminated plates.
このようにして得られた積層板用レゾール型フェノール
樹脂組成物を有機溶剤に溶解希釈し、これをクラフト紙
等の紙基材に含浸させ、これを複数枚積層した後、加熱
加圧成形することにより目的の積層板が得られる。The thus-obtained resol-type phenolic resin composition for laminated plate is dissolved and diluted in an organic solvent and impregnated in a paper base material such as kraft paper, and a plurality of the laminated substrates are heat-pressed. As a result, the desired laminate is obtained.
[発明の実施例] 次に本発明の実施例について記載する。Examples of the Invention Next, examples of the present invention will be described.
実施例1 コンデンサ付四つ口フラスコに、桐油臭素化エステル
(GX−6025 第一工業製薬社製)100g、フェ
ノール100gおよびパラトルエンスルホン酸0.2g
を仕込み、100℃で2時間反応させた後、37%ホル
マリン140g、モノメチルアミンでpH6に調節した
後、100℃で2時間反応させた。反応後減圧脱水し、
トルエン:メタノール=1:2溶液で希釈し、樹脂固形
分55%、粘度1.5ポアズ(25℃)、ゲル化時間3
分10秒(150℃)のワニスを調整した。Example 1 In a four-necked flask with a condenser, tung oil brominated ester (GX-6025 manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) 100 g, phenol 100 g, and paratoluenesulfonic acid 0.2 g.
Was charged, reacted at 100 ° C. for 2 hours, adjusted to pH 6 with 140% of 37% formalin and monomethylamine, and then reacted at 100 ° C. for 2 hours. After the reaction, dehydration under reduced pressure,
Diluted with toluene: methanol = 1: 2 solution, resin solid content 55%, viscosity 1.5 poise (25 ° C.), gelation time 3
A varnish having a time of 10 seconds (150 ° C.) was prepared.
実施例2 コンデンサ付四つ口フラスコに桐油臭素化エステル(G
X−6026 第一工業製薬社製)200g、フェノー
ル100gおよびパラトルエンスルホン酸0.2gを仕
込み、100℃で2時間反応させた後、37%ホルマリ
ン140gを加えモノメチルアミンでpH6に調節した
後、100℃で2時間反応させた。反応後減圧脱水し、
トルエン:メタノール=1:2溶液で希釈し、樹脂固形
分56%、粘度1.7ポアズ(25℃)、ゲル化時間4
分(150℃)のワニスを調整した。Example 2 Tung oil brominated ester (G
X-6026 (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), 200 g, 100 g of phenol and 0.2 g of paratoluenesulfonic acid were charged, reacted for 2 hours at 100 ° C., 140 g of 37% formalin was added, and the pH was adjusted to 6 with monomethylamine. The reaction was carried out at 100 ° C for 2 hours. After the reaction, dehydration under reduced pressure,
Diluted with toluene: methanol = 1: 2 solution, resin solid content 56%, viscosity 1.7 poise (25 ° C.), gelation time 4
A varnish of minutes (150 ° C.) was prepared.
実施例3 実施例1で得られた樹脂組成物にクレジルジフェニルフ
ォスフェートを添加し、ブロム化率12%、リン化率1
%になるよう混合し、ゲル化時間4分(150℃)のワ
ニスを調整した。Example 3 Cresyl diphenyl phosphate was added to the resin composition obtained in Example 1 to give a bromination rate of 12% and a phosphation rate of 1
% To prepare a varnish having a gelation time of 4 minutes (150 ° C.).
実施例4 実施例2で得られた樹脂組成物にクレジルジフェニルフ
ォスフェートを添加し、ブロム化率8.5%、リン化率
1.8%になるよう混合し、ゲル化時間5分10秒(1
50℃)のワニスを調整した。Example 4 Cresyl diphenyl phosphate was added to the resin composition obtained in Example 2 and mixed so that the bromination rate was 8.5% and the phosphation rate was 1.8%, and the gelation time was 5 minutes 10 Seconds (1
A varnish of 50 ° C.) was prepared.
比較例1 コンデンサ付四つ口フラスコにフェノール110g、桐
油90g、パラトルエンスルホン酸0.2gを仕込み、
後は実施例1と同様にして反応させ、樹脂固形分55
%、粘度2.0ポアズ(25℃)、ゲル化時間3分(1
50℃)のワニスを調整した。Comparative Example 1 A four-necked flask with a condenser was charged with 110 g of phenol, 90 g of tung oil, and 0.2 g of paratoluenesulfonic acid,
After that, the reaction is carried out in the same manner as in Example 1 to give a resin solid content of 55.
%, Viscosity 2.0 poise (25 ° C.), gelation time 3 minutes (1
A varnish of 50 ° C.) was prepared.
比較例2 比較例1で得た樹脂組成物に、テトラブロモジフェニル
エーテルおよびクレジルジフェニルフォスフェートをブ
ロム化率12%、リン化率1%になるよう混合し、ゲル
化時間5分30秒(150℃)のワニスを調整した。Comparative Example 2 Tetrabromodiphenyl ether and cresyl diphenyl phosphate were mixed with the resin composition obtained in Comparative Example 1 so that the bromination rate was 12% and the phosphation rate was 1%, and the gelling time was 5 minutes 30 seconds (150 ℃) was prepared.
比較例3 比較例1で得た樹脂組成物に、YDB−400T60
(東都化成(株)製)およびクレジルジフェニルフォス
フェートをブロム化率12%、リン化率1%になるよう
混合し、ゲル化時間2分30秒(150℃)のワニスを
調整した。Comparative Example 3 YDB-400T60 was added to the resin composition obtained in Comparative Example 1.
(Toto Kasei Co., Ltd.) and cresyl diphenyl phosphate were mixed so that the bromination rate was 12% and the phosphation rate was 1%, and a varnish with a gelation time of 2 minutes and 30 seconds (150 ° C.) was prepared.
以上の実施例および比較例で得た樹脂組成物を10ミル
スのクラフト紙に含浸塗布し、樹脂含浸量50重量%、
レジンフロー8%の加工紙を得た。この加工紙8枚と接
着付銅箔1枚を重ね合せ、170℃、100Kg/cm2の
加熱加圧条件で75分間成形し、厚さ1.6mmの銅張積
層板を得た。得られた銅張積層板の特性についての試験
結果を表に示す。The resin compositions obtained in the above Examples and Comparative Examples were impregnated and applied to 10 mils kraft paper to obtain a resin impregnation amount of 50% by weight,
A processed paper having a resin flow of 8% was obtained. Eight sheets of this processed paper and one sheet of copper foil with adhesive were superposed on each other and molded under heat and pressure conditions of 170 ° C. and 100 kg / cm 2 for 75 minutes to obtain a copper clad laminate having a thickness of 1.6 mm. The test results for the properties of the obtained copper clad laminate are shown in the table.
[発明の効果] 以上の実施例からも明らかなように、本発明による積層
板用レゾール型フェノール樹脂組成物は従来のものに比
べ難燃性に優れていると同時に、優れた電気特性、物理
特性をも有するものである。 [Effects of the Invention] As is clear from the above examples, the resol-type phenolic resin composition for laminates according to the present invention is superior in flame retardancy to conventional ones, and at the same time has excellent electrical characteristics and physical properties. It also has characteristics.
Claims (4)
酸エステルとハロゲン化化合物との反応により合成され
る反応型難燃剤を酸性触媒の存在下でフェノール類と反
応させた後、塩基性触媒の存在下でホルムアルデヒドと
反応させることを特徴とする難燃性積層板用レゾール型
フェノール樹脂組成物の製造方法。1. A reaction-type flame retardant synthesized by the reaction of a fatty acid or a fatty acid ester of a drying oil or a semi-drying oil with a halogenated compound is reacted with a phenol in the presence of an acidic catalyst, and then a basic catalyst is added. A method for producing a resol-type phenol resin composition for flame-retardant laminates, which comprises reacting with formaldehyde in the presence of the same.
0%である特許請求の範囲第1項記載の積層板用レゾー
ル型フェノール樹脂組成物の製造方法。2. The halogen content of the reactive flame retardant is 10-5.
It is 0%, The manufacturing method of the resol type phenolic resin composition for laminated boards of Claim 1.
許請求の範囲第1項記載の積層板用レゾール型フェノー
ル樹脂組成物の製造方法。3. The method for producing a resol-type phenolic resin composition for laminated plates according to claim 1, wherein the halogenated compound is a brominated compound.
特許請求の範囲第1項から第3項のいずれか1項に記載
の積層板用レゾール型フェノール樹脂組成物の製造方
法。4. A method for producing a resol-type phenolic resin composition for a laminated plate according to claim 1, wherein a compatible flame retardant is added to the resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59111681A JPH0611778B2 (en) | 1984-05-31 | 1984-05-31 | Method for producing resol type phenolic resin composition for laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59111681A JPH0611778B2 (en) | 1984-05-31 | 1984-05-31 | Method for producing resol type phenolic resin composition for laminated plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60255816A JPS60255816A (en) | 1985-12-17 |
| JPH0611778B2 true JPH0611778B2 (en) | 1994-02-16 |
Family
ID=14567479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59111681A Expired - Lifetime JPH0611778B2 (en) | 1984-05-31 | 1984-05-31 | Method for producing resol type phenolic resin composition for laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611778B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5432671A (en) * | 1977-08-12 | 1979-03-10 | Takasaki Nobuyuki | Calcium enriched table salt |
-
1984
- 1984-05-31 JP JP59111681A patent/JPH0611778B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60255816A (en) | 1985-12-17 |
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