JPH0611841B2 - Conductive epoxy resin composition - Google Patents
Conductive epoxy resin compositionInfo
- Publication number
- JPH0611841B2 JPH0611841B2 JP62003935A JP393587A JPH0611841B2 JP H0611841 B2 JPH0611841 B2 JP H0611841B2 JP 62003935 A JP62003935 A JP 62003935A JP 393587 A JP393587 A JP 393587A JP H0611841 B2 JPH0611841 B2 JP H0611841B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- epoxy resin
- carbon fiber
- resin composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】 〔発明の目的〕 産業上の利用分野 本発明は導電性部材間などの導通を維持しながら強固な
接着を達成する導電性接着剤組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] The present invention relates to a conductive adhesive composition that achieves strong adhesion while maintaining conduction between conductive members.
従来の技術 電気部品などを組立てるに当って金属などの部材の電気
的な導電を確保すると同時に固定したい場合には溶接や
鑞接を用いるのが普通である。しかし、加熱を避けたい
ときやフラックスを用いることができないとき、あるい
はハンダなどが乗らない素材を使用するときは導電性の
接着剤などが用いられる。2. Description of the Related Art When assembling an electric component or the like, it is common to use welding or brazing to secure electrical conductivity of a member such as metal and at the same time fix it. However, a conductive adhesive or the like is used when it is desired to avoid heating, when it is not possible to use flux, or when a material such as solder is not used.
こうした導電性接着剤として、銀やニッケルなどの微粉
末を熱硬化性樹脂たとえばスポキシ系樹脂などに分散さ
せたものがあるが、これらの金属粉末は高価であるため
に、安価な導電材料を用いて導電性接着剤を作ることが
提案され、たとえば導電性炭素粉末とエポキシ樹脂を配
合した導電性接着剤などが商品化されている。ところが
導電性炭素粉末はどうしても導電性の点で金属粉末に劣
る。そして、導電性を高めるために多量に配合すると組
成物の粘度が増加し、ポッティングなどの際の加工性が
悪化する問題があり、また硬化後においても高温での導
電性の経時変化が大きいという欠点がある。As such a conductive adhesive, there is one in which fine powder such as silver or nickel is dispersed in a thermosetting resin such as spoxy resin. However, since these metal powders are expensive, an inexpensive conductive material is used. It has been proposed to make a conductive adhesive by using, for example, a conductive adhesive in which a conductive carbon powder and an epoxy resin are mixed has been commercialized. However, conductive carbon powder is inferior to metal powder in terms of conductivity. When a large amount is added to increase the conductivity, the viscosity of the composition increases, and there is a problem that the processability during potting and the like deteriorates. Further, even after curing, there is a large change with time in the conductivity at high temperature. There are drawbacks.
そこで、導電材料として炭素繊維を用いることが考えら
れたが、炭素繊維の長さが長いときには加工性のよい組
成物が得られず、また粉砕して用いても加工性や導電性
の再現性が充分でなく、実用に耐える導電性を有する接
着用組成物は得られていなかった。Therefore, it was considered to use carbon fiber as the conductive material, but when the length of carbon fiber is long, a composition with good processability cannot be obtained, and even if it is crushed and used, reproducibility of processability and conductivity Is not sufficient, and an adhesive composition having conductivity that can withstand practical use has not been obtained.
解決しようとする問題点 本発明は、加工性および導電性が優れ、しかも安定した
品質を持つ導電性接着剤を炭素質の導電材料とくに炭素
繊維を用いて実現することを目的としたものである。Problems to be Solved The present invention has as its object to realize a conductive adhesive having excellent workability and conductivity, and having stable quality, by using a carbonaceous conductive material, particularly carbon fiber. .
問題点を解決するための手段 本発明者は、炭素質の導電材料について研究を進めた結
果、特定の炭素繊維と導電性炭素粉末とを組み合わせる
ことにより、本発明の目的が達成できることを見出し
た。すなわち、本発明の導電性エポキシ樹脂組成物は、
エポキシ樹脂100重量部に対して気相成長系炭素繊維
10−200重量部および導電性炭素粉末5〜100重
量部を配合してなるものである。Means for Solving the Problems The present inventor has conducted research on a carbonaceous conductive material, and as a result, found that the object of the present invention can be achieved by combining a specific carbon fiber and a conductive carbon powder. . That is, the conductive epoxy resin composition of the present invention,
10 to 200 parts by weight of vapor grown carbon fiber and 5 to 100 parts by weight of conductive carbon powder are mixed with 100 parts by weight of epoxy resin.
本発明において用いられたエポキシ樹脂は、溶剤を用い
ずに配合可能な液状樹脂であればよく、たとえばビスフ
ェノール化合物、ポリフェノール化合物、多価アルコー
ル類などとエピクロルヒドリンとを反応させて得られた
エポキシ樹脂やエポキシ化ポリオレフィン、エポキシ化
ポリブタジエンなどのエポキシ基含有樹脂などが用いら
れるが、特に限定されるものではない。The epoxy resin used in the present invention may be a liquid resin that can be compounded without using a solvent, for example, an epoxy resin obtained by reacting epichlorohydrin with a bisphenol compound, a polyphenol compound, a polyhydric alcohol, or the like. Epoxy group-containing resins such as epoxidized polyolefin and epoxidized polybutadiene are used, but are not particularly limited.
本発明において配合される気相成長系炭素繊維は、炭化
水素化合物を触媒の存在の下で、非酸化性雰囲気中で気
相熱分解して得られたものである。このような気相生長
系炭素繊維は、たとえば横型電気炉中に設置したムライ
ト質の反応管中に鉄などの遷移金属又はその化合物の微
粒子を触媒として付着させた担体基板を置き、水素など
のキャリアとたとえばエタン、ベンゼンなどの炭化水素
化合物とのガス状混合物を1000〜1400℃の温度
下に導入し、基板と接触した炭化水素を熱分解して炭素
繊維を成長させ、これを回収することによって得られ
る。更には、同様な反応装置の中にケイ素を含むセラミ
ックス等の基板を置き、水素などのキャリアとたとえば
エタン、ベンゼンなどの炭化水素化合物とたとえば単体
イオウ、硫化水素、メルカプタンなどのイオウ含有物質
との混合ガス、あるいは水素などのキャリアとたとえば
ジベンゾチオフェンなどのイオウ含有炭化水素化合物と
との混合ガスを1200〜1400℃の温度下に導入
し、基板と接触した炭化水素を熱分解して炭素繊維を成
長させ、これを回収することによっても得られる。この
ような気相成長系炭素繊維は、反応条件によって径10
μm、長さ数cm程度のものも得られるが、本発明に於て
は径1〜2μm、長さ0.1〜1mm程度のものが好適に使
用できる。The vapor-grown carbon fiber blended in the present invention is obtained by vapor-phase pyrolyzing a hydrocarbon compound in the presence of a catalyst in a non-oxidizing atmosphere. Such a vapor-grown carbon fiber is obtained by, for example, placing a carrier substrate on which fine particles of a transition metal such as iron or a compound thereof is attached as a catalyst in a mullite reaction tube installed in a horizontal electric furnace to obtain hydrogen gas or the like. Introducing a gaseous mixture of a carrier and a hydrocarbon compound such as ethane or benzene at a temperature of 1000 to 1400 ° C., thermally decomposing the hydrocarbon in contact with the substrate to grow carbon fiber, and recovering the carbon fiber. Obtained by Furthermore, a substrate such as ceramics containing silicon is placed in a similar reaction apparatus, and a carrier such as hydrogen and a hydrocarbon compound such as ethane and benzene and a sulfur-containing substance such as elemental sulfur, hydrogen sulfide, and mercaptan are included. A mixed gas or a mixed gas of a carrier such as hydrogen and a sulfur-containing hydrocarbon compound such as dibenzothiophene is introduced at a temperature of 1200 to 1400 ° C. to thermally decompose the hydrocarbon in contact with the substrate to form carbon fiber. It can also be obtained by growing and recovering this. Such a vapor-grown carbon fiber has a diameter of 10 depending on reaction conditions.
Although a product having a diameter of about μm and a length of several cm can be obtained, a material having a diameter of about 1 to 2 μm and a length of about 0.1 to 1 mm can be preferably used in the present invention.
また、気相成長系炭素繊維と共に配合される導電性炭素
粉末は構造の発達したものが望ましく、特にケッチェン
ブラック(ライオンアクゾ社、商品名)などの如き高導
電性のカーボンブラックを用いるのが好ましい。このよ
うな炭素粉末の粒径としては、10〜50μm程度であ
ることが好ましい。Further, it is desirable that the conductive carbon powder to be blended with the vapor grown carbon fiber has a well-developed structure, and it is particularly preferable to use a highly conductive carbon black such as Ketjen Black (Lion Akzo Co., trade name). preferable. The particle size of such carbon powder is preferably about 10 to 50 μm.
このような気相成長系炭素繊維と導電性炭素粉末とは、
エポキシ樹脂100重量部に対してそれぞれ10〜20
0重量部および5〜100重量部の範囲内にあるのがよ
く、さらには炭素繊維と炭素粉末との合計に対して炭素
繊維が30〜90重量%、さらには40〜80重量%の
範囲内にあるものが好ましい。本発明の組成物中の炭素
繊維や炭素粉末の配合量が少な過ぎると充分な導電性が
得られず、また、配合量が多すぎると組成物の粘度が高
くなり加工性が悪化する。Such vapor grown carbon fiber and conductive carbon powder,
10 to 20 for each 100 parts by weight of epoxy resin
It is preferable to be in the range of 0 parts by weight and 5 to 100 parts by weight, and further to the range of 30 to 90% by weight, and further 40 to 80% by weight of the carbon fiber with respect to the total of the carbon fiber and the carbon powder. Those in are preferred. If the amount of the carbon fiber or carbon powder in the composition of the present invention is too small, sufficient conductivity cannot be obtained, and if the amount is too large, the viscosity of the composition becomes high and the processability deteriorates.
本発明の組成物中には、硬化剤、硬化促進剤、充填剤、
希釈剤などを配合することができる。これらのうち、硬
化剤として好適なものはアミン系硬化剤で、脂肪族アミ
ン、芳香族アミン、複合アミンなどのうちから希望する
硬化条件や硬化物の物性などに応じて適宜選択し、エポ
キシ樹脂100重量部に対して3〜150重量部を使用
するのが適当である。In the composition of the present invention, a curing agent, a curing accelerator, a filler,
A diluent or the like can be added. Of these, amine-based curing agents are preferable as the curing agent, and the epoxy resin is appropriately selected from aliphatic amines, aromatic amines, complex amines, etc. according to desired curing conditions and physical properties of the cured product. It is suitable to use 3 to 150 parts by weight for 100 parts by weight.
作用 本発明の導電性エポキシ樹脂組成物は、良好な加工性を
有していて適用される部材の表面とよくなじみ、強い接
着力を発揮すると共に優れた導電性を有する硬化物が得
られる。Action The conductive epoxy resin composition of the present invention has good processability, is well compatible with the surface of a member to which it is applied, exhibits a strong adhesive force, and provides a cured product having excellent conductivity.
実施例1 エポキシ樹脂としてエピコークト815(シェル化学
社、商品名)、導電性炭素粉末としてケッチェンブラッ
クEC(ライオンアクゾ社、商品名)を用い、また炭素
繊維として下記のような気相成長系炭素繊維FSおよび
FFとPAN系炭素繊維粉砕物FNをそれぞれ第1表に
示すような配合量に従って混合し、充分に混練したのち
硬化剤としてエピキュアZ(シェル化学社、商品名)を
添加、均一に分散させて、導電性エポキシ樹脂組成物を
調製した。Example 1 Epikokuto 815 (Shell Chemical Co., trade name) was used as the epoxy resin, Ketjen Black EC (Lion Akzo Co., trade name) was used as the conductive carbon powder, and the following vapor phase growth carbon was used as the carbon fiber. The fibers FS and FF and the PAN-based carbon fiber pulverized product FN were mixed according to the compounding amounts shown in Table 1 and thoroughly kneaded, and then Epicure Z (trade name of Shell Chemical Co., Ltd.) was added as a curing agent to homogenize the mixture. By dispersing, a conductive epoxy resin composition was prepared.
使用した炭素繊維 FS:イオウおよびケイ素触媒を用いて得たもの (径:約1μm、長さ:約0.3〜0.5mm) FF:鉄系触媒を用いて得たもの (径:約1μm、長さ:約0.3〜0.5mm) FN:トレカMLD−300(東レ社、商品名) (径:約7μm、長さ:約0.3mm) これらの組成物について平行板粘度計を用いて流れ易さ
を測定し、その結果を加工性の指標として第1表に示し
た。Carbon fiber used FS: obtained by using sulfur and silicon catalyst (diameter: about 1 μm, length: about 0.3 to 0.5 mm) FF: obtained by using iron-based catalyst (diameter: about 1 μm , Length: about 0.3 to 0.5 mm) FN: Trading Card MLD-300 (trade name, Toray Co., Ltd.) (Diameter: about 7 μm, Length: about 0.3 mm) A parallel plate viscometer is used for these compositions. The easiness of flow was measured by using the results, and the results are shown in Table 1 as an index of workability.
また、これらの組成物を平滑なガラス板上に均一な厚さ
となるよう薄く塗布し、120℃で3時間加熱処理して
硬化させ、体積固有抵抗を測定した結果を第1表に合せ
て示した。Further, these compositions were thinly applied on a smooth glass plate so as to have a uniform thickness, heat-treated at 120 ° C. for 3 hours to be cured, and the results of measuring volume resistivity are also shown in Table 1. It was
さらに、前記の硬化物を120℃および160℃で熱処
理したときの電気抵抗値経時変化の様子をグラフとして
第1図のA、Bおよび第2図のA、Bに示した。Further, changes in the electric resistance with time when the above-mentioned cured product was heat-treated at 120 ° C. and 160 ° C. are shown as graphs in A and B of FIG. 1 and A and B of FIG.
これらの結果をみると、本発明の組成物は優れた加工性
を保持しながら、PAN系炭素繊維であるFNを配合し
た組成物に比べて初期抵抗値および抵抗値変化率がいず
れも小さい、優れた導電性を与えることがわかる。From these results, the composition of the present invention retains excellent processability, but both the initial resistance value and the resistance value change rate are smaller than those of the composition containing FN, which is a PAN-based carbon fiber, It can be seen that it gives excellent conductivity.
実施例2 エポキシ樹脂に対して導電性フィラーとしてカーボンブ
ラックを配合したものと、硬化剤としてのポリアミド樹
脂に対して同じく導電性フィラーとしてカーボンブラッ
クを配合したものとを組合わせた市販の導電性接着剤
(ドータイトA−3およびドータイトC−3、藤倉化成
社、商品名)に対して、実施例1において用いたと同じ
炭素繊維および炭素粉末をそれぞれ第2表に示すような
配合量で混合し、充分に均一に混練して導電性エポキシ
樹脂組成物を調製した。 Example 2 Commercially available conductive adhesive in which a mixture of epoxy resin with carbon black as a conductive filler and a mixture of polyamide resin as a curing agent with carbon black as a conductive filler are combined. The same carbon fibers and carbon powders as those used in Example 1 were mixed with the agents (Dautite A-3 and Dautite C-3, Fujikura Kasei Co., Ltd.) in the compounding amounts shown in Table 2, respectively. The mixture was kneaded sufficiently uniformly to prepare a conductive epoxy resin composition.
実施例1と同様にして測定した加工性、および加熱硬化
条件を150℃で30分としたほかは同様にして測定し
た体積固有抵抗値を、第2表に合せて示した。Table 2 also shows the workability measured in the same manner as in Example 1 and the volume resistivity measured in the same manner except that the heat curing condition was 150 ° C. for 30 minutes.
また、加熱処理による電気抵抗値の経時変化の様子を第
3図および第4図に示した。Further, changes in the electric resistance with time due to the heat treatment are shown in FIGS. 3 and 4.
これらの結果をみると、気相成長系炭素繊維を添加した
本発明の組成物は、PAN系炭素繊維であるFNや導電
性炭素粉末を配合した組成物に比べて優れた加工性およ
び電気的特性を有していることがわかる。These results show that the composition of the present invention to which the vapor growth carbon fiber is added is superior in processability and electrical properties to the composition containing FN which is a PAN carbon fiber and conductive carbon powder. It can be seen that it has characteristics.
〔発明の効果〕 前述のように、本発明の導電性エポキシ樹脂組成物は加
工し易い流動性を維持しながら電気抵抗が低く、しかも
硬化物は高温条件の下でも安定して優れた導電特性を示
すものであって、高信頼性の導電性接着剤や導電性塗料
などとして利用することができる。 [Effects of the Invention] As described above, the conductive epoxy resin composition of the present invention has low electrical resistance while maintaining fluidity that is easy to process, and the cured product has stable and excellent conductive properties even under high temperature conditions. And can be used as a highly reliable conductive adhesive or conductive paint.
第1〜4図は、それぞれ導電性エポキシ樹脂組成物の硬
化物を加熱処理したときの、電気抵抗値の経時変化を示
すグラフである。FIGS. 1 to 4 are graphs showing changes with time of electric resistance values when a cured product of a conductive epoxy resin composition is heat-treated.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C09J 163/00 JFN 8830−4J ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C09J 163/00 JFN 8830-4J
Claims (2)
長系炭素繊維10〜200重量部および導電性炭素粉末
5〜100重量部を配合してなる導電性エポキシ樹脂組
成物。1. A conductive epoxy resin composition comprising 100 parts by weight of an epoxy resin, 10 to 200 parts by weight of vapor grown carbon fiber and 5 to 100 parts by weight of conductive carbon powder.
酸化性雰囲気中で触媒の存在下に熱分解して得られたも
のである、特許請求の範囲第1項記載の導電性エポキシ
樹脂組成物。2. The conductive epoxy according to claim 1, wherein the vapor grown carbon fiber is obtained by thermally decomposing a hydrocarbon compound in the presence of a catalyst in a non-oxidizing atmosphere. Resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62003935A JPH0611841B2 (en) | 1987-01-13 | 1987-01-13 | Conductive epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62003935A JPH0611841B2 (en) | 1987-01-13 | 1987-01-13 | Conductive epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63172722A JPS63172722A (en) | 1988-07-16 |
| JPH0611841B2 true JPH0611841B2 (en) | 1994-02-16 |
Family
ID=11570992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62003935A Expired - Lifetime JPH0611841B2 (en) | 1987-01-13 | 1987-01-13 | Conductive epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611841B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102277097A (en) * | 2011-07-19 | 2011-12-14 | 彩虹集团公司 | Carbon black conducting resin and preparation method thereof |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0277442A (en) * | 1988-09-14 | 1990-03-16 | Showa Denko Kk | Electrically conductive thermoplastic resin composition |
| DE4426906C2 (en) * | 1994-07-29 | 1996-10-24 | Daimler Benz Aerospace Airbus | Electrically conductive fiber composite material made of plastic and manufacturing process |
| JP4425548B2 (en) | 2003-01-24 | 2010-03-03 | イーグル工業株式会社 | Sliding member for sealing and manufacturing method thereof |
| KR20110044869A (en) * | 2008-08-25 | 2011-05-02 | 제온 코포레이션 | Thermally conductive pressure sensitive adhesive compositions, thermally conductive pressure sensitive adhesive sheets, and electronic components |
| CA3095453C (en) | 2018-03-28 | 2023-09-19 | Zoltek Corporation | Electrically conductive adhesive |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59190839A (en) * | 1983-04-13 | 1984-10-29 | 大日本インキ化学工業株式会社 | Conductive thermosetting resin molding material |
| JPS60144364A (en) * | 1984-01-06 | 1985-07-30 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition |
| JPH0645724B2 (en) * | 1985-03-23 | 1994-06-15 | 旭化成工業株式会社 | Carbon fiber composite resin composition |
-
1987
- 1987-01-13 JP JP62003935A patent/JPH0611841B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102277097A (en) * | 2011-07-19 | 2011-12-14 | 彩虹集团公司 | Carbon black conducting resin and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63172722A (en) | 1988-07-16 |
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