JPH061245B2 - Automatic analyzer for metal fragments - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an automatic analyzer for metal pieces in which all analytical operations of emission spectroscopy of steel and the like are completely automated.

2. Description of the Related Art In recent years, for the analysis of metals in the steelmaking process and the like, an emission spectroscopic analysis method has been adopted, and a combination with a computer has significantly shortened the analysis work time.

However, recently, the frequency of analysis has greatly increased with the continuation and speeding up of the steelmaking process, and in order to cope with this, further reduction in analysis time has been demanded.

In order to meet the demand, a robotized automatic analyzer has been developed in recent years. As one of them, automatic analysis system (Shimadzu Kagaku Kikai news vol.25, No.4 (1984.6) P4-7)
Is known.

In this automatic analysis system, the high-temperature analysis sample sent by a pneumatic tube is put into an automatic cutting and polishing machine and cooled, and then the sample is cut, rough-polished, finish-polished, etc. to finish and finish the finished sample. The sample is taken out to the sample pedestal, and the sample on the pedestal is set on the luminescence stand of the emission spectroscopic analyzer by the analysis robot to perform the first analysis.
A second analysis is performed with 0 ° rotation. If the difference between the two analysis values is less than the specified value, the average value of the two analysis values is calculated, and if the average of the two analysis values is larger than the specified value, the two analysis values Is rejected, and the same analysis is performed twice, and up to four analyzes are performed on one sample.

Since the sample set to the emission position of the emission spectroscopic analyzer by this analysis robot is always placed at a fixed position, a defective position with a nest or a crack on the sample surface may overlap with the emission position. In this case, since an analysis error occurs and an accurate analysis value cannot be obtained, it is necessary to set again and repeat the analysis, and it is unavoidable that the processing time increases.

As a countermeasure for this, a defect position detecting device for the sample grinding surface for emission spectroscopy analysis is provided, the defect position coordinates of the grinding surface are obtained by the calculating means, the maximum circular sample surface not containing a defect is searched for, and the center of this circle is determined. Emission spectroscopic analysis in which the radius is calculated, and if the radius of the circle is larger than the predetermined radius, the sample is loaded into a predetermined position in the light emitting chamber by the transport positioning device, and regrinding is performed when an appropriate circle is not seen. A sample processing method (JP-A-53-184) has been proposed.

Problems to be Solved by the Invention According to the method disclosed in JP-A-53-184,
The defect position on the sample surface can be detected, and the light emission position can always be set to a good light emission position, and the analysis work can be automated.

However, in the analysis work, the total required processing time from receiving the sample to storage after the end of analysis is about 2 minutes.
Since it took 0 seconds, when the analysis was performed 4 times, the whole analysis operation could not be completed within 2 minutes, which was a problem.

The present invention has been made in view of the current situation,
It is an object of the present invention to provide an automatic analyzer which can significantly reduce the polishing time in an automatic finish polishing apparatus.

Means for Solving the Problems That is, the present invention provides a sample receiving table, a sample automatic polishing device, an image processing device for setting a light emitting position while avoiding a defective position, and an analysis by the set light emitting position. The emission spectroscopic analyzer to be performed and the sample storage table are arranged on the locus of horizontal movement of the arm fingers of the storage robot, and a series of analysis work is completely automatically operated by the peripheral control device and the analysis robot control device. In the apparatus, a non-contact roughness meter is provided in the sample automatic polishing apparatus, and the roughness of a portion without cavities or cracks on the sample surface input from the non-contact roughness meter in the peripheral control device and a target surface obtained in advance The optimum polishing time is calculated and set based on the relationship between the polishing time and the surface roughness to obtain the roughness, and after the polishing is completed, the input surface roughness and the target surface roughness are compared to obtain the target surface roughness. The automatic analyzer for metal pieces is characterized in that it is provided with a function of outputting a polishing command again when the degree is not obtained.

As shown in Fig. 2, the non-contact roughness meter installed in the working automatic polishing machine applies the focused laser beam emitted from the laser oscillator (11) to the sample surface, and the reflected beam is used as a computing device. The surface roughness is detected by inputting it into (18), and the roughness of the portion of the sample surface without cavities or cracks is measured using this non-contact roughness meter. The peripheral control device, based on the measurement result input from the non-contact roughness meter and the relationship between the polishing time and the surface roughness for obtaining the target surface roughness α as shown in FIG. Since the optimum polishing time for obtaining the target surface roughness α is set, wasteful polishing time can be saved by performing automatic polishing based on this set time.

Embodiment 1 Next, an embodiment of the present invention will be described with reference to the drawings. First
As shown in the figure, sample receiving table (1), standard sample table (1-2), automatic polishing device with a non-contact roughness meter (2),
The image processing device (3), the emission spectroscopic analysis device (4), and the sample storage table (5) are arranged on the horizontal trajectory of the finger of the arm (6-1) of the analysis robot (6).

Since each of the above devices is arranged on the turning line of the arm tip of the analysis robot (6), the analysis robot (6) can employ a simple cylindrical coordinate type robot capable of high-speed positioning. An example of this is shown in FIG. 7 in which the horizontally extending arm (6-1) attached to the upper end of the swivel cylinder (20) has a cylinder (21) vertically penetrating the tip (6-2). A robot (22) that holds the sample on the rod of
(9) controls the swing, extension and contraction of the arm, and the vertical movement of the finger (22).

The standard sample table (1-2) stores standard samples used for standardization work to correct changes over time of the emission spectroscopic analyzer, and standard samples taken out from the table may be stored if necessary. The sample is analyzed by the same procedure as that for a normal sample.

The second embodiment of the non-contact roughness meter provided in the automatic polishing device (2)
Shown in the figure. Convergence optical system that emits light from a laser oscillator (11)
The reflected light of the laser beam (5) focused by (13) is projected onto the light receiving element (17) through the converging optical system (16), and the reflected laser beam (15) is projected based on the roughness on the sample surface. The deviation of the angle is detected by the arithmetic unit (18) and the surface roughness generating circuit (19) and used as the output signal of the surface roughness. At this time, the surface roughness is represented by an output signal of the center line average roughness.

Surface roughness β of the sample in a portion free from cavities and cracks measured using the above non-contact roughness meter, and polishing time and surface for obtaining a target surface roughness α as shown in FIG. The optimum polishing time (t ₁ -t) is calculated based on the relationship with the roughness. This optimum polishing time (t ₁ -t) is set as the actual sample polishing time and polishing is performed. Then, after the polishing is finished, the surface roughness is measured with the non-contact roughness meter, and when the target surface roughness α is not obtained, the polishing time is set again to obtain the target surface roughness α and the polishing is performed. And finish to the target roughness.

The automatic polishing apparatus uses a cylindrical grindstone, and the surface roughness is measured during the dressing work of the polishing apparatus.

Next, an embodiment of image processing for determining a light emitting position while avoiding a defective position on the sample surface will be described with reference to FIG.

The still image of the sample (14) captured by the ITV camera (7) is loaded into the frame memory of the image input device (3-1), and the image processing device (3)
Binarize at a predetermined slice level with
-2) Detect the defective position. That is, as shown in Fig. 5, the image is divided into 6 mm squares (light emitting area), and the presence or absence of scratches (24) in each square (23) is checked, and the center coordinates of the scratchless squares are shown. Control robot controller with light emitting position (25)
Output to (9).

A system block diagram of the automatic analyzer is shown in FIG. Reference numeral (8) in the figure denotes a peripheral control device, and each device is controlled by a command from this device. Further, (10) indicates a manual setting operation panel.

Sample automatic polishing by the above-mentioned automatic analyzer, processing from the presence or absence inspection of scratches to emission spectral analysis position control, first set the sample in the automatic polishing device, the optimum polishing time to obtain the target display roughness α in the above manner ( Set t ₁ -t) to perform automatic polishing.
After the polishing is completed, the surface roughness is measured and the target surface roughness α
If not obtained, the polishing time is set again and polishing is performed to finish to the target roughness. For the sample finished to the target roughness, set the center to the reference position of the image processing device,
Perform the scratch inspection in the same manner as above, determine the inspection coordinates (Xt, Yt) by selecting the cells without scratches, match the inspection position with the discharge position (Xs, Ys), and use the optical emission spectrometer (4). It is performed by setting it on the light emitting table (4-1). Then, the arithmetic processing during that time is performed as follows.

As shown in FIG. 8, the image processing reference position (X
g, Yg) is L ₁ , the angle with the X axis is θ ₁ , the distance from the sample center to the inspection position (Xt, Yt) is L ₁ ′, and the angle with the X axis is θ ₁ ′. Then, the image processing reference coordinates (Xg, Yg) are (Xg, Yg) = (L ₁ , θ ₁ ).

∴θ ₁ = tan ¹ (Xg, Yg), L ₁ = Xt / cos
θ ₁ = Yt / sin θ _{1 The} inspection coordinate (Xt, Yt) is (Xt, Yt) = (L ₁ , θ ₁ ).

∴θ ₁ = tan ¹ (Ys / Xs) L ₁ ′ = Xs / cos θ ₁ ′ = Ys / sin θ ₁ ′ θd = θ ₁ −θ ₁ ′ Then, the inspection position (Xt, Yt) is changed to the discharge position (Xs, Ys). ), The sample center position when the sample is set is (L ₃ ,
θ ₂ ), and the discharge position (Xs, Ys) at the sample center (L ₂ , θ
₂ ″), the inspection position is {L ₂ , (θ ₂ ″ + θ
_d )} and L ₁ = L ₂ and L ₁ ′ = L ₂ ′, α = L ₂ ′ −L ₂ cos θ _d β = L ₂ sin θ _d ∴L ₃ = {(L ₂ −α) ² + Β ² } ^1/2 θ ₂ ′ = tan ⁻¹ {β / (L ₂ −α)} θ ₂ ″ = tan ⁻¹ (Ys / Xs) θ ₂ = θ ₂ ″ −θ ₂ ′ Coordinates obtained by the above When the sample center is moved to (L ₃ , θ ₂ ), the inspection position is set to match the discharge position.

Example 2 A steel sample having a diameter of 35 mm and a length of 35 mm was analyzed using the above automatic analyzer. The sample is from a state where the black scale remains, and it is 2-3 μR with a cylindrical rotary grindstone.
Polishing is performed in 10 seconds until the _maximum surface roughness is obtained, and the calculation shown in FIG.
(CCD) was used to partition into 512 × 512 cells.
As a result, a flaw with a diameter of 0.2 mm was detected, and avoiding this flaw, emission spectroscopic analysis was performed.

EFFECTS OF THE INVENTION This invention, by attaching a non-contact roughness meter to an automatic polishing apparatus, can always efficiently polish a target surface roughness at an optimum polishing time, and perform a series of analytical operations starting from a set of samples. It can be fully automated and the analysis is always accurate and fast.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view showing the arrangement of an automatic analyzer according to the present invention, FIG. 2 is an explanatory view of an embodiment of a non-contact roughness meter attached to an automatic polishing device, and FIG. FIG. 4 is a graph showing the relationship between the surface roughness and the polishing time for obtaining the target surface roughness α obtained in advance, FIG. 4 is an explanatory view showing an image processing system centering on an image processing apparatus, and FIG. 5 is Same as above, an explanatory view showing an example of an image in the image processing, FIG. 6 is a block diagram showing a system of an automatic analyzer of the present invention, FIG. 7 is a perspective view showing an example of a main part of an analysis robot, and FIG. 8 is an image. It is explanatory drawing at the time of calculating the set position of the sample in a process. 1 ... Sample receiving table, 2 ... Automatic polishing apparatus, 3 ... Image processing apparatus, 4 ... Emission spectroscopy analyzer, 5 ... Sample storage table, 6 ... Analysis robot, 6-1 ... Arm 7 ... ITV camera, 8 ... Peripheral control Device, 9 ... Analytical robot controller, 10 ... Operation panel for manual setting.

Claims (1)

[Claims] 1. A sample receiving table, a sample automatic polishing device, an image processing device for setting a light emitting position while avoiding a defective position, an emission spectroscopic analyzer for performing analysis at the set light emitting position, and a sample. A storage table and a storage robot are arranged on the horizontal trajectory of the arm fingers of the storage robot, and in a metal fragment automatic analysis device in which a series of analysis work is completely automatically operated by the peripheral control device and the analysis robot control device,
The sample automatic polishing device is provided with a non-contact roughness meter, and the roughness of the sample surface without cavities or cracks, which is input from the non-contact roughness meter to the peripheral control device, and the target surface roughness obtained in advance. The optimum polishing time is calculated and set based on the relationship between the polishing time and the surface roughness to obtain the target surface roughness by comparing the input surface roughness and the target surface roughness after polishing. An automatic analyzer for metal fragments, which is equipped with a function to output a polishing command again when there is no such metal.