JPH0615380B2 - Wafer protection sheet sticker - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a wafer protection sheet sticking apparatus for inserting a wafer between a protection sheet and a release paper.

[Conventional technology]

The wafer on which the semiconductor elements are formed is divided into individual elements by making a kerf along the scribe line and braking by rollers. Here, when braking is performed, the wafer surface is covered with a protective sheet.

Conventionally, the step of covering the wafer surface with the protective sheet is performed by the method shown in FIGS. 2 (a) and 2 (b).

That is, the sheet 2 and the release paper 3 set as a roll are separated via the roller guide 6, the sheet 2 is drawn into the rubber roller 1, and the release paper 3 is passed through the release paper guide 7 and then the rubber roller 1 Be drawn into. The wafer 8 is inserted into the space between the sheet 2 and the release paper 3, and the rubber roller 1 sandwiches and press-bonds the release paper 3 and the sheet 2.

[Problems to be solved by the invention]

In the above-described conventional wafer protection sheet sticking apparatus, the release paper and the sheet are separated by pulling the sheet by the rubber roller 1 having a driving function, so that the force necessary for the separation is applied to the sheet 2. become. Therefore, the stretchable sheet becomes longer than the supplied length. Further, even when the wafer is pressure-bonded, the above-mentioned phenomenon is promoted because the sheet 2 is pressed by the rubber roller 1. Therefore, the sheet and the release paper supplied as one unit have a difference in the length initially set between the separation point and the crimping point. Therefore, the space required for inserting the wafer cannot be secured between the sheet and the release paper, so it is necessary to cut the sheet and perform the set again with the space provided.

The present invention, before re-stacking the protective sheet and the release paper,
Provided is a wafer protective sheet sticking device that absorbs the elongation of a protective sheet.

[Means for solving problems]

The wafer protective sheet sticking apparatus of the present invention is characterized in that an extension absorbing mechanism for absorbing the extension of the sheet is provided on the sheet path from the separation point between the protective sheet and the release paper to the pressure bonding point.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, a roller guide 6 is provided on the feeding side of a roll around which an integrated protective sheet 2 and release paper 3 are wound, and two support rollers 5 and 5 are provided at a certain distance in front of the roller guide 6 in the horizontal direction. And the release sheet guide 7 is installed vertically below the roller guide 6, and the protective sheet 2 and the release sheet 3 separated in front of the guide 7 in the horizontal direction are pressed again. Set up.

Further, the intermediate roller 4 is installed between the two support rollers 5 and 5 so as to be vertically movable. Here, the two support rollers 5,
An extension absorbing mechanism for absorbing the extension of the protective sheet 2 by a combination of an intermediate roller 4 which moves up and down in proportion to the extension amount of the sheet 2 between the two supporting rollers 5 and 5 and adds tension to the sheet 2. Constitute.

In FIG. 1, the protective sheet 2 supplied in a roll state
And the release paper 3 are separated via the roller guide 6, the sheet 2 is guided to the rubber roller 1 via the support roller 5 and the intermediate roller 4, and the release paper 3 is guided to the rubber roller 1 via the release paper guide 7. Get burned. The rubber roller 1 is attached to a drive unit (not shown), and simultaneously with feeding the sheet 2 and the release paper 3, the sheet is pressed onto the wafer 8. The support roller 5 is fixed, and the intermediate roller 4 disposed between the two is attached to a shaft that can move in the vertical direction, and an amount proportional to the extension amount of the sheet 2 is lowered by a motor to absorb the extension of the protective sheet 2. To do.

〔The invention's effect〕

As described above, since the present invention absorbs the expansion of the protective sheet that occurs when the protective sheet and the release paper are separated and pressure-bonded, the space necessary for inserting the wafer between the sheet and the release paper is always secured. However, it has an effect that stable operation can be performed.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of the present invention, FIG. 2 (a) is a side view showing an outline of a conventional system, and FIG. 2 (b) is a sketch showing an outline of the conventional system. . 1 ... rubber roller, 2 ... sheet, 3 ... release paper, 4 ...
... Intermediate roller, 5 ... Support roller, 6 ... Roller guide, 7 ... Release paper guide, 8 ... Wafer

Claims (1)

[Claims] 1. A device for temporarily separating a protective sheet and a release paper, which are superposed on each other, inserting wafers on both surfaces of the paper, re-superimposing the wafer, and sandwiching the wafer between the protective sheet and the release paper. A wafer protective sheet sticking device, characterized in that, in the path of the protective sheet separated from the release paper, there is provided an extension absorbing mechanism for absorbing the extension of the protective sheet generated when the wafers are inserted and then stacked again.