JPH0618085B2 - Method for producing nonflammable inorganic coating material for electronic parts - Google Patents
Method for producing nonflammable inorganic coating material for electronic partsInfo
- Publication number
- JPH0618085B2 JPH0618085B2 JP59003948A JP394884A JPH0618085B2 JP H0618085 B2 JPH0618085 B2 JP H0618085B2 JP 59003948 A JP59003948 A JP 59003948A JP 394884 A JP394884 A JP 394884A JP H0618085 B2 JPH0618085 B2 JP H0618085B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- coating material
- electronic parts
- inorganic coating
- inorganic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Paints Or Removers (AREA)
- Details Of Resistors (AREA)
- Inorganic Insulating Materials (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、過負荷や自己発熱を伴う電子部品、すなわち
抵抗器、フィルムコンデンサ、セラミックコンデンサ、
コイル、各種ヒータ等に使用される電子部品用不燃性無
機被覆材料の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component involving overload or self-heating, that is, a resistor, a film capacitor, a ceramic capacitor,
The present invention relates to a method for producing a nonflammable inorganic coating material for electronic parts used for coils, various heaters, and the like.
従来例の構成とその問題点 一般の電子部品用被覆材料(塗料)は、有機系を主と
し、エポキシ系、フェノール系及び難燃性に優れるシリ
コン系が知られ、実用化されている。この中で電子部品
の不燃化対策被覆材料として使われているシリコン系
は、電気的特性、耐熱性、耐水性等において優秀なる性
能を有しているが、資源の欠乏及び臭い、発煙量、引火
量、溶剤規制等の欠点を有し、一方電子部品の製作工程
上、高温(180℃)かつ長時間(60分)焼付しなけ
ればならず、量産性にも欠点を有し、これらの解決が目
下の急務となっている。例えば、不燃性レベルの向上と
してシリコンの減量が実施されているが、本来の電気的
性能、塗膜強度において性能悪化に連がっている。Configuration of Conventional Example and Problems Thereof As general coating materials (paints) for electronic parts, mainly organic type, epoxy type, phenol type and silicon type excellent in flame retardancy are known and put into practical use. Among them, the silicon-based material used as a non-combustibility countermeasure coating material for electronic parts has excellent performance in electrical characteristics, heat resistance, water resistance, etc., but lack of resources and odor, smoke generation, It has drawbacks such as the amount of ignition, regulation of solvent, etc. On the other hand, it has to be baked at a high temperature (180 ° C.) for a long time (60 minutes) in the manufacturing process of electronic parts, and has a drawback in mass productivity. There is an urgent need for resolution. For example, the amount of silicon has been reduced to improve the nonflammability level, but the original electrical performance and coating strength deteriorate.
発明の目的 本発明は上記のような点に鑑みなされたものであり、定
温(約160℃)かつ短時間(約10分)の焼付硬化を
可能とし、無毒、無臭にして、かつ不燃性に良好な特性
(発炎なし、発煙量の減少)を示す電子部品用不燃性無
機被覆材料の製造方法を提供しようとするものである。OBJECT OF THE INVENTION The present invention has been made in view of the above points, and enables bake hardening at a constant temperature (about 160 ° C.) for a short time (about 10 minutes), making it nontoxic, odorless, and nonflammable. An object of the present invention is to provide a method for producing a nonflammable inorganic coating material for electronic parts, which exhibits good properties (no flame generation and reduction of smoke generation).
発明の構成 この目的を達成するために本発明の電子部品用無機被覆
材料の製造方法は、シリカ固形成分1〜40%を有する
水性コロイダルシリカ100部に、エチルシリケート単
量体1〜10部とシランカップリング剤1〜5部を結合
剤として添加して加水分解し、さらに無機フィラーを混
合するものである。これは、まず最初にシリカ固形成分
1〜40%を有する水性コロイダルシリカ100部に対
し、エチルシリケート単量体1〜10部とシランカップ
リング剤1〜5部を無機質結合剤として添加し加水分解
させたものであり、生成物は均一で透明なワニス状のも
のになる。次に上記ワニス状のものを、バインダー成分
として、それに厚塗り塗料化するためシリカ粉、アルミ
ナ粉等の無機質フィラー及び必要に応じて無機顔料を混
合して均一な完全無機質で厚塗り専用の液状スラリーと
して塗料化することができる。In order to achieve this object, the method for producing an inorganic coating material for electronic parts of the present invention comprises: 100 parts of aqueous colloidal silica having a silica solid content of 1 to 40%; and 1 to 10 parts of ethyl silicate monomer. 1 to 5 parts of a silane coupling agent is added as a binder for hydrolysis, and an inorganic filler is further mixed. First, 1 to 10 parts of ethyl silicate monomer and 1 to 5 parts of silane coupling agent were added as an inorganic binder to 100 parts of aqueous colloidal silica having a silica solid content of 1 to 40% for hydrolysis. The product is in the form of a uniform, transparent varnish. Next, the above varnish is used as a binder component, and silica powder, an inorganic powder such as alumina powder, and an inorganic pigment, if necessary, are mixed to form a thick coating paint, and a uniform completely inorganic liquid for exclusive use in thick coating is mixed. It can be made into a paint as a slurry.
ここで本発明のコロイダルシリカは負に帯電した無定形
シリカ粒子が水中に分散してコロイド状をなしており、
コロイド粒子の表面には−SiOH基及び−OHイオン
が存在し、アルカリイオンにより電気二重層が形成さ
れ、粒子間の反発により安定化されている。Here, the colloidal silica of the present invention has negatively charged amorphous silica particles dispersed in water to form a colloidal state,
-SiOH groups and -OH ions are present on the surface of the colloidal particles, an electric double layer is formed by the alkali ions, and the particles are stabilized by repulsion between the particles.
上記コロイダルシリカ中の水分子とエチルシリケート及
びシランカップリング剤との加水分解反応は、次式で示
される。The hydrolysis reaction of water molecules in the colloidal silica with ethyl silicate and the silane coupling agent is represented by the following formula.
Si(OC2H5)4+4H2O→Si(OH)4+4C2H5OH エチルシルケート シラノール RSi(OCH3)3+3H2O→RSi(OH)3+3CH3OH シランカップリング剤 シラノール 両者の加水分解反応生成物であるシラノールが媒体とな
って相溶性のあるものになる。Si (OC 2 H 5 ) 4 + 4H 2 O → Si (OH) 4 + 4C 2 H 5 OH Ethylsilcate silanol RSi (OCH 3 ) 3 + 3H 2 O → RSi (OH) 3 + 3CH 3 OH Silane cup Ring agent silanol Silanol, which is a hydrolysis reaction product of both, becomes a medium and becomes compatible.
コロイダルシリカとカップリング剤との反応機構は、以
下の様に考えられている。The reaction mechanism between the colloidal silica and the coupling agent is considered as follows.
この反応ではコロイダルシリカはシラノールの一種と考
えられており、最終的には脱水、縮合によりSiO2の
硬い無機塗料膜になる。ここで、シラノールの密度をで
きるだけ多くするには、(コロイダルシリカ+シランカ
ップリング剤)に架橋剤として有機チタン化合物(特に
ブチルチタネートが効果あり)を重量比にて0.1〜
1.0%添加すると効果的である。このようなバインダ
ー成分に無機質フィラーと必要に応じて無機顔料を混合
してなる塗料は、焼付温度150℃〜170℃、焼付時
間10〜15分の硬化処理により脱水縮合し、有害ガス
の発生もなく、セラミック状のシロキサンとなり、緻密
でしかも厚塗りの塗膜を形成する。 In this reaction, colloidal silica is considered to be a kind of silanol, and finally it becomes a hard inorganic coating film of SiO 2 by dehydration and condensation. Here, in order to increase the density of silanol as much as possible, an organic titanium compound (especially butyl titanate is effective) as a cross-linking agent in (colloidal silica + silane coupling agent) is added in a weight ratio of 0.1 to 0.1.
It is effective to add 1.0%. A coating material obtained by mixing an inorganic filler and, if necessary, an inorganic pigment in such a binder component is dehydrated and condensed by a curing treatment at a baking temperature of 150 ° C. to 170 ° C. for a baking time of 10 to 15 minutes, and harmful gas is also generated. Instead, it becomes a siloxane in the form of a ceramic and forms a dense and thick coating film.
実施例の説明 以下、本発明の実施例について説明する。まず水性コロ
イダルシリカ(シリカ固形成分20%)100部に対
し、エチルシリケート2部と、シランカップリング剤2
部を無機質結合剤として添加し加水分解させたものをバ
インダー成分として使用し、このバインダー成分30部
に対し、無機質フィラー70部及び無機顔料1部を混合
して均一な完全無機質の厚塗り塗料として塗料化した。Description of Examples Examples of the present invention will be described below. First, with respect to 100 parts of aqueous colloidal silica (silica solid component 20%), 2 parts of ethyl silicate and 2 parts of silane coupling agent are used.
Part was added as an inorganic binder and hydrolyzed was used as a binder component, and 30 parts of this binder component was mixed with 70 parts of an inorganic filler and 1 part of an inorganic pigment to form a uniform, completely inorganic thick coating composition. Painted.
上記塗料を電子部品に塗布して特性調査を行った。ここ
において電子部品で一番発熱量が大なるものは抵抗器で
あり、不燃性の点で要求の強いものであるため、電子部
品の代表例として抵抗器を使用した。そして、抵抗器に
は金属酸化物皮膜抵抗器で、2W・22KΩのものを用
い、160℃で15分間の硬化乾燥を行ったものを試験
試料とした。下記に特性試験の結果を示すが、十分規格
値を満足し、かつ従来のシリコン系塗料よりも不燃性、
表面硬度、耐熱性、耐溶剤性の点で良好な結果が得られ
た。The above coating material was applied to electronic parts and characteristics were investigated. Here, the electronic component that generates the largest amount of heat is the resistor, and the resistor is used as a typical example of the electronic component because the resistor has a strong requirement in terms of noncombustibility. A metal oxide film resistor having a resistance of 2 W · 22 KΩ was used as the resistor, and a test sample was obtained by curing and drying at 160 ° C. for 15 minutes. The result of the characteristic test is shown below, but it satisfies the standard value sufficiently and is more non-flammable than the conventional silicone-based paint.
Good results were obtained in terms of surface hardness, heat resistance and solvent resistance.
<試験方法> 不燃特性:抵抗器に定格の16倍の過負荷電力を破壊す
るまで印加し、その時に発炎するかどうか調べる。また
煙の発生度合を比較する。 <Test method> Nonflammability: 16 times the rated overload power is applied to the resistor until it is destroyed, and it is checked whether or not a flame is generated at that time. Also, compare the degree of smoke generation.
耐溶剤性:トリクロルエタンに浸漬し、超音波洗浄を1
0分間行い、塗膜の外観状態を比較する(但し、両者と
も乾燥条件を、160℃で15分間とする。)。Solvent resistance: Immersed in trichloroethane and ultrasonically cleaned 1
It is performed for 0 minutes, and the appearance state of the coating film is compared (however, in both cases, the drying condition is 160 ° C. for 15 minutes).
乾燥性:比較データである。Dryability: Comparative data.
負荷寿命:EIAJ規格(RC−645A)を適用。Load life: EIAJ standard (RC-645A) is applied.
耐湿負荷寿命:EIAJ規格(RC−645A)を適
用。Moisture resistance load life: EIAJ standard (RC-645A) is applied.
湿度特性:MIL−STD−202規格を適用。Humidity characteristics: MIL-STD-202 standard is applied.
温度サイクル:JIS−C−6402規格を適用。Temperature cycle: JIS-C-6402 standard is applied.
ここで、本発明の製造方法に関する材料は、上記実施例
に限定されるものではなく、シリカ固形成分1〜40%
を有する水性コロイダルシリカ100部に対し、エチル
シリケート単量体1〜10部、シランカップリング剤1
〜5部の範囲で、所期の目的、効果を達成することがで
きる。すなわち、水性コロイダルシリカのシリカ固形成
分が0%(シリカなし)では、コロイダルシリカを形成
できないため不可であり、1%未満でも焼付後の塗膜強
度が劣化し、一方シリカ固形成分が40%を超えた場合
には、コロイダル液のゲル化が始まって好ましくない。
また、エチルシリケート単量体の限定理由は、1部未満
では結合力がなくなり、10部を超えた時にはゲル化し
て塗膜にクラックが発生するためである。また、シラン
カップリング剤の限定理由は、1部未満では結合剤とし
ての効力がなく、5部を超えた場合にはゲル化し、塗膜
にクラックが発生するためである。Here, the material relating to the production method of the present invention is not limited to the above-mentioned examples, and the silica solid component is 1 to 40%.
1 to 10 parts of ethyl silicate monomer and 1 silane coupling agent to 100 parts of aqueous colloidal silica having
Within the range of up to 5 parts, the intended purpose and effect can be achieved. That is, when the silica solid content of the aqueous colloidal silica is 0% (no silica), colloidal silica cannot be formed, and therefore it is not possible. If it exceeds the limit, gelation of the colloidal solution will start, which is not preferable.
The reason why the ethyl silicate monomer is limited is that the binding force is less than 1 part and the gelation occurs and the coating film cracks when it exceeds 10 parts. The reason for limiting the silane coupling agent is that if it is less than 1 part, it is not effective as a binder, and if it exceeds 5 parts, it gels and cracks in the coating film.
発明の効果 以上のように本発明の製造方法で生産された電子部品用
無機被覆材料は低温、かつ短時間の焼付硬化が可能なた
め、量産性に富むと共に省エネルギーの面でも有利なも
のである。また、電子部品に被覆した際に、塗膜強度も
硬く、耐溶剤性に優れ、しかも厚塗りにもかかわらず過
負荷に対し発炎や引火を伴わず、かつ耐熱性に優れてい
るため、電子部品の被覆材としての安全性を十分確保す
ることができるものである。そして、耐湿性等の品質特
性も良好で、かつ有機溶剤を使用しない無公害、無毒、
無臭の完全無機質の厚塗り用被覆材料を提供する製造方
法であり、その産業性は誠に大なるものである。EFFECTS OF THE INVENTION As described above, the inorganic coating material for electronic parts produced by the production method of the present invention can be bake-cured at a low temperature for a short time, so that it is advantageous in terms of mass productivity and energy saving. . Further, when coated on electronic parts, the coating film strength is also hard, it has excellent solvent resistance, and even though it is thickly coated, it does not accompany flame or ignition against overload, and because it has excellent heat resistance, The safety as a covering material for electronic components can be sufficiently ensured. And quality characteristics such as moisture resistance are also good, and no pollution, non-toxic, without using organic solvent,
It is a manufacturing method for providing an odorless completely inorganic coating material for thick coating, and its industriality is extremely great.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 進藤 泰宏 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 石田 英基 兵庫県尼崎市塚口町3丁目38番地43 株式 会社石田化学研究所内 (56)参考文献 特開 昭55−121210(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuhiro Shindo 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. In the laboratory (56) Reference JP-A-55-121210 (JP, A)
Claims (1)
ロイダルシリカ100部に、エチルシリケート単量体1
〜10部とシランカップリング剤1〜5部を結合剤とし
て添加して加水分解し、さらに無機フィラーを混合する
ことを特徴とする電子部品用不燃性無機被覆材料の製造
方法。1. An ethyl silicate monomer 1 is added to 100 parts of an aqueous colloidal silica having a silica solid content of 1 to 40%.
-10 parts and a silane coupling agent 1-5 parts are added as a binder, it hydrolyzes, and also an inorganic filler is mixed, The manufacturing method of the noncombustible inorganic coating material for electronic parts characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59003948A JPH0618085B2 (en) | 1984-01-12 | 1984-01-12 | Method for producing nonflammable inorganic coating material for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59003948A JPH0618085B2 (en) | 1984-01-12 | 1984-01-12 | Method for producing nonflammable inorganic coating material for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60148004A JPS60148004A (en) | 1985-08-05 |
| JPH0618085B2 true JPH0618085B2 (en) | 1994-03-09 |
Family
ID=11571334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59003948A Expired - Lifetime JPH0618085B2 (en) | 1984-01-12 | 1984-01-12 | Method for producing nonflammable inorganic coating material for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0618085B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001213662A (en) * | 2000-01-31 | 2001-08-07 | Kenzo Naoi | Cement composition with electrical insulation property |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2619905B2 (en) * | 1987-02-27 | 1997-06-11 | 株式会社中戸研究所 | Composite material and method for producing the same |
| US20030148019A1 (en) * | 2001-11-19 | 2003-08-07 | Hwang Byung Keun | Compositions and methods for forming dielectric layers using a colloid |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55121210A (en) * | 1979-03-13 | 1980-09-18 | Matsushita Electric Industrial Co Ltd | Nonncombustible inorganic coating material for electronic part |
-
1984
- 1984-01-12 JP JP59003948A patent/JPH0618085B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001213662A (en) * | 2000-01-31 | 2001-08-07 | Kenzo Naoi | Cement composition with electrical insulation property |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60148004A (en) | 1985-08-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |