JPH0626012B2 - Magnetic disk substrate - Google Patents
Magnetic disk substrateInfo
- Publication number
- JPH0626012B2 JPH0626012B2 JP28968686A JP28968686A JPH0626012B2 JP H0626012 B2 JPH0626012 B2 JP H0626012B2 JP 28968686 A JP28968686 A JP 28968686A JP 28968686 A JP28968686 A JP 28968686A JP H0626012 B2 JPH0626012 B2 JP H0626012B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic disk
- titanium
- disk substrate
- alloy
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 239000010936 titanium Substances 0.000 claims description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910001000 nickel titanium Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 description 10
- 239000011162 core material Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Magnetic Record Carriers (AREA)
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は記憶媒体として用いられる磁気ディスクのため
の基板に関する。The present invention relates to a substrate for a magnetic disk used as a storage medium.
〈従来の技術〉 高密度記録用の薄膜タイプの磁気ディスクの基板は、そ
の取扱いの便宜のために十分な強度が必要であり、磁気
媒体をスパッタリングで成形する場合には温度上昇に耐
え得るような耐熱性を備え、高密度の磁気記録を可能に
しかつ磁気ヘッドの摺接に対する所要の耐摩耗性を確保
するように高い表面精度及び十分な硬度を有する必要が
ある。<Prior Art> The substrate of a thin-film magnetic disk for high-density recording must have sufficient strength for convenience of handling, and should be able to withstand a temperature rise when forming a magnetic medium by sputtering. It is necessary to have high heat resistance and high surface accuracy and sufficient hardness so as to enable high-density magnetic recording and to secure required abrasion resistance against sliding contact of the magnetic head.
従来は、アルミ合金からなる薄板のブランクの両面を鏡
面研磨した後に、無電解ニッケルめっき、またはアルマ
イト被膜処理を行なうことにより表面層を形成し、その
表面を研磨した後にクロム、鉄、ニッケル、コバルトな
どからなる磁気膜を塗布、めっき、スパッタリングなど
により形成し、更にその表面に保護膜を形成して磁気デ
ィスクを完成するようにしていた。Conventionally, after mirror-polishing both surfaces of a thin plate of aluminum alloy, to form a surface layer by electroless nickel plating or alumite coating treatment, after polishing the surface, chromium, iron, nickel, cobalt A magnetic film made of, for example, is formed by coating, plating, sputtering or the like, and a protective film is further formed on the surface to complete a magnetic disk.
しかるに、良好な表面層を形成するためには、アルミ芯
板が、0.015μm程度の高い精度の表面粗さを要求
されるので、特に非金属介在物を含まない高価なアルミ
合金素材を必要とし、またアルミ合金が比較的軟質であ
るためにその表面加工が困難であり、磁気ディスク基板
のコストアップの原因となっていた。また無電解ニッケ
ルめっき層は、厚さが10〜20μm程度であるために
強度が必ずしも十分でなく、また250℃付近で磁気変
態を起こすので、磁気膜をスパッタリングで成形する場
合には基板表面の温度上昇に伴い磁気特性の劣化を生じ
たり、或いは温度上昇を抑えるために特殊なスパッタリ
ング工程が必要となり、製造工程に多大な時間を要する
原因となっていた。更に、アルマイト処理を行なう際
に、十分な強度が得られるように表面層の厚さを十分大
きくした場合には、表面にボア等の欠陥を生じ易くな
る。また、2回の研磨過程を必要とするために製造コス
トが高騰し、製造に多大な時間が必要となる。However, in order to form a good surface layer, the aluminum core plate is required to have a highly accurate surface roughness of about 0.015 μm, and therefore an expensive aluminum alloy material containing no non-metallic inclusions is required. In addition, since the aluminum alloy is relatively soft, it is difficult to process the surface thereof, which causes an increase in the cost of the magnetic disk substrate. Further, the electroless nickel plating layer has a thickness of about 10 to 20 μm, so that the strength is not always sufficient, and since magnetic transformation occurs at around 250 ° C., when a magnetic film is formed by sputtering, As the temperature rises, the magnetic characteristics are deteriorated, or a special sputtering process is required to suppress the temperature rise, which causes a large amount of time in the manufacturing process. Furthermore, when performing the alumite treatment, if the thickness of the surface layer is made sufficiently large so as to obtain sufficient strength, defects such as bores are likely to occur on the surface. Further, since the polishing process is required twice, the manufacturing cost rises, and the manufacturing requires a lot of time.
このため、特公昭53−37202号公報に開示されて
いるように、アルミニウム芯板の表面にスパッタリング
によりセラミックス材料の微粉末を付着させて硬質の表
面層を形成することが提案されているが、表面層をスパ
ッタリング或いは蒸着により形成すると、被膜の形成に
時間を要し、かつ熱が放散するために被膜の厚さを約1
μm以上にすることが困難である。硬質被膜が薄いと磁
気ディスクの強度が不十分となり、磁気ヘッドと接触し
た際の強度不足を生じたり例えば床に落した場合に破損
するなど取扱い上の問題が発生し易い。Therefore, as disclosed in Japanese Examined Patent Publication No. 53-37202, it has been proposed to attach a fine powder of a ceramic material to the surface of an aluminum core plate by sputtering to form a hard surface layer. When the surface layer is formed by sputtering or vapor deposition, it takes time to form the film and heat is dissipated.
It is difficult to increase the thickness to more than μm. If the hard coating is thin, the strength of the magnetic disk becomes insufficient, and the strength of the magnetic disk becomes insufficient when it comes into contact with the magnetic head, or handling problems such as damage when dropped on the floor are likely to occur.
上記の問題点を考慮して本願出願人は、昭和61年9月
29日付特願昭61−230910号明細書に於て、ア
ルミニウムまたはアルミニウム合金からなる芯材にセラ
ミックまたはガラス質材料からなる表面層を接合するこ
とにより、十分な強度、耐熱性、表面精度及び表面硬度
を有する磁気ディスク用基板を提案している。In consideration of the above problems, the applicant of the present invention has disclosed in Japanese Patent Application No. 61-230910 dated Sep. 29, 1986 that a core material made of aluminum or an aluminum alloy has a surface made of a ceramic material or a glass material. By joining the layers, a magnetic disk substrate having sufficient strength, heat resistance, surface accuracy and surface hardness is proposed.
ところが、表面層に使用されるセラックまたはガラス層
は一般に熱膨脹率が小さいのに対し、芯材を構成するア
ルミニウムまたはアルミニウム合金は熱膨脹率が大き
い。このため、両者を加圧しかつ加熱して接合すると、
両者間の寸法に差が生じて歪が発生するおそれがある。
また、この基板を磁気ディスク装置に組込んだ場合に、
温度変化によって読取り精度が低下する可能性がある。However, the shellac or glass layer used for the surface layer generally has a small coefficient of thermal expansion, whereas the aluminum or aluminum alloy forming the core material has a large coefficient of thermal expansion. Therefore, if both are pressed and heated to join,
Distortion may occur due to a difference in size between the two.
Also, when this substrate is incorporated into a magnetic disk device,
The reading accuracy may be deteriorated due to the temperature change.
〈発明が解決しようとする問題点〉 そこで、本発明の目的は、磁気ディスク基板として必要
な強度、表面精度及び表面硬度を有すると共に、特に耐
熱性に優れた改良された磁気ディスク用基板を提供する
ことにある。<Problems to be Solved by the Invention> Therefore, an object of the present invention is to provide an improved magnetic disk substrate having strength, surface accuracy and surface hardness required for a magnetic disk substrate, and particularly excellent heat resistance. To do.
〈問題点を解決するための手段〉 このような目的は、本発明によれば、磁気ディスク基板
であって、チタンまたはチタン合金からなる芯板と、イ
ンサート材層と、ニッケル、チタン、ニッケル合金また
はチタン合金層と、ガラスまたはセラミック層とをこの
順序にて積層してなることを特徴とする磁気ディスク基
板を提供することにより達成される。<Means for Solving the Problems> According to the present invention, such an object is a magnetic disk substrate, a core plate made of titanium or a titanium alloy, an insert material layer, nickel, titanium, a nickel alloy. Alternatively, it can be achieved by providing a magnetic disk substrate characterized by laminating a titanium alloy layer and a glass or ceramic layer in this order.
〈作用〉 このようにチタンまたはチタン合金を芯材とし、かつ表
面硬化層としてセラミック或いはガラス層を用いること
により、十分な強度、緻密性及び硬度と共に、特に優れ
た耐熱性が得られる。特に、ニッケル、チタン或いはこ
れらの合金はガラス系材料に対する付着性が良い。<Operation> By using titanium or a titanium alloy as the core material and using the ceramic or glass layer as the surface hardened layer in this way, particularly excellent heat resistance can be obtained together with sufficient strength, denseness and hardness. In particular, nickel, titanium or alloys thereof have good adhesion to glass-based materials.
〈実施例〉 以下、本発明の好適実施例を添付の図面について詳しく
説明する。<Embodiment> Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
第1図は本発明に基づく磁気ディスク基板の断面図であ
る。まずチタン合金もしくは純チタンからなる芯板1を
準備するが、従来技術に基づく場合と異なり、その表面
粗さが比較的問題とならない。次に、厚さが約50μm
〜500μmのソーダ石灰ガラスからなるガラス薄板2
の片面にニッケル膜3をPVD(物理的蒸着)或いはめ
っきなどにより0.5μm〜20μmの厚さに成膜す
る。薄板2は、アルミナ、ジルコニア、炭化硅素、窒化
硅素などのセラミックス材料或いは石英ガラス、硼硅酸
ガラスなどのガラス質材料からなるものであって良く、
ニッケル膜3は、チタン、ニッケル合金またはチタン合
金からなるものであっても良い。次に、ニッケル膜3と
芯板1の表面との間に0.5μm〜100μmの厚さの
インサート材としての銅合金の薄板4を挾設し、548
℃〜630℃の温度にて互いに圧接する。FIG. 1 is a sectional view of a magnetic disk substrate according to the present invention. First, the core plate 1 made of a titanium alloy or pure titanium is prepared, but unlike the case of the prior art, the surface roughness thereof does not pose a problem. Next, the thickness is about 50 μm
Glass thin plate made of soda-lime glass of ~ 500 μm 2
A nickel film 3 is formed on one surface of the substrate by PVD (physical vapor deposition) or plating to a thickness of 0.5 μm to 20 μm. The thin plate 2 may be made of a ceramic material such as alumina, zirconia, silicon carbide, or silicon nitride, or a glass material such as quartz glass or borosilicate glass,
The nickel film 3 may be made of titanium, a nickel alloy or a titanium alloy. Next, between the nickel film 3 and the surface of the core plate 1, a copper alloy thin plate 4 as an insert material having a thickness of 0.5 μm to 100 μm is inserted and placed 548.
They are pressed against each other at a temperature of from ℃ to 630 ℃.
このようにして得られた磁気ディスク基板は、350℃
の温度にて磁気膜をスパッタリングする場合でも何ら悪
影響を受けることがない。また、400℃に加熱してこ
れを水中に没入させる急冷過程を5サイクル繰返して
も、割れや変形などの異常を生じることがなかった。ま
た、ガラス薄板2の面取りを行なったサンプルについ
て、約1メートルの高さから塩化ビニールタイル上に落
した場合にも破損や割れが生じなかった。また、このよ
うなサンプルにより割れ試験を行なった所、ガラス層の
割れが発生した場合でも、接合面が剥離することがな
く、十分な接合強度が得られていることが見出された。The magnetic disk substrate thus obtained has a temperature of 350 ° C.
Even when the magnetic film is sputtered at the above temperature, there is no adverse effect. Further, even if the rapid cooling process of heating to 400 ° C. and immersing it in water was repeated 5 cycles, no abnormality such as cracking or deformation occurred. Further, regarding the sample obtained by chamfering the thin glass plate 2, no damage or cracking occurred even when it was dropped onto a vinyl chloride tile from a height of about 1 meter. In addition, when a cracking test was conducted on such a sample, it was found that even if a crack in the glass layer occurred, the bonding surface did not peel off and sufficient bonding strength was obtained.
インサート材としては純銅または銅系(銅合金)のろう
材が好適である。銅または銅合金はガラスに対する付着
性が良くないが、ニッケル、チタンなどはガラスに対す
る付着性が良い。従って、上述のようにニッケル膜3を
挾んで銅合金の薄板4からなるインサート材を使用し、
上述したように548℃〜630℃の温度に加熱しなが
ら圧接を行なうことにより、十分な接合力が得られる。As the insert material, pure copper or a copper-based (copper alloy) brazing material is suitable. Copper or copper alloy does not have good adhesion to glass, but nickel, titanium, etc. have good adhesion to glass. Therefore, as described above, using the insert material made of the copper alloy thin plate 4 sandwiching the nickel film 3,
As described above, a sufficient bonding force can be obtained by performing the pressure contact while heating to the temperature of 548 ° C to 630 ° C.
〈発明の効果〉 上述のように本発明によれば、芯材として比較的熱膨脹
率の小さいチタンまたはチタン合金を使用することによ
り、基板自体の耐熱性が著しく向上すると同時に、経時
変化を小さくすることができる。従って、磁気ディスク
に組込んだ場合に於ても、温度の上昇による寸法変化が
小さいので読取り精度の向上を図れる。更に、チタンは
一般に剛性が比較的大きいので、芯材をより肉薄にする
ことができ、基板の軽量化が図られ、慣性モーメントが
小さくなって使用の際に所定回転数に達する時間を短縮
し得る等の利点がある。<Effects of the Invention> As described above, according to the present invention, by using titanium or a titanium alloy having a relatively small coefficient of thermal expansion as a core material, the heat resistance of the substrate itself is significantly improved and at the same time, the change over time is reduced. be able to. Therefore, even when incorporated in a magnetic disk, the dimensional change due to a rise in temperature is small, so that the reading accuracy can be improved. Furthermore, since titanium generally has relatively high rigidity, the core material can be made thinner, the weight of the substrate can be reduced, the moment of inertia can be reduced, and the time required to reach a predetermined rotation speed during use can be shortened. There are advantages such as getting.
第1図は本発明に基づく磁気ディスク基板の断面図であ
る。 1……芯板、2……ガラス薄板 3……ニッケル膜、4……銅合金薄板FIG. 1 is a sectional view of a magnetic disk substrate according to the present invention. 1 ... Core plate, 2 ... Glass thin plate 3 ... Nickel film, 4 ... Copper alloy thin plate
Claims (2)
と、 ガラスまたはセラミック層とをこの順序にて積層してな
ることを特徴とする磁気ディスク基板。1. A magnetic disk substrate comprising: a core plate made of titanium or a titanium alloy; an insert material layer; a nickel, titanium, nickel alloy or titanium alloy layer; and a glass or ceramic layer laminated in this order. A magnetic disk substrate characterized by being formed.
ることを特徴とする特許請求の範囲第1項に記載の磁気
ディスク基板。2. The magnetic disk substrate according to claim 1, wherein the insert material is made of copper or a copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28968686A JPH0626012B2 (en) | 1986-12-04 | 1986-12-04 | Magnetic disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28968686A JPH0626012B2 (en) | 1986-12-04 | 1986-12-04 | Magnetic disk substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63142521A JPS63142521A (en) | 1988-06-14 |
| JPH0626012B2 true JPH0626012B2 (en) | 1994-04-06 |
Family
ID=17746431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28968686A Expired - Lifetime JPH0626012B2 (en) | 1986-12-04 | 1986-12-04 | Magnetic disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626012B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0624065B2 (en) * | 1989-02-23 | 1994-03-30 | 日本鋼管株式会社 | Magnetic disk substrate |
| JPH0319130A (en) * | 1989-06-16 | 1991-01-28 | Nkk Corp | Production of magnetic disk substrate made of titanium |
-
1986
- 1986-12-04 JP JP28968686A patent/JPH0626012B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63142521A (en) | 1988-06-14 |
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