JPH0626175B2 - Chip-shaped solid electrolytic capacitor with fuse and manufacturing method - Google Patents
Chip-shaped solid electrolytic capacitor with fuse and manufacturing methodInfo
- Publication number
- JPH0626175B2 JPH0626175B2 JP62260822A JP26082287A JPH0626175B2 JP H0626175 B2 JPH0626175 B2 JP H0626175B2 JP 62260822 A JP62260822 A JP 62260822A JP 26082287 A JP26082287 A JP 26082287A JP H0626175 B2 JPH0626175 B2 JP H0626175B2
- Authority
- JP
- Japan
- Prior art keywords
- anode
- external electrode
- fuse
- lead terminal
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 47
- 239000007787 solid Substances 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Fuses (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はヒューズ付きチップ状固体電解コンデンサおよ
びその製造方法に関する。TECHNICAL FIELD The present invention relates to a chip-shaped solid electrolytic capacitor with a fuse and a method for manufacturing the same.
従来、この種の固体電解コンデンサは一般的に種々の電
子回路に使用されており、故障率が小さいことが利点と
されているが、一旦故障が発生した場合の故障モードと
しては短絡故障が多いため、大きな短絡電流が流れてコ
ンデンサが発熱し、遂には焼損に至ることがある。この
過度の短絡電流による故障発生の際には、回路構成素子
を保護するため故障モードを短絡から開放にすることが
必要で、一般にヒューズが用いられている。Conventionally, this type of solid electrolytic capacitor is generally used in various electronic circuits, and it is considered that the failure rate is small. However, if a failure occurs once, the failure mode is often a short-circuit failure. Therefore, a large short-circuit current may flow to heat the capacitor, which may eventually result in burning. In the event of a failure due to this excessive short-circuit current, it is necessary to open the failure mode from a short circuit in order to protect the circuit components, and a fuse is generally used.
第５図，第６図は、それぞれ従来の固体電解コンデンサ
の斜視図および断面図である。陰極層３と陽極リード２
からなるコンデンサ素子１の陽極リード２に陽極リード
端子４が接続され、陰極層３と陰極リード端子５は絶縁
性接着剤２１を介して接着され、ヒューズ６をはんだ２
０により橋絡接続させ、さらにヒューズ６は弾性樹脂７
により被覆され、全体が樹脂９により外装されることに
よりヒューズ付きチップ状固体電解コンデンサが構成さ
れている。5 and 6 are a perspective view and a sectional view of a conventional solid electrolytic capacitor, respectively. Cathode layer 3 and anode lead 2
An anode lead terminal 4 is connected to an anode lead 2 of a capacitor element 1 made of, and the cathode layer 3 and the cathode lead terminal 5 are adhered to each other via an insulating adhesive 21.
0 for bridge connection, and the fuse 6 is made of elastic resin 7
The chip-shaped solid electrolytic capacitor with a fuse is formed by being coated with and entirely covered with resin 9.
上述した従来のヒューズ付きチップ状固体電解コンデン
サは、陰極層と陰極リード端子がヒューズにより電気的
に接続されているので、以下のような欠点がある。The conventional chip-shaped solid electrolytic capacitor with a fuse described above has the following drawbacks because the cathode layer and the cathode lead terminal are electrically connected by a fuse.
(1) ヒューズがコンデンサ素子が近接しており、過電流
が流れたときにはヒューズが発熱し、この熱によって間
接的には陰極層のはんだが溶け、熱膨張して外装樹脂を
破壊し、その破面よりはんだが吹き出して他の配線回路
を短絡させて二次災害を引き起こしたり、また、直接点
にはコンデンサ素子の焼損を発生させ、さらに回路全体
に甚大な災害を及ぼすことがある。(1) The fuse and the capacitor element are close to each other, and when overcurrent flows, the fuse heats up, and this heat indirectly melts the solder in the cathode layer, causing thermal expansion and destroying the exterior resin. The solder may be blown from the surface to short-circuit other wiring circuits to cause a secondary disaster, or the capacitor element may be burned at the direct point, which may cause a great disaster to the entire circuit.
(2) ヒューズの接続に際しては、コンデンサ素子の陰極
層と陰極リード端子間の絶縁のため絶縁性樹脂が用いら
れているが、この樹脂が硬化する過程で陰極層と陰極リ
ード端子が短絡する危険性があるので、予め陰極層また
は陰極リード端子の少くとも一方の絶縁をとっておく必
要があり、また、陰極層の表面はコンデンサ素子自体の
大きさ、形状が必ずしも一定でないことから、はんだ付
けを自動的に行なうことが困難であることなど、工程が
煩雑となる。(2) When connecting the fuse, an insulating resin is used to insulate between the cathode layer of the capacitor element and the cathode lead terminal, but there is a danger that the cathode layer and the cathode lead terminal will short-circuit during the process of hardening of this resin. Therefore, it is necessary to insulate at least one of the cathode layer and the cathode lead terminal beforehand.Since the surface of the cathode layer is not necessarily the same in size and shape of the capacitor element itself, soldering It is difficult to perform automatically, and the process becomes complicated.
(3) チップ状固体電解コンデンサは、特に小型大容量化
の要求が強く、収容されるコンデンサ素子を大きくして
外装樹脂の厚さをできるだけ薄くする必要があるが、陰
極層側にヒューズを接続するためには、接続部およびヒ
ューズ自体のスペースの確保，はんだの吹き出し防止の
ための外装樹脂の厚さを厚くする必要があること等の諸
要因により、上記の要求に反し容量の体積効率が小さく
なる。(3) Chip solid electrolytic capacitors are especially required to be small and large in capacity, so it is necessary to make the capacitor element accommodated large to make the thickness of the exterior resin as thin as possible, but connect the fuse to the cathode layer side. In order to achieve the above, due to various factors such as securing a space for the connection part and the fuse itself and increasing the thickness of the exterior resin for preventing the solder from blowing out, the volumetric efficiency of the capacity is contradictory to the above requirements. Get smaller.
本発明のヒューズ付きチップ状固体電解コンデンサは、
陰極層と陽極リードからなるコンデンサ素子を含み、陰
極層の陽極リードと反対側の面および上面に陰極リード
端子が導電性接着剤により固着され、陽極リードには弾
性樹脂により被覆されたヒューズにより接続部と陽極外
部電極部とが接続されてなる陽極リード端子の前記接続
部が固着され、さらに陽極リード端子の陽極外部電極部
と陰極リード端子の露出部分を除いて樹脂により絶縁外
装されてなる。The chip-shaped solid electrolytic capacitor with a fuse of the present invention,
Including a capacitor element consisting of cathode layer and anode lead, cathode lead terminals are fixed by conductive adhesive on the surface and the upper surface of the cathode layer opposite to the anode lead, and the anode lead is connected by a fuse covered with elastic resin. The connection portion of the anode lead terminal formed by connecting the portion and the anode external electrode portion is fixed, and is further insulated and covered with resin except the exposed portion of the anode external electrode portion and the cathode lead terminal of the anode lead terminal.
また、本発明のヒューズ付きチップ状固体電解コンデン
サの製造方法は、一枚の金属板内に陽極リードの接続部
と陽極外部電極部を形成し、陽極リード端子の前記接続
部と陽極外部電極部をヒューズにて橋絡接続する工程
と、樹脂外装後に外装樹脂外部にて前記陽極リード端子
の接続部と陽極外部電極部をフレームから切り離す工程
を有する。Further, in the method for manufacturing a chip solid electrolytic capacitor with a fuse of the present invention, the connection part of the anode lead and the anode external electrode part are formed in one metal plate, and the connection part of the anode lead terminal and the anode external electrode part are formed. And a step of bridging the connection with a fuse, and a step of separating the connection portion of the anode lead terminal and the anode external electrode portion from the frame outside the exterior resin after the exterior packaging of the resin.
さらにまた、本発明の別の製造方法は、一枚の金属板内
に所定間隔ごとにフレームから突出させた陽極リードの
接続部と、陽極外部電極部を設けた陽極リード端子を形
成し、さらに、対向するフレームから所定間隔ごとに突
出させた陰極外部電極部を設けた陰極リード端子を形成
し、陽極リード端子の前記接続部と陽極外部電極部をヒ
ューズにより橋絡接続する工程と、ヒューズを絶縁性を
有する弾性体で被覆する工程と、樹脂外装後に外装樹脂
外部にて前記陽極リード端子の接続部と外部電極部を切
り離す工程と、前記陽極外部電極部および陰極外部電極
部をそれぞれフレームから切り離す工程を有する。Furthermore, another manufacturing method of the present invention is to form an anode lead terminal provided with a connection portion of an anode lead protruding from the frame at a predetermined interval in a single metal plate and an anode external electrode portion, and A step of forming a cathode lead terminal provided with a cathode external electrode portion protruding from the opposing frame at predetermined intervals and bridging the connecting portion of the anode lead terminal and the anode external electrode portion with a fuse; The step of covering with an elastic body having an insulating property, the step of separating the connection part of the anode lead terminal and the external electrode part outside the exterior resin after the resin exterior, and the anode external electrode part and the cathode external electrode part from the frame respectively. There is a step of separating.
したがって、大きな短絡電流が流れても、ヒューズがコ
ンデンサ素子の陰極層から離れでいるので、ヒューズが
発熱して切断するまでの間にコンデンサ素子からのはん
だの吹き出しや焼損事故は発生せず、また陽極リード端
子の接続部と外部電極部は機械的加工にて製作されてお
り、平坦性や寸法の均一性が良好なため、ヒューズの接
続は自動機械によって可能であり、さらに、陽極リード
端子側は陰極層側に比べてヒューズの接続スペースが十
分にあり、チップ形状を大きくしたりコンデンサ素子形
状を小さくしたりする必要もなく、容量の体積効率が向
上する。Therefore, even if a large short-circuit current flows, since the fuse is separated from the cathode layer of the capacitor element, there is no occurrence of solder blowout or burning accident from the capacitor element until the fuse heats up and is cut. Since the connection part of the anode lead terminal and the external electrode part are manufactured by mechanical processing, and the flatness and the uniformity of dimensions are good, the fuse can be connected by an automatic machine. Has a sufficient space for connecting a fuse as compared with the cathode layer side, and it is not necessary to enlarge the chip shape or the capacitor element shape, and the volumetric efficiency of capacitance is improved.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明のヒューズ付きチップ状固体電解コンデ
ンサの一実施例の内部構造を示す一部断面斜視図、第２
図は第１図の断面図である。FIG. 1 is a partial cross-sectional perspective view showing the internal structure of an embodiment of a chip solid electrolytic capacitor with a fuse of the present invention, FIG.
The figure is a cross-sectional view of FIG.
陰極層３と陽極リード２からなるコンデンサ素子１に
は、陰極層３の陽極リード２と反対側の面および上面
に、陰極リード端子５が導電性接着剤８により固着さ
れ、陽極リード２には、弾性（シリコン）樹脂７により
被覆されたヒューズ６により接続部４ａと陽極外部電極
部４ｂとが接続されてなる陽極リード端子４の接続部４
ａが溶接固着され、さらに、陽極リード端子４の陽極外
部電極部４ｂと陰極リード端子５の露出部分を除き外装
樹脂９により絶縁外装されてヒューズ付きチップ状固体
電解コンデンサ１０が構成されている。In the capacitor element 1 including the cathode layer 3 and the anode lead 2, the cathode lead terminal 5 is fixed to the surface and the upper surface of the cathode layer 3 opposite to the anode lead 2 with the conductive adhesive 8. , A connection part 4 of an anode lead terminal 4 in which the connection part 4a and the anode external electrode part 4b are connected by a fuse 6 covered with an elastic (silicon) resin 7.
The chip-shaped solid electrolytic capacitor 10 with fuse is affixed by welding, and is further insulated and sheathed by the exterior resin 9 except for the exposed portions of the anode external electrode portion 4b of the anode lead terminal 4 and the cathode lead terminal 5.
次に、このヒューズ付きチップ状固体電解コンデンサ１
０の製造方法について説明する。第３図は陽極リード端
子４の組立前の形状を示したもので、陽極リード２との
接続部４ａと陽極外部電極部４ｂがフレーム１１により
支持されている。陰極リード端子５の段差部の内側に導
電性接着剤８が塗布され、この塗布部に陰極層３の一方
の面と上面が接着され、陽極リード端子４の接続部４ａ
は陽極リード２に溶着固着され、さらに、接続部４ａと
陽極外部電極部４ｂはヒューズ６のはんだ付けにより橋
絡接続され、その上をシリコン樹脂７により被覆され
る。シリコン樹脂７は弾性および絶縁性を有している。
このように形成された組立体は、陽極リード端子４の接
続部４ａおよび陽極外部電極部４ｂと、陰極リード端子
５のそれぞれの露出部を残して外装樹脂９によりトラン
スファモールド手段により絶縁外装された後、接続部４
ａの露出部のＡ−ＡおよびＣ−Ｃ線と陽極外部電極部４
ｂの露出部のＢ−Ｂ線よりフレーム１１側が切落され、
さらに陽極リード端子４の陽極外部電極部４ｂと陰極リ
ード端子５が外装樹脂９の外壁に沿って折曲げられ、ヒ
ューズ付きチップ状固体電解コンデンサ１０が形成され
る。本実施例では外装樹脂９としてエポキシ樹脂を用い
た。Next, this chip-shaped solid electrolytic capacitor with fuse 1
The manufacturing method of 0 will be described. FIG. 3 shows the shape of the anode lead terminal 4 before assembly, in which the connection portion 4 a with the anode lead 2 and the anode external electrode portion 4 b are supported by the frame 11. A conductive adhesive 8 is applied to the inside of the stepped portion of the cathode lead terminal 5, and one surface and the upper surface of the cathode layer 3 are adhered to this application portion, and the connection portion 4a of the anode lead terminal 4 is attached.
Is welded and fixed to the anode lead 2, and the connection portion 4a and the anode external electrode portion 4b are bridge-connected by soldering the fuse 6, and the silicon resin 7 is coated thereon. The silicone resin 7 has elasticity and insulating properties.
The assembly thus formed was insulated and exterior-coated by the transfer molding means with the exterior resin 9 except the exposed portions of the connection portion 4a of the anode lead terminal 4 and the anode external electrode portion 4b, and the cathode lead terminal 5. After the connection part 4
A-A and C-C line of exposed part of a and anode external electrode part 4
The frame 11 side is cut off from the line BB of the exposed part of b,
Further, the anode external electrode portion 4b of the anode lead terminal 4 and the cathode lead terminal 5 are bent along the outer wall of the exterior resin 9 to form a chip solid electrolytic capacitor 10 with a fuse. In this embodiment, an epoxy resin is used as the exterior resin 9.
次に、このヒューズ付きチップ状固体電解コンデンサ１
０の別の製造方法について説明する。Next, this chip-shaped solid electrolytic capacitor with fuse 1
Another manufacturing method of No. 0 will be described.
第４図(a) は陽極リード端子４，陰極リード端子５の組
立前の形状を示したもので、一方の側において陽極リー
ド２との接続部４ａと陽極外部電極部４ｂがフレーム１
１により、対向するもう一方の側において陰極リード端
子５がフレーム１２により支持されている。FIG. 4 (a) shows the shape of the anode lead terminal 4 and the cathode lead terminal 5 before assembling, and the connection portion 4a for the anode lead 2 and the anode external electrode portion 4b are provided on the frame 1 on one side.
1, the cathode lead terminal 5 is supported by the frame 12 on the opposite side.
陽極リード端子４および陰極リード端子５はともに一枚
の金属板のフレーム１１，１２から同一平面内に所定の
間隔をもって突出され、両者のピッチは同じである。Both the anode lead terminal 4 and the cathode lead terminal 5 are projected from the frames 11 and 12 of a single metal plate in the same plane at a predetermined interval, and the pitches of both are the same.
第４図(b) は陽極リード端子４，陰極リード端子５の組
立後の形状を示したものである。FIG. 4 (b) shows the shape of the anode lead terminal 4 and the cathode lead terminal 5 after assembly.
まず、この陰極リード端子５の段差部の内側に導電性接
着剤８を塗布し、この塗布部に前記陽極リード端子４、
陰極リード端子５と同じピッチ間隔で並べられたコンデ
ンサ素子１に陰極層３の一方の側面と上面を接着する。
次に陽極リード端子４の接続部４ａと陽極リード２を溶
接により接続し、さらに前記接続部４ａと陽極外部電極
部４ｂとをヒューズ６によりはんだ付けあるいはワイヤ
ーボンディング等の手段を用いて橋絡接続し、その上を
シリコン樹脂等の絶縁性を有する弾性樹脂７により被覆
する。最後に陽極リード端子４の接続部４ａ，陽極外部
電極部４ｂの露出部および陰極リード端子５の露出部で
ある陰極外部電極部５ａを残してトランスファモールド
等の手段を用いて第１図のように外装樹脂９により絶縁
外装した後、金属板を陽極リード端子４の接続部４ａの
露出部のＡ−Ａ線，Ｃ−Ｃ線および陽極外部電極部４ｂ
の露出部のＢ−Ｂ線から切断して、フレーム１１側から
分離し、さらに陰極リード端子５の露出部である陰極外
部電極部５ａのＤ−Ｄ線から同様に切断してフレーム１
２側から分離し、残った陽極外部電極部４ｂ，陰極外部
電極部５ａを外装樹脂９の外壁に沿って折り曲げ、ヒュ
ーズ付きチップ状固体電解コンデンサ１０を形成する。First, a conductive adhesive 8 is applied to the inside of the stepped portion of the cathode lead terminal 5, and the anode lead terminal 4,
One side surface and the upper surface of the cathode layer 3 are bonded to the capacitor elements 1 arranged at the same pitch intervals as the cathode lead terminals 5.
Next, the connection portion 4a of the anode lead terminal 4 and the anode lead 2 are connected by welding, and the connection portion 4a and the anode external electrode portion 4b are bridge-connected by means of a fuse 6 by means of soldering or wire bonding. Then, it is covered with an elastic resin 7 having an insulating property such as a silicone resin. Finally, using a means such as transfer molding, leaving the connection portion 4a of the anode lead terminal 4, the exposed portion of the anode external electrode portion 4b, and the cathode external electrode portion 5a, which is the exposed portion of the cathode lead terminal 5, as shown in FIG. After being insulated and sheathed with a sheathing resin 9, the metal plate is exposed to the AA line, C-C line and the anode external electrode part 4b of the connection part 4a of the anode lead terminal 4.
Of the exposed portion of the cathode lead electrode 5 is separated from the line BB, and the exposed portion of the cathode lead terminal 5 is cut off similarly from the line D-D of the cathode external electrode portion 5a.
The anode external electrode portion 4b and the cathode external electrode portion 5a, which are separated from the second side, are bent along the outer wall of the exterior resin 9 to form a chip solid electrolytic capacitor with a fuse 10.
このようにして形成されたヒューズ付きチップ状固体電
解コンデンサに過電流を流しても、ヒューズ６と陰極層
３とは近接していないので、ヒューズ６が発熱してから
溶断に至るまでの間に陰極層３からのはんだの吹出しや
コンデンサ素子１の焼損等の事故は発生せず、安全装置
として確実に機能し、二次災害は発生しないことが確認
された。また、陽極リード端子４，陰極リード端子５
は、第３図，第４図(3) に示した形状の機械加工等によ
り形成されるので、低コストで、しかも平坦性や寸法の
均一性が良く、自動のワイヤボンディング機等を適用し
てヒューズの自動接続が可能となり、製造工程が大幅に
簡略化された。さらに、陽極リード端子４側は陰極リー
ド端子５側に比べてヒューズ６の接続スペースが十分に
あり、チップ形状を大きくしたり、コンデンサ素子１の
形状を小さくしたりする必要がなく、ヒューズを付けな
いチップ状固体電解コンデンサと同等の体積効率を有す
る、小型、大容量化の要求に応えうるヒューズ付チップ
状固体電解コンデンサが得られた。また、陽極リード端
子４の接続部４ａと陽極外部電極部４ｂとの間をテスタ
ー等にて測定することにより、ヒューズ６の接続抵抗を
求めることができ、接続状態を電気的に確認することが
できる。Even if an overcurrent is passed through the chip-shaped solid electrolytic capacitor with a fuse formed in this way, since the fuse 6 and the cathode layer 3 are not in close proximity to each other, the fuse 6 is heated and then blown. It was confirmed that no accident such as blowing out of solder from the cathode layer 3 or burning of the capacitor element 1 occurred, the device reliably functions as a safety device, and no secondary disaster occurs. Also, the anode lead terminal 4 and the cathode lead terminal 5
Is formed by machining the shape shown in FIGS. 3 and 4 (3), so it is low in cost and has good flatness and dimensional uniformity. The fuse can be automatically connected, greatly simplifying the manufacturing process. Further, the anode lead terminal 4 side has a sufficient connection space for the fuse 6 as compared with the cathode lead terminal 5 side, and it is not necessary to enlarge the chip shape or reduce the shape of the capacitor element 1. A chip solid electrolytic capacitor with a fuse, which has the same volume efficiency as a chip solid electrolytic capacitor that does not meet the requirements of small size and large capacity, was obtained. Further, the connection resistance of the fuse 6 can be obtained by measuring the distance between the connection portion 4a of the anode lead terminal 4 and the anode external electrode portion 4b with a tester or the like, and the connection state can be electrically confirmed. it can.
以上説明したように本発明は、陽極リードとの接続部と
外部電極部からなる陽極リード端子と、外装樹脂の内部
で陽極リード端子の接続部と外部電極部を橋絡接続する
ヒューズを備え、さらに、一枚の金属板から多くの端子
板をまとめて製造することにより、以下のような効果が
ある。As described above, the present invention includes an anode lead terminal including a connection portion with an anode lead and an external electrode portion, and a fuse that bridge-connects the connection portion of the anode lead terminal and the external electrode portion inside the exterior resin, Furthermore, the following effects can be obtained by collectively manufacturing a large number of terminal plates from a single metal plate.
(1) 短絡した時でも陰極層からのはんだの吹き出しや、
コンデンサ自身の焼損事故の危険性がない。(1) Even when a short circuit occurs, the solder may blow out from the cathode layer,
There is no risk of accidental burning of the capacitor itself.
(2) 端子板を高精度で低コストで製造することができ、
接続部と外部電極部のヒューズによる橋絡接続を自動装
置で簡便に行うことができ、製造工程が大幅に簡略化さ
れる。(2) The terminal board can be manufactured with high precision and low cost,
The bridging connection between the connecting portion and the external electrode portion by the fuse can be easily performed by an automatic device, and the manufacturing process is greatly simplified.
(3) 体積効率が高く小型、大容量化が容易である。(3) It has high volume efficiency, and it is easy to reduce the size and increase the capacity.
(4) 絶縁外装後に接続部と陽極外部電極部とを引り離す
ので、ヒューズの接続信頼性を大きく向上させることが
可能となる。(4) Since the connection part and the anode external electrode part are pulled apart after the insulation coating, it is possible to greatly improve the connection reliability of the fuse.
(5) 接続部の一部が絶縁外装から露出しているので、こ
の露出部分と陽極外部電極部の露出部分との間の導通状
態を測定することにより、ヒューズが切れているかどう
かを容易に確認でき、製造工程中でのチェックのみなら
ず、故障時の原因解析を容易とすることができる。(5) Since a part of the connection part is exposed from the insulation exterior, it is easy to determine whether the fuse is blown by measuring the conduction state between this exposed part and the exposed part of the anode external electrode part. It can be confirmed, and not only the check in the manufacturing process but also the cause analysis at the time of failure can be facilitated.
第１図は本発明のヒューズ付きチップ状固体電解コンデ
ンサの一実施例の内部構造を示す斜視図、第２図は第１
図の側断面図、第３図は陽極リード端子４の組立前の形
状の一例の正面図、第４図(a) はこの固体電解コンデン
サ10の別の製造方法の実施例における陽極リード端子４
および陰極リード端子５の組立前の形状を示し、第４図
(b) はそれらの組立後の形状を示す平面図、第５図は従
来のヒューズ付きチップ状固体電解コンデンサの一例の
内部構造を示す斜視図、第６図は第５図の側断面図であ
る。 １……コンデンサ素子、２……陽極リード、 ３……陰極層、４……陽極リード端子、 ４ａ……接続部、４ｂ……陽極外部電極部、 ５……陰極リード端子、５ｂ……陰極外部電極部、 ６……ヒューズ、 ７……弾性（シリコン）樹脂、 ８……導電性接着剤、９……外装樹脂、 １０……ヒューズ付きチップ状固体電解コンデンサ、 １１，１２……フレーム、 ２０……はんだ、２１……絶縁性接着剤。FIG. 1 is a perspective view showing the internal structure of an embodiment of a chip solid electrolytic capacitor with a fuse of the present invention, and FIG.
FIG. 3 is a side sectional view of the figure, FIG. 3 is a front view of an example of the shape of the anode lead terminal 4 before assembly, and FIG. 4 (a) is an anode lead terminal 4 in an embodiment of another manufacturing method of the solid electrolytic capacitor 10.
FIG. 4 shows the shape of the cathode lead terminal 5 before assembly and FIG.
(b) is a plan view showing the shape after assembly thereof, FIG. 5 is a perspective view showing an internal structure of an example of a conventional chip solid electrolytic capacitor with a fuse, and FIG. 6 is a side sectional view of FIG. is there. 1 ... Capacitor element, 2 ... Anode lead, 3 ... Cathode layer, 4 ... Anode lead terminal, 4a ... Connection part, 4b ... Anode external electrode part, 5 ... Cathode lead terminal, 5b ... Cathode External electrode part, 6 ... Fuse, 7 ... Elastic (silicon) resin, 8 ... Conductive adhesive, 9 ... Exterior resin, 10 ... Chip solid electrolytic capacitor with fuse, 11, 12 ... Frame, 20 ... Solder, 21 ... Insulating adhesive.
Claims (3)
素子と、前記陰極層に接続された陰極リード端子と、前
記陽極リードに電気的に接続された陽極リード端子とを
有し、前記陽極リード端子は前記陽極リードに固着され
た接続部と前記接続部と離間した陽極外部電極部とを有
するものであって、前記接続部と前記陽極外部電極部と
がヒューズで橋絡されるとともに前記陰極リード端子お
よび前記陽極外部電極部の露出部分を除いて樹脂により
絶縁外装されてなるヒューズ付きチップ状固体電解コン
デンサにおいて、前記接続部の一部が前記絶縁外装から
露出していることを特徴とするヒューズ付きチップ状固
体電解コンデンサ。1. A capacitor element having a cathode layer and an anode lead, a cathode lead terminal connected to the cathode layer, and an anode lead terminal electrically connected to the anode lead. The lead terminal has a connection portion fixed to the anode lead and an anode external electrode portion separated from the connection portion, and the connection portion and the anode external electrode portion are bridged by a fuse and In a chip-like solid electrolytic capacitor with a fuse, which is insulated and sheathed with a resin except for the exposed portion of the cathode lead terminal and the anode external electrode portion, a part of the connection portion is exposed from the insulating sheath. Chip type solid electrolytic capacitor with fuse.
素子と、前記陰極層に接続された陰極リード端子と、前
記陽極リードに電気的に接続された陽極リード端子とを
有し、前記陽極リード端子は前記陽極リードに固着され
た接続部と前記接続部と離間した陽極外部電極部とを有
するものであって、前記接続部と前記陽極外部電極部と
がヒューズで橋絡されるとともに前記陰極リード端子お
よび前記陽極外部電極部の露出部分と前記接続部の一部
を除いて樹脂により絶縁外装されてなるヒューズ付きチ
ップ状固体電解コンデンサの製造方法において、 前記接続部と前記陽極外部電極部とを連結支持するフレ
ームを前記接続部および陽極外部電極部とともに一枚の
金属板で形成し、前記接続部と前記陽極外部電極部とを
前記ヒューズにて橋絡接続する工程と、前記樹脂による
絶縁外装を行う工程と、前記絶縁外装後に外装樹脂外部
にて前記接続部と前記陽極外部電極部とを前記フレーム
から切り離す工程とを有することを特徴とするヒューズ
付きチップ状固体電解コンデンサの製造方法。2. A capacitor element having a cathode layer and an anode lead, a cathode lead terminal connected to the cathode layer, and an anode lead terminal electrically connected to the anode lead. The lead terminal has a connection portion fixed to the anode lead and an anode external electrode portion separated from the connection portion, and the connection portion and the anode external electrode portion are bridged by a fuse and A method of manufacturing a chip-shaped solid electrolytic capacitor with a fuse, which is insulated and sheathed with a resin except for an exposed part of the cathode lead terminal and the anode external electrode part and a part of the connection part, wherein the connection part and the anode external electrode part A frame that connects and supports the connection part and the anode external electrode part is formed of a single metal plate, and the connection part and the anode external electrode part are bridge-connected by the fuse. With a fuse, including a step of continuing, a step of performing an insulating sheath with the resin, and a step of disconnecting the connection portion and the anode external electrode portion from the frame outside the sheath resin after the insulating sheath. Manufacturing method of chip solid electrolytic capacitor.
素子と、前記陰極層に接続された陰極リード端子と、前
記陽極リードに電気的に接続された陽極リード端子とを
有し、前記陽極リード端子は前記陽極リードに固着され
た接続部と前記接続部と離間した陽極外部電極部とを有
するものであって、前記接続部と前記陽極外部電極部と
がヒューズで橋絡されるとともに前記陰極リード端子お
よび前記陽極外部電極部の露出部分と前記接続部の一部
を除いて樹脂により絶縁外装されてなるヒューズ付きチ
ップ状固体電解コンデンサの製造方法において、 一枚の金属板内に、所定間隔ごとにフレームから突出さ
せた前記陽極リード端子を形成し、さらに、対向するフ
レームから所定間隔ごとに突出させた陰極外部電極部を
設けた陰極リード端子を形成し、前記接続部と前記陽極
外部電極部とを前記ヒューズにて橋絡接続する工程と、
前記ヒューズを絶縁性を有する弾性体で被覆する工程
と、前記樹脂により絶縁外装を行う工程と、前記絶縁外
装後に外装樹脂外部にて前記接続部を前記フレームから
切り離す工程と、前記陽極外部電極部および陰極外部電
極部をそれぞれ前記フレームから切り離す工程とを有す
ることを特徴とするヒューズ付きチップ状固体電解コン
デンサの製造方法。3. A capacitor element having a cathode layer and an anode lead, a cathode lead terminal connected to the cathode layer, and an anode lead terminal electrically connected to the anode lead. The lead terminal has a connection portion fixed to the anode lead and an anode external electrode portion separated from the connection portion, and the connection portion and the anode external electrode portion are bridged by a fuse and In a method of manufacturing a chip solid electrolytic capacitor with a fuse, which is insulated and sheathed with a resin except for the exposed portion of the cathode lead terminal and the external electrode portion of the anode and a part of the connection portion, a predetermined amount is provided in a single metal plate. The cathode lead terminals formed by forming the above-mentioned anode lead terminals projecting from the frame at intervals, and further providing the cathode external electrode portions projecting from the opposing frame at predetermined intervals. Forming, and connecting the connection portion and the anode external electrode portion by bridging with the fuse,
A step of covering the fuse with an elastic body having an insulating property, a step of performing an insulating exterior with the resin, a step of disconnecting the connection part from the frame outside the exterior resin after the insulating exterior, and the anode external electrode part And a step of disconnecting the cathode external electrode portion from the frame, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260822A JPH0626175B2 (en) | 1986-12-17 | 1987-10-16 | Chip-shaped solid electrolytic capacitor with fuse and manufacturing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61-302513 | 1986-12-17 | ||
| JP30251386 | 1986-12-17 | ||
| JP62260822A JPH0626175B2 (en) | 1986-12-17 | 1987-10-16 | Chip-shaped solid electrolytic capacitor with fuse and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63265418A JPS63265418A (en) | 1988-11-01 |
| JPH0626175B2 true JPH0626175B2 (en) | 1994-04-06 |
Family
ID=26544763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62260822A Expired - Fee Related JPH0626175B2 (en) | 1986-12-17 | 1987-10-16 | Chip-shaped solid electrolytic capacitor with fuse and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626175B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5608602A (en) * | 1992-04-07 | 1997-03-04 | Rohm Co., Ltd. | Circuit incorporating a solid electrolytic capacitor |
| JP2766446B2 (en) * | 1993-05-12 | 1998-06-18 | ローム株式会社 | Structure of solid electrolytic capacitor |
| KR100415569B1 (en) * | 2001-11-28 | 2004-01-24 | 삼성전기주식회사 | Tantalum condenser containing improved lead frame |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0231852B2 (en) * | 1984-05-31 | 1990-07-17 | Matsuo Electric Co | HYUUZUIRIKONDENSAOYOBISONOSEIZOHOHO |
| JPS61160923A (en) * | 1985-01-08 | 1986-07-21 | 日本電気株式会社 | Solid electrolytic capacitor with fuse |
-
1987
- 1987-10-16 JP JP62260822A patent/JPH0626175B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63265418A (en) | 1988-11-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |