JPH0626787B2 - Tilt detection method for cutting device - Google Patents
Tilt detection method for cutting deviceInfo
- Publication number
- JPH0626787B2 JPH0626787B2 JP14864987A JP14864987A JPH0626787B2 JP H0626787 B2 JPH0626787 B2 JP H0626787B2 JP 14864987 A JP14864987 A JP 14864987A JP 14864987 A JP14864987 A JP 14864987A JP H0626787 B2 JPH0626787 B2 JP H0626787B2
- Authority
- JP
- Japan
- Prior art keywords
- tilt
- work
- position sensor
- cut
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
- B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
【発明の詳細な説明】 [産業上の利用分野] この発明は、切断装置におけるワーク(被切断物)の傾
き検出技術に関し、例えば半導体単結晶インゴットをス
ライスしてウェハを切り出す結晶切断装置における結晶
の水平方向の傾きおよび垂直方向の傾きの検出装置に利
用して効果的な技術に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for detecting the inclination of a workpiece (object to be cut) in a cutting device, for example, a crystal in a crystal cutting device for slicing a semiconductor single crystal ingot to cut a wafer. The present invention relates to a technique effectively applied to a horizontal tilt and vertical tilt detection device.
[従来技術] 結晶インゴットからウェハを切り出す切断装置として、
研磨剤を塗布したワイヤを往復移動させてスライスする
ワイヤソーがある。従来のワイヤソーにおけるゴニオテ
ーブル上に固定された結晶の水平面に対する左右方向の
傾きθ1(以下、振れと称する)の修正は、ワーク(結
晶体)1の端面にペースト等の薄い油膜を塗布して、例
えば第5図(A)に示すように、その端面にワイヤ2を
接触させ、油膜に残ったワイヤの跡を目視して傾いてい
ることを検出し、同図(B)のようにワイヤ2が端面の
油膜全体に均一に接触するようにゴニオテーブルを調整
することで行なっている。また、ゴニオテーブル3上の
ワーク1の水平面に対する前後方向の傾きθ2(以下、
倒れと称する)は、第6図に示すようにマイクロメータ
15のプローブ15aをワーク1の端面に接触させて垂
直方向に移動させ、その移動量lとマイクロメータの測
定値δとから傾きθ2=tanδ/lとして求めていた。[Prior Art] As a cutting device for cutting a wafer from a crystal ingot,
There is a wire saw that reciprocates a wire coated with an abrasive and slices it. In the conventional wire saw, the correction of the inclination θ 1 (hereinafter referred to as runout) in the left-right direction of the crystal fixed on the gonio table with respect to the horizontal plane is performed by applying a thin oil film such as paste to the end surface of the work (crystal body) 1. For example, as shown in FIG. 5 (A), the wire 2 is brought into contact with the end face, the trace of the wire remaining on the oil film is visually detected, and it is detected that the wire 2 is tilted. This is done by adjusting the gonio table so that the No. 2 uniformly contacts the entire oil film on the end face. Further, the inclination θ 2 of the work 1 on the gonio table 3 in the front-back direction with respect to the horizontal plane (hereinafter,
As shown in FIG. 6, the probe 15a of the micrometer 15 is brought into contact with the end face of the work 1 and moved vertically as shown in FIG. 6, and the inclination θ 2 is calculated from the movement amount l and the measured value δ of the micrometer. = Tan δ / l.
[発明が解決しようとする問題点] 前述した従来の傾き検出方式にあっては、高い精度を得
るのに繰返し作業が不可欠であり、かつ作業者の熟練も
要する。また、左右方向と前後方向の傾きすなわち振れ
と倒れを別々にしかも異なる方式で検出しなければなら
ないので、傾きの検出、修正に要する作業時間が長くな
るという問題点があった。[Problems to be Solved by the Invention] In the above-described conventional inclination detection method, repetitive work is indispensable to obtain high accuracy, and skill of the operator is also required. Moreover, since the tilts in the left-right direction and the front-rear direction, that is, the shake and the tilt must be detected separately and by different methods, there is a problem that the work time required for detecting and correcting the tilt becomes long.
この発明は上記のような問題点に着目してなされたもの
で、その目的とするところは棒状ワークの切断装置にお
いて、基準面の振れおよび倒れの検出を同時かつ精度よ
く行なえるとともに、熟練を必要とせずしかも短時間で
行なえるような傾き検出装置を提供することにある。The present invention has been made in view of the problems as described above, and the purpose thereof is, in a cutting device for a rod-shaped work, it is possible to detect the deflection and tilt of the reference plane simultaneously and with high precision. An object of the present invention is to provide an inclination detection device that does not require it and can be performed in a short time.
[問題点を解決するための手段] 上記目的を達成するためこの発明は、投光器と受光器と
からなる2組の光電スイッチを互いに検出光軸が平行に
なるように配設して切断用ワイヤの検出手段とするとと
もに、一対のマイクロメータをそのプローブ先端を結ぶ
仮想線が上記2つの検出光軸を含む面と平行となるよう
に配設した傾き検出装置を構成した。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a cutting wire in which two sets of photoelectric switches, each of which includes a light transmitter and a light receiver, are arranged so that their detection optical axes are parallel to each other. And a pair of micrometers are arranged such that an imaginary line connecting the probe tips is parallel to the plane including the two detection optical axes.
[作用] 上記した手段によると、一対のマイクロメータをワーク
に対し垂直方向に相対的に移動させて、ワーク端面の位
置を測定することにより、端面の振れと倒れを同時に測
定できるようにし、これによって従来のように振れと倒
れを別々に測定したり、測定を繰り返す必要をなくすと
ともに、かつ表示器に傾きを定量的に表示させて、熟練
を要することなく短時間に精度よく被切断物の基準面の
傾きを検出できるようにするという上記目的を達成する
ことができる。[Operation] According to the above-mentioned means, the pair of micrometer is moved in the vertical direction relative to the work to measure the position of the end face of the work, so that the shake and tilt of the end face can be simultaneously measured. This eliminates the need to separately measure runout and tilt as in the past, and eliminates the need to repeat the measurement, and also displays the tilt quantitatively on the display unit to accurately and quickly cut the object to be cut without skill. The above-described object of being able to detect the inclination of the reference plane can be achieved.
[実施例] 第1図〜第3図には、本発明を半導体結晶インゴットを
切断するワイヤソーに適用した場合の傾き検出装置の一
実施例を示す。[Embodiment] FIGS. 1 to 3 show an embodiment of an inclination detecting device when the present invention is applied to a wire saw for cutting a semiconductor crystal ingot.
傾き検出装置全体を支持する水平な支持プレート11の
先端には、取付プレート12が下方へ垂下するように固
定され、取付プレート12の背面には投光器13aと受
光器13bとからなる光電スイッチ13が2組設けられ
ている。2組の光電スイッチ13は、各々その検出光軸
が垂直方向を向くように、投光、受光器13a,13b
が各々ブラケット14によって固定されている。A mounting plate 12 is fixed to the tip of a horizontal support plate 11 that supports the entire tilt detection device so as to hang downward, and a photoelectric switch 13 including a light projector 13a and a light receiver 13b is provided on the back surface of the mounting plate 12. Two sets are provided. The two sets of photoelectric switches 13 have light-emitters and light-receivers 13a and 13b so that their detection optical axes are oriented in the vertical direction.
Are fixed by brackets 14, respectively.
また、取付プレート12の中央には開口部12aが形成
され、この開口部12a内に位置し、かつ検出用プロー
ブ15aが前方へ突出するように一対の電気マイクロメ
ータ15,15が取付プレート12に取り付けられてい
る。マイクロメータ15の検出信号は指示計4(第4図
参照)に供給され、各プローブの移動量がアナログ表示
されるようになっている。Further, an opening 12a is formed in the center of the mounting plate 12, and a pair of electric micrometers 15 and 15 are mounted on the mounting plate 12 so as to be located in the opening 12a and to allow the detection probe 15a to project forward. It is installed. The detection signal of the micrometer 15 is supplied to the indicator 4 (see FIG. 4), and the moving amount of each probe is displayed in analog.
上記一対の電気マイクロメータ15,15は、その検出
用プローブ15a,15aの先端同士を結ぶ仮想線が、
上記2組の光電スイッチ13の検出光軸を含む面と平行
となるように位置決めされている。In the pair of electric micrometers 15 and 15, an imaginary line connecting the tips of the detection probes 15a and 15a is
The two sets of photoelectric switches 13 are positioned so as to be parallel to the surface including the detection optical axis.
一方、検出装置を支持する上記支持プレート11は、第
3図に示すようにアルグルブラケット16によって基端
側が直動ステージ17に固定され、直動ステージ17は
回転ステージ18上にスライド可能に載置されている。
そして、回転ステージ18は、電磁チャックを有するマ
グネットベース19上に回転可能に載置されている。On the other hand, as shown in FIG. 3, the support plate 11 that supports the detection device is fixed at its base end side to the linear movement stage 17 by an aruggle bracket 16, and the linear movement stage 17 is slidably mounted on the rotary stage 18. It is placed.
The rotary stage 18 is rotatably mounted on a magnet base 19 having an electromagnetic chuck.
上記直動ステージ17は調整用ノブ17aを回すことに
より支持プレート11の延設方向に移動させることがで
き、回転ステージ18は固定ツマミ18aをつかんで鉛
直軸回りに回すことにより角度を調整できるように構成
されている。The translation stage 17 can be moved in the extending direction of the support plate 11 by turning the adjustment knob 17a, and the rotary stage 18 can be adjusted in angle by grasping the fixed knob 18a and turning it around the vertical axis. Is configured.
次に、上記傾き検出装置10を適用したワイヤソーにお
けるワークの位置修正方法を、第4図を用いて説明す
る。Next, a method of correcting the position of the work in the wire saw to which the tilt detecting device 10 is applied will be described with reference to FIG.
先ず、適当な校正治具(図示省略)を使って、電気マイ
クロメータのプローブ15a,15aの先端を結ぶ線
が、2組の光電スイッチ13の検出光軸を含む面と平行
になるように位置決めを行なう。そして、このときのマ
イクロメータの指示計4の指示を「0」に合わせる。そ
れから、この検出装置10が装着された支持プレート1
1を、ワイヤソーの取付けベース9上にセットする。First, using an appropriate calibration jig (not shown), position the line connecting the tips of the probes 15a, 15a of the electric micrometer so that they are parallel to the plane including the detection optical axes of the two photoelectric switches 13. Do. Then, the instruction of the indicator 4 of the micrometer at this time is set to "0". Then, the support plate 1 on which the detection device 10 is mounted
1 is set on the mounting base 9 of the wire saw.
次に、切断用ワイヤ2を検出装置に接近させ、回転ステ
ージ18と直動ステージ17を使って2組の光電スイッ
チ13が同時にワイヤ2を検出する状態になるように支
持プレート11の位置調整を行なう。この場合、光電ス
イッチ13の信号によって対応した2つのランプを点灯
できるようにしておき、ランプを見ながらステージ1
7,18を移動させてそれらが同時に点灯した位置でス
テージを固定させるようにすればよい。これによって、
一対の電気マイクロメータ15のプローブ15aの先端
を結ぶ線は、切断用ワイヤ2と完全に平行な状態にあ
る。Next, the cutting wire 2 is brought close to the detection device, and the position of the support plate 11 is adjusted by using the rotary stage 18 and the linear movement stage 17 so that the two photoelectric switches 13 detect the wire 2 at the same time. To do. In this case, the two lamps corresponding to the signal of the photoelectric switch 13 can be turned on, and the stage 1
It suffices to move 7 and 18 and fix the stage at a position where they are turned on at the same time. by this,
The line connecting the tips of the probes 15a of the pair of electric micrometers 15 is completely parallel to the cutting wire 2.
そこで、ゴニオテーブル3と直動ステージ17のいずれ
か一方を移動させて互いに接近させ、プローブ15aを
ワーク1の端面に当接させる。そして、そのときの指示
計4の指示値によりワークの振れ方向を確認し、2つの
指示計4の指示値の差がゼロになるようにゴニオテーブ
ル3の振れ方向角度の調整を行なう。Therefore, one of the gonio table 3 and the linear movement stage 17 is moved to approach each other, and the probe 15a is brought into contact with the end surface of the work 1. Then, the deflection direction of the work is confirmed by the indication value of the indicator 4 at that time, and the deflection direction angle of the goniometer table 3 is adjusted so that the difference between the indication values of the two indicators 4 becomes zero.
それから、ワーク1の端面にプローブ15aを当接させ
たままゴニオテーブル3を上下動させて、指示計4を見
て端面の倒れ方向を確認し、2つの指示計4の指示値の
差が連続してゼロになるようにゴニオテーブルの倒れ方
向の傾き調整を行なう。Then, while the probe 15a is kept in contact with the end surface of the work 1, the goniometer table 3 is moved up and down, the tilt direction of the end surface is confirmed by looking at the indicator 4, and the difference between the indicated values of the two indicators 4 is continuous. Then, adjust the tilt of the gonio table in the direction of tilt so that it becomes zero.
上記方法に従うと、ワークの振れと倒れを一つの検出装
置で行なうことができるため、振れと倒れを別個の検出
方法で検出して修正する従来方式に比べて短時間にワー
クの傾きの修正を行なうことができる。また、上記実施
例の検出装置ではワークの振れの程度を指示計によって
定量的に表示できるため、ワークの端面に油膜を形成
し、そこに切断ワイヤを接触させて振れを検出する従来
方式のように作業者の熟練を必要としたり、繰返し検出
を行なって振れをゼロに近づけていくような作業が不要
となる。そのため、ワークの傾きの修正精度も向上され
る。According to the above method, since the shake and tilt of the work can be performed by one detection device, the tilt of the work can be corrected in a shorter time than the conventional method in which the shake and the tilt are detected and corrected by separate detection methods. Can be done. Further, in the detection device of the above-mentioned embodiment, since the degree of the shake of the work can be quantitatively displayed by the indicator, an oil film is formed on the end face of the work, and a cutting wire is brought into contact with the oil film to detect the shake as in the conventional method. Therefore, it is not necessary to require the skill of the operator or to perform the detection repeatedly to bring the shake close to zero. Therefore, the accuracy of correcting the inclination of the work is also improved.
表1には、ワイヤソーにセットされたワークについて従
来方法と上記実施例の検出装置を適用してワークの傾き
修正を行なった場合の修正誤差の実験結果を示す。な
お、実験には径の大きさが160μmのワイヤを使用し
た。Table 1 shows the experimental results of the correction error when the inclination of the work is corrected by applying the conventional method and the detection device of the above-mentioned embodiment to the work set on the wire saw. A wire having a diameter of 160 μm was used in the experiment.
表1より、本実施例の検出装置を使用すると、従来方式
に比べて特にワークの振れ方向の誤差が大幅に向上され
ることが分かる。From Table 1, it can be seen that the use of the detection apparatus of the present embodiment significantly improves the error in the deflection direction of the work, as compared with the conventional method.
なお、上記実施例では光電スイッチと電気マイクロメー
タを組合せて傾き検出装置を構成したものについて説明
したが、電気マイクロメータの代りに変位計または粗さ
計等のセンサを用い、それと光電スイッチを組合せて傾
き検出装置を構成するようにしてもよい。 In the above embodiment, the tilt detecting device is configured by combining the photoelectric switch and the electric micrometer, but a sensor such as a displacement gauge or a roughness meter is used instead of the electric micrometer, and the photoelectric switch is combined with the sensor. Alternatively, the tilt detection device may be configured.
また、実施例では電気マイクロメータの測定値を指示計
にてアナログ表示させているが、ディジタル表示器を使
って表示させるようにしてもよいことは勿論である。Further, in the embodiment, the measured value of the electric micrometer is analog-displayed by the indicator, but it goes without saying that it may be displayed by a digital display.
さらに、上記実施例では、電気マイクロメータを2個使
ってそれを相対的に移動させることによりワークの倒れ
を検出しているが、電気マイクロメータを3個使って測
定を行なうようにしてもよい。Further, in the above embodiment, the tilt of the work is detected by using two electric micrometers and moving them relatively, but the measurement may be performed using three electric micrometers. .
[発明の効果] 以上説明したようにこの発明は、切断刃の位置を2点に
おいて検出するための一対の光電スイッチと、被切断物
の基準面を2カ所以上にて測定する位置センサと、該位
置センサによる測定値を表示する表示手段とを設け、上
記位置センサの検出子の先端を結ぶ線が上記光電スイッ
チの2つの検出光軸を含む面と所定の位置関係を保つよ
うに位置決めされた状態で、上記光電スイッチの2つの
検出光軸を含む面に上記切断刃の位置を合わせた跡、被
切断物の端面を上記位置センサの検出子に当接させて、
その際の当該位置センサからの信号測定に基づいて被切
断物の端面の傾きを検出するようにしたので、ワークの
振れと倒れを別々に測定したり、測定を繰り返す必要が
なくなるとともに表示器に傾きが定量的に表示されるた
め、熟練を要することなく短時間に精度よく被切断物の
基準面の傾きを検出することができるという効果があ
る。[Effects of the Invention] As described above, the present invention has a pair of photoelectric switches for detecting the position of the cutting blade at two points, a position sensor for measuring the reference surface of the object to be cut at two or more points, Display means for displaying the measured value by the position sensor is provided, and the line connecting the tips of the detectors of the position sensor is positioned so as to maintain a predetermined positional relationship with the surface including the two detection optical axes of the photoelectric switch. In a state where the position of the cutting blade is aligned with the surface including the two detection optical axes of the photoelectric switch, the end face of the object to be cut is brought into contact with the detector of the position sensor,
Since the tilt of the end surface of the workpiece is detected based on the signal measurement from the position sensor at that time, it is not necessary to separately measure the shake and tilt of the work, and it is not necessary to repeat the measurement and the display Since the inclination is quantitatively displayed, there is an effect that the inclination of the reference plane of the object to be cut can be detected accurately in a short time without requiring skill.
なお、この発明は切断刃としてワイヤソーを使用した切
断装置に限定されず、バンドソーさらには円板状のブレ
ードを使用し切断装置におけるワークの傾き検出装置に
応用することができる。また、切断されるワークも半導
体結晶体に限定されず、ワークに設けられた基準面に対
して平行もしくは所定の角度をもって切断刃を移動させ
て切断を行なう装置に適用することができる。The present invention is not limited to a cutting device that uses a wire saw as a cutting blade, and can be applied to a band saw and a workpiece inclination detection device in a cutting device that uses a disk-shaped blade. Further, the work to be cut is not limited to the semiconductor crystal body, and can be applied to an apparatus for cutting by moving a cutting blade in parallel or at a predetermined angle with respect to a reference plane provided on the work.
第1図は、本発明に係るワークの傾き検出装置の一実施
例を示す背部の斜視図、 第2図はその傾き検出装置を正面側から見た斜視図、 第3図は傾き検出装置の切断装置への取付方法を示す正
面図、 第4図は本発明に係るワークの傾き検出装置を使った傾
き検出方法を説明するための斜視図、 第5図(A),(B)は従来方式によるワークの振れ検
出方法を示す平面図、 第6図(A),(B)は従来方式によるワークの倒れ検
出方法を示す平面図である。 1……被切断物(ワーク)、2……切断刃(ワイヤ)、
10……傾き検出装置、13……光電スイッチ、15…
…距離センサ(電気マイクロメータ)、15a……検出
子(プローブ)。FIG. 1 is a perspective view of a back portion showing an embodiment of a work inclination detecting apparatus according to the present invention, FIG. 2 is a perspective view of the inclination detecting apparatus seen from the front side, and FIG. FIG. 4 is a front view showing a method of attaching to a cutting device, FIG. 4 is a perspective view for explaining a tilt detecting method using a work tilt detecting device according to the present invention, and FIGS. 5 (A) and 5 (B) are conventional. FIGS. 6 (A) and 6 (B) are plan views showing a method for detecting the shake of a work by the conventional method, and FIGS. 1 ... Object to be cut (workpiece), 2 ... Cutting blade (wire),
10 ... Tilt detection device, 13 ... Photoelectric switch, 15 ...
... distance sensor (electrical micrometer), 15a ... detector (probe).
Claims (1)
の一対の光電スイッチと、2以上の検出子を有し被切断
物の基準面を2カ所以上にて測定する位置センサと、該
位置センサによる測定値を表示する表示手段とを設け、
上記位置センサの検出子の先端同士を結ぶ線が上記光電
スイッチの2つの検出光軸を含む面と所定の位置関係を
保つように位置決めされた状態で、上記光電スイッチの
2つの検出光軸を含む面に上記切断刃の位置を合わせた
後、被切断物の端面を上記位置センサの検出子に当接さ
せて、その際の当該位置センサからの測定信号に基づい
て被切断物の端面の傾きを検出するようにしたことを特
徴とする切断装置における傾き検出方法。1. A pair of photoelectric switches for detecting the position of a cutting blade at two points, a position sensor having two or more detectors for measuring a reference surface of an object to be cut at two or more points, Providing display means for displaying the measured value by the position sensor,
With the line connecting the tips of the detectors of the position sensor positioned so as to maintain a predetermined positional relationship with the surface including the two detection optical axes of the photoelectric switch, the two detection optical axes of the photoelectric switch are After aligning the position of the cutting blade with the surface containing, the end surface of the object to be cut is brought into contact with the detector of the position sensor, and the end surface of the object to be cut based on the measurement signal from the position sensor at that time. A tilt detecting method in a cutting device, wherein the tilt is detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14864987A JPH0626787B2 (en) | 1987-06-15 | 1987-06-15 | Tilt detection method for cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14864987A JPH0626787B2 (en) | 1987-06-15 | 1987-06-15 | Tilt detection method for cutting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63312057A JPS63312057A (en) | 1988-12-20 |
| JPH0626787B2 true JPH0626787B2 (en) | 1994-04-13 |
Family
ID=15457525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14864987A Expired - Lifetime JPH0626787B2 (en) | 1987-06-15 | 1987-06-15 | Tilt detection method for cutting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626787B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2026152A2 (en) | 2007-07-31 | 2009-02-18 | Fanuc Ltd | Machine tool having the function of correcting mounting error through contact detection |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH690907A5 (en) * | 1996-05-23 | 2001-02-28 | Hct Shaping Systems Sa | Wire sawing device |
| JP4797276B2 (en) * | 2001-05-10 | 2011-10-19 | 住友電気工業株式会社 | Cutting method of single crystal ingot |
-
1987
- 1987-06-15 JP JP14864987A patent/JPH0626787B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2026152A2 (en) | 2007-07-31 | 2009-02-18 | Fanuc Ltd | Machine tool having the function of correcting mounting error through contact detection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63312057A (en) | 1988-12-20 |
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