JPH0626912B2 - Thermal recording head - Google Patents
Thermal recording headInfo
- Publication number
- JPH0626912B2 JPH0626912B2 JP60076411A JP7641185A JPH0626912B2 JP H0626912 B2 JPH0626912 B2 JP H0626912B2 JP 60076411 A JP60076411 A JP 60076411A JP 7641185 A JP7641185 A JP 7641185A JP H0626912 B2 JPH0626912 B2 JP H0626912B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- interlayer insulating
- insulating film
- silicon dioxide
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は、二層配線構造よりなる感熱記録ヘッドに係
り、特に保護膜を効率よく形成するに好適な層間絶縁膜
に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal recording head having a two-layer wiring structure, and more particularly to an interlayer insulating film suitable for efficiently forming a protective film.
従来の感熱ヘッドは、例えば日経エレクトロニクス（19
82年９月13日号）の第119頁におよび第２図に示すよう
に発熱抵抗体１の熱による抵抗体層の浮上り防止用の保
護膜３はSiO2／Ta2O5よりなり層間絶縁膜５はポリイミ
ド系樹脂にて形成されていた。しかし、発熱抵抗体１を
押えつける目的の保護膜３を層間絶縁膜５としても用い
る点については配慮されていなかった。尚図中２は第１
配線、４は耐摩耗膜および６は第２配線である。The conventional thermal head is, for example, Nikkei Electronics (19
(September 13, 1982 issue) As shown on page 119 and FIG. 2, the protective film 3 for preventing the resistor layer from floating due to the heat of the heating resistor 1 is made of SiO 2 / Ta 2 O 5 . The interlayer insulating film 5 was made of polyimide resin. However, no consideration was given to the use of the protective film 3 for holding the heating resistor 1 also as the interlayer insulating film 5. In the figure, 2 is the first
The wiring 4 is a wear resistant film, and 6 is a second wiring.
本発明の目的は、保護膜を層間絶縁膜としても用い、ポ
リイミド系樹脂と併用することにより、層間絶縁膜の欠
陥をなくした薄膜感熱ヘッドを提供することにある。It is an object of the present invention to provide a thin film thermal head in which a protective film is also used as an interlayer insulating film and is used in combination with a polyimide resin to eliminate defects in the interlayer insulating film.
本発明は上述の目的を達成するために、保護膜として用
いた二酸化珪素を層間絶縁膜としても用い、ポリイミド
系樹脂と併用することにより相互に欠陥を補いあい無欠
陥の層間絶縁膜を形成するものである。In order to achieve the above-mentioned object, the present invention uses silicon dioxide used as a protective film also as an interlayer insulating film, and by using it together with a polyimide resin, mutually complements defects to form a defect-free interlayer insulating film. It is a thing.
〔発明の実施例〕 以下、本発明の一実施例を第１図により説明する。発熱
抵抗体１及び第１層配線２をパターン形成した後、保護
膜の二酸化珪素３を全面に形成する。発熱抵抗体１の上
部には、記録紙に対する耐摩耗膜としてプラズマ窒化珪
素７を部分的に形成する。層間絶縁膜として用いる二酸
化珪素３は、エッチングによるスルーホールを形成す
る。その上に更にポリイミド系樹脂を塗布し、発熱抵抗
体１上及び二酸化珪素３のスルーホール部をエッチング
にて除去する。スルーホール部の形状は、二酸化珪素３
に対してポリイミド系樹脂５を小さくすることにより二
酸化珪素３のスルーホール部テーパーが形成されない場
合にもポリイミド系樹脂５にて被覆され第二層配線６の
段切れ防止に効果がある。[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIG. After patterning the heating resistor 1 and the first layer wiring 2, the silicon dioxide 3 as a protective film is formed on the entire surface. On the upper part of the heating resistor 1, a plasma silicon nitride 7 is partially formed as an abrasion resistant film for the recording paper. Silicon dioxide 3 used as an interlayer insulating film forms a through hole by etching. A polyimide resin is further applied thereon, and the heating resistor 1 and the through-holes of the silicon dioxide 3 are removed by etching. The shape of the through hole is silicon dioxide 3
On the other hand, by making the polyimide resin 5 small, even if the through-hole taper of the silicon dioxide 3 is not formed, it is covered with the polyimide resin 5 and is effective in preventing disconnection of the second layer wiring 6.
耐摩耗膜のプラズマ窒化珪素７は、二酸化珪素３のスル
ーホール形成後に行なうことも可能である。The plasma silicon nitride 7 of the abrasion resistant film can be formed after the through holes of the silicon dioxide 3 are formed.
本実施例によれば、エッチング性の悪い膜質の二酸化珪
素でも層間絶縁膜として用いることができる効果があ
る。又、大面積の層間絶縁膜を二層構造にすることによ
り無欠陥で形成できる効果がある。According to this embodiment, there is an effect that even silicon dioxide having a poor etching property can be used as an interlayer insulating film. In addition, the large-area interlayer insulating film having a two-layer structure has an effect that it can be formed without defects.
本発明によれば、第１に層間絶縁膜のポリイミド系樹脂
の膜厚を従来の1/2にすることができるので、材料費の
低減ができる。第２に、層間絶縁膜を二層構造にするこ
とにより相互に欠陥を補いあい層間絶縁膜の欠陥を無く
すことができる。第３に、耐摩耗膜に硬い珪化珪素を用
いることにより保護膜と耐摩耗膜の膜厚を減少し、発熱
抵抗体からの熱効率の向上により、印画特性が向上し発
熱抵抗体への印加電力の低減に効果がある。According to the present invention, firstly, the film thickness of the polyimide resin of the interlayer insulating film can be halved as compared with the conventional one, so that the material cost can be reduced. Secondly, by forming the interlayer insulating film in a two-layer structure, the defects can be complemented each other and the defects in the interlayer insulating film can be eliminated. Thirdly, by using hard silicon silicide for the abrasion resistant film, the thickness of the protective film and the abrasion resistant film is reduced, and the thermal efficiency from the heating resistor is improved, so that the printing characteristics are improved and the power applied to the heating resistor is improved. Is effective in reducing
第１図は本発明の薄膜感熱ヘッドの一例を示す縦断面
図、第２図は、従来の薄膜感熱ヘッドの縦断面図であ
る。 １……発熱抵抗体、２……第一層配線 ３……保護膜、４……耐摩耗膜 ５……層間絶縁膜、６……第二層配線 ７……プラズマ窒化珪素FIG. 1 is a vertical sectional view showing an example of the thin film thermal head of the present invention, and FIG. 2 is a vertical sectional view of a conventional thin film thermal head. 1 ... Heating resistor, 2 ... First layer wiring 3 ... Protective film, 4 ... Wear resistant film 5 ... Interlayer insulating film, 6 ... Second layer wiring 7 ... Plasma silicon nitride
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭54−161344（ＪＰ，Ａ) 特開 昭60−217171（ＪＰ，Ａ) 特開 昭60−217172（ＪＰ，Ａ) 特開 昭59−225973（ＪＰ，Ａ) 特開 昭59−179365（ＪＰ，Ａ) 特開 昭57−152968（ＪＰ，Ａ) ─────────────────────────────────────────────────── --- Continuation of the front page (56) Reference JP-A-54-161344 (JP, A) JP-A-60-217171 (JP, A) JP-A-60-217172 (JP, A) JP-A-59- 225973 (JP, A) JP 59-179365 (JP, A) JP 57-152968 (JP, A)
Claims (1)
い二酸化珪素とプラズマ窒化珪素の二層膜を用い、前記
保護膜を形成する二酸化珪素膜とポリイミド樹脂膜とを
もって層間絶縁膜を二層構造化したことを特徴とする感
熱記録ヘッド。1. A double-layer film of silicon dioxide and plasma silicon nitride having a large compressive stress is used as a protective film for a heating resistor, and a two-layer interlayer insulating film is formed with a silicon dioxide film and a polyimide resin film forming the protective film. A thermal recording head characterized by being structured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60076411A JPH0626912B2 (en) | 1985-04-12 | 1985-04-12 | Thermal recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60076411A JPH0626912B2 (en) | 1985-04-12 | 1985-04-12 | Thermal recording head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61235164A JPS61235164A (en) | 1986-10-20 |
| JPH0626912B2 true JPH0626912B2 (en) | 1994-04-13 |
Family
ID=13604492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60076411A Expired - Lifetime JPH0626912B2 (en) | 1985-04-12 | 1985-04-12 | Thermal recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626912B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57152968A (en) * | 1981-03-19 | 1982-09-21 | Ricoh Co Ltd | Manufacture of thermal head |
| JPS59179365A (en) * | 1983-03-31 | 1984-10-11 | Oki Electric Ind Co Ltd | Manufacture of protective film on thermal head heating element |
| JPS59225973A (en) * | 1983-06-08 | 1984-12-19 | Hitachi Ltd | thermal head |
-
1985
- 1985-04-12 JP JP60076411A patent/JPH0626912B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61235164A (en) | 1986-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0466705B2 (en) | ||
| JPH0626912B2 (en) | Thermal recording head | |
| JP2579389B2 (en) | Thermal head | |
| JP2728989B2 (en) | Thermal head | |
| JP2758738B2 (en) | Thermal head | |
| JPH03219967A (en) | Thermal head | |
| JPS6295245A (en) | Thermal head | |
| JP2006326936A (en) | Electronic device, thermal head, and manufacturing method thereof | |
| JPS62105645A (en) | Structure of thermal head | |
| JP2617246B2 (en) | Manufacturing method of thermal head | |
| JPH06340103A (en) | Thermal head | |
| JPS61290067A (en) | Thermal head | |
| JPH0546916Y2 (en) | ||
| JP2584332Y2 (en) | Thermal print head | |
| JPH05305719A (en) | Thermal head | |
| JP3103107B2 (en) | Recording head | |
| JPH0636924Y2 (en) | Thermal head | |
| JPS62162564A (en) | Manufacture of thermal head | |
| JPH0258941U (en) | ||
| JPS62184863A (en) | Thermal head | |
| JPH0124076B2 (en) | ||
| JPS58220770A (en) | Thin film-type thermal head | |
| JPH02220855A (en) | Thermal head | |
| JPS60109862A (en) | thermal head | |
| JPH068051B2 (en) | Method of manufacturing thermal print head |