JPH0629359B2 - Sealing resin composition - Google Patents
Sealing resin compositionInfo
- Publication number
- JPH0629359B2 JPH0629359B2 JP25386286A JP25386286A JPH0629359B2 JP H0629359 B2 JPH0629359 B2 JP H0629359B2 JP 25386286 A JP25386286 A JP 25386286A JP 25386286 A JP25386286 A JP 25386286A JP H0629359 B2 JPH0629359 B2 JP H0629359B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- silica powder
- present
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title claims description 18
- 238000007789 sealing Methods 0.000 title description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 11
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 9
- 239000005011 phenolic resin Substances 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 7
- 239000012778 molding material Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、耐湿性、半田耐熱性に優れた、封止用樹脂組
成物に関する。Detailed description of the invention [Industrial application] The present invention relates to a sealing resin composition having excellent moisture resistance and solder heat resistance.
（従来の技術） 近年、半導体集積回路の分野において、高集積化、高信
頼性化の技術開発と同時に半導体装置の組立工程の自動
化が推進されている。例えばフラットパッケージ型の半
導体装置を回路基板に取り付ける場合、従来はリードピ
ン毎に半田付けを行っていたが、最近は半導体装置全体
を250℃以上に加熱した半田浴に浸漬して半田付けを行
う方法が採用されている。(Prior Art) In recent years, in the field of semiconductor integrated circuits, automation of assembly process of semiconductor devices has been promoted at the same time as technological development of high integration and high reliability. For example, when mounting a flat package type semiconductor device to a circuit board, conventionally, soldering was performed for each lead pin, but recently, a method of dipping the entire semiconductor device in a solder bath heated to 250 ° C or higher for soldering is performed. Has been adopted.
（発明が解決しようとする問題点） しかし、従来のエポキシ樹脂、ノボラック型フェノール
樹脂およびシリカ粉末からなる樹脂組成物で封止した半
導体装置は、装置全体の半田浴浸漬を行うと耐湿性が低
下するという欠点があった。特に吸湿した半導体装置を
半田浸漬すると封止用樹脂と半導体チップおよびリード
フレームとの間に剥がれが生じ、著しい耐湿性劣化を生
じ、電極の腐食による断線や水分によるリーク電流を生
じ、長期間の信頼性を保証することができないという欠
点がある。このため、吸湿の影響が少なく、半導体装置
全体の半田浴浸漬をしても耐湿性劣化の少ない封止用樹
脂の開発が強く要望されていた。本発明はこの欠点を解
消し、要望に応えるためになされたもので、吸湿の影響
が少なく、特に半田浸漬後の耐湿性および半田耐熱性に
優れた封止用樹脂組成物を提供することを目的としてい
る。(Problems to be Solved by the Invention) However, a semiconductor device sealed with a conventional resin composition composed of an epoxy resin, a novolac-type phenol resin, and silica powder has reduced moisture resistance when the entire device is immersed in a solder bath. There was a drawback to do. In particular, when a semiconductor device that has absorbed moisture is dipped in solder, peeling occurs between the encapsulating resin and the semiconductor chip and lead frame, causing significant deterioration in moisture resistance, causing wire breakage due to electrode corrosion and leak current due to moisture, and The drawback is that reliability cannot be guaranteed. Therefore, there has been a strong demand for the development of a sealing resin that is less affected by moisture absorption and has less moisture resistance deterioration even when the entire semiconductor device is immersed in a solder bath. The present invention has been made in order to solve this drawback and to meet the demand, has little influence of moisture absorption, and particularly provides a sealing resin composition having excellent moisture resistance after solder immersion and solder heat resistance. Has an aim.
［発明の構成］ （問題点を解決するための手段と作用） 本発明者らは、上記の目的を達成しようと鋭意研究を重
ねた結果、両末端に水酸基を有するジシクロペンタジエ
ン重合体を配合すれば耐湿性および半田耐熱性が向上す
ること見いだし、本発明を完成したものである。即ち、
本発明は、 （Ａ）エポキシ樹脂 （Ｂ）ノボラック型フェノール樹脂 （Ｃ）一般式（Ｉ）で示される両末端に水酸基を有する
ジシクロペンタジエン重合体および （但し、式中ｎは１以上の整数を表す） （Ｄ）シリカ粉末 を必須成分とし、樹脂組成物に対して前記（Ｃ）の両末
端に水酸基を有するジシクロペンタジエン重合体を0.1
〜10重量％、また前記（Ｄ）のシリカ粉末を68〜85重量
％それぞれ含有することを特徴とする封止用樹脂組成物
である。[Structure of the Invention] (Means and Actions for Solving Problems) As a result of intensive studies to achieve the above-mentioned object, the present inventors have blended a dicyclopentadiene polymer having hydroxyl groups at both ends. It was found that the moisture resistance and solder heat resistance are improved by doing so, and the present invention has been completed. That is,
The present invention provides (A) an epoxy resin, (B) a novolac type phenol resin, (C) a dicyclopentadiene polymer represented by the general formula (I) and having a hydroxyl group at both ends, and (In the formula, n represents an integer of 1 or more.) (D) Silica powder is an essential component, and 0.1 parts of dicyclopentadiene polymer having hydroxyl groups at both ends of (C) is added to the resin composition.
The resin composition for sealing is characterized by containing ˜10 wt% and 68 to 85 wt% of the silica powder (D).
本発明に使用する（Ａ）エポキシ樹脂は、その分子中に
エポキシ基を少なくとも２個有する化合物である限り、
分子構造、分子量などに特に制限はなく、一般に使用さ
れているものを広く包含することができる。例えばビス
フェノール型の芳香族系、シクロヘキサン誘導体の脂環
族系、さらに次の一般式で示されるエポキシノボラック
系等の樹脂が挙げられる。As long as the (A) epoxy resin used in the present invention is a compound having at least two epoxy groups in its molecule,
There is no particular limitation on the molecular structure, the molecular weight, etc., and generally used ones can be widely included. Examples thereof include bisphenol type aromatic resins, cyclohexane derivative alicyclic resins, and epoxy novolac resins represented by the following general formula.
（式中、Ｒ１は水素原子、ハロゲン原子又はアルキル基
を、Ｒ２は水素原子又はアルキル基を、ｎは１以上の整
数をそれぞれ表す）。これらのエポキシ樹脂は単独又は
２種以上混合して用いることができる。 (In the formula, R 1 represents a hydrogen atom, a halogen atom or an alkyl group, R 2 represents a hydrogen atom or an alkyl group, and n represents an integer of 1 or more, respectively). These epoxy resins can be used alone or in combination of two or more.
本発明に用いる（Ｂ）ノボラック型フェノール樹脂とし
ては、フェノール、アルキルフェノール等のフェノール
類と、ホルムアルデヒドあるいはパラホルムアルデヒド
とを反応させて得られるノボラック型フェノール樹脂お
よびこれらの変性樹脂、例えばエポキシ化もしくはブチ
ル化ノボラック型フェノール樹脂、シリコーン変性フェ
ノール樹脂等が挙げられ、ノボラック型フェノール樹脂
である限り特に制限はなく広く使用することができる。
そしてこれらのノボラック型フェノール樹脂は、単独も
しくは２種以上混合して用いることができる。Examples of the (B) novolak type phenol resin used in the present invention include novolak type phenol resins obtained by reacting phenols such as phenol and alkylphenol with formaldehyde or paraformaldehyde, and modified resins thereof, for example, epoxidized or butylated. Examples thereof include novolac type phenolic resins and silicone-modified phenolic resins. As long as they are novolac type phenolic resins, they are not particularly limited and can be widely used.
And these novolak type phenol resins can be used individually or in mixture of 2 or more types.
本発明に用いる（Ｃ）両末端に水酸基を有するジシクロ
ペンタジエン重合体は一般式（Ｉ）を有するもので （但し、式中ｎは１以上の整数を表す）ジシクロペンタ
ジエンを自己重合させることにより得られるものであ
り、またその基本骨格を有するいずれの誘導体でもよ
く、従って本発明でいう該重合体には広くそれらの誘導
体を包含する。このジシクロペンタジエン重合体の配合
割合は、樹脂組成物に対して0.1〜10重量％含有するこ
とが望ましい。配合割合が0.1重量％未満では半田浸漬
後の耐湿性に効果なく、また10重量％を超えると成形性
が悪くなり実用に適さない。The dicyclopentadiene polymer (C) having hydroxyl groups at both ends used in the present invention has the general formula (I). (In the formula, n represents an integer of 1 or more) It is obtained by self-polymerizing dicyclopentadiene, and may be any derivative having a basic skeleton thereof. Broadly include their derivatives. The compounding ratio of this dicyclopentadiene polymer is preferably 0.1 to 10% by weight based on the resin composition. If the blending ratio is less than 0.1% by weight, the moisture resistance after solder immersion is not effective, and if it exceeds 10% by weight, the moldability is deteriorated and it is not suitable for practical use.
本発明の封止用樹脂組成物において、両末端に水酸基を
有するジシクロペンタジエン重合体を配合することによ
って、樹脂組成物と半導体チップとの密着性および樹脂
組成物とリードフレームとの密着性が向上する上、樹脂
組成物に柔軟性を付与し応力を緩和し低応力になると考
えられるため、半田浴に浸漬しても耐湿性劣化が少ない
という効果がある。In the encapsulating resin composition of the present invention, by incorporating a dicyclopentadiene polymer having a hydroxyl group at both ends, the adhesiveness between the resin composition and the semiconductor chip and the adhesiveness between the resin composition and the lead frame are improved. In addition to the improvement, it is considered that flexibility is imparted to the resin composition to relieve stress, resulting in low stress. Therefore, even if the resin composition is immersed in a solder bath, there is little deterioration in moisture resistance.
本発明に用いる（Ｄ）シリカ粉末としては、一般に市販
されているものが使用されるが、それらの中でも不純物
濃度が低く、平均粒径が30μｍ以下のものが好ましい。
平均粒径が30μｍを超えると耐湿性および成形性が悪く
好ましくない。As the (D) silica powder used in the present invention, those commercially available are generally used, and among them, those having a low impurity concentration and an average particle diameter of 30 μm or less are preferable.
If the average particle size exceeds 30 μm, the moisture resistance and moldability are poor, which is not preferable.
シリカ粉末の配合割合は、樹脂組成物に対して68〜85重
量％含有することが好ましい。配合割合が68重量％未満
では樹脂組成物の吸湿量が高く、半田浸漬後の耐湿性に
劣り好ましくない。また85重量％を超えると極端に流動
性が悪く、成形性に劣り好ましくない。従って上記範囲
内に限定される。The content of silica powder is preferably 68 to 85% by weight based on the resin composition. If the blending ratio is less than 68% by weight, the resin composition has a high moisture absorption amount and is inferior in moisture resistance after solder immersion, which is not preferable. On the other hand, if it exceeds 85% by weight, the fluidity is extremely poor and the moldability is poor, which is not preferable. Therefore, it is limited to the above range.
本発明の封止用樹脂組成物は、エポキシ樹脂、ノボラッ
ク型フェノール樹脂、両末端に水酸基を有するジシクロ
ペンタジエン重合体およびシリカ粉末を必須成分とする
が、必要に応じて、例えば天然ワックス類、合成ワック
ス類、直鎖脂肪酸の金属塩、酸アミド、エステル類、パ
ラフィンなどの離型剤、三酸化アンチモンなどの難燃
剤、カーボンブラックなどの着色剤、シランカップリン
グ剤、種々の硬化促進剤等を適宜添加・配合することが
できる。The encapsulating resin composition of the present invention contains an epoxy resin, a novolac type phenolic resin, a dicyclopentadiene polymer having hydroxyl groups at both ends and silica powder as essential components, but if necessary, for example, natural waxes, Synthetic waxes, metal salts of linear fatty acids, acid amides, esters, releasing agents such as paraffin, flame retardants such as antimony trioxide, colorants such as carbon black, silane coupling agents, various curing accelerators, etc. Can be appropriately added and blended.
本発明の封止用樹脂組成物を成形材料として調製する場
合の一般的方法は、エポキシ樹脂、ノボラック型フェノ
ール樹脂、両末端に水酸基を有するジシクロペンタジエ
ン重合体、シリカ粉末、その他を配合し、ミキサー等に
よって十分均一に混合した後、更に熱ロールによる溶融
混合処理又はニーダ等による混合処理を行い、次いで冷
却固化させ適当な大きさに粉砕して成形材料とすること
ができる。そして、この成形材料を電子部品あるいは電
気部品の封止、被覆、絶縁等に適用し、優れた特性と信
頼性を付与することができる。A general method for preparing the encapsulating resin composition of the present invention as a molding material is to blend an epoxy resin, a novolac type phenol resin, a dicyclopentadiene polymer having a hydroxyl group at both ends, silica powder, and the like, After sufficiently uniformly mixing with a mixer or the like, melt mixing treatment with a hot roll or mixing treatment with a kneader or the like is further performed, followed by cooling and solidifying and pulverizing to an appropriate size to obtain a molding material. Then, this molding material can be applied to the sealing, coating, insulation, etc. of electronic components or electric components to impart excellent characteristics and reliability.
（実施例） 以下発明の実施例を比較例とともに説明するが、本発明
は以下の実施例に限定されるものではない。以下におい
て「％」とは「重量％」を意味するものとする。(Examples) Examples of the present invention will be described together with comparative examples, but the present invention is not limited to the following examples. In the following, “%” means “% by weight”.
実施例 クレゾールノボラックエポキシ樹脂（エポキシ当量21
5）18％、ノボラック型フェノール樹脂（フェノール当
量107）８％、両末端に水酸基を有するジシクロペンタ
ジエン重合体２％、シリカ粉末71％、硬化促進剤0.3
％、エステル系ワックス0.3％およびシランカップリン
グ剤0.4％を常温で混合し、さらに90〜95℃で混練し冷
却した後、粉砕して成形材料を得た。得られた成形材料
を170℃に加熱した金型内にトランスファー注入し、硬
化させて封止した成形品を得た。この成形品について歪
試験、ガラス転移温度および耐湿性を試験したのでその
結果を第１表に示した。本発明の顕著な効果が認められ
た。Example Cresol novolac epoxy resin (epoxy equivalent 21
5) 18%, novolac type phenol resin (phenol equivalent 107) 8%, dicyclopentadiene polymer having hydroxyl groups at both ends 2%, silica powder 71%, curing accelerator 0.3
%, Ester wax 0.3% and silane coupling agent 0.4% were mixed at room temperature, further kneaded at 90 to 95 ° C., cooled, and then pulverized to obtain a molding material. The obtained molding material was transfer-injected into a mold heated to 170 ° C. and cured to obtain a sealed molding. The molded product was tested for strain test, glass transition temperature and moisture resistance. The results are shown in Table 1. The remarkable effect of the present invention was recognized.
比較例 クレゾールノボラックエポキシ樹脂（エポキシ当量21
5）19％、ノボラック型フェノール樹脂（フェノール当
量107）９％、およびシリカ粉末71％、硬化促進剤0.3
％、エステル系ワックス0.3％およびシランカップリン
グ剤0.4％を混合し、実施例と同様にして成形材料およ
び成形品を得た。得られた成形品について実施例と同様
にして諸実験を行ったのでその結果を第１表に示した。Comparative Example Cresol novolac epoxy resin (epoxy equivalent 21
5) 19%, novolac type phenolic resin (phenol equivalent 107) 9%, and silica powder 71%, curing accelerator 0.3
%, An ester wax 0.3% and a silane coupling agent 0.4% were mixed, and a molding material and a molded product were obtained in the same manner as in the example. Various experiments were conducted on the obtained molded product in the same manner as in the example, and the results are shown in Table 1.
［発明の効果］ 本発明の封止用樹脂組成物は、密着性が良く、かつ低応
力であり、半田浴に浸漬した後でも耐湿性に優れ、電極
の腐食による断線や水分によるリーク電流の発生などを
著しく低減することができ、しかも長期間にわたって信
頼性を保証することができる。また250℃以上の半田浴
浸漬にもかかわらず優れた耐熱性を示した。 [Effects of the Invention] The encapsulating resin composition of the present invention has good adhesiveness and low stress, has excellent moisture resistance even after being immersed in a solder bath, and is resistant to disconnection due to electrode corrosion and leakage current due to moisture. It is possible to significantly reduce the occurrence and the like, and it is possible to guarantee the reliability for a long period of time. It also showed excellent heat resistance despite immersion in a solder bath at 250 ° C or higher.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/31 (56)参考文献 特開 昭61−89247（ＪＰ，Ａ) 特開 昭61−4721（ＪＰ，Ａ) 特公 昭60−3340（ＪＰ，Ｂ２)─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Internal reference number FI Technical display location H01L 23/31 (56) Reference JP-A-61-89247 (JP, A) JP-A-61- 4721 (JP, A) Japanese Patent Sho 60-3340 (JP, B2)
Claims (1)
ジシクロペンタジエン重合体および （但し、式中ｎは１以上の整数を表す） （Ｄ）シリカ粉末 を必須成分とし、樹脂組成物に対して前記（Ｃ）の両末
端に水酸基を有するジシクロペンタジエン重合体を0.1
〜10重量％、また前記（Ｄ）のシリカ粉末を68〜85重量
％含有することを特徴とする封止用樹脂組成物。1. (A) Epoxy resin (B) Novolac type phenolic resin (C) Dicyclopentadiene polymer having hydroxyl groups at both terminals, represented by the general formula (I), and (In the formula, n represents an integer of 1 or more.) (D) Silica powder is an essential component, and 0.1 parts of dicyclopentadiene polymer having hydroxyl groups at both ends of (C) is added to the resin composition.
-10% by weight, and 68 to 85% by weight of the silica powder (D) described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25386286A JPH0629359B2 (en) | 1986-10-27 | 1986-10-27 | Sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25386286A JPH0629359B2 (en) | 1986-10-27 | 1986-10-27 | Sealing resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63110213A JPS63110213A (en) | 1988-05-14 |
| JPH0629359B2 true JPH0629359B2 (en) | 1994-04-20 |
Family
ID=17257161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25386286A Expired - Lifetime JPH0629359B2 (en) | 1986-10-27 | 1986-10-27 | Sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0629359B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998015595A1 (en) * | 1996-10-09 | 1998-04-16 | Nippon Zeon Co., Ltd. | Norbornene polymer composition |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2808187B2 (en) * | 1989-12-20 | 1998-10-08 | 日本石油株式会社 | Novel resin, method for producing the same, and composition containing the resin |
-
1986
- 1986-10-27 JP JP25386286A patent/JPH0629359B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998015595A1 (en) * | 1996-10-09 | 1998-04-16 | Nippon Zeon Co., Ltd. | Norbornene polymer composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63110213A (en) | 1988-05-14 |
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