JPH0630795B2 - Treatment method of water supply treatment device - Google Patents
Treatment method of water supply treatment deviceInfo
- Publication number
- JPH0630795B2 JPH0630795B2 JP60276119A JP27611985A JPH0630795B2 JP H0630795 B2 JPH0630795 B2 JP H0630795B2 JP 60276119 A JP60276119 A JP 60276119A JP 27611985 A JP27611985 A JP 27611985A JP H0630795 B2 JPH0630795 B2 JP H0630795B2
- Authority
- JP
- Japan
- Prior art keywords
- ultrafiltration membrane
- membrane device
- water
- treatment
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 82
- 238000011282 treatment Methods 0.000 title claims description 55
- 238000000034 method Methods 0.000 title claims description 11
- 239000012528 membrane Substances 0.000 claims description 74
- 238000000108 ultra-filtration Methods 0.000 claims description 68
- 230000001954 sterilising effect Effects 0.000 claims description 39
- 238000004659 sterilization and disinfection Methods 0.000 claims description 36
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 17
- 239000012498 ultrapure water Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000011221 initial treatment Methods 0.000 claims description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 27
- 238000004140 cleaning Methods 0.000 description 14
- 239000012535 impurity Substances 0.000 description 12
- 230000014759 maintenance of location Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 239000010419 fine particle Substances 0.000 description 7
- 241000894006 Bacteria Species 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000012466 permeate Substances 0.000 description 4
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000001223 reverse osmosis Methods 0.000 description 3
- 239000003957 anion exchange resin Substances 0.000 description 2
- 239000003729 cation exchange resin Substances 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001112 coagulating effect Effects 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 filtration Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001471 micro-filtration Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
- Treatment Of Water By Ion Exchange (AREA)
- Physical Water Treatments (AREA)
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明はＬＳＩや超ＬＳＩを生産する電子工業におい
て、その中間製品である半導体ウエハーまたはチップ
（以下半導体ウエハーという。）の洗浄用の超純水を製
造する給水処理装置の処理方法に関するものであり、特
に原水を凝集沈澱，濾過，活性炭処理，逆浸透膜処理，
イオン交換処理，精密濾過，紫外線照射処理等を組み合
わせた一次処理系の装置によって処理して得られる純水
を、末端においてさらに処理していわゆる超純水を製造
する限外濾過膜（ＵＦ膜）装置を含む給水処理装置の処
理方法に関するのもである。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention is an ultrapure semiconductor for cleaning an intermediate product such as a semiconductor wafer or a chip (hereinafter referred to as a semiconductor wafer) in the electronic industry that produces an LSI or a VLSI. The present invention relates to a treatment method of a water supply treatment device for producing water, and particularly to coagulation and sedimentation of raw water, filtration, activated carbon treatment, reverse osmosis membrane treatment,
Ultrafiltration membrane (UF membrane) for producing so-called ultrapure water by further treating at the terminal end pure water obtained by treatment with an apparatus of a primary treatment system that combines ion exchange treatment, microfiltration, ultraviolet irradiation treatment, etc. The present invention also relates to a method of treating a water supply treatment device including the device.
〈従来の技術〉 ＬＳＩや超ＬＳＩを生産する電子工業においては、その
中間製品である半導体ウエハーの洗浄にあたり、その歩
留りを向上するために、イオンの量および微粒子の量を
ｐｐｂオーダーまで減少させるだけでなく、生菌数を１
０-1個／mlまで減少させた、いわゆる超純水を必要とす
る。<Prior Art> In the electronic industry that produces LSIs and VLSIs, in cleaning semiconductor wafers, which are intermediate products, in order to improve the yield, simply reduce the amount of ions and the amount of fine particles to the ppb order. Not the viable count
So-called ultrapure water reduced to 0 -1 pieces / ml is required.
したがって従来ではかかる超純水を製造するにあたり、
原水を凝集沈澱装置，砂濾過機，活性炭濾過機，逆浸透
膜装置，２床３塔式純水製造装置，紫外線照射装置，混
床式ポリシャー等を組み合わせた一次処理系で処理して
可能なかぎり高純度の純水を製造し、そして半導体ウエ
ハーを洗浄する直前で当該純水をさらに限外濾過膜装置
で処理し、いわゆる超純水を得、洗浄水として供してい
る。Therefore, in the conventional production of such ultrapure water,
It is possible by treating the raw water with a primary treatment system that combines a coagulating sedimentation device, a sand filter, an activated carbon filter, a reverse osmosis membrane device, a 2-bed 3-tower pure water production device, an ultraviolet irradiation device, a mixed-bed polisher, etc. As far as possible, pure water of high purity is produced, and immediately before cleaning the semiconductor wafer, the pure water is further processed by an ultrafiltration membrane device to obtain so-called ultrapure water, which is used as cleaning water.
〈従来技術の問題点〉 しかしながら限外濾過膜装置はその構造上、細菌が発生
し易く、したがって定期的に殺菌処理を実施する必要が
ある。<Problems of Prior Art> However, due to the structure of the ultrafiltration membrane device, bacteria are likely to be generated, and therefore, it is necessary to regularly perform sterilization treatment.
当該殺菌処理は通常一週間に１回、熱水あるいは0.5〜
１％の過酸化水素溶液で、限外濾過膜装置を洗浄するも
のであるが、このような殺菌処理を実施しないと、限外
濾過膜装置から多量の生菌が漏洩することとなり、した
がって半導体ウエハーを洗浄する直前で限外濾過膜装置
を用いるかぎり、当該殺菌処理を省略することができな
い。The sterilization is usually performed once a week with hot water or 0.5-
Although the ultrafiltration membrane device is washed with a 1% hydrogen peroxide solution, if such a sterilization treatment is not performed, a large amount of viable bacteria will leak from the ultrafiltration membrane device. The sterilization process cannot be omitted unless the ultrafiltration membrane device is used immediately before cleaning the wafer.
ところがこのような殺菌処理をすると、処理直後の透過
水に不純物が漏洩し、透過水の比抵抗値が低下する。し
たがって殺菌処理後に多量の純水で洗浄せねばならない
が、当該純水は前述したごとく種々の装置によって高コ
ストをかけて製造した純水であり、これを限外濾過膜装
置の洗浄のために多量に用いることは甚だ不経済であ
る。However, such a sterilization treatment causes impurities to leak into the permeated water immediately after the treatment, which lowers the specific resistance value of the permeated water. Therefore, it must be washed with a large amount of pure water after the sterilization treatment, but the pure water is a pure water produced at high cost by various devices as described above, and is used for cleaning the ultrafiltration membrane device. It is very uneconomical to use a large amount.
〈発明の目的〉 本発明は限外濾過膜装置の殺菌処理を実施してもその処
理水に不純物を全く漏洩させずかつ洗浄用の純水を可及
的少量とすることを目的とするものである。<Object of the Invention> The present invention is intended to prevent impurities from leaking to the treated water at all even when the sterilization treatment of the ultrafiltration membrane device is performed, and to make the amount of pure water for cleaning as small as possible. Is.
〈問題点を解決する手段〉 本発明は一次処理系で処理された純水を前段の限外濾過
膜装置で処理して、その透過水を次いで紫外線照射装
置、カチオン交換樹脂とアニオン交換樹脂を用いる混床
式ポリシャーで処理し、次いで再び後段の限外濾過膜装
置で処理することにより超純水を得ることを基本フロー
とし、当該限外濾過膜装置の殺菌処理に関しては、後段
の限外濾過膜装置のみを殺菌処理し、さらに殺菌処理を
終了した限外濾過膜装置を前記基本フローに復帰させる
際には前段の限外濾過膜装置として用いることを特徴と
するものである。<Means for Solving Problems> The present invention treats pure water treated in a primary treatment system with an ultrafiltration membrane device in the preceding stage, and the permeated water is then treated with an ultraviolet irradiation device, a cation exchange resin and an anion exchange resin. The basic flow is to obtain ultrapure water by treating with the mixed bed polisher used and then again with the ultrafiltration membrane device in the latter stage. It is characterized in that when only the filtration membrane device is sterilized, and when the sterilization-treated ultrafiltration membrane device is returned to the basic flow, it is used as a preceding stage ultrafiltration membrane device.
以下に本発明の実施態様を殺菌処理に過酸化水素溶液を
用いる場合を例にして図面を用いて詳細に説明する。Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings by taking an example of using a hydrogen peroxide solution for sterilization treatment.
図面は本発明の実施態様の一例を示すフローの説明図で
あり、１は第１限外濾過膜装置、２は第２限外濾過膜装
置、３は滞留槽、４は紫外線照射装置、５は混床式ポリ
シャーを示す。The drawings are explanatory views of a flow showing an example of an embodiment of the present invention, in which 1 is a first ultrafiltration membrane device, 2 is a second ultrafiltration membrane device, 3 is a retention tank, 4 is an ultraviolet irradiation device, 5 Indicates a mixed bed polisher.
まず本発明における超純水の製造工程を説明すると、一
次処理系から供給される純水６をポンプ７で加圧して弁
８を介して殺菌処理後の第１限外濾過膜装置１に供給
し、ここで純水６中に含まれている微粒子，細菌等を除
去し、その透過水を弁９、配管１０を介して滞留槽３に
送水する。一方非透過水１１は一次処理系に循環回収す
る。First, the process for producing ultrapure water in the present invention will be described. Pure water 6 supplied from the primary treatment system is pressurized by a pump 7 and supplied to the first ultrafiltration membrane device 1 after sterilization treatment via a valve 8. Then, fine particles, bacteria and the like contained in the pure water 6 are removed here, and the permeated water is sent to the retention tank 3 through the valve 9 and the pipe 10. On the other hand, the non-permeate water 11 is circulated and collected in the primary treatment system.
次いで滞留槽３内の透過水をポンプ１２により紫外線照
射装置４に供給する。なお滞留槽３を設置しない場合
は、第１限外濾過膜装置１の透過水を直接紫外線照射装
置４に供給することになる。Next, the permeated water in the retention tank 3 is supplied to the ultraviolet irradiation device 4 by the pump 12. When the retention tank 3 is not installed, the permeated water of the first ultrafiltration membrane device 1 is directly supplied to the ultraviolet irradiation device 4.
第１限外濾過膜装置１は後述する殺菌工程で述べるごと
く過酸化水素溶液で殺菌処理した直後のものなので、そ
の透過水に微量の不純物が含まれ、かつ比抵抗値が低下
しており、さらに微量の過酸化水素が含まれている場合
があるが、当該透過水を紫外線照射装置４で紫外線処理
することにより当該残留する過酸化水素を分解除去する
ことができ、また比抵抗を低下させる原因物質のうち一
部の有機性不純物を分解除去することができる。Since the first ultrafiltration membrane device 1 is one immediately after being sterilized with a hydrogen peroxide solution as described in the sterilization step described later, its permeated water contains a trace amount of impurities and has a low specific resistance value. Further, although a small amount of hydrogen peroxide may be contained, the residual hydrogen peroxide can be decomposed and removed by subjecting the permeated water to ultraviolet treatment by the ultraviolet irradiation device 4, and the specific resistance can be lowered. It is possible to decompose and remove some organic impurities of the causative substance.
このような紫外線処理後の処理水を次いで混床式ポリシ
ャー５で処理する。The treated water after such ultraviolet treatment is then treated with the mixed bed polisher 5.
本発明では紫外線照射後に混床式ポリシャー５で処理す
るので、比抵抗を低下させる原因となる不純物を完全に
除去することができ、ここで極限値まで比抵抗値を上昇
させることができる。In the present invention, since the mixed bed polisher 5 is used for the treatment after the irradiation with ultraviolet rays, it is possible to completely remove the impurities that cause the decrease in the specific resistance, and the specific resistance can be increased to the limit here.
本発明に用いる混床式ポリシャー５は、充分に再生され
たＨ形カチオン交換樹脂とＯＨ形アニオン交換樹脂の混
合樹脂を充填した再生機構を有していない、いわゆる混
床式カートリッジを用いるが、再生機構を有する通常の
混床式ポリシャーを用いても差し支えない。The mixed bed type polisher 5 used in the present invention uses a so-called mixed bed type cartridge having no regeneration mechanism filled with a sufficiently regenerated mixed resin of an H type cation exchange resin and an OH type anion exchange resin. An ordinary mixed bed polisher having a regeneration mechanism may be used.
次いで当該混床式ポリシャー５の処理水をポンプ１３に
より加圧し、弁１４を介して第２限外濾過膜装置２に供
給し、ここで最終的に微粒子，細菌等を除去した透過水
である超純水を得、当該超純水を弁１５を介して半導体
ウエハー洗浄工程へ送給する。なお生ずる非透過水１１
は一次処理系に循環回収する。Next, the treated water of the mixed bed polisher 5 is pressurized by the pump 13 and supplied to the second ultrafiltration membrane device 2 via the valve 14, where it is the permeated water from which fine particles, bacteria and the like are finally removed. Ultrapure water is obtained, and the ultrapure water is fed to the semiconductor wafer cleaning step via the valve 15. Impermeable water 11
Is circulated and recovered in the primary treatment system.
このように処理の最終段に限外濾過膜装置を設置してい
るので、その前段の処理装置たとえば混床式ポリシャー
に用いるイオン交換樹脂の劣化等に起因してたとえ微細
な微粒子が漏洩しても最終段の限外濾過膜装置で当該微
粒子を可及的に低減することができる。Since the ultrafiltration membrane device is installed at the final stage of the treatment as described above, even if fine particles leak due to deterioration of the ion exchange resin used for the treatment device at the preceding stage, for example, a mixed bed polisher, etc. Also, the fine particles can be reduced as much as possible by the ultrafiltration membrane device at the final stage.
次に本発明における殺菌工程を説明する。Next, the sterilization step in the present invention will be described.
前述した超純水の製造工程を一定時間行った後、第２限
外濾過膜装置２を以下のような殺菌処理するため、通水
フローから切り離す。すなわちポンプ７の手前で弁２２
を開口して過酸化水素を注入し、純水６で希釈した過酸
化水素溶液を弁１７を介して第２限外濾過膜装置２に供
給し、過酸化水素を含む透過水を弁２１を介して排出
し、また過酸化水素を含む非透過水も排出する。After performing the above-described ultrapure water production process for a certain period of time, the second ultrafiltration membrane device 2 is separated from the water flow for sterilization treatment as described below. That is, the valve 22 is provided in front of the pump 7.
Is opened to inject hydrogen peroxide, a hydrogen peroxide solution diluted with pure water 6 is supplied to the second ultrafiltration membrane device 2 via the valve 17, and permeated water containing hydrogen peroxide is supplied to the valve 21. And also the non-permeate water containing hydrogen peroxide.
前記過酸化水素溶液の洗浄が終了したら、次いで弁２２
を閉じ、純水６のみを第２限外濾過膜装置２に送給し、
洗浄を行う。当該洗浄は約１時間程度で充分である。When the cleaning of the hydrogen peroxide solution is completed, then the valve 22
Is closed, and only pure water 6 is fed to the second ultrafiltration membrane device 2,
Perform cleaning. About 1 hour is sufficient for the cleaning.
このような殺菌処理をしている間に、第１限外濾過膜装
置１は運転を中断してもよいが、以下のような運転を行
うことも可能である。すなわち滞留槽３の滞留水をポン
プ１２、紫外線照射装置４、混床式ポリシャー５、ポン
プ１３、弁１６を介して第１限外濾過膜装置１に供給
し、得られる透過水である超純水を弁２０を介して半導
体ウエハー洗浄工程へ送給する。The operation of the first ultrafiltration membrane device 1 may be interrupted during the sterilization treatment, but it is also possible to perform the following operation. That is, the accumulated water in the retention tank 3 is supplied to the first ultrafiltration membrane device 1 through the pump 12, the ultraviolet irradiation device 4, the mixed bed polisher 5, the pump 13, and the valve 16, and the ultra pure water that is the permeated water obtained. Water is delivered to the semiconductor wafer cleaning process through the valve 20.
すわなち後段の限外濾過膜装置を殺菌処理している間
に、前段として用いていた第１限外濾過膜装置１のみを
用い、透過処理を続行するものである。That is, while sterilizing the subsequent ultrafiltration membrane device, only the first ultrafiltration membrane device 1 used as the previous stage is used to continue the permeation treatment.
このように本実施態様のごとく２基の限外濾過膜装置の
中間に滞留槽３を設置することにより、一方の限外濾過
膜装置を殺菌処理している間でも、当該滞留水を被処理
水として透過水を連続的に供給することができる。As described above, by installing the retention tank 3 in the middle of the two ultrafiltration membrane devices as in the present embodiment, the accumulated water can be treated while the one ultrafiltration membrane device is being sterilized. Permeate can be continuously supplied as water.
第２限外濾過膜装置２の殺菌処理が終了したら、第２限
外濾過膜装置２を前段に位置させるとともに当該殺菌処
理の直前までに前段に用いていた第１限外濾過膜装置１
を後段に位置させて超純水の製造工程を再開する。すな
わち、純水６をポンプ７で加圧して、弁１７を介して第
２限外濾過膜装置２に供給し、その透過水を弁１９、配
管１０を介して滞留槽３に送給し、当該滞留槽３内の滞
留水をポンプ１２、紫外線照射装置４、混床式ポリシャ
ー５、ポンプ１３、弁１６を介して第１限外濾過膜装置
１に供給し、得られる透過水である超純水を弁２０を介
して半導体ウエハー洗浄工程へ送給する。殺菌処理した
直後の第２限外濾過膜装置２の透過水に、たとえ微量の
不純物あるいは過酸化水素が残留していても、前述した
ごとく当該透過水を紫外線照射し、次いで混床式ポリシ
ャー５で処理するので安全である。When the sterilization treatment of the second ultrafiltration membrane device 2 is completed, the second ultrafiltration membrane device 2 is positioned in the preceding stage and the first ultrafiltration membrane device 1 used in the preceding stage until immediately before the sterilization treatment.
Is placed in the latter stage and the manufacturing process of ultrapure water is restarted. That is, the pure water 6 is pressurized by the pump 7, supplied to the second ultrafiltration membrane device 2 via the valve 17, and the permeated water is sent to the retention tank 3 via the valve 19 and the pipe 10. The accumulated water in the retention tank 3 is supplied to the first ultrafiltration membrane device 1 through the pump 12, the ultraviolet irradiation device 4, the mixed-bed polisher 5, the pump 13, and the valve 16, and is the permeated water obtained. Pure water is fed to the semiconductor wafer cleaning process through the valve 20. Even if a trace amount of impurities or hydrogen peroxide remains in the permeated water of the second ultrafiltration membrane device 2 immediately after the sterilization treatment, the permeated water is irradiated with ultraviolet rays as described above, and then the mixed bed polisher 5 is used. It is safe because it is processed in.
なお前述したと同様に滞留槽３を設置しない場合は、第
２限外濾過膜装置２の透過水を直接紫外線照射装置４に
供給することになる。When the retention tank 3 is not installed as in the case described above, the permeated water of the second ultrafiltration membrane device 2 is directly supplied to the ultraviolet irradiation device 4.
次に本発明における殺菌工程を再び説明する。Next, the sterilization step in the present invention will be described again.
上記の超純水の製造工程を一定時間行った後、第１限外
濾過膜装置１を通水フローから切り離し、殺菌処理す
る。すなわちポンプ７の手前で弁２２を開口して過酸化
水素を注入し、純水６で希釈した過酸化水素溶液を弁８
を介して第１限外濾過膜装置１に供給し、過酸化水素を
含む透過水を弁１８を介して排出し、また過酸化水素を
含む非透過水も排出する。After performing the above-described ultrapure water production process for a certain period of time, the first ultrafiltration membrane device 1 is separated from the water flow and sterilized. That is, the valve 22 is opened in front of the pump 7 to inject hydrogen peroxide, and the hydrogen peroxide solution diluted with pure water 6 is supplied to the valve 8
Is supplied to the first ultrafiltration membrane device 1 via the valve, the permeated water containing hydrogen peroxide is discharged via the valve 18, and the non-permeated water containing hydrogen peroxide is also discharged.
一方殺菌処理をしている間に前述したと同様に、第２限
外濾過膜装置２は運転を中断してもよいし、以下のよう
な運転を行うこともできる。すなわち滞留槽３の滞留水
をポンプ１２、紫外線照射装置４、混床式ポリシャー
５、ポンプ１３、弁１４を介して第２限外濾過膜装置２
に供給し、得られる透過水である超純水を弁１５を介し
て半導体ウエハー洗浄工程へ送給する。On the other hand, while the sterilization treatment is being performed, the operation of the second ultrafiltration membrane device 2 may be interrupted or the following operation may be performed as described above. That is, the accumulated water in the retention tank 3 is passed through the pump 12, the ultraviolet irradiation device 4, the mixed bed polisher 5, the pump 13, and the valve 14 to the second ultrafiltration membrane device 2
Then, ultrapure water which is the permeated water obtained is sent to the semiconductor wafer cleaning step through the valve 15.
第１限外濾過膜装置の殺菌工程が終了したら、一次処理
系から供給される純水６を第１限外濾過膜装置１、紫外
線照射装置４、混床式ポリシャー５、第２限外濾過膜装
置２の順に処理する超純水の製造工程を再開するもので
ある。After the sterilization process of the first ultrafiltration membrane device is completed, the pure water 6 supplied from the primary treatment system is treated with the first ultrafiltration membrane device 1, the ultraviolet irradiation device 4, the mixed bed polisher 5, and the second ultrafiltration device. This is to restart the ultrapure water manufacturing process in which the membrane device 2 is sequentially processed.
〈発明の効果〉 以上説明したごとく、本発明は超純水の給水処理装置の
最終段に限外濾過膜装置を設置しているので、水中の微
粒子，殺菌等を可及的に低減することができるととも
に、２基の限外濾過膜装置を巧みに組み合わせ、かつ２
基の限外濾過膜装置の間に紫外線照射装置と混床式ポリ
シャーを設置しているので、殺菌処理をしても最終処理
水に不純物が漏洩することを極力排除することができ
る。<Effects of the Invention> As described above, according to the present invention, since the ultrafiltration membrane device is installed at the final stage of the ultrapure water feed treatment device, it is possible to reduce fine particles in water, sterilization, etc. as much as possible. It is possible to combine two ultrafiltration membrane devices skillfully and
Since the ultraviolet irradiation device and the mixed bed polisher are installed between the base ultrafiltration membrane devices, the leakage of impurities into the final treated water can be eliminated as much as possible even after the sterilization treatment.
すなわち殺菌処理後の限外濾過膜装置を通水処理工程に
復帰させる際には必ず前段とすることにより、たとえ殺
菌処理により不純物が透過水に漏洩しても後段の紫外線
照射装置で当該不純物の一部を分解することができ、か
つ後段の混床式ポリシャーで残留する不純物を極限値ま
で除去でき、さらにたとえ混床式ポリシャーから微粒子
が漏洩したとしても、後段の限外濾過膜装置でこれを可
及的に低減することができる。That is, when returning to the water treatment process after the ultrafiltration membrane device after sterilization treatment, be sure to use the first stage so that even if impurities are leaked into the permeated water by the sterilization treatment, the ultraviolet irradiation device in the second stage can remove the impurities. Part of it can be decomposed, and the residual impurities can be removed to the limit value by the mixed bed polisher in the latter stage, and even if the fine particles leak from the mixed bed polisher, this can be done by the latter ultrafiltration membrane device. Can be reduced as much as possible.
さらに殺菌処理後に前段として用いられる限外濾過膜装
置は、後段の限外濾過膜装置を殺菌処理するまでの間、
透過処理中に充分に洗浄されるので、当該前段に用いた
限外濾過膜装置を後段として用いる時は、殺菌処理に起
因する不純物が漏洩することは全くない。Further, the ultrafiltration membrane device used as the first stage after the sterilization treatment, until the sterilization treatment of the second stage ultrafiltration membrane device,
Since it is sufficiently washed during the permeation treatment, when the ultrafiltration membrane device used in the preceding stage is used in the subsequent stage, impurities caused by the sterilization treatment never leak.
このように２基の限外濾過膜装置を巧みに用い、殺菌処
理後の限外濾過膜装置を常に前段とし、殺菌処理後に微
量残留する不純物を限外濾過膜装置の透過処理中に洗浄
することができるので、殺菌処理後に用いる洗浄水の使
用量を大幅に低減することができる。In this way, two ultrafiltration membrane devices are skillfully used, the ultrafiltration membrane device after the sterilization treatment is always in the previous stage, and impurities remaining in a trace amount after the sterilization treatment are washed during the permeation treatment of the ultrafiltration membrane device. Therefore, the amount of washing water used after the sterilization treatment can be significantly reduced.
前述した実施態様では殺菌処理に過酸化水素溶液を用い
たが、本発明の殺菌処理は過酸化水素溶液処理に限定さ
れず、要は限外濾過膜の膜面に付着した細菌類を殺菌で
きる他の薬剤による処理あるいは熱水処理でも差し支え
ない。Although the hydrogen peroxide solution was used for the sterilization treatment in the above-described embodiment, the sterilization treatment of the present invention is not limited to the hydrogen peroxide solution treatment, and the point is that bacteria attached to the membrane surface of the ultrafiltration membrane can be sterilized. Treatment with other chemicals or hot water treatment is also acceptable.
以下に本発明の実施例を説明する。Examples of the present invention will be described below.
実施例 除濁濾過装置で除濁した原水を逆浸透膜装置で処理した
後、２床３塔式純水製造装置で処理し、その処理水を真
空脱気塔で脱気後、混床式純水製造装置で処理し、当該
純水を純水槽へ貯水した。この純水を前段の限外濾過膜
装置へポンプで送水した。その時の圧力は６kg/cm2Ｇで
ある。Example Raw water turbidized by a turbidity filtration device was treated by a reverse osmosis membrane device, then treated by a two-bed, three-column type pure water production device, and the treated water was deaerated by a vacuum deaeration tower, and then a mixed-bed type The pure water was processed by the pure water manufacturing apparatus and the pure water was stored in the pure water tank. This pure water was pumped to the ultrafiltration membrane device in the previous stage. The pressure at that time is 6 kg / cm 2 G.
当該透過水を紫外線照射装置、混床式カートリッジで処
理した後、ポンプで後段の限外濾過膜装置へ送水した。
後段の限外濾過膜装置については、９時間透過処理をし
た後に１回の割りで、0.5％過酸化水素溶液で２時間殺
菌処理し、その後純水で１時間洗浄を行った。The permeated water was treated with an ultraviolet irradiator and a mixed bed type cartridge, and then the water was sent to a subsequent ultrafiltration membrane device by a pump.
The latter ultrafiltration membrane device was subjected to permeation treatment for 9 hours, then sterilized with 0.5% hydrogen peroxide solution for 2 hours, and then washed with pure water for 1 hour.
このような殺菌処理を順に行い、殺菌処理をした限外濾
過膜装置を常に前段とし、運転を3,000時間続行したと
ころ、後段限外濾過膜装置の透過水の水質は第１表の通
りであった。Such sterilization treatment was sequentially performed, and the sterilized ultrafiltration membrane device was always in the first stage, and the operation was continued for 3,000 hours. The water quality of the permeate of the latter stage ultrafiltration membrane device was as shown in Table 1. It was
図面は本発明の実施態様の一例を示すフローの説明図で
ある。 １……第１限外濾過膜装置 ２……第２限外濾過膜装置 ３……滞留槽、４……紫外線照射装置 ５……混床式ポリシャー、６……純水 ７……ポンプ、８……弁 ９……弁、１０……配管 １１……非透過水、１２……ポンプ １３……ポンプ、１４〜２２……弁Drawing is an explanatory view of a flow showing an example of an embodiment of the present invention. 1 ... 1st ultrafiltration membrane device 2 ... 2nd ultrafiltration membrane device 3 ... retention tank, 4 ... UV irradiation device 5 ... mixed bed polisher, 6 ... pure water 7 ... pump, 8 ... Valve 9 ... Valve, 10 ... Piping 11 ... Impermeable water, 12 ... Pump 13 ... Pump, 14-22 ... Valve
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０２Ｆ 1/44 Ｊ 8014−4Ｄ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C02F 1/44 J 8014-4D
Claims (1)
濾過膜装置で処理し、次いで紫外線照射装置、混床式ポ
リシャーの順に処理し、次いで後段の限外濾過膜装置で
処理して超純水を製造する給水処理装置の処理方法であ
って、限外濾過膜装置を殺菌処理するに際しては後段に
位置する限外濾過膜装置のみを殺菌処理し、また当該殺
菌処理後に超純水の製造を再開するに際しては、殺菌処
理を終了した後段の限外濾過膜装置を前段に、殺菌処理
の直前までに前段に位置していた限外濾過膜装置を後段
にそれぞれ位置させて超純水の製造を行うことを特徴と
する給水処理装置の処理方法。1. Pure water produced by a primary treatment system is treated with an ultrafiltration membrane device in the preceding stage, then an ultraviolet irradiation device and a mixed bed polisher in this order, and then treated with an ultrafiltration membrane device in the subsequent stage. A method of treating a water supply treatment apparatus for producing ultrapure water by sterilizing only an ultrafiltration membrane device located at a subsequent stage when sterilizing the ultrafiltration membrane device, and after the sterilization treatment When resuming the production of pure water, place the ultrafiltration membrane device at the latter stage after finishing the sterilization treatment at the front stage, and the ultrafiltration membrane device that was located at the front stage just before the sterilization treatment at the rear stage. A method for treating a water supply treatment device, which comprises producing ultrapure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60276119A JPH0630795B2 (en) | 1985-12-10 | 1985-12-10 | Treatment method of water supply treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60276119A JPH0630795B2 (en) | 1985-12-10 | 1985-12-10 | Treatment method of water supply treatment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62136298A JPS62136298A (en) | 1987-06-19 |
| JPH0630795B2 true JPH0630795B2 (en) | 1994-04-27 |
Family
ID=17565057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60276119A Expired - Lifetime JPH0630795B2 (en) | 1985-12-10 | 1985-12-10 | Treatment method of water supply treatment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0630795B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4998842B2 (en) * | 2005-06-13 | 2012-08-15 | 三浦工業株式会社 | Household water softener |
| CN115286154A (en) * | 2022-08-02 | 2022-11-04 | 深圳市龙图光电有限公司 | Ultrapure water system for mask cleaning and detection method |
-
1985
- 1985-12-10 JP JP60276119A patent/JPH0630795B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62136298A (en) | 1987-06-19 |
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