JPH0632430B2 - Chip component mounting machine - Google Patents

Description

Description: TECHNICAL FIELD The present invention is designed to remove a chip component causing a suction error when automatically mounting a rectangular or cylindrical chip component from a taping part or a magazine by a chip component mounting machine. The present invention relates to a chip component mounting machine to be activated.

Configuration of Conventional Example and Problems Thereof In recent years, a chip component mounting machine for mounting a leadless type component has been emphasized along with FA (factory automation).

FIG. 1 is a front view of the conventional chip component mounting machine as described above.

In FIG. 1, 1 is a mounting drive shaft slidably supported by a mounting head main body (not shown), 2 is a tip of the mounting drive shaft 1, and a chip component 3 is adsorbed to a printed wiring board (hereinafter referred to as a printed wiring board). A suction nozzle to be mounted on the substrate 4) 5 is a centering claw for moving and holding the chip component sucked by the suction nozzle 2 to the center of the tip of the suction nozzle 2, 6 is a part in which a tape having the chip component 3 is taped is loaded. It is a cassette.

The operation of the conventional chip component mounting machine configured as described above will be described below.

First, the suction nozzle 2 is moved downward by the mounting drive shaft 1 in order to suck the chip component 3 provided in the parts cassette 4. After sucking the chip component 3, the chip component 3 is raised by the centering claw 5 in the center of the suction nozzle 2.
Position it so that it holds. Then, the suction nozzle 2 is mounted on the printed circuit board 4 by moving the mounting drive shaft 1 forward on the printed circuit board 4 and then descending again.

However, the conventional chip component mounting machine has a suction nozzle 2
Therefore, when the chip component 2 is sucked from the parts cassette 6, the taping quality of the parts cassette 6 is not stable, and the chip component sucked from the taping part may not be held in a regular shape by the tip of the suction nozzle 2. there were. In this case, the chip component mounting machine that has detected a suction abnormality by a sensor (not shown) or the like is stopped. At this time, in order to restart it, it is necessary to remove the parts that have been adsorbed and held in an abnormal state, and in order to prevent quality problems, it requires complicated manual operation and it takes a long time to significantly increase the efficiency of the device. It had the drawback of lowering it.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional drawbacks, and makes it unnecessary to perform a complicated operation associated with a removal operation and a correction operation when a chip component is sucked and held in an abnormal state, thereby improving the efficiency of a device. With the goal.

In order to achieve the above object, the chip component mounting machine of the present invention responds to a means for grabbing one chip component from a taping part or a magazine, and a sensor output for detecting whether the chip component is in a holding state or not. The chip component is configured to move and be mounted to a predetermined position of the printed wiring board, and the chip component is removed to a position different from the printed wiring board only when it is determined that the holding state of the chip component is bad. It is configured to have a means for transferring.

With this configuration, when the chip component is abnormally adsorbed, the chip component is removed to another position.

Description of Embodiments An embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a front view of a chip component mounting machine according to an embodiment of the present invention.

In FIG. 2, the same members as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. 1'is a chip component mounting device, 7 is a nozzle whose inner diameter is determined so as to suck the chip component 3 abnormally adsorbed by the adsorption nozzle 2, and one end of which is directed toward the chip component 3, and 8 is the other end of the nozzle 7 connected. A vacuum pump pipe, 9 is a removal hopper equipped with a vacuum pump (not shown) for sucking and removing chip components, 10 is a cylinder for holding a removal device 11 including a nozzle 7, a vacuum pipe 8 and a removal hopper 9, 12 Is a cylinder shaft for moving the cylinder to the suction nozzle 3, 13 is a drive device for alternately inhaling and exhausting the vacuum pipes 14a, 14b to move the cylinder, and 15 is a forward magnet switch 16a for detecting the position of the cylinder. , A drive circuit for controlling the reverse magnet switch 16b, the removal hopper 9 and the drive device 17,
Is a vacuum pump that sucks the chip component 3 with the suction nozzle 2, 18 is an air sensor that is provided in the suction nozzle 2 and the vacuum pipe 19 of the vacuum pump 17, and detects air pressure, 20
Is a control device that is connected to the air sensor 18 and the drive circuit 15 and controls the chip component mounting device 1 ′ and the like.

The operation of the present embodiment configured as described above will be described below.

Now, FIG. 2 shows a case where the chip component 3 is adsorbed to the tip of the adsorption nozzle 2 in an abnormal state due to instability of the taping quality loaded in the parts cassette 6.
In this case, the suction nozzle 2 rises and the centering claw 5 operates, but since the chip component 3 is not held by the suction nozzle 2 in a normal state, the air pressure in the vacuum pipe 17 is different from the normal pressure, and Is detected by the air sensor 20, and a signal indicating a suction error is output. On the other hand, when the control circuit 20 receives this suction failure signal, it stops the chip component mounting machine 1'and simultaneously sends a signal for removing the chip component 3 to the drive circuit 15. The drive circuit 15 sends air from the drive device 13 to the vacuum pipe 14b to advance the cylinder 10 along the cylinder shaft 12 so that the tip of the nozzle 7 covers the chip component 3, and the position of the advance magnet switch 16a is confirmed. Is input to stop the cylinder 10. Then, the suction force stronger than the suction force of the suction nozzle 2 causes the chip components 3 to be sucked into the nozzle 7, and the chip components 3 are collected in the removal hopper 9. After removing the chip component 3, air is sent to the vacuum pipe 14a to retract the cylinder 10 and the cylinder 10 is stopped by the output of the reverse magnet switch 16b. After that, sequence program (not shown)
The chip component mounting apparatus 1 ′ newly adsorbs the same chip component 3 as removed and restarts the mounting operation.

As described above, according to this embodiment, the chip component mounting machine 1 '
The air sensor 18 detects whether or not the chip component 3 is held by the suction nozzle 2 in the normal form, and outputs a signal indicating a suction error at the time of abnormality to remove the chip component 3.
Since the same thing as this chip part 3 is newly sucked and the chip part mounting machine 1'is automatically restarted, when the chip part 3 is abnormally picked up as in the conventional case, the work of removing and correcting the abnormal part is performed manually. Complicated work is unnecessary,
The mounting ability of the chip component mounting apparatus 1'can be improved, and at the same time, the loss of time and the like due to an abnormality can be suppressed as much as possible. Further, since the chip component 3 is sucked in, there is no need to worry that the chip component 3 does not scatter to another position and falls onto another printed circuit board 4 to cause a secondary defect.

As described above, according to the chip component mounting machine of the present invention, when the chip component is not held in the regular shape in the suction nozzle, the chip component is removed and a new chip component is sucked and automatically. Since it is restarted, the complicated work of removing and correcting the abnormal parts by hand is unnecessary, the mounting ability can be improved, and the loss due to abnormalities can be suppressed as much as possible. There is something.

Moreover, according to the chip component mounting apparatus of the present invention, since the abnormal component is removed by sucking the chip component, the chip component does not scatter to a position other than the predetermined position,
Even minute parts can be easily collected.

[Brief description of drawings]

FIG. 1 is a front view of a conventional chip component mounting machine, and FIG. 2 is a front view of a chip component mounting machine according to an embodiment of the present invention. 1 '... Chip component mounting device, 2 ... Suction nozzle, 3 ...
… Chip parts, 7… Nozzle, 11… Removal device, 18
...... Air sensor.

Claims (1)

[Claims] 1. A chip component mounting device for clamping and moving one chip component from a taping part or a magazine to a predetermined position on a printed wiring board, and a sensor output for detecting whether or not the clamping condition of the chip component is good or bad. And a control circuit that outputs a control signal, and a removing device configured to be capable of advancing and retracting with respect to the chip component clamping position of the chip component mounting device and suctioning the chip component. When it is detected, the chip component mounting machine is configured so that the removal device is controlled to move forward by the control signal of the control circuit and the removal device is driven to suck and remove the chip component.