JPH0634444B2 - Printed circuit board cleaning method and apparatus - Google Patents
Printed circuit board cleaning method and apparatusInfo
- Publication number
- JPH0634444B2 JPH0634444B2 JP13128789A JP13128789A JPH0634444B2 JP H0634444 B2 JPH0634444 B2 JP H0634444B2 JP 13128789 A JP13128789 A JP 13128789A JP 13128789 A JP13128789 A JP 13128789A JP H0634444 B2 JPH0634444 B2 JP H0634444B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- cleaning
- printed circuit
- liquid
- cleaning liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、はんだ付けを終了したプリント基板の洗浄
を行うプリント基板の洗浄方法およびその装置に関する
ものである。Description: TECHNICAL FIELD The present invention relates to a method and apparatus for cleaning a printed circuit board for cleaning a printed circuit board that has been soldered.
従来、はんだ付けを終了したプリント基板、あるいはは
んだん付けを終了した後、リード線またはリード端子を
カッティングしたプリント基板は、水または洗剤を溶解
した水、あるいはフレオン(デュポン社の商品名)の液
からなる洗浄液の中に浸漬したり、洗浄液を吹き付けた
りしてプリント基板に付着したフラックスやカッティン
グにより付着した金属粉末を除去していた。Conventionally, a printed circuit board that has been soldered, or a printed circuit board that has been cut with lead wires or lead terminals after it has been soldered, is either water or a solution of detergent, or Freon (a product name of DuPont). The metal powder adhered to the printed circuit board was removed by immersing it in a cleaning liquid consisting of or spraying the cleaning liquid.
ところで、上記従来のプリント基板の洗浄方法およびそ
の装置は、走行するプリント基板を洗浄槽に貯溜された
洗浄液に浸漬させたり、あるいは洗浄液を吹き付けたり
するだけであるため、フラックス処理により付着したフ
ラックやリード線のカッティングにより付着した金属粉
末等の汚れを完全に取り除くことができないにもかかわ
らず、2枚目以降のプリント基板においては、フラック
スや金属粉末が混入して汚染された洗浄液で洗浄を行わ
なければならないという問題点があった。By the way, in the conventional method and apparatus for cleaning a printed circuit board described above, since the traveling printed circuit board is simply immersed in the cleaning liquid stored in the cleaning tank, or sprayed with the cleaning liquid, it is possible to remove flacks or Although it is not possible to completely remove stains such as metal powder adhered by cutting the lead wires, the second and subsequent printed circuit boards are cleaned with a cleaning liquid contaminated with flux and metal powder. There was a problem that it had to be.
また、フレオンの蒸気を使用するものは、フレオンが高
価であり、また、加熱されたフレオンの蒸気の一部が外
部へ排出されることにより、無駄に消費されて製品のコ
ストが上昇し、また、作業環境が悪化し、さらにフレオ
ンの蒸気による公害が発生するという問題点があった。Further, in the case of using the Freon vapor, the Freon is expensive, and a part of the heated Freon vapor is discharged to the outside, which is wastefully consumed and the cost of the product rises. However, there is a problem that the working environment is deteriorated and that pollution due to Freon vapor occurs.
この発明は、上記の問題点を解決するためになされたも
ので、プリント基板に付着したフラックや金属粉末等の
大きな汚れは洗浄液を含んだロールブラシによる洗浄
と、流動する洗浄液に浸漬してから洗浄液のシャワーに
よる洗浄とを行うとともに、上記それぞれの洗浄を行う
ごとにプリント基板に付着した洗浄液を除去するように
したプリント基板の洗浄方法およびその装置を得ること
を目的とする。The present invention has been made to solve the above-mentioned problems. Large stains such as flacks and metal powder adhered to a printed circuit board are cleaned by a roll brush containing a cleaning solution and after being immersed in a flowing cleaning solution. An object of the present invention is to provide a method and apparatus for cleaning a printed circuit board, in which the cleaning solution is cleaned by a shower and the cleaning solution attached to the printed circuit board is removed each time the cleaning is performed.
この発明の第1の発明に係るプリント基板の洗浄方法
は、はんだ付けを終了したプリント基板を搬送手段によ
りはんだ付け面を下面に、他の面を上面として搬送する
とともに、洗浄液を含んだロールブラシにより前記プリ
ント基板の下面を洗浄した後、加圧空気の吹き付けによ
り前記プリント基板に付着した洗浄液を除去し、次い
で、前記プリント基板を下降させ前記プリント基板の走
行方向に対いて反対方向と、前記プリント基板の走行方
向に対して交差し、かつ、前記プリント基板面と平行な
方向とにそれぞれ噴流する洗浄液の中に前記プリント基
板を浸漬して洗浄し、次いで、前記プリント基板を上昇
させるときに洗浄液を吹き付けて前記プリント基板の上
面と下面を洗浄し、次いで、加圧空気の吹き付けにより
前記プリント基板に付着した洗浄液を除去し、次いで、
前記プリント基板を熱風により乾燥した後、冷風により
冷却を行うものである。A method for cleaning a printed circuit board according to a first aspect of the present invention is to transfer a printed circuit board, which has been soldered, by a transfer means with a soldering surface as a lower surface and another surface as an upper surface, and a roll brush containing a cleaning liquid. After cleaning the lower surface of the printed circuit board by, to remove the cleaning liquid adhering to the printed circuit board by blowing pressurized air, then lower the printed circuit board and the opposite direction to the running direction of the printed circuit board, When the printed circuit board is immersed in a cleaning liquid that intersects the traveling direction of the printed circuit board and is jetted in a direction parallel to the printed circuit board surface for cleaning, and then when the printed circuit board is raised. A cleaning liquid is sprayed to clean the upper and lower surfaces of the printed circuit board, and then the printed circuit board is attached by spraying pressurized air. The washing solution was removed and then,
After drying the printed circuit board with hot air, it is cooled with cool air.
また、この発明の第2の発明にかかるプリント基板の洗
浄装置は、プリント基板をはんだ付け面を下面に、他の
面を上面にして搬送手段で各工程の装置に順次搬送して
洗浄する装置であって、洗浄液を収容した洗浄槽に前記
プリント基板の下面を洗浄するロールブラシを設けたブ
ラシ洗浄装置と;前記プリント基板に付着した洗浄液を
加圧空気により除去する液除去装置と;前記プリント基
板の搬送方向に対して反対方向と、前記プリント基板の
搬送方向と交差する方向で少なくとも該プリント基板面
と平行な方向とにそれぞれ洗浄液を噴流する噴流管を有
する浸漬洗浄槽と、前記プリント基板が前記浸漬洗浄槽
から引き上げられた際に前記プリント基板の下面と上面
に向けてそれぞれ洗浄液を噴出する噴出管を有し、これ
らの噴出管から噴出する洗浄液により洗浄を行うシャワ
ー洗浄器とを設けた浸漬・シャワー洗浄装置と;前記プ
リント基板に付着した洗浄液を熱風により乾燥する熱風
乾燥装置と;前記加熱されたプリント基板を冷風により
冷却する冷却装置;を順に配置して成り、 前記プリント基板を、前記ブラシ洗浄装置、前記液除去
装置、前記浸漬・シャワー洗浄装置、前記熱風乾燥装
置、前記冷却装置、の順に搬送するとともに、前記浸漬
・シャワー洗浄装置の浸漬洗浄槽の液中に前記プリント
基板を下降して浸漬する機構と、前記液中から上昇させ
引き上げる機構とを有する搬送手段を備えたものであ
る。A printed circuit board cleaning device according to a second aspect of the present invention is a device for cleaning a printed circuit board by sequentially transferring the printed circuit board to a device of each step with a soldering surface as a lower surface and another surface as an upper surface. A brush cleaning device provided with a roll brush for cleaning the lower surface of the printed circuit board in a cleaning tank containing a cleaning liquid; a liquid removing device for removing the cleaning liquid adhering to the printed circuit board with pressurized air; An immersion cleaning tank having a jet pipe for jetting a cleaning liquid in a direction opposite to the substrate transport direction and in a direction intersecting the printed substrate transport direction and at least parallel to the printed circuit board surface; and the printed circuit board. Has ejection pipes for ejecting the cleaning liquid toward the lower surface and the upper surface of the printed circuit board when the liquid is pulled up from the immersion cleaning tank. An immersion / shower cleaning device provided with a shower cleaning device for cleaning with a cleaning liquid for cleaning; a hot-air drying device for drying the cleaning liquid adhering to the printed circuit board with hot air; a cooling device for cooling the heated printed circuit board with cold air Are arranged in order, and the printed circuit board is conveyed in the order of the brush cleaning device, the liquid removing device, the immersion / shower cleaning device, the hot air drying device, and the cooling device, and the immersion / shower cleaning is performed. The apparatus is provided with a conveying means having a mechanism for lowering and soaking the printed circuit board in the liquid in the immersion cleaning tank of the apparatus, and a mechanism for raising and lifting the printed circuit board from the liquid.
この発明にかかるプリント基板の洗浄方法およびその装
置は、プリント基板の下面を洗浄液を含んだロールブラ
シにより洗浄した後、プリント基板に付着した洗浄液を
除去する。次いで、プリント基板を流動する洗浄液によ
り洗浄した後、プリント基板の上面と下面を噴出する洗
浄液により洗浄し、次いで、プリント基板に付着した洗
浄液を除去し、さらに、プリント基板を熱風で乾燥した
後、冷却する。The method and apparatus for cleaning a printed circuit board according to the present invention cleans the lower surface of the printed circuit board with a roll brush containing a cleaning solution and then removes the cleaning solution adhering to the printed circuit board. Then, after cleaning the printed circuit board with a flowing cleaning solution, the upper surface and the lower surface of the printed circuit board are cleaned with a spraying cleaning solution, then the cleaning solution adhering to the printed circuit board is removed, and the printed circuit board is dried with hot air. Cooling.
〔実施例〕 第1図はこの発明の一実施例を示す概略構成図で、1は
プリント基板で、1aは上面、1bははんだ付け面であ
る下面を示す。2は前記プリント基板1を装着して矢印
A方向へ搬送するキャリア、3は前記プリント基板1を
搬送する手段としての搬送チェーンで、図中の2点鎖線
で示すように、後述する浸漬・シャワー洗浄装置21,
41にて下降と水平走行および上昇走行を行う配設構造
となっている。4は前記はんだ付けを終了したプリント
基板1を洗浄る洗浄装置の全体を示す。5は前記プリン
ト基板1の搬入口、6は搬出口、7は洗浄液である。1
1は前記プリント基板1のはんだ付け面である下面1b
を洗浄するブラシ洗浄装置、12は洗浄槽、13は前記
洗浄液7を含んで回転するロールブラシ、14は前記洗
浄液7が供給される供給パイプ、15は前記洗浄槽12
の上部から溢れ出た洗浄液7を受ける受溜槽、16は排
出パイプ、17は前記プリント基板1に付着した洗浄液
7除去する第1の液除去装置、21は第1の浸漬・シャ
ワー洗浄装置、22は前記第1の浸漬・シャワー洗浄装
置21の第1の浸漬洗浄層で、その詳細を第2図(a),
(b)に示す、第2図(a),(b)において、第2図(a)は
平面図、第2図(b)は、第2図(a)のI−I線による断
面図を示す。第1図,第2図(a),(b)において、23
は前記洗浄液7の噴流管で、洗浄液7をプリント基板1
の走行方向(矢印A方向)と反対方向の矢印B方向に噴流
する。24は前記洗浄液7の噴流管で、第2図(b)に示
すように噴射管23よりも高さhだけ下方に位置してお
り、洗浄液7をプリント基板1の走行方向(矢印A方向)
と交差し、かつ、プリント基板1面と平行な方向(矢印
C方向)に噴流する。第1図において、25は前記洗浄
液7を加熱するヒータ、26はフィルタ、27は前記第
1の浸漬洗浄槽22内の洗浄液7が循環する循環パイ
プ、28は前記循環パイプ27内の洗浄液7を噴流管2
3,24から噴流せしめるポンプである。29は前記第
1の浸漬洗浄槽22内から溢れ出た洗浄液7を受ける受
溜槽、30は前記受溜槽29内の洗浄液7を排出する排
出パイプ、31はフィルタである。32は第1のシャワ
ー洗浄器、33,34,35はいずれも前記洗浄液7を
噴出する噴出管で、噴出管33は洗浄液7を下方の液面
に向けて噴出し、洗浄液7を第1の浸漬洗浄槽22に貯
溜する。噴出管34は前記斜め方向に上昇するプリント
基板1の上面1aに向けて噴出する。噴出管35は前記
走行するプリント基板1の下面1bに向けて噴出する。
36は第2の液除去装置、41は第2の浸漬・シャワー
洗浄装置で、その構成は第2図(a),(b)の第1の浸漬
・シャワー洗浄装置21と同一である。第2の浸漬・シ
ャワー洗浄装置41において、42は第2の浸漬洗浄
槽、43,44は噴流管、45はヒータ、46はフィル
タ、47は循環パイプ、48はポンプ、49は受溜槽、
50は排出パイプ、51はフィルタ、52は第2のシャ
ワー洗浄器、53,54,55は噴出管、56は第3の
液除去装置、57は熱風乾燥装置、58は熱風の噴出
口、59は熱風の吸入口、60は前記熱風乾燥装置57
で加熱されたプリント基板1を冷却する冷却器、61は
新しい洗浄液7を供給する新液供給槽、62は前記新し
い洗浄液7を加熱する加熱器である。71は前記第1,
第2の浸漬・シャワー洗浄装置21,41から排出され
た洗浄液7を貯溜する貯溜装置の全体を示し、72,7
3は前記第1,第2の浸漬・シャワー洗浄装置21,4
1から排出された洗浄液7を貯溜する第1,第2の貯溜
槽で、仕切壁74により仕切られている。75は前記第
1の貯溜槽72内の洗浄液7をブラシ洗浄装置11の洗
浄槽12へ供給する供給パイプ、76はポンプ、77は
前記第2の貯溜槽73内の洗浄液7を第2の浸漬・シャ
ワー洗浄装置41の第1のシャワー洗浄器32へ供給す
る供給パイプ、78はポンプ、79はヒータ、80は前
記第1の貯溜槽72から溢れた出た洗浄液7を受ける受
溜槽、81は排出パイプ、82は前記各受溜槽15,8
0から汚染により排出された洗浄液7の廃液を受ける廃
液受溜槽である。なお、噴流管23と43,24と44
は対応しており、その作用も同様である。[Embodiment] FIG. 1 is a schematic constitutional view showing an embodiment of the present invention, in which 1 is a printed circuit board, 1a is an upper surface, and 1b is a lower surface which is a soldering surface. 2 is a carrier for mounting the printed board 1 and carrying it in the direction of arrow A, 3 is a carrying chain as a means for carrying the printed board 1, and as shown by a chain double-dashed line in the drawing, a dipping / shower described later. Cleaning device 21,
At 41, a disposition structure for descending, horizontal traveling, and ascending traveling is provided. Reference numeral 4 denotes an entire cleaning device for cleaning the printed circuit board 1 after the soldering. Reference numeral 5 is a carry-in port of the printed circuit board 1, 6 is a carry-out port, and 7 is a cleaning liquid. 1
Reference numeral 1 denotes a lower surface 1b which is a soldering surface of the printed circuit board 1.
A brush cleaning device for cleaning the cleaning liquid, 12 a cleaning tank, 13 a roll brush that rotates by containing the cleaning liquid 7, 14 a supply pipe to which the cleaning liquid 7 is supplied, 15 a cleaning tank 12
, A receiving pipe for receiving the cleaning liquid 7 overflowing from the upper part, a discharge pipe 17, a first liquid removing device for removing the cleaning liquid 7 adhering to the printed circuit board 1, a first dipping / shower cleaning device, 22 Is a first immersion cleaning layer of the first immersion / shower cleaning device 21, the details of which are shown in FIG.
2 (a) and 2 (b) shown in FIG. 2 (b), FIG. 2 (a) is a plan view, and FIG. 2 (b) is a sectional view taken along line I-I of FIG. 2 (a). Indicates. In FIGS. 1 and 2 (a) and (b), 23
Is a jet tube of the cleaning liquid 7, and the cleaning liquid 7 is applied to the printed circuit board 1
Jet in the direction of arrow B, which is the opposite direction of the traveling direction (direction of arrow A). Reference numeral 24 denotes a jet pipe of the cleaning liquid 7, which is located below the jet pipe 23 by a height h as shown in FIG. 2B, and the cleaning liquid 7 runs in the traveling direction of the printed circuit board 1 (direction of arrow A).
And jets in a direction parallel to the surface of the printed board 1 (direction of arrow C). In FIG. 1, 25 is a heater for heating the cleaning liquid 7, 26 is a filter, 27 is a circulation pipe through which the cleaning liquid 7 in the first immersion cleaning tank 22 circulates, and 28 is the cleaning liquid 7 in the circulation pipe 27. Jet tube 2
It is a pump that makes the jet flow from 3,24. Reference numeral 29 is a receiving tank for receiving the cleaning liquid 7 overflowing from the inside of the first immersion cleaning tank 22, 30 is a discharge pipe for discharging the cleaning liquid 7 in the receiving tank 29, and 31 is a filter. Reference numeral 32 is a first shower cleaner, and 33, 34 and 35 are all spray pipes for spraying the cleaning liquid 7, and the spray pipe 33 sprays the cleaning liquid 7 toward the lower liquid surface, so that the cleaning liquid 7 is discharged into the first cleaning liquid. It is stored in the immersion cleaning tank 22. The ejection pipe 34 ejects toward the upper surface 1a of the printed circuit board 1 rising in the oblique direction. The ejection pipe 35 ejects toward the lower surface 1b of the traveling printed circuit board 1.
Reference numeral 36 is a second liquid removing device, 41 is a second immersion / shower cleaning device, and the construction thereof is the same as that of the first immersion / shower cleaning device 21 shown in FIGS. 2 (a) and 2 (b). In the second immersion / shower cleaning device 41, 42 is a second immersion cleaning tank, 43 and 44 are jet pipes, 45 is a heater, 46 is a filter, 47 is a circulation pipe, 48 is a pump, 49 is a receiving tank,
50 is a discharge pipe, 51 is a filter, 52 is a second shower cleaner, 53, 54 and 55 are ejection pipes, 56 is a third liquid removing device, 57 is a hot air drying device, 58 is a hot air ejection port, 59 Is a hot air inlet, 60 is the hot air drying device 57.
A cooler for cooling the printed circuit board 1 heated in step 1, 61 is a new solution supply tank for supplying new cleaning solution 7, and 62 is a heater for heating the new cleaning solution 7. 71 is the first,
The entire storage device for storing the cleaning liquid 7 discharged from the second immersion / shower cleaning device 21, 41 is shown as 72, 7
3 is the first and second immersion / shower cleaning devices 21, 4
The first and second storage tanks store the cleaning liquid 7 discharged from the first storage tank 1, and are partitioned by a partition wall 74. 75 is a supply pipe for supplying the cleaning liquid 7 in the first storage tank 72 to the cleaning tank 12 of the brush cleaning device 11, 76 is a pump, and 77 is a second immersion of the cleaning liquid 7 in the second storage tank 73. A supply pipe for supplying the first shower cleaning device 32 of the shower cleaning device 41, 78 is a pump, 79 is a heater, 80 is a receiving tank for receiving the cleaning liquid 7 overflowed from the first storage tank 72, and 81 is A discharge pipe and 82 are the receiving tanks 15 and 8 described above.
The waste liquid storage tank receives the waste liquid of the cleaning liquid 7 discharged from 0 due to contamination. The jet tubes 23 and 43, 24 and 44
Correspond, and the action is the same.
次に動作について説明する。Next, the operation will be described.
キャリア2に装着され、はんだ付けを終了し、あるいは
はんだ付けを終了した後、リード線またはリード端子を
カッティングしたプリント基板1は、搬送チエーン3に
係止された前記キャリア2に保持されて、該搬送チェー
ン3により矢印A方向に走行し、搬入口5から洗浄装置
4内に入る。次いで、ブラシ洗浄装置11のロールブラ
シ13によりプリント基板1の下面に1bにフラックス
処理により付着したフラックスやカッティングにより付
着した金属粉末等の大きな汚れが洗浄され、第1の液除
去装置17で空気の吹き付けにより洗浄液7が除去され
る。次いで、プリント基板1を下降させて第1の浸漬洗
浄槽22の洗浄液7内に浸漬する。ここで、噴流管23
からプリント基板1の走行方向と逆向きに噴流する洗浄
液7、噴流管24からプリント基板1の走行方向と交差
する方向で該プリント基板面に平行に噴流する洗浄液
7、噴出管33からプリント基板1の走行方向と交差す
る方向で該プリント基板面に垂直に噴出する洗浄液7、
によって浸漬洗浄層22内の洗浄液7が攪拌され、か
つ、浸漬層22へ洗浄液の供給がなされる。また、プリ
ント基板1に装着した部品でその基板上の高さが高い部
品にあっては、浸漬洗浄槽22の洗浄液面から当該部品
が部分的に飛び出す場合もあるが、噴出管33から噴出
する洗浄液により当該部分も洗い流され、プリント基板
1の上面1a,下面1bが洗浄される。次いで、プリン
ト基板1を第1の浸漬洗浄層22の洗浄液7から上昇さ
せるとき、第1のシャワー洗浄器32の各噴出管34,
35から噴出する洗浄液7によりプリント基板1の上面
1aと下面1bを洗浄する。次いで、プリント基板1は
水平に走行し、第2の液除去装置36に入ると、空気の
吹き付けにより洗浄液7が除去される。次いで、プリン
ト基板1を第2の浸漬・シャワー洗浄装置41で、第1
の浸漬・シャワー洗浄装置21と同一の工程を経て洗浄
を行い、次いで、第3の液除去装置56内に入り、空気
の吹き付けにより洗浄液7が除去される。次いで、熱風
乾燥装置57内に入り噴出口58から噴出する熱風によ
り乾燥される。なお、プリント基板1を乾燥した熱風は
吸入口59に入り、熱風乾燥装置57内を循環する。次
いで、乾燥されたプリント基板1は冷却器60から噴出
する冷風により冷却され、搬出口6から送り出される。The printed circuit board 1 mounted on the carrier 2 and completed the soldering or after the completion of the soldering and having the lead wire or the lead terminal cut is held by the carrier 2 locked by the transport chain 3 and The carrier chain 3 travels in the direction of arrow A and enters the cleaning device 4 from the carry-in port 5. Then, the roll brush 13 of the brush cleaning device 11 cleans the lower surface of the printed circuit board 1 for large contaminants such as flux adhered to the lower surface 1b by flux treatment and metal powder adhered by cutting, and the first liquid removing device 17 removes air. The cleaning liquid 7 is removed by spraying. Next, the printed circuit board 1 is lowered and immersed in the cleaning liquid 7 in the first immersion cleaning tank 22. Here, the jet tube 23
Cleaning liquid 7 that jets in a direction opposite to the traveling direction of the printed circuit board 1; Cleaning liquid 7 which is jetted perpendicularly to the printed circuit board surface in a direction intersecting the traveling direction of
By this, the cleaning liquid 7 in the immersion cleaning layer 22 is agitated, and the cleaning liquid is supplied to the immersion layer 22. Further, in the case of a component mounted on the printed circuit board 1 and having a high height on the circuit board, the component may be partially ejected from the cleaning liquid surface of the immersion cleaning tank 22, but is ejected from the ejection pipe 33. This portion is also washed away by the cleaning liquid, and the upper surface 1a and the lower surface 1b of the printed board 1 are cleaned. Next, when the printed circuit board 1 is lifted from the cleaning liquid 7 of the first immersion cleaning layer 22, the ejection pipes 34 of the first shower cleaning device 32,
The upper surface 1a and the lower surface 1b of the printed circuit board 1 are cleaned with the cleaning liquid 7 jetted from 35. Next, the printed circuit board 1 travels horizontally, and when it enters the second liquid removing device 36, the cleaning liquid 7 is removed by blowing air. Then, the printed circuit board 1 is subjected to the first immersion / shower cleaning device 41 in the first
Cleaning is performed through the same steps as those of the immersion / shower cleaning device 21, and then the cleaning liquid 7 is removed by spraying air into the third liquid removing device 56. Then, it is dried by the hot air that enters the hot air drying device 57 and is ejected from the ejection port 58. The hot air that has dried the printed circuit board 1 enters the suction port 59 and circulates in the hot air drying device 57. Next, the dried printed circuit board 1 is cooled by the cool air blown from the cooler 60 and sent out from the carry-out port 6.
次に洗浄液7の流動する系統について、第1図と第3図
により説明する。Next, the system through which the cleaning liquid 7 flows will be described with reference to FIGS. 1 and 3.
第3図は洗浄液7が流動する系統を示す図で、第1図と
同一符号は同一部分を示す。第1図〜第3図において、
新しい洗浄液7は新液供給槽61内に貯溜された後、加
熱器62で加熱され、温液となった洗浄液7は第2の浸
漬・シャワー洗浄装置41の第2のシャワー洗浄器52
へ送られてから噴出してプリント基板1の洗浄に供し、
その後、第2の浸漬洗浄槽42に入る。すなわち、洗浄
液7が浸漬洗浄槽42に供給される。第2の浸漬洗浄槽
42内の洗浄液7はポンプ48により第1図に示す各噴
流管43,44から噴流され、噴流された洗浄液7は第
2の浸漬洗浄槽42内を循環する。一方、第2の浸漬洗
浄槽42から溢れた洗浄液7は貯溜槽71のうちの第2
の貯溜槽73内に入る。次いで、第2の貯溜槽73内の
洗浄液7はポンプ78により第1の浸漬・シャワー洗浄
装置の21の第1のシャワー洗浄器32へ送られてから
噴出してプリント基板1の洗浄に供し、その後、第1の
浸漬洗浄槽22に入る。すなわち、洗浄液7が浸漬洗浄
槽22に供給される。第1の浸漬洗浄槽22内の洗浄液
7はポンプ28により第1図に示す各噴流管23,24
から噴流され、第1の浸漬洗浄槽22内を循環する。ま
た、第1の浸漬洗浄槽22から溢れ出た洗浄液7は第1
の貯溜槽72内に入る。次いで、第1の貯溜槽72内の
洗浄液7はポンプ76によりブラシ洗浄装置11へ供給
される。次いで、ブラシ洗浄装置11から溢れた洗浄液
7と第1の貯留槽72から溢れた洗浄液7はいずれも廃
液受溜槽82に受溜される。FIG. 3 is a diagram showing a system in which the cleaning liquid 7 flows, and the same reference numerals as those in FIG. 1 indicate the same parts. 1 to 3,
The new cleaning liquid 7 is stored in the new liquid supply tank 61 and then heated by the heater 62, and the cleaning liquid 7 that has become a warm liquid is the second shower cleaning device 52 of the second immersion / shower cleaning device 41.
After being sent to the
After that, the second immersion cleaning tank 42 is entered. That is, the cleaning liquid 7 is supplied to the immersion cleaning tank 42. The cleaning liquid 7 in the second immersion cleaning tank 42 is jetted from the jet pipes 43 and 44 shown in FIG. 1 by the pump 48, and the jetted cleaning liquid 7 circulates in the second immersion cleaning tank 42. On the other hand, the cleaning liquid 7 overflowing from the second immersion cleaning tank 42 is the second cleaning liquid in the storage tank 71.
Into the storage tank 73. Next, the cleaning liquid 7 in the second storage tank 73 is sent to the first shower cleaning device 32 of the first immersion / shower cleaning device 21 by the pump 78 and then jetted to be used for cleaning the printed circuit board 1. After that, the first immersion cleaning tank 22 is entered. That is, the cleaning liquid 7 is supplied to the immersion cleaning tank 22. The cleaning liquid 7 in the first immersion cleaning tank 22 is pumped by the pump 28 into the jet pipes 23, 24 shown in FIG.
And is circulated in the first immersion cleaning tank 22. Further, the cleaning liquid 7 overflowing from the first immersion cleaning tank 22 is the first
Into the storage tank 72. Next, the cleaning liquid 7 in the first storage tank 72 is supplied to the brush cleaning device 11 by the pump 76. Next, both the cleaning liquid 7 overflowing from the brush cleaning device 11 and the cleaning liquid 7 overflowing from the first storage tank 72 are stored in the waste liquid storage tank 82.
また、第2の貯溜槽73から溢れた洗浄液7は、第1の
貯溜槽72内に入る。The cleaning liquid 7 overflowing from the second storage tank 73 enters the first storage tank 72.
このように、第2の浸漬・シャワー洗浄装置41には加
熱された新しい洗浄液7が供給され、第1の浸漬・シャ
ワー洗浄装置21では第2の浸漬・シャワー洗浄装置4
1で使用された洗浄液7により洗浄が行われる。また、
ブラシ洗浄装置11においても、第1の浸漬・シャワー
洗浄装置21で使用された洗浄液7により洗浄が行われ
る。In this way, the heated new cleaning liquid 7 is supplied to the second immersion / shower cleaning device 41, and the second immersion / shower cleaning device 4 is supplied to the first immersion / shower cleaning device 21.
Cleaning is performed with the cleaning liquid 7 used in 1. Also,
Also in the brush cleaning device 11, cleaning is performed with the cleaning liquid 7 used in the first immersion / shower cleaning device 21.
また、第1液除去装置17を設けたことによりブラシ洗
浄装置11で汚れた洗浄液7が、第1の浸漬・シャワー
洗浄装置21に混入することがない。また、第2の液除
去装置36においても第1の浸漬・シャワー洗浄装置2
1で汚れた洗浄液7が完全に除去されて、第2の浸漬・
シャワー洗浄装置41に混入することがないようになっ
ている。Further, since the first liquid removing device 17 is provided, the cleaning liquid 7 soiled by the brush cleaning device 11 does not mix into the first immersion / shower cleaning device 21. Further, also in the second liquid removing device 36, the first dipping / shower cleaning device 2
The cleaning liquid 7 contaminated with 1 is completely removed, and the second immersion
It does not mix with the shower cleaning device 41.
以上説明したように、この発明の第1の発明は、はんだ
付けを終了したプリント基板を搬送手段によりはんだ付
け面を下面に、他の面を上面として搬送するとともに、
洗浄液を含んだロールブラシにより前記プリント基板の
下面を洗浄した後、加圧空気の吹き付けにより前記プリ
ント基板に付着した洗浄液を除去し、次いで、前記プリ
ント基板を下降させて前記プリント基板の走行方向に対
して反対方向と、前記プリント基板の走行方向に対して
交差し、かつ少なくとも前記プリント基板面と平行な方
向とにそれぞれ噴流する洗浄液の中に前記プリント基板
を浸漬して洗浄し、次いで、前記プリント基板を上昇さ
せるときに洗浄液を吹き付けて前記プリント基板の下面
と上面を洗浄し、次いで、加圧空気の吹き付けにより前
記プリント基板に付着した洗浄液を除去し、次いで、前
記プリント基板を熱風により乾燥した後、冷風により冷
却を行うので、プリント基板の洗浄が完全に行われ、品
質のよいプリント基板が得られる利点がある。As described above, according to the first aspect of the present invention, the printed circuit board that has been soldered is carried by the carrying means with the soldering surface as the lower surface and the other surface as the upper surface, and
After cleaning the lower surface of the printed circuit board with a roll brush containing a cleaning solution, the cleaning solution adhering to the printed circuit board is removed by blowing pressurized air, and then the printed circuit board is lowered to the running direction of the printed circuit board. On the other hand, the printed circuit board is immersed in a cleaning liquid that is jetted in the opposite direction and in a direction that intersects the traveling direction of the printed circuit board and is parallel to at least the printed circuit board surface for cleaning, and then, When the printed circuit board is raised, a cleaning liquid is sprayed to clean the lower surface and the upper surface of the printed circuit board, then the cleaning solution adhering to the printed circuit board is removed by spraying pressurized air, and then the printed circuit board is dried with hot air. After that, it is cooled with cool air, so the printed circuit board is completely washed and high quality printed There is an advantage that the plate can be obtained.
また、この発明の第2の発明は、洗浄液を収容した洗浄
槽に前記プリント基板の下面を洗浄するロールブラシを
設けたブラシ洗浄装置と;前記プリント基板に付着した
洗浄液を加圧空気により除去する液除去装置と;前記プ
リント基板の搬送方向に対して反対方向と、前記プリン
ト基板の搬送方向と交差する方向で少なくとも該プリン
ト基板面と平行な方向とにそれぞれ洗浄液を噴流する噴
流管を有する浸漬洗浄槽と、前記プリント基板が前記浸
漬洗浄槽から引き上げられた際に前記プリント基板の下
面と上面に向けてそれぞれ洗浄液を噴出する噴出管を有
し、これらの噴出管から噴出うする洗浄液により洗浄を
行うシャワー洗浄器とを設けた浸漬・シャワー洗浄装置
と;前記プリント基板に付着した洗浄液を熱風により乾
燥する熱風乾燥装置と;前記加熱されたプリント基板を
冷風により冷却する冷却装置と;を順に配置して成り、 前記プリント基板を、前記ブラシ洗浄装置、前記液除去
装置、前記浸漬・シャワー洗浄装置、前記熱風乾燥装
置、前記冷却装置、の順に搬送するとともに、前記浸漬
・シャワー洗浄装置の浸漬洗浄槽の液中に前記プリント
基板を下降して浸漬する機構と、前記液中から上昇させ
て引き上げる機構とを有する搬送手段を備えたので、プ
リント基板に付着したフラックス金属粉末等の大きな汚
れが次段の洗浄液に混入することがないため、プリント
基板が洗浄されるごとにきれいな洗浄液で洗浄されるの
で、プリント基板の汚れが完全に除去されるとともに、
洗浄液の消費量が少なく経済的である等の利点を有す
る。A second invention of the present invention is a brush cleaning device in which a cleaning tank containing a cleaning liquid is provided with a roll brush for cleaning the lower surface of the printed circuit board; and the cleaning liquid attached to the printed circuit board is removed by pressurized air. A liquid removing device; a dip having jet nozzles for jetting a cleaning liquid in a direction opposite to the printed circuit board transport direction and in a direction intersecting the printed circuit board transport direction and at least parallel to the printed circuit board surface. It has a cleaning tank and jet pipes for jetting the cleaning liquid toward the lower surface and the upper surface of the printed circuit board when the printed circuit board is pulled up from the immersion cleaning tank, and is cleaned by the cleaning liquid sprayed from these jet tubes. An immersion / shower washing device provided with a shower washing device for performing; a hot air drying device for drying the washing liquid adhering to the printed circuit board with hot air And a cooling device that cools the heated printed circuit board with cold air in that order, the printed circuit board having the brush cleaning device, the liquid removing device, the immersion / shower cleaning device, and the hot air drying device. And a cooling device, and a mechanism for descending and soaking the printed circuit board in the liquid in the immersion cleaning tank of the immersion / shower cleaning device and a mechanism for elevating and lifting the liquid from the liquid. Since the means is provided, large dirt such as flux metal powder adhering to the printed circuit board will not be mixed in the cleaning solution in the next stage, so that the cleaning solution is cleaned every time the printed circuit board is cleaned. As dirt is completely removed,
It has advantages such as low consumption of cleaning liquid and economic efficiency.
【図面の簡単な説明】 第1図はこの発明の一実施例を示す概略構成図、第2図
(a),(b)は、第1図の第1の浸漬洗浄槽を示すもの
で、第2図(a)は平面図、第2図(b)は、第2図(a)の
I−I線による断面図、第3図は洗浄液の流動する系統
を示す図である。 図中、1はプリント基板、1aは上面、1bは下面、3
は搬送チェーン、4は洗浄装置、7は洗浄液、11はブ
ラシ洗浄装置、12は洗浄槽、13はロールブラシ、1
7は第1の液除去装置、21は第1の浸漬・シャワー洗
浄装置、22は第1の浸漬洗浄槽、23,24,43,
44は噴流管、32は第1のシャワー洗浄器、33,3
4,35,53,54,55は噴出管、36は第2の液
除去装置、41は第2の浸漬・シャワー洗浄装置、42
は第2の浸漬洗浄槽、52は第2のシャワー洗浄器、5
6は第3の液除去装置、57は熱風乾燥装置、60は冷
却器、61は新液供給槽、62は加熱器である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention, FIG.
(a), (b) shows the 1st immersion washing tank of FIG. 1, FIG. 2 (a) is a top view, FIG. 2 (b) is I of FIG. 2 (a). FIG. 3 is a cross-sectional view taken along line I, and FIG. 3 is a diagram showing a system in which the cleaning liquid flows. In the figure, 1 is a printed circuit board, 1a is an upper surface, 1b is a lower surface, 3
Is a transport chain, 4 is a cleaning device, 7 is a cleaning liquid, 11 is a brush cleaning device, 12 is a cleaning tank, 13 is a roll brush, 1
7 is a first liquid removing device, 21 is a first immersion / shower cleaning device, 22 is a first immersion cleaning tank, 23, 24, 43,
44 is a jet pipe, 32 is a first shower cleaner, 33, 3
4, 35, 53, 54, 55 are jet pipes, 36 is a second liquid removing device, 41 is a second immersion / shower cleaning device, 42
Is a second immersion cleaning tank, 52 is a second shower cleaning device, 5
6 is a third liquid removing device, 57 is a hot air drying device, 60 is a cooler, 61 is a new liquid supply tank, and 62 is a heater.
Claims (2)
手段によりはんだ付け面を下面に、他の面を上面として
搬送するとともに、洗浄液を含んだロールブラシにより
前記プリント基板の下面を洗浄した後、加圧空気の吹き
付けにより前記プリント基板に付着した洗浄液を除去
し、次いで、前記プリント基板を下降させて前記プリン
ト基板の走行方向に対して反対方向と、前記プリント基
板の走行方向に対して交差し、かつ、前記プリント基板
面と平行な方向とにそれぞれ噴流する洗浄液の中に前記
プリント基板を浸漬して洗浄し、次いで、前記プリント
基板を上昇させるときに洗浄液を吹き付けて前記プリン
ト基板の下面と上面を洗浄し、次いで、加圧空気の吹き
付けにより前記プリント基板に付着した洗浄液を除去
し、次いで、前記プリント基板を熱風により乾燥した
後、冷風により冷却を行うことを特徴とするプリント基
板の洗浄方法。1. A printed circuit board after soldering is transferred by a transfer means with a soldering surface as a lower surface and another surface as an upper surface, and after cleaning a lower surface of the printed circuit board by a roll brush containing a cleaning liquid, The cleaning liquid adhering to the printed circuit board is removed by blowing pressurized air, and then the printed circuit board is lowered to cross the direction opposite to the traveling direction of the printed circuit board and the traveling direction of the printed circuit board. And, the printed circuit board is immersed in a cleaning liquid that jets in a direction parallel to the printed circuit board surface for cleaning, and then, when the printed circuit board is raised, the cleaning liquid is sprayed onto the lower surface of the printed circuit board. The upper surface is cleaned, and then the cleaning liquid adhering to the printed circuit board is removed by blowing pressurized air. After the door substrate is dried by hot air, the printed board cleaning method and performing the cooling by cold air.
だ付け面を下面に、他の面を上面にして搬送手段で各工
程の装置に順次搬送して洗浄する装置であって、 洗浄液を収容した洗浄槽に前記プリント基板の下面を洗
浄するロールブラシを設けたブラシ洗浄装置と;前記プ
リント基板に付着した洗浄液を加圧空気により除去する
液除去装置と;前記プリント基板の搬送方向に対して反
対方向と、前記プリント基板の搬送方向と交差する方向
で該プリント基板面と平行な方向とにそれぞれ洗浄液を
噴流する噴流管を有する浸漬洗浄槽と、前記プリント基
板が前記浸漬洗浄槽から引き上げられた際に前記プリン
ト基板の下面と上面に向けてそれぞれ洗浄液を噴出する
噴出管を有し、これらの噴出管から噴出する洗浄液によ
り洗浄を行うシャワー洗浄器とを設けた浸漬・シャワー
洗浄装置と;前記プリント基板に付着した洗浄液を熱風
により乾燥する熱風乾燥装置と;前記加熱されたプリン
ト基板を冷風により冷却する冷却装置と;を順に配置し
て成り、 前記プリント基板を、前記ブラシ洗浄装置、前記液除去
装置、前記浸漬・シャワー洗浄装置、前記熱風乾燥装
置、前記冷却装置、の順に搬送するとともに、前記浸漬
・シャワー洗浄装置の浸漬洗浄槽の液中に前記プリント
基板を下降して浸漬する機構と、前記液中から上昇させ
て引き上げる機構とを有する搬送手段を備えたことを特
徴とするプリント基板の洗浄装置。2. An apparatus for sequentially cleaning a printed circuit board, which has been soldered, with a soldering surface as a lower surface and another surface as an upper surface, to a device for each step by a transfer means and containing a cleaning liquid. A brush cleaning device provided with a roll brush for cleaning the lower surface of the printed circuit board in a cleaning tank; a liquid removing device for removing cleaning liquid adhering to the printed circuit board by pressurized air; Direction, and an immersion cleaning tank having jet pipes for spraying a cleaning liquid in a direction that intersects with the conveyance direction of the printed circuit board and in a direction parallel to the printed circuit board surface, and the printed circuit board was pulled up from the immersion cleaning tank. In this case, there is a shower pipe for ejecting the cleaning liquid toward the lower surface and the upper surface of the printed circuit board, and the shower cleaning is performed by the cleaning liquid ejected from these ejection pipes. A dipping / shower cleaning device provided with a purifier; a hot-air drying device for drying the cleaning liquid adhering to the printed circuit board with hot air; a cooling device for cooling the heated printed circuit board with cold air; Consist of the brush cleaning device, the liquid removing device, the immersion / shower cleaning device, the hot air drying device, and the cooling device in that order, and the immersion cleaning tank of the immersion / shower cleaning device. An apparatus for cleaning a printed circuit board, comprising: a transporting unit having a mechanism for lowering and dipping the printed circuit board in the liquid, and a mechanism for lifting and raising the liquid circuit board in the liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13128789A JPH0634444B2 (en) | 1989-05-26 | 1989-05-26 | Printed circuit board cleaning method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13128789A JPH0634444B2 (en) | 1989-05-26 | 1989-05-26 | Printed circuit board cleaning method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02310989A JPH02310989A (en) | 1990-12-26 |
| JPH0634444B2 true JPH0634444B2 (en) | 1994-05-02 |
Family
ID=15054431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13128789A Expired - Fee Related JPH0634444B2 (en) | 1989-05-26 | 1989-05-26 | Printed circuit board cleaning method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0634444B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06285440A (en) * | 1992-04-16 | 1994-10-11 | Seikosha Co Ltd | Cleaning and drying apparatus |
| JPH08841U (en) * | 1995-10-17 | 1996-05-21 | 株式会社精工舎 | Washing / drying device |
| CN102227157B (en) * | 2011-04-14 | 2013-08-21 | 北京泰拓精密清洗设备有限公司 | Hairbrush cleaning machine of through type |
-
1989
- 1989-05-26 JP JP13128789A patent/JPH0634444B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02310989A (en) | 1990-12-26 |
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