JPH0635656B2 - Vacuum deposition equipment - Google Patents
Vacuum deposition equipmentInfo
- Publication number
- JPH0635656B2 JPH0635656B2 JP61234422A JP23442286A JPH0635656B2 JP H0635656 B2 JPH0635656 B2 JP H0635656B2 JP 61234422 A JP61234422 A JP 61234422A JP 23442286 A JP23442286 A JP 23442286A JP H0635656 B2 JPH0635656 B2 JP H0635656B2
- Authority
- JP
- Japan
- Prior art keywords
- vapor
- vapor deposition
- metal
- duct
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001771 vacuum deposition Methods 0.000 title claims description 3
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 238000007740 vapor deposition Methods 0.000 claims description 27
- 238000001704 evaporation Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 description 12
- 239000010959 steel Substances 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002436 steel type Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は付着量分布制御が可能な連続真空蒸着装置に関
するものである。TECHNICAL FIELD The present invention relates to a continuous vacuum vapor deposition apparatus capable of controlling the amount distribution of adhered substances.
帯鋼等の基板に連続的に、例えば、亜鉛等の金属をめつ
きする手段として連続式真空蒸着装置が使用されている
が、従来の連続式真空蒸着装置の概略構成を第６図によ
つて説明する。A continuous-type vacuum vapor deposition apparatus is used as a means for continuously depositing a metal such as zinc on a substrate such as a strip steel. The schematic configuration of a conventional continuous-type vacuum vapor deposition apparatus is shown in FIG. I will explain.
図中、１は帯鋼（被蒸着基板）、２は複数のシール室か
らなる真空シール装置、３は蒸着室、４は帯鋼１をガイ
ドして通板させる巻付ロール、７は溶融した金属（亜鉛
等）５の蒸気５ａを真空条件下で発生させ、浴槽６と金
属蒸気５ａを帯鋼１まで導くダクト（チヤンネル）であ
り、連続真空蒸着装置は一般にこれらを主構成要素とし
て構成されている。In the figure, 1 is a strip steel (substrate to be vapor-deposited), 2 is a vacuum seal device composed of a plurality of sealing chambers, 3 is a vapor deposition chamber, 4 is a winding roll for guiding the strip steel 1 to pass, and 7 is a melt. This is a duct (channel) for generating a vapor 5a of a metal (zinc or the like) 5 under a vacuum condition and guiding the bath 6 and the metal vapor 5a to the strip steel 1. Generally, a continuous vacuum vapor deposition apparatus is configured with these as main constituent elements. ing.
帯鋼１に蒸着させるに必要な金属蒸気量（蒸発量）は、
浴槽６内に設置したヒータ８の電力と、浴槽６出口に設
置したシヤツタ９を、例えば、シリンダ等の開閉装置１
０で開閉して開口部１１の面積を変えることにより制御
できる如く構成されている。The amount of metal vapor (evaporation amount) necessary for vapor deposition on the strip steel 1 is
The electric power of the heater 8 installed in the bathtub 6 and the shutter 9 installed at the outlet of the bathtub 6 are connected to, for example, a switchgear 1 such as a cylinder.
It is constructed so that it can be controlled by opening and closing at 0 and changing the area of the opening 11.
前記、浴槽６への溶融金属５は蒸着室３下部の溶解炉１
２から圧力差によりスノーケル１３を介して吸引・供給
される。The molten metal 5 in the bath 6 is melted in the melting furnace 1 below the vapor deposition chamber 3.
2 is sucked and supplied through the snorkel 13 due to the pressure difference.
蒸着室３は管１４及び弁１５を介して真空ポンプ１６に
接続し、通常、溶融金属５の飽和蒸気圧力より低い圧力
に窒素(N2)等の不活性ガスを介して保持されている。な
お、図中、矢印Ｚは金属蒸気５ａの流れ方向を示す。The vapor deposition chamber 3 is connected to a vacuum pump 16 via a pipe 14 and a valve 15, and is usually maintained at a pressure lower than the saturated vapor pressure of the molten metal 5 via an inert gas such as nitrogen (N 2 ). In the figure, the arrow Z indicates the flow direction of the metal vapor 5a.
以上の構成であるから、運転に際しては、製造指令（鋼
種、板巾、板厚、通板速度、目標蒸着量等）にもとづい
て設定された蒸着速度（単位面積、単位時間当りの蒸着
量）に対応して蒸着室３の圧力を設定すると共に、蒸着
金属の所要蒸発量に対応させてヒータ８の電力とシヤツ
タ９開度を調整することにより帯鋼１表面の蒸着量、す
なわち、蒸着膜厚を目標値に制御するものである。Because of the above configuration, during operation, the vapor deposition rate (unit area, vapor deposition amount per unit time) set based on the manufacturing instruction (steel type, strip width, strip thickness, stripping speed, target vapor deposition amount, etc.) The pressure of the vapor deposition chamber 3 is set corresponding to the above, and the amount of vapor deposition on the surface of the strip steel 1, that is, the vapor deposition film The thickness is controlled to a target value.
しかしながら、前記装置では、金属蒸気５ａがシヤツタ
９の開口部１１を通過した後、ダクト７内での流れが乱
れるため帯鋼１表面の蒸着金属の膜厚分布が不均一とな
り、とくに、板幅方向の分布に関しては、第４、５図の
実機における計測データ中、点線a1，a2で示す如く、大
きなばらつきが発生し、メツキ製品の品質低下ならび
に、蒸着むらによる蒸着金属の歩留りが低下するという
問題があつた。However, in the above-mentioned apparatus, after the metal vapor 5a passes through the opening 11 of the shutter 9, the flow in the duct 7 is disturbed, so that the film thickness distribution of the vapor-deposited metal on the surface of the strip steel 1 becomes uneven, and particularly, the plate width Regarding the directional distribution, as shown by the dotted lines a 1 and a 2 in the measured data of the actual machine in Figs. 4 and 5, there is a large variation, and the quality of the plated product deteriorates and the yield of evaporated metal decreases due to uneven deposition. There was a problem of doing.
本発明は、かかる問題に鑑みて提案されたものであつ
て、つねに膜厚分布を均一に制御し、メツキ成品の品質
向上を図ると共に、蒸着金属の歩留りを向上させコスト
低減が可能な連続式真空蒸着装置を提案せんとするもの
である。The present invention has been proposed in view of such a problem, always controlling the film thickness distribution uniformly, while aiming to improve the quality of the finished product, improve the yield of the deposition metal and reduce the cost continuously. The purpose is to propose a vacuum deposition apparatus.
本発明は、前記問題を解決するために、ダクト（チヤン
ネル）内に、金属蒸気の流れ方向Ｚに直角に、多孔板か
らなる整流板を１枚以上取付けて、金属蒸気の流れを均
一化させることにより、蒸着膜厚分布を均一にする如く
真空蒸着装置を構成させたものである。According to the present invention, in order to solve the above problem, one or more straightening vanes, which are perforated plates, are attached in a duct (channel) at right angles to the flow direction Z of metal vapor to make the flow of metal vapor uniform. As a result, the vacuum vapor deposition apparatus is configured so as to make the vapor deposition film thickness distribution uniform.
すなわち本発明は真空条件下で溶融金属を蒸発させる浴
槽と、該金属蒸気を被蒸着基板まで導くダクトと、前記
浴槽の出口にあつて、その開口面積を自在に制御し得る
シヤツタとを具備してなる連続真空蒸着装置において、
前記ダクト内に金属蒸気の流れ方向に対し直角に、かつ
適宜間隔をおいて少くとも１枚以上の多孔板からなる整
流板を取付けてなることを特徴とする真空蒸着装置であ
る。That is, the present invention comprises a bath for evaporating the molten metal under vacuum conditions, a duct for guiding the metal vapor to the substrate to be vapor-deposited, and a shutter capable of freely controlling the opening area of the outlet of the bath. In the continuous vacuum evaporation system consisting of
The vacuum vapor deposition apparatus is characterized in that a rectifying plate composed of at least one perforated plate is attached in the duct at right angles to the flow direction of the metal vapor and at appropriate intervals.
シヤツタの開閉によりその開口面積が設定され、所定量
の金属蒸気は整流板によりその流れを均一化されて被蒸
着基板上に均一に蒸着される。The opening area of the shutter is set by opening and closing the shutter, and the flow of the predetermined amount of metal vapor is made uniform by the straightening plate, and the metal vapor is evenly deposited on the deposition target substrate.
以下、図面によつて本発明をより具体的に説明する。 Hereinafter, the present invention will be described more specifically with reference to the drawings.
第１図は本発明の一実施例に係る連続式真空蒸着装置の
蒸着室及び蒸発槽の概略構成図、第２、３図は、それぞ
れ、第１図中Ａ−Ａ及びＢ−Ｂ矢視による整流板の正面
図を示すが、図中、従来装置（第６図）と同一部材には
同一符号を付し、重複する詳細構成説明は省略する。FIG. 1 is a schematic configuration diagram of a vapor deposition chamber and an evaporation tank of a continuous vacuum vapor deposition apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are views taken along arrows AA and BB in FIG. 1, respectively. 2 is a front view of the current plate according to the present invention. In the figure, the same members as those in the conventional device (FIG. 6) are designated by the same reference numerals, and the detailed description of the overlapping configurations will be omitted.
本発明装置は、従来装置（第１図）におけるダクト７内
に、金属蒸気５ａの流れ方向Ｚに対し直角に、かつ、適
宜間隔をおいて、少なくとも１枚以上（例示の場合は２
枚）の多孔板からなる整流板２０ａ，２０ｂを取付け
て、ダクト７内の金属蒸気５ａの流れを均一に整流させ
ることによつて、蒸着膜厚分布を均一化せんとするもの
である。ここで整流板の設置枚数、孔の配列及び数量に
関しては、本出願人が実機において種々実験の結果決定
されたもので、実験結果では、整流板の枚数は多いほど
膜厚分布の均一化の効果は大きくなるも、金属蒸気６ａ
の圧力損失が増大して、所要の蒸発量が得られなくなる
ことから結局蒸発量の程度に応じて適当な枚数にするこ
とが必要である。従つて、ここでは２枚の場合について
述べることとする。The device of the present invention includes at least one sheet (2 in the example shown) in the duct 7 of the conventional device (FIG. 1) at right angles to the flow direction Z of the metal vapor 5a and at appropriate intervals.
The distribution film thickness distribution is not made uniform by attaching the flow regulating plates 20a and 20b made of a perforated plate and uniformly regulating the flow of the metal vapor 5a in the duct 7. Here, the number of rectifying plates to be installed, the arrangement and the number of holes are determined by the applicant as a result of various experiments in an actual machine, and the experimental result shows that the more the number of rectifying plates is, the more uniform the film thickness distribution becomes. Although the effect is large, metal vapor 6a
Since the pressure loss of 1 increases and the required amount of evaporation cannot be obtained, it is necessary to properly adjust the number of sheets according to the degree of evaporation. Therefore, the case of two sheets will be described here.
前記、２枚の整流板２０ａ及び２０ｂのうち、巻付ロー
ル４側の整流板２０ａは、第２図に示す如く、多数の孔
２１を、ほぼ等ピツチで千鳥状に板の全面にわたつて貫
設する。一方、シャツタ１０側の整流板２０ｂは前記整
流板２０ａと同一であるか、あるいは望ましくは第３図
に示す如く、シヤツタ１０の取付位置及び標準開度に対
応して、孔２１の配列及びピツチを局部的に変更してい
る。Of the two straightening vanes 20a and 20b, the straightening vane 20a on the side of the winding roll 4 has a large number of holes 21 in a zigzag pattern over the entire surface of the plate as shown in FIG. To pierce. On the other hand, the straightening plate 20b on the side of the shirt 10 is the same as the straightening plate 20a, or preferably, as shown in FIG. 3, the arrangement and the pitch of the holes 21 correspond to the mounting position and the standard opening of the shutter 10. Has been changed locally.
第３図の場合はシヤツタ１０の取位置及び開口位置はダ
クト７の上部にあるため、これに対応して整流板２０ｂ
の孔２１の上部数段（例示の場合は３段）は１段おきに
開口せず、板上部の開口比を下部の開口比より小さくす
る。従つて、両整流板２０ａ，２０ｂの開口面積比を、
それぞれ、ma，mbとするとma＞mbとなる。このように開
孔することによつて蒸着膜厚分布が第４、５図中実線
b1，b2で示すすように、従来装置の場合の分布曲線a1，
a2にくらべて、良好な均一度が得られることが実機にお
いて立証された。第４図は目標蒸着膜厚が３０μ、第５
図は５０μの場合の板幅方向の膜厚分布の実測値を示
す。In the case of FIG. 3, the take-off position and the opening position of the shutter 10 are located at the upper part of the duct 7.
The upper few stages (three stages in the illustrated example) of the holes 21 are not opened every other stage, and the aperture ratio of the plate upper part is made smaller than the aperture ratio of the lower part. Therefore, the opening area ratio of both rectifying plates 20a and 20b is
If m a and m b are respectively satisfied , then m a > m b . By forming the holes in this way, the vapor deposition film thickness distribution is shown by the solid line in FIGS.
As shown by b 1 and b 2 , the distribution curves a 1 and
It was proved in the actual machine that good uniformity was obtained compared to a 2 . Fig. 4 shows the target deposition thickness of 30μ,
The figure shows the measured value of the film thickness distribution in the plate width direction in the case of 50 μm.
以上詳細に説明したように本発明装置では、金属蒸気
（zn等）６ａを蒸着基板（帯鋼等）の蒸着面へ導くダク
ト（チヤンネル）７内に金属蒸気５ａの流れ方向Ｚに直
角に多孔板からなる１枚以上の整流板２０ａ，２０ｂを
取付けて、金属蒸気５ａのダクト７内の流れの乱れを均
一に整流することによつて、蒸着膜厚を均一化すること
が可能となり、めつき製品の品質向上ならびに蒸着金属
（Zn等）５の歩留りを向上させコスト低減を図ることが
できた。As described above in detail, in the device of the present invention, the metal vapor (zn or the like) 6a is perforated at right angles to the flow direction Z of the metal vapor 5a in the duct (channel) 7 that guides it to the vapor deposition surface of the vapor deposition substrate (steel strip or the like). By attaching one or more straightening vanes 20a, 20b made of plates to uniformly rectify the turbulence of the flow of the metal vapor 5a in the duct 7, it is possible to make the vapor deposition film thickness uniform. It was possible to reduce the cost by improving the quality of attached products and the yield of evaporated metal (Zn, etc.) 5.
第１図は本発明の一実施例に係る連続式真空蒸着装置の
概略構成図、第２及び３図は、それぞれ、第１図中Ａ−
Ａ及びＢ−Ｂ矢視による整流板の正面図、第４、５図
は、実機における板幅方向の蒸着膜厚分布曲線の計測デ
ータ、第６図は従来の連続式真空蒸着装置の概略構成図
を示す。 １……蒸着基板、３……蒸着室、４……巻付ロール、５
……蒸着金属、５ａ……金属蒸気、６……浴槽、７……
ダクト、９……シヤツタ、１１……開口部、20a，２０
ｂ……整流板、Ｚ……金属蒸気の流れ方向。FIG. 1 is a schematic configuration diagram of a continuous vacuum vapor deposition apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are A- in FIG. 1, respectively.
A and BB front views of the straightening vane viewed from the arrows, FIGS. 4 and 5 are measurement data of a vapor deposition film thickness distribution curve in an actual machine in a plate width direction, and FIG. 6 is a schematic configuration of a conventional continuous vacuum vapor deposition apparatus. The figure is shown. 1 ... Evaporation substrate, 3 ... Evaporation chamber, 4 ... Winding roll, 5
…… Vapor-deposited metal, 5a …… Metal vapor, 6 …… Bath, 7 ……
Duct, 9 ... Shutter, 11 ... Opening, 20a, 20
b ... current plate, Z ... flow direction of metal vapor.
フロントページの続き (72)発明者 加藤 光雄 広島県広島市西区観音新町４丁目６番22号 三菱重工業株式会社広島研究所内 (72)発明者 田口 俊夫 広島県広島市西区観音新町４丁目６番22号 三菱重工業株式会社広島研究所内 (72)発明者 平井 悦郎 広島県広島市西区観音新町４丁目６番22号 三菱重工業株式会社広島研究所内 (72)発明者 築地 憲夫 大阪府堺市石津西町５番地 日新製鋼株式 会社阪神研究所内 (72)発明者 愛甲 琢哉 大阪府堺市石津西町５番地 日新製鋼株式 会社阪神研究所内 (72)発明者 森山 義輝 大阪府堺市石津西町５番地 日新製鋼株式 会社阪神製造所内 (72)発明者 伊藤 武彦 東京都千代田区丸の内３丁目４番１号 日 新製鋼株式会社内 (56)参考文献 特開 昭61−73875（ＪＰ，Ａ) 特開 昭60−21379（ＪＰ，Ａ) 特開 昭57−174458（ＪＰ，Ａ)Front page continuation (72) Inventor Mitsuo Kato 4-6-22 Kannon Shinmachi, Nishi-ku, Hiroshima City, Hiroshima Prefecture Mitsubishi Heavy Industries, Ltd. Hiroshima Research Institute (72) Inventor Toshio Taguchi 4-22 Kannon-shinmachi, Nishi-ku, Hiroshima City, Hiroshima Prefecture No. Mitsubishi Heavy Industries, Ltd. Hiroshima Research Institute (72) Inventor Etsuro Hirai 4-6-22 Kannon Shinmachi, Nishi-ku, Hiroshima-shi, Hiroshima Prefecture Mitsubishi Heavy Industries Ltd. Hiroshima Research Institute (72) Norio Tsukiji 5 Ishizu Nishimachi, Sakai City, Osaka Prefecture Nisshin Steel Co., Ltd.Hanshin Research Center (72) Inventor Takuya Aiko 5 Ishizu Nishimachi, Sakai City, Osaka Prefecture Nisshin Steel Co., Ltd. Hanshin Research Center (72) Inventor Yoshiteru Moriyama 5th Ishizu Nishimachi, Sakai City, Osaka Nisshin Steel Co., Ltd. Company Hanshin Works (72) Inventor Takehiko Ito 3-4-1, Marunouchi, Chiyoda-ku, Tokyo Nisshin Steel Co., Ltd. (56) Reference JP 61-73875 (JP, A) JP 60-21379 (JP, A) JP-A-57-174458 (JP, A)
Claims (1)
と、該金属蒸気を被蒸着基板まで導くダクトと、前記浴
槽の出口にあつて、その開口面積を自在に制御し得るシ
ヤツタとを具備してなる連続真空蒸着装置において、前
記ダクト内に金属蒸気の流れ方向に対し直角に、かつ適
宜間隔をおいて少くとも１枚以上の多孔板からなる整流
板を取付けてなることを特徴とする真空蒸着装置。1. A bath for evaporating molten metal under vacuum conditions, a duct for guiding the metal vapor to a substrate to be vapor-deposited, and a shutter capable of freely controlling the opening area of the outlet of the bath. In the continuous vacuum vapor deposition apparatus configured as described above, a straightening plate composed of at least one perforated plate is attached in the duct at right angles to the flow direction of the metal vapor and at appropriate intervals. Vacuum deposition equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61234422A JPH0635656B2 (en) | 1986-10-03 | 1986-10-03 | Vacuum deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61234422A JPH0635656B2 (en) | 1986-10-03 | 1986-10-03 | Vacuum deposition equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6389651A JPS6389651A (en) | 1988-04-20 |
| JPH0635656B2 true JPH0635656B2 (en) | 1994-05-11 |
Family
ID=16970770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61234422A Expired - Fee Related JPH0635656B2 (en) | 1986-10-03 | 1986-10-03 | Vacuum deposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635656B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006111926A (en) * | 2004-10-15 | 2006-04-27 | Hitachi Zosen Corp | Vapor deposition equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0378890A (en) * | 1989-08-23 | 1991-04-04 | Fuji Electric Co Ltd | Display method for tabular document information |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57174458A (en) * | 1981-04-22 | 1982-10-27 | Mitsubishi Heavy Ind Ltd | Construction of vessel for evaporating source |
| JPH062942B2 (en) * | 1983-07-18 | 1994-01-12 | 三菱重工業株式会社 | Vacuum deposition equipment |
| JPS6173875A (en) * | 1984-09-17 | 1986-04-16 | Mitsubishi Heavy Ind Ltd | Vacuum depositing apparatus provided with plate for regulating width of path |
-
1986
- 1986-10-03 JP JP61234422A patent/JPH0635656B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006111926A (en) * | 2004-10-15 | 2006-04-27 | Hitachi Zosen Corp | Vapor deposition equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6389651A (en) | 1988-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4394236A (en) | Magnetron cathode sputtering apparatus | |
| JPS6365755B2 (en) | ||
| KR890002745B1 (en) | Continuous vacuum deposition apparatus with control panels for regulating width of vapor flow | |
| JPS6410592B2 (en) | ||
| JPH0635656B2 (en) | Vacuum deposition equipment | |
| KR940001031B1 (en) | Vacuum deposition equipment | |
| JPH0735567B2 (en) | Continuous vacuum deposition equipment | |
| JPH0735566B2 (en) | Continuous vacuum deposition equipment | |
| JPS58100675A (en) | Method and device for continuous vapor deposition | |
| JP3901773B2 (en) | Vacuum deposition equipment | |
| JPH027394B2 (en) | ||
| JPH06102828B2 (en) | Strip coating device | |
| JPH0379747A (en) | Molten metal plating apparatus | |
| JPH0730450B2 (en) | Continuous vacuum deposition equipment | |
| JPH0660396B2 (en) | Method for producing alloyed vapor-deposited zinc plated steel strip | |
| JPS61261477A (en) | Vacuum deposition furnace | |
| JPS6296669A (en) | Manufacture of galvanizing steel sheet by alloying vapor deposition | |
| JPS6350472A (en) | Vacuum deposition device | |
| JP2712118B2 (en) | Continuous electrolytic treatment of steel strip | |
| JPS58130273A (en) | Vacuum evaporation device | |
| JPH01219157A (en) | Formation of extra thin metallic vapor-deposited film | |
| JPH05339706A (en) | Equipment for vacuum vapor deposition plating | |
| JPH062942B2 (en) | Vacuum deposition equipment | |
| JPH03104849A (en) | Alloying furnace for hot dip metal plating | |
| JPH0293054A (en) | Production of hot dip galvanized steel sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |