JPH0636310B2 - Magnetic bubble memory module - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a magnetic bubble memory module, and in particular,
A bubble chip is placed at a position surrounded by a rectangular ring-shaped core having windings on two opposite sides, and the bubble chip is electrically connected to a wiring board. The bubble chip, the winding and the core are connected by a conductor shield case. Covered magnetic bubble memory module.

[Background of the Invention]

With regard to this type of magnetic bubble memory module, for example, a prior application of Japanese Patent Publication No. 57-19517 of the applicant of the present invention is known. FIG. 4 is a partially cutaway perspective view showing an example of a magnetic bubble memory obtained by further improving the known magnetic bubble memory module, and FIG. 5 is a sectional view of the same.

A bubble chip 1 is surrounded by a rectangular ring-shaped core 3. Reference numeral 2 is a winding wire provided on each side of the rectangular annular core 3. The conductor shield case 4 covers the above-mentioned components.

Reference numeral 5 is a magnet plate, and 6 is a magnetic compensating plate, which are arranged above and below the bubble chip 1, and a rectangular cylindrical magnetic shield case 7 (only the upper one is shown in FIG. 4) is formed almost entirely. It's wrapped.

The bubble chip 1 is electrically connected to the external terminal T via the flexible wiring board 8. The bubble chip 1 and the flexible wiring board 8 are connected and electrically connected by a wire 9.
In the magnetic bubble memory module, the wire 9 is formed into a shallow U-shape because of the bonding operation for connecting the wire 9 to the bubble chip 1 so as to make them conductive (inverted U-shape in FIG. 5). Attached to the shape).

In order to fix the relative positions of the constituent members connected by the U-shaped wire 9 described above, it is necessary to provide a reinforcing member including a reinforcing bottom plate 10a, a reinforcing spacer 10b, and a reinforcing lid plate 10c. Since such a reinforcing structure must be provided, it is difficult to make the module thinner and smaller, and the performance is impaired for the following reasons.

That is, since the reinforcing member is provided, the gap length l _g of the magnetic circuit is increased, and the surface area S and the internal volume v of the conductor shield case 4 are increased.

The required driving current I increases in proportion to the gear length l _g . At this time, the power consumption P increases in proportion to the square of the drive current I.

P∝I ² ∝l ² _g …………………… (1) Moreover, the power consumption P increases in proportion to the surface area S.

P∝S ………………………… (2) Also, the VI product increases in proportion to the internal volume v.

VI ∝v ……………………………… (3) [Object of the invention] The present invention has been made in view of the above circumstances, and is intended to reduce the size and thickness of the magnetic bubble memory. If possible, it is intended to contribute to the reduction of the power consumption and the VI product of the magnetic bubble memory.

[Outline of Invention]

Next, the basic principle of the present invention will be briefly described. In the structure of the module shown in FIG. 5, the wire 9 had to be formed into a U-shape due to the bonding operation. However, if the wire 9 is replaced with a metal foil, it does not give an extra curvature. However, the connection can be conducted by using a known technique. If a metal foil that does not bend is used, the required installation volume is significantly reduced compared to the case where the U-shaped wire 9 is used. Further, when the bubble chip 1 is brought into contact with and fixed to the conductor shield case 4, the overall structure of the magnetic bubble memory module is further reduced in size and thickness. Based on the above principle, the above-mentioned purpose (power consumption and VI
In the magnetic bubble memory module according to the present invention, a bubble chip is arranged at a position surrounded by a rectangular ring-shaped core having windings on two opposite sides, and the bubble chip is wired. In a magnetic bubble memory module that is electrically connected to a substrate and has the bubble chip, the winding and the core covered with a conductor shield case, the wiring substrate and the bubble chip are electrically connected using a metal foil, and The feature is that the bubble chip is fixed directly on the conductor shield case.

Example of Invention

Next, one embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a sectional view of a magnetic bubble memory module of this embodiment, and 4 is a conductor shield case. FIG. 2 is a plan view drawn with the conductor shield case 4 removed.

As shown in FIG. 1, the core 3 is provided with the winding 2, and the winding 2 is positioned in the area surrounded by the winding 2, so that the bubble chip 1 is directly fixed on the conductor shield case 4. In the present invention, "on the conductor case" means that the conductor shield is brought into contact with the surface of the conductor shield, and does not limit the vertical relationship with respect to the earth.

8 is a flexible substrate, which is a copper foil through an insulating film 16.
15 are stacked. Copper foil leads 14 are laid between the laminated copper foil 15 and the bubble chip 1, and bumps 13 and 17 are provided at both ends of the copper foil leads 14 to connect them and make them conductive.

When carrying out the present invention, a gold foil lead, a gold plated foil lead, or the like may be used instead of the copper foil lead 14.

According to this embodiment, since the bubble chip 1 and the flexible wiring board 8 can be supported by the conductor shield case 4 and the conductor shield case 4 can be used as a packaging case, the conventionally used reinforcing plate is unnecessary.

Further, as shown in FIG. 1, since the bubble chip 1 is directly fixed on the conductor shield case 4, the magnetic bubble memory module is thin.

As described above, when the bubble chip is connected using a wire, bonding cannot be performed unless the wire is curved and formed in a U shape. However, when the metal foil lead is used as in this example, this metal foil lead is particularly Since the bonding can be performed without actually bending it, the illustrated gear gap size G can be significantly reduced. As a result, the surface area S and the internal volume v of the conductor shield case 4 decrease, so that the formula (1), the formula
From (2) and equation (3), low power consumption and low VI product are achieved.

FIG. 3 shows another embodiment of the present invention.

The flexible wiring board 8 of this example has a laminated structure of a bubble chip 1 having bumps 13 formed thereon, a copper foil 15 and an insulating film 16, and a copper foil lead 19 is formed on the copper foil 15 at the end to be integrated. The wiring board 8 has a structure and is electrically connected to the copper foil leads 19 by the bumps 13.

According to this embodiment, since the copper foil leads 19 are integrated with the flexible wiring board 8, the bonding process for reducing the number of electrical connection points by half compared to the case where individual copper foil leads are used is facilitated. ing. Further, since the space at the connecting portion between the copper foil 15 and the copper foil lead 19 is unnecessary, the core gear cut length l _g ′ can be shortened in the drive magnetic circuit structure for supplying the rotating magnetic field. As a result, the drive current I can be reduced from the equation (1), and a significant reduction in power consumption is achieved.

〔The invention's effect〕

As described in detail with respect to each of the above embodiments, when the present invention is applied, the gap length l _g of the magnetic circuit, the surface area S of the conductor shield case, and the internal volume v of the magnetic circuit can be significantly reduced. It has an excellent practical effect that the power consumption and the VI product can be reduced while the size and thickness are reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of one embodiment of a magnetic bubble memory module of the present invention, and FIG. 2 is a plan view of the above embodiment with the conductor shield case removed. FIG. 3 is a sectional view of an embodiment different from the above. FIG. 4 is a perspective view of the magnetic bubble memory module of the prototype, partially cut away, and FIG.
The figure is a cross-sectional view of the above-mentioned trial. 1 ... Bubble chip, 2 ... Winding, 3 ... Rectangular annular core, 4 ... Conductor shield case, 5 ... Magnet plate, 6 ...
... Magnetic shunt plate, 7 ... Magnetic shield case, 8 ... Flexible wiring board, 9 ... Wire, 10a ... Reinforcement bottom plate, 10b
…… Reinforcement spacer, 10c …… Reinforcement cover plate, 13 …… Bump,
14 …… Copper foil lead, 15 …… Copper foil, 16 …… Insulating film,
17 …… Bump, 18 …… Leader wire, 19 …… Copper foil lead.

Claims (1)

[Claims] 1. A bubble chip is arranged at a position surrounded by a rectangular ring-shaped core having windings on opposite two sides, and the bubble chip is electrically connected to a wiring board. ， In a magnetic bubble memory module in which a winding and a core are covered with a conductor shield case, the wiring board and the bubble chip are electrically connected using a metal foil, and the bubble chip is directly fixed on the conductor shield case. A magnetic bubble memory module characterized by the above.