JPH0636387B2 - Socket - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a socket for accommodating a semiconductor device, and more particularly to a technique effectively used when inspecting a semiconductor device.

[Background technology]

At present, the production amount of semiconductor devices (hereinafter, simply referred to as IC) is rapidly increasing, so that how to efficiently remove defective ICs has become a problem. By the way, for example, in order to inspect an IC of a flat type package, it is possible to use a socket S as shown in FIGS. 1 and 2. (See Japanese Patent Application No. 57-149347). In the figure, reference numeral 1 denotes an electrical connection terminal having a spring function corresponding to the number of exposed leads 10 of the IC 7, which is fixedly arranged in a box-shaped frame body 2 for housing the IC 7. In addition, in this electrical connection terminal 1, the spring portion 3 is bent outward with a certain length, that is, in the socket outer peripheral direction so that a suitable load is applied to the lead 10 of the IC 7 (FIG. 2). 4 connects the lead 10 of the IC 7 to the electrical connection terminal 1 and appropriately connects the lead 10 and the connection terminal 1 to each other.
It is a lid part provided in the socket in order to obtain the connecting force of the IC 7 and the holding force of the IC 7. However, when a socket having such a structure is used, the socket requires a very large volume as compared with the size of the IC itself, and therefore, when performing inspections such as sorting and aging, more ICs can be processed at once. It was difficult to inspect. Therefore, the inventor
As a result of diligent examination as to whether the socket can be miniaturized, as can be seen from FIG. 2, the spring portion 3 of the electrical connection terminal 1 is bent in the socket outer peripheral direction, that is, outward in both directions A and B of FIG. As a result, the electrical connection terminal 1
The present inventor has noticed that the volume of the socket is large and the volume of the socket is correspondingly large. for that reason,
The present inventor has found that the socket is much larger than the size of the IC itself.

[Object of the Invention]

An object of the present invention is to provide a technique capable of miniaturizing a socket.

An object of the present invention is to provide a technique by which more electronic components can perform inspections such as selection and aging.

Another object of the present invention is to provide a technique capable of improving the throughput of inspection such as selection and aging.

The above and other objects and novel characteristics of the present invention are
It will be apparent from the description of the present specification and the accompanying drawings.

[Outline of Invention]

The outline of a typical one of the inventions disclosed in the present application will be briefly described as follows.

That is, a semiconductor device, that is, an IC, has a sealing body having a quadrilateral outer surface and a plurality of leads protruding from the four outer surfaces of the sealing body.
A plurality of Cs are housed in the socket body while being arranged at predetermined intervals. Electrical connection terminals are attached to the socket body so as to correspond to the leads provided so as to project from the four outer surfaces. The electrical connection terminals that are electrically connected to the leads that protrude from the two outer surfaces that are parallel to each other among the four outer surfaces are bent outward from the connection portion with the leads. A spring portion is formed. And the other two in the direction intersecting with the two outer surfaces
The electrical connection terminals, which are electrically connected to the leads protruding from the two outer surfaces, are formed with spring portions that are bent inwardly of the connection portions with the leads. As a result, the size of the socket body for accommodating the IC can be shortened, so that the size of the socket can be reduced. Furthermore, when performing inspections such as selection and aging, it is possible to arrange more sockets in the inspection device and inspect more ICs, thus improving inspection throughput.

[Embodiment 1] FIG. 3 shows a flat type IC which is an embodiment of the present invention.
Top view of a socket that can be used for
Sectional view in _X 2 -X ₂ line in FIG., Fig. 5 of FIG. 3 Y
It is a cross-sectional view of ₂ -Y ₂ line.

As shown in FIG. 5, the flat type IC, that is, the semiconductor device 7, has a sealing body 7a having a quadrangular outer surface, and a plurality of leads protruding from each outer surface of the sealing body 7a. As shown in FIG. 3, they are housed in the frame body, that is, the socket body 8 and arranged at predetermined intervals.

As shown in FIG. 3, the arrangement direction is C, and the direction intersecting this is indicated by D.

The electrical connection terminals 5 are attached to the socket body 8 in correspondence with the number of leads 10 protruding from the sealing body 7a of the IC 7. Of the four outer surfaces of the IC 7, the electrical connection terminal 5 electrically connected to the lead 10 protruding from the outer surface parallel to the arrangement direction C is connected to the lead as shown in FIG. A spring portion 6 is formed which is bent inwardly of the portion. Due to the spring portion 6, an appropriate load is applied to the leads 10 that come into contact with the respective electrical connection terminals 5.

FIG. 4 is a diagram showing the electrical connection terminals 5 electrically connected to the leads 10 protruding from the two outer surfaces of the IC 7 in the direction D intersecting the arrangement direction C on the outer surface thereof.
As shown in FIG. 4, this electrical connection terminal 5 has
Spring part 6 bent outward from the connection part with the lead
Are formed.

As described above, the electrical connection terminals 5 connected to the leads 10 protruding from the two outer surfaces of the four outer surfaces of the sealing body 7a of the IC 7 which are parallel to the arrangement direction C have Also, since the spring portion 6 bent inward is formed and the spring portion 6 bent outward is formed on the other two outer surfaces, the contact between the connection terminals is prevented, and the D direction The dimension H occupied by the electrical connection terminal 5 can be reduced as much as possible.

A lid portion 9 is provided on the socket body 8, and the leads 9 of the IC 7 and the electrical connection terminals 5 are appropriately connected by the lid portion 9.

In this embodiment, the electrical connection terminal 5 electrically connected to the lead 10 protruding from the outer surface parallel to the arrangement direction C is provided with the spring portion 5 bent inward from the connection portion with the lead. Although the dimension in the D direction is shortened as it is formed, the dimension in the C direction may be shortened as in the embodiment described below.

[Embodiment 2] FIG. 6 is a schematic perspective view of an aging apparatus which is an example of the case where the socket shown in Embodiment 1 is applied, FIG.
The figure is a partial cross-sectional view of the main part of the aging device.
As shown in FIG. 6, the aging device 11 is provided with a measuring unit 12, and the inside of the measuring unit 12 is controlled and maintained at a desired temperature by heating or cooling means (not shown). . An aging board 14 having a plurality of socket bodies 13 arranged in a matrix on the main surface is housed in the measuring section 12. The aging boards 14 are arranged in multiple rows in the measuring unit 12, and the aging boards 14 are attached to the guide member 15.
Is held in a state where it is slid and fitted. 1
Reference numeral 6 denotes a connector, which is electrically connected to a connector pin provided on an aging board described later. Further, the wiring 17 from the connector 16 is connected to a tester (not shown) so that the voltage and the like required for aging can be controlled and the aging result can be analyzed. Reference numeral 18 is a door for shutting off the temperature atmosphere in the measuring unit 12 from the outside. FIG. 7 shows the aging board 14.
FIG. 4 is a partial side cross-sectional view showing a case where a plurality of socket bodies 13 shown in FIG. 3 are arranged above in the Y ₂ -Y ₂ direction. That is, in the embodiment shown in FIG. 7, the electrical connection terminals 5 connected to the leads protruding from the two outer surfaces in the direction intersecting with the arrangement direction are connected to the leads as shown in the drawing. Also, a spring portion 6 bent inward is formed. In contrast, in the above embodiment, the socket body 13, Y ₂ -Y ₂ direction of a series of electrical connecting terminals 5
Since the bending direction of the spring part 6 of is inward,
_The length H occupied by the electrical connection terminals 5 in the _2- Y ₂ direction becomes very small, and as a result, the individual socket body lengths G
Is getting shorter. Therefore, when arranged on aging substrate 14 to the socket body 13, Y ₂ -Y ₂ direction of the socket sequence number, since it increases, so does the number of IC that can be measured with a single aging substrates.

Next, the operation will be described. First, the aging board 14
The IC 7 which is the object to be inspected is housed in each of the upper socket bodies 13 so that each lead 10 is properly connected to the corresponding electrical connection terminal 5, and the lid 9 leads 1 of the IC 7 to each other.
0 and an appropriate load on the electrical connection terminal 5 and I
Hold C7. At this time, since the sockets are downsized, more sockets are arranged on one aging board 14. After that, the aging board 14 on which the IC 7 is mounted is mounted on the guide portion 15 in the measuring portion 12.
Is inserted to connect the connector 16 to the connector pin 19 provided on the aging board 14. When the aging board 14 is completely stored, the door 18 is closed and the measuring unit 12
After the internal temperature is maintained at a desired temperature, aging, inspection, etc. are performed using a tester (not shown).

[Embodiment 3] FIG. 8 is a configuration diagram of a semiconductor device which can be used for a socket which is an embodiment of the present invention.

In FIG. 8, it is a plastic-sealed flat package type IC, and has a plurality of leads 26A to 26C protruding from the sealing body of the ICs 25A to 25C. Reference numeral 23 is a hole provided in the lead frame 24 for positioning and carrying. Such a plurality of ICs are held in a multiple state by a lead frame, but they are separated after inspection and measurement.

Figure 9 is a top view of a socket according to an embodiment of the present invention for accommodating the semiconductor device shown in FIG. 8, FIG. 10, the Y ₃
Sectional view taken -Y ₃ line, 11 _is a cross-sectional view in X 2 -X ₂ line.

In FIG. 9, reference numeral 27 denotes the semiconductor device, that is, the lead frame 24 holding the ICs in a multiple state,
Further, it is a socket having a positioning function for the lead frame 24. Reference numeral 28 denotes a metal electrical connection terminal corresponding to the lead 26 of the IC 25 arranged in the E direction. The connection terminal 28 is bent with a certain length so that it can be properly connected to each lead. The spring portion 29 is provided. Reference numeral 30 is an electrical connection terminal arranged in the F direction intersecting with the E direction. The connection terminals 28, 3
The other end which is not connected to the 0 lead is connected to a tester or the like. As can be seen from FIG. 11, in this embodiment, the lead frame 24 is housed in the E direction, and the spring portions 29 of the adjacent electrical connection terminals 28 in the E direction reduce the length in the E direction. Therefore, in the connection terminal 28 in the E direction, the spring portion 29 of the connection terminal, which is connected to each of the opposing leads via the sealing body, is bent inward. As described above, the present invention can be applied to a case where a plurality of ICs arranged at predetermined intervals are housed in one socket main body 27 before the large number of ICs 25 are separated from the lead frame 24.

Next, a state in which the IC is stored in the socket of this embodiment will be described.

A semiconductor chip (not shown) is sealed by the sealing body, and unnecessary leads are removed, and a predetermined number of ICs shown in FIG.
The lead frame 24 having the above is inserted into the socket main body 27 shown in FIG. The lead 26 of the IC 25 and the socket body 27 are formed by the positioning hole 23 of the inserted lead frame 24 and the inner surface of the socket body 27.
The electrical connection terminals 28 and 30 are positioned so as to be connected to the tip portions of the electrical connection terminals 28 and 30, and the lead 26 and the connection terminal 2 are connected.
8 and 30 are properly connected by the weight of the IC 25 and the lead frame 24.

In the present embodiment, the weight is applied to the IC 25 and the lead frame 24, but a means capable of being pressed from above may be added.

〔effect〕

(1) Of the four outer surfaces of the encapsulant, the electrical connection terminals that are connected to the leads protruding from the two outer surfaces that are parallel to each other should face outward from the connection part with the leads. A bent spring portion is formed, and an electrical connection terminal connected to a lead protruding from the other two outer surfaces in a direction intersecting with the outer surface has an inner portion than a connection portion with the lead. Since the spring part that is bent towards one side is formed, the dimension occupied by the electrical connection terminals can be shortened while preventing contact between both electrical connection terminals, and the miniaturization of the socket is achieved. The effect of being able to do is obtained.

(2) Since the size of the socket is reduced, more ICs can be installed in an inspection device for sorting, aging, etc. while accommodating more ICs in the socket. Therefore, it is possible to increase the number of ICs that can be inspected.

(3) Since more sockets can be arranged in the inspection device for sorting, aging, etc., the number of ICs that can be inspected increases, and the throughput can be improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention. Nor.

[Field of application]

In the above description, the invention made by the present inventor was mainly described for the socket used for the IC of the flat type package which is the field of application which is the background of the invention and the device using the same, but the invention is not limited thereto. It may be applied to a package IC such as a dual in-line type or a chip carrier.

[Brief description of drawings]

FIG. 1 is a top view of a possible socket, FIG. 2 is a sectional view taken along line X ₁ -X _{1 and} line Y ₁ -Y ₁ of FIG. _1, and FIG. 3 is an embodiment of the present invention. top view of a socket, FIG. 4 is a cross-sectional view at _X 2 -X ₂ line of FIG. 3, FIG. 5 is a sectional view in _Y 2 -Y ₂ line of FIG. 3, FIG. 6, the present FIG. 7 is a schematic perspective view of an aging device using a socket which is an embodiment of the invention, FIG. 7 is a partial sectional view of a main part of FIG. 6, and FIG. 8 is used for a socket which is an embodiment of the present invention. FIG. 9 is a configuration diagram of a semiconductor device capable of being manufactured, FIG. 9 is a top view of a socket which is an embodiment of the present invention, FIG. 10 is a cross-sectional view taken along line Y ₃ -Y _{3 of} FIG. 9, and FIG. 10 is a sectional view taken along line X ₃ -X _{3 in} FIG. 9. 1, 5, 28, 30 ... Electrical connection terminals, 2, 8 ... Frame body, 3, 6, 29 ... Spring portion, 4, 9 ... Lid portion, 7,
25a to c ... IC, 10, 26A to C ... Lead, 1
1 ... Aging device, 12 ... Measuring unit, 13, 27 ...
… Socket, 14 …… Aging board, 15 …… Guide part, 16 …… Connector, 17 …… Wiring, 18 …… Door, 1
9 ... Connector pin, 23 ... Hole, 24 ... Lead frame.

Claims (5)

[Claims] 1. A sealing body having a quadrilateral outer surface,
A socket in which a plurality of semiconductor devices each having a plurality of leads protruding from four outer surfaces of the encapsulant are housed in a socket body while being arranged at predetermined intervals, the socket being attached to the socket body, Among the four outer side surfaces, the electrical connection terminals electrically connected to the plurality of leads protruding from the two outer side surfaces parallel to each other have an electrical connection terminal that is directed outwardly from a connection portion with the leads. Electricity that forms a bent spring portion, is attached to the socket body, and is electrically connected to each of the plurality of leads protruding from the other two outer surfaces in a direction intersecting with the two outer surfaces. The socket is characterized in that a spring portion bent toward an inner side of a connection portion with the lead is formed in the dynamic connection terminal. 2. An electrical circuit electrically connected to each of the leads projecting from two outer side surfaces of a plurality of semiconductor devices arranged at a predetermined interval in a direction parallel to the arrangement direction. The connection terminal is formed with a spring portion that is bent inwardly of the connection portion with the lead, and is electrically connected to each of the leads protruding from two outer surfaces in a direction intersecting the arrangement direction. For the electrical connection terminals,
The socket according to claim 1, wherein a spring portion is formed that is bent outwardly of a connection portion with the lead. 3. An electrical circuit electrically connected to the leads projecting from two outer surfaces of the plurality of semiconductor devices arranged at predetermined intervals, the outer surfaces being parallel to the arrangement direction. The connection terminal is formed with a spring portion that is bent outward from the connection portion with the lead, and is electrically connected to each of the leads protruding from two outer surfaces in the direction intersecting the arrangement direction. For the electrical connection terminals,
The socket according to claim 1, wherein a spring portion bent inwardly of a connection portion with the lead is formed. 4. A multiple lead frame is provided with a sealing body at predetermined intervals and has a socket main body for accommodating a plurality of semiconductor devices linearly arranged at a predetermined interval. Of the respective outer side surfaces, the electrical connection terminals electrically connected to the leads protruding from the outer side surface in the direction parallel to the arrangement direction are provided with springs bent outward from the connecting portion with the leads. And a spring bent inward from the connecting portion with the lead, in an electric connecting terminal that is electrically connected to each of the leads protruding from an outer surface in a direction intersecting the arrangement direction. The socket according to claim 1, wherein a part is formed. 5. The socket according to claim 1, which is provided in the inspection device.