JPH0637325B2 - Ceramic green sheet - Google Patents
Ceramic green sheetInfo
- Publication number
- JPH0637325B2 JPH0637325B2 JP59204162A JP20416284A JPH0637325B2 JP H0637325 B2 JPH0637325 B2 JP H0637325B2 JP 59204162 A JP59204162 A JP 59204162A JP 20416284 A JP20416284 A JP 20416284A JP H0637325 B2 JPH0637325 B2 JP H0637325B2
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- ceramic green
- hole
- holes
- pitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Producing Shaped Articles From Materials (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明はセラミツクグリーンシートに係り、特に高精度
でかつ高密度のスルーホール加工に好適なセラミツクグ
リーンシートの組成に関する。Description: TECHNICAL FIELD The present invention relates to a ceramic green sheet, and more particularly to a ceramic green sheet composition suitable for highly accurate and high-density through-hole processing.
セラミツクグリーンシートの組成は、成形性，積層性，
焼結性などから決められており、積層した時上，下配線
パターンを接続する為のスルーホールを高密度にかつ高
精度に打抜きする為のグリーンシート組成、あるいはグ
リーンシートの機械的特性に関しては考慮されていなか
つた（例えば特開昭54−35679 ，特開昭56−55210 な
ど）。The composition of the ceramic green sheet is:
It is determined from the sinterability, etc., and regarding the mechanical properties of the green sheet or the green sheet composition for punching through holes for connecting the upper and lower wiring patterns with high density and high accuracy when laminated. It has not been considered (for example, JP-A-54-35679 and JP-A-56-55210).
従つて、このようなセラミツクグリーンシートに直径0.
15mmのスルーホールを高密度に打抜くと、例えば第８図
に示すようにピツチが小さくなるとたるみが発生し、穴
位置精度が得られなかつた。Therefore, such a ceramic green sheet has a diameter of 0.
When a 15 mm through hole was punched at a high density, for example, as shown in FIG. 8, when the pitch became small, slack occurred, and hole position accuracy could not be obtained.
本発明の目的は高密度かつ高精度にスルーホールの打抜
きが行なえるセラミツクグリーンシートを提供すること
にある。An object of the present invention is to provide a ceramic green sheet capable of punching through holes with high density and high precision.
一般に、セラミツクグリーンシートの機械特性は第１図
に示すようになつており、引張り変形に対する変形抵抗
が非常に小さく、圧縮に対する変形抵抗が非常に大き
く、せん断はその中間である。Generally, the mechanical properties of ceramic green sheets are as shown in FIG. 1, and the deformation resistance to tensile deformation is very small, the deformation resistance to compression is very large, and the shear is in the middle.
一方、スルーホールの打抜きにおいては、第２図に示す
現象が生じている。つまり、穴１，２，３，４があけら
れているセラミツクグリーンシートに穴５を打抜くと、
ポンチ押込みにより穴５の周囲には内圧Ｐが作用し、こ
の内圧Ｐにより穴５の周囲が変形し、変形領域６がすで
に打抜かれた穴（第２図で穴２，４）に達した時には、
穴２−５間及び穴４−５間では、セラミックグリーンシ
ートが見掛け上引張変形し、スルーホールの位置精度が
損われることになる。On the other hand, in punching through holes, the phenomenon shown in FIG. 2 occurs. In other words, when the hole 5 is punched in the ceramic green sheet having the holes 1, 2, 3, and 4,
When the punch is pushed, an internal pressure P acts on the periphery of the hole 5, the periphery of the hole 5 is deformed by the internal pressure P, and when the deformation region 6 reaches the already punched hole (holes 2 and 4 in FIG. 2). ,
Between the holes 2-5 and between the holes 4-5, the ceramic green sheet apparently undergoes tensile deformation, and the through hole position accuracy is impaired.
今、半径方向に発生する最大応力をσrmaxとするとσrm
axは次の(1)式で表わされる関数である。If the maximum stress generated in the radial direction is σrmax, σrm
ax is a function expressed by the following equation (1).
σrmax＝ｆ（ks） ……(1) （ここでksはせん断降伏応力） 一方、変形領域がすでに打抜かれた穴に達する圧力つま
り限界内圧Pcrは次の(2)式で表わされる。σrmax = f (ks) (1) (where ks is the shear yield stress) On the other hand, the pressure at which the deformation area reaches the already punched hole, that is, the limit internal pressure Pcr, is expressed by the following equation (2).
Pcr＝ｆ（kT，ａ，ｄ） ……(2) ここで、kT；引張り降伏応力 ａ；スルーホールピツチ ｄ；スルーホール直径 また、限界内圧Ｐcrは概略次の (3)式で求めることがで
きる。Pcr = f (k T , a, d) (2) where k T ; tensile yield stress a; through-hole pitch d; through-hole diameter. Also, the critical internal pressure Pcr is calculated by the following formula (3). be able to.
つまり、引張り降伏応力ｋＴ，スルーホールピッチａが
大きくなると、限界内圧が大きくなり変形しにくいこと
になる。またスルーホール直径ｄが小さくなれば同様で
ある。 That is, when the tensile yield stress k T and the through-hole pitch a increase, the internal limit pressure increases and it becomes difficult to deform. The same applies if the diameter d of the through hole is reduced.
従つて、σrmaxがPcr より大きくなつた時セラミツクグ
リーンシートがたるみ、ピツチ精度が悪くなる。Therefore, when σrmax becomes larger than Pcr, the ceramic green sheet sags, and the pitch accuracy deteriorates.
今、このσrmaxとPcr の比をスルーホールピツチとの関
係で考察してみる。 (1)式の σrmax＝３ｋｓとする
と、このσrmaxと (3)式のＰcrの比は、次の (4)式とな
る。Now consider the ratio of σrmax and Pcr in relation to the through hole pitch. (1) When expression σrmax = 3k s, the ratio of Pcr this Shigumarmax and (3) is represented by the following equation (4).
(4)式において、３ｋｓ／ｋＴは定数であり、またスル
ーホール直径ｄを0.15mmとしたとき、σrmaxとＰcrの比
とスルーホールピッチａとの関係は第３図のようにな
り、スルーホールピツチが小さくなるに従つてこの値が
大きくなり、σrmax／Pcr の比が１以上のピツチで、第
８図に示したようにたるみが発生する。この原因は第１
図に示したように一般にセラミツクグリーンシートが引
張りに対して非常に弱いことに帰因している。 In (4), the 3k s / k T is a constant, also when the through hole diameter d of 0.15 mm, the relationship between the ratio and the through-hole pitch a of σrmax and Pcr is as shown in Figure 3, This value increases as the through-hole pitch decreases, and slack occurs as shown in FIG. 8 in the pitch where the ratio σrmax / Pcr is 1 or more. This cause is the first
As shown in the figure, it is generally attributed to the fact that ceramic green sheets are very weak against pulling.
従つて、セラミツクグリーンシートに微小ピツチでスル
ーホールを打抜くには、セラミツクグリーンシートの引
張り変形に対する抵抗を大きくするか、せん断に対する
抵抗を小さくすれば良い。このことは（引張変形抵抗）
／（せん断変形抵抗）、すなわち、スルーホールの穴あ
け時に、該穴の周囲に変形を及ぼす力となるグリーンシ
ートのせん断強さと、これを抑止する力であるグリーン
シートの引張り強さとの比（引張り強さ／せん断強さ）
を大きくすることであり、セラミツク粒子を囲む有機物
によつて左右されると考えられた。つまり、有機バイン
ダの重合度を大きくするかその量を多くする、あるいは
可塑剤の量を少なくすることによりこの値を大きくする
ことが考えられた。セラミツクグリーンシートでは金属
の場合のように引張り、あるいはせん断変形抵抗を求め
ることは困難であり、引張り強さとせん断強さの比を変
形抵抗比として考えた。即ちセラミックグリーンシート
の機械特性は、第１図に見られるように引張り応力−ひ
ずみ曲線で金属のような弾性限が明確ではなく、引張り
降伏応力を求めるのが困難である。また、せん断変形抵
抗はねじりによる純粋せん断で求めるべきであるが、ド
クターブレード法で成形できるグリーンシートの厚さは
１mm程度が限度で、打抜きでせん断強さを求めるしかな
く、これらに代わる指数として引張り、せん断強さを用
いた。Therefore, in order to punch through holes in the ceramic green sheet with minute pitches, the resistance to tensile deformation of the ceramic green sheet may be increased or the resistance to shearing may be decreased. This is (tensile deformation resistance)
/ (Shear deformation resistance), that is, the ratio of the shear strength of the green sheet, which is a force that causes deformation around the through hole when drilling a through hole, and the tensile strength of the green sheet, which is a force that suppresses this (tensile strength). Strength / shear strength)
It was thought that it depends on the organic matter surrounding the ceramic particles. That is, it has been considered that this value is increased by increasing the degree of polymerization of the organic binder or increasing the amount thereof, or by decreasing the amount of the plasticizer. With ceramic green sheets, it is difficult to obtain the tensile or shear deformation resistance as in the case of metal, so the ratio of tensile strength to shear strength was considered as the deformation resistance ratio. That is, regarding the mechanical properties of the ceramic green sheet, the elastic limit like metal is not clear on the tensile stress-strain curve as shown in FIG. 1, and it is difficult to determine the tensile yield stress. In addition, the shear deformation resistance should be obtained by pure shear due to torsion, but the thickness of the green sheet that can be formed by the doctor blade method is limited to about 1 mm, and there is no choice but to obtain the shear strength by punching, and it is an index that replaces these. Tensile and shear strength were used.
以下、本発明を実施例により更に説明する。セラミツク
粉末としてアルミナ粉末を用い、アルミナ粉末90重量部
に有機バインダP.V.B.（ポリビニルブチラール）、可塑
剤B.P.B.G.（ブチルフタリルブチルグリコレート）及び
溶剤を加えて混合してスラリーとした。このスラリー
を、ドクターブレード法で厚さ0.25mmのグリーンシート
に成形した。なおグリーンシート中の溶剤は、製造工程
において揮散している。Hereinafter, the present invention will be further described with reference to examples. Alumina powder was used as the ceramic powder, and 90 parts by weight of the alumina powder was mixed with an organic binder PVB (polyvinyl butyral), a plasticizer BPBG (butylphthalyl butyl glycolate) and a solvent to form a slurry. This slurry was formed into a green sheet having a thickness of 0.25 mm by the doctor blade method. The solvent in the green sheet is volatilized during the manufacturing process.
引張試験は幅10mm、チヤツク間距離80mmの条件で、せん
断試験は直径24.03 mmのダイ穴を設けたダイ上にグリー
ンシートを置き、直径24mmのポンチでダイ穴とのクリア
ランスを両側30μｍで行なつた。ここで、ひずみ速度は
両試験とも0.1sec-1であつた。The tensile test is 10 mm wide and the distance between the chucks is 80 mm, and the shear test is that the green sheet is placed on a die with a die hole of 24.03 mm in diameter, and a punch with a diameter of 24 mm is used to make a clearance with the die hole of 30 μm on both sides. It was Here, the strain rate was 0.1 sec -1 in both tests.
また、スルーホールの打抜きは、直径0.15mmのポンチと
穴直径0.18mmのダイを用いてピツチ0.5 mmで行なつた。The punching of the through hole was performed with a punch having a diameter of 0.15 mm and a die having a hole diameter of 0.18 mm with a pitch of 0.5 mm.
第４図は種々の重合度のP.V.B.を用い、B.P.B.G.の量を
変えたグリーンシートの変形抵抗比７とたるみ量８を示
す。これからわかるようにたるみ発生領域Ｂでたるみが
発生し、可塑剤量を減らすことにより、たるみが生じな
くなり、その量はP.V.B.の重合度によつて異なるが、そ
の時の変形抵抗比７（引張強さ／せん断強さ）は0.64以
上（第４図中変形抵抗比0.64以上の領域Ａ）となつてい
る。FIG. 4 shows the deformation resistance ratio 7 and the sag amount 8 of the green sheet in which the amount of BPBG was changed by using PVB having various degrees of polymerization. As can be seen, slack is generated in the slack area B, and by reducing the amount of plasticizer, slack does not occur. The amount depends on the degree of polymerization of PVB, but at that time the deformation resistance ratio 7 (tensile strength / Shear strength) is 0.64 or more (region A with a deformation resistance ratio of 0.64 or more in Fig. 4).
一方、P.V.B.の重合度が変わつた時のグリーンシートの
成形性は第５図に示すように成形可能領域Ｃ、混合不充
分領域Ｄ、割れ発生領域Ｅが変わり、気温，成形前の脱
泡により粘度が約3000cps変動することを考慮に入れる
とP.V.B.の重合度の上限は2000と考えられる。On the other hand, the moldability of the green sheet when the degree of polymerization of PVB changes, as shown in Fig. 5, the moldable region C, the insufficient mixing region D, and the crack generation region E change, depending on the temperature and defoaming before molding. Considering that the viscosity varies by about 3000 cps, the upper limit of the polymerization degree of PVB is considered to be 2000.
また、B.P.B.G.の量を減らすと第６図に示すように伸び
が減少する。伸びが１％以下になるとグリーンシートが
脆くなりハンドリング性が悪くなる。このことからB.P.
B.G.量の下限は５％と考えられる。Moreover, when the amount of BPBG is reduced, the elongation is reduced as shown in FIG. When the elongation is 1% or less, the green sheet becomes brittle and the handling property deteriorates. From this, BP
The lower limit of BG amount is considered to be 5%.
これからグリーンシートを変形させることなく0.5 mm以
下のピツチで打抜くには変形抵抗比を0.64以上にすれば
良く、その時、P.V.B.の重合度は1000〜2000，B.P.B.G.
の量は５〜7.3vol％が良い。In order to punch the green sheet with a pitch of 0.5 mm or less without deforming it, the deformation resistance ratio should be 0.64 or more. At that time, the polymerization degree of PVB is 1000 to 2000, BPBG
5 to 7.3 vol% is good.
また、P.V.B.の量を変えた場合、第７図に示すようにP.
V.B.の量を増やすことによりたるみが発生しなくなり、
その時の変形抵抗はやはり0.64以上（第７図中ハツチン
グ部分Ａ）となつている。しかし、P.V.B.の量を増やす
と焼結時、ふくれあるいは割れが発生しやすく、その上
限は30vol ％が良い。Also, when the amount of PVB is changed, as shown in FIG.
Slack does not occur by increasing the amount of VB,
The deformation resistance at that time is still 0.64 or more (hatched portion A in Fig. 7). However, if the amount of PVB is increased, swelling or cracking tends to occur during sintering, and the upper limit is 30 vol%.
以上、述べたように、微細穴を高密度にかつ高精度に打
抜くにはグリーンシートの変形抵抗比を大きくすれば良
く、直径0.15mmのスルーホールをピツチ0.5 mm以下で高
精度に打抜くには変形抵抗比を0.64以上にすれば良い。
この時P.V.B.の重合度は1000〜2000，配合量は20〜30vo
l ％、B.P.B.G.の配合量は５〜7.3 vol ％が良い。As described above, in order to punch micro holes with high density and high precision, it is sufficient to increase the deformation resistance ratio of the green sheet, and punch through holes with a diameter of 0.15 mm with a pitch of 0.5 mm or less with high precision. The deformation resistance ratio should be 0.64 or more.
At this time, the polymerization degree of PVB is 1000 to 2000, and the compounding amount is 20 to 30 vo.
The blending amount of l% and BPBG is preferably 5 to 7.3 vol%.
重合度1,250 のP.V.B.を20vol ％、B.P.B.G.を７vol ％
含有する残部アルミナよりなるグリーンシートに直径0.
15mmのスルーホールをピツチ0.5 mmで120 ×120 mmの領
域に打抜いた結果、たるみはなく、ほとんど位置ずれの
ない高精度のスルーホール加工が出来た。20 vol% of PVB with a degree of polymerization of 1,250 and 7 vol% of BPBG
The diameter is 0.
As a result of punching a 15 mm through hole in an area of 120 × 120 mm with a pitch of 0.5 mm, there was no slack and high precision through hole processing with almost no misalignment was possible.
さらに、有機バインダ量を増やすことはセラミツクグリ
ーンシートの面粗さを向上することになり、配線の印刷
性が向上する。Furthermore, increasing the amount of the organic binder improves the surface roughness of the ceramic green sheet, which improves the printability of the wiring.
また、セラミツクはアルミナに限らずムライトなどでも
良い。The ceramic is not limited to alumina and may be mullite or the like.
また、前記のスラリーに焼結助剤を８〜12重量部加えた
ものを、ドクターブレード法でグリーンシートを作成し
たものも同様の結果が得られた。Similar results were also obtained when a green sheet was prepared by the doctor blade method using 8 to 12 parts by weight of a sintering aid added to the above slurry.
また、グリーンシートの変形抵抗比とたるみを発生しな
いスルーホールピツチ（限界スルーホールピツチ）は、
例えば、前述した直径０．１５ｍｍのスルーホールの場
合には、第９図に示すようになつており、これにより、
0.5以下のピツチでスルーホールを打抜く時グリーンシ
ートの変形抵抗比が決められる。Also, the deformation resistance ratio of the green sheet and the through hole pitch that does not cause slack (limit through hole pitch) is
For example, in the case of the above-mentioned through hole having a diameter of 0.15 mm, it is as shown in FIG.
When punching through holes with a pitch of 0.5 or less, the deformation resistance ratio of the green sheet is determined.
以上述べたごとく本発明によれば微小ピツチでスルーホ
ールの打抜きが可能なため、回路基板が約1/4に小さく
出来、性能は２倍以上になることが期待出来る。As described above, according to the present invention, since the through holes can be punched by the fine pitch, the circuit board can be reduced to about 1/4 and the performance can be expected to be doubled or more.
第１図はセラミツクグリーンシートの機械的特性（ひず
み速度0.1sec-1）を示す図、第２図はたるみの発生を示
す模式図、第３図はスルーホールピツチとスルーホール
の打抜きにおける半径方向最大応力と限昇内圧の比との
関係を示す計算結果を示す図、第４図はB.P.B.G.量とた
るみ量及び変形抵抗比との関係を示す図、第５図はグリ
ーンシートの成形性を示す図、第６図はB.P.B.G.量と伸
びの関係を示す図、第７図はP.V.B.量とたるみ量及び変
形抵抗比の関係を示す図、第８図はセラミツクグリーン
シートのスルーホールピツチとたるみ量との関係を示す
図、第９図はグリーンシートの変形抵抗比とたるみを発
生しないスルーホールピツチの関係を示す図である。 １，２，３，４，５……穴、６……変形領域、７……変
形抵抗比、８……たるみ量、Ａ……変形抵抗比0.64以上
の領域、Ｂ……たるみ発生領域、Ｃ……成形可能領域、
Ｄ……混合不充分領域、Ｅ……割れ発生領域。Fig. 1 shows the mechanical properties of ceramic green sheet (strain rate 0.1 sec -1 ), Fig. 2 is a schematic diagram showing the occurrence of slack, and Fig. 3 is the radial direction in punching through-hole pitch and through-hole. The figure which shows the calculation result which shows the relationship between the maximum stress and the ratio of the limit internal pressure, FIG. 4 shows the relationship between the amount of BPBG, the amount of slack, and the deformation resistance ratio, and FIG. 5 shows the formability of a green sheet. Fig. 6 is a diagram showing the relationship between the BPBG amount and the elongation, Fig. 7 is a diagram showing the relationship between the PVB amount and the slack amount and the deformation resistance ratio, and Fig. 8 is a diagram showing the through hole pitch and the slack amount of the ceramic green sheet. And FIG. 9 is a diagram showing the relationship between the deformation resistance ratio of the green sheet and the through-hole pitch that does not cause slack. 1, 2, 3, 4, 5 ... Hole, 6 ... Deformation area, 7 ... Deformation resistance ratio, 8 ... Deflection amount, A ... Deformation resistance ratio of 0.64 or more area, B ... Sag generation area, C: Moldable area,
D: Insufficient mixing area, E: Cracking area.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 高崎 光弘 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (72)発明者 市本 和久 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (56)参考文献 特開 昭56−14476（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mitsuhiro Takasaki 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Inside Production Engineering Research Laboratory, Hitachi, Ltd. (72) Inventor Kazuhisa Ichimoto 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Bunka Co., Ltd. Production Engineering Laboratory, Hitachi, Ltd. (56) References Japanese Patent Laid-Open No. 56-14476 (JP, A)
Claims (1)
ンシートであって、前記セラミックグリーンシートは、
前記セラミックグリーンシートにピッチ１．０mm以下の
スルーホールを打抜く際に、スルーホールの半径方向に
作用する半径方向最大応力によって生じる変形領域が既
に打か抜かれたスルーホールに達しない限界内圧以下と
なるような引張り強さを有し、かつ前記引張り強さと前
記打抜き時の抵抗となるせん断強さとの比（引張り強さ
／せん断強さ）において０．６４以上であることを特徴
とするセラミックグリーンシート。1. A ceramic green sheet for through-hole processing, wherein the ceramic green sheet is
When punching through holes with a pitch of 1.0 mm or less on the ceramic green sheet, the deformation region caused by the maximum radial stress acting in the radial direction of the through holes is equal to or less than the internal pressure limit that does not reach the already punched through holes. Ceramic green having the following tensile strength and having a ratio (tensile strength / shear strength) of the tensile strength to the shear strength which is the resistance at the time of punching is 0.64 or more. Sheet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59204162A JPH0637325B2 (en) | 1984-10-01 | 1984-10-01 | Ceramic green sheet |
| JP4318156A JPH0751461B2 (en) | 1984-10-01 | 1992-11-27 | Ceramic green sheet |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59204162A JPH0637325B2 (en) | 1984-10-01 | 1984-10-01 | Ceramic green sheet |
| JP4318156A JPH0751461B2 (en) | 1984-10-01 | 1992-11-27 | Ceramic green sheet |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4318156A Division JPH0751461B2 (en) | 1984-10-01 | 1992-11-27 | Ceramic green sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183668A JPS6183668A (en) | 1986-04-28 |
| JPH0637325B2 true JPH0637325B2 (en) | 1994-05-18 |
Family
ID=26514320
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59204162A Expired - Lifetime JPH0637325B2 (en) | 1984-10-01 | 1984-10-01 | Ceramic green sheet |
| JP4318156A Expired - Lifetime JPH0751461B2 (en) | 1984-10-01 | 1992-11-27 | Ceramic green sheet |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4318156A Expired - Lifetime JPH0751461B2 (en) | 1984-10-01 | 1992-11-27 | Ceramic green sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JPH0637325B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03170360A (en) * | 1989-11-30 | 1991-07-23 | Taiyo Yuden Co Ltd | Composition for ceramic green sheet |
| JPH10275747A (en) * | 1997-03-28 | 1998-10-13 | Nec Corp | Electric double layer capacitor |
| JP2002158136A (en) * | 2000-11-20 | 2002-05-31 | Murata Mfg Co Ltd | Ceramic green sheet, design method thereof, and laminated ceramic electronic component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608990B2 (en) * | 1979-07-06 | 1985-03-07 | 松下電器産業株式会社 | Method for manufacturing piezoelectric sintered sheet |
-
1984
- 1984-10-01 JP JP59204162A patent/JPH0637325B2/en not_active Expired - Lifetime
-
1992
- 1992-11-27 JP JP4318156A patent/JPH0751461B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05319906A (en) | 1993-12-03 |
| JPS6183668A (en) | 1986-04-28 |
| JPH0751461B2 (en) | 1995-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69523732T2 (en) | COMPOSITE MATERIAL AND METHOD FOR THE PRODUCTION THEREOF | |
| DE3882859T2 (en) | Ceramic composite body and method for its production. | |
| WO1996010546A1 (en) | Silicon nitride ceramic and method of shaping the same | |
| DE102014102717B4 (en) | Component arrangement with at least two components and method for producing a component arrangement | |
| DE102011122029A1 (en) | Thermoelectric conversion module and method for its production | |
| DE102015224464A1 (en) | Copper-ceramic substrate, copper semi-finished product for producing a copper-ceramic substrate and method for producing a copper-ceramic substrate | |
| DE69601594T2 (en) | Process for producing a ceramic body with small through holes | |
| DE102022113414A1 (en) | Composite material and heat dissipation part thereof | |
| JP3948452B2 (en) | Load sensor and manufacturing method thereof | |
| EP2716402A1 (en) | Active metal brazing material | |
| JPH0637325B2 (en) | Ceramic green sheet | |
| Xu et al. | Size effects in micro blanking of metal foil with miniaturization | |
| EP2189548B1 (en) | Stress-buffering material | |
| JPS60180954A (en) | Manufacture of aluminum nitirde green sheet | |
| DE60215240T2 (en) | Copper and copper alloy and method of manufacture | |
| JP2001085571A (en) | Copper pasted silicon nitride circuit board | |
| Langdon et al. | Future research directions for interface engineering in high temperature plasticity | |
| EP0154479B1 (en) | Acrylic polymer composition for bonding metal powders | |
| JP2000244123A (en) | Multilayer ceramic circuit board | |
| DE69014793T2 (en) | Sintered ceramic composite body and process for its production. | |
| JPH07240571A (en) | Method for manufacturing ceramic substrate having dividing groove | |
| Mayo | Superplasticity of nanostructured ceramics | |
| US3541672A (en) | Process for forming a protective ceramic coating on a metal surface | |
| JPH0344452A (en) | Production of heat-treated type aluminum alloy member | |
| US3129497A (en) | Beryllium metal products |