JPH063769B2 - Inductance element formation method - Google Patents

Description

The present invention relates to a method for forming an inductance element, and more particularly to a method for forming an inductance element by winding an insulating winding using an ultrasonic bonding apparatus.

(B) Conventional technology With the recent progress of chip parts, hybrid circuits of electronic circuits have been remarkably developed. In the hybrid integrated circuit, by accommodating the external components such as capacitors, resistors and coils in one package in addition to the semiconductor integrated circuit, it is possible to greatly reduce the number of electronic device parts, simplify assembly, and perform maintenance and inspection. It has the advantage that it can be facilitated.

However, the miniaturization of the inductance element is much delayed. This is because the coil formed by winding a conductor has problems that cannot be solved for the heat resistance of the insulator covering the conductor and the connection between the conductor and the external terminal in the solder dip when mounting it on a substrate as a chip component. Because there is.

Figures 4 and 5 show conventional small inductance elements.
The one shown in the figure can be mentioned (for example, JP-A-57 / 57).
-92807). FIG. 4 shows a magnetic body, for example, a drum type core (20) having a winding (21) and winding ends (22) and (22) on the end faces of the flanges (23) and (23) of both ends of the core (20). Formed silver electrode
(24) A small inductance element formed by bending the surface of (24) and then electrically connecting winding terminals, electrodes and lead wires (26) and (26) through solders (25) and (25). . FIG. 5 shows that the winding portion (21) is applied to the winding portion of the drum type core (20) in which the lead wires (26) and (26) are projected on the bottom surface of the preliminary collar portion (23), and the winding end ( 22) (22)
Is a small inductance element in which the lead wires (26) and (26) are entwined with each other and connected by solder (25) and (25). All of the small inductance elements are lead wires (26) (26), solder (25) (2
It requires 5) and cannot be miniaturized like chip resistors and chip capacitors.

Therefore, a chip inductance element shown in FIG. 6 is proposed in Japanese Patent Laid-Open No. 59-43513. In FIG. 6, the winding (21) is applied to the drum type core (20), and the flange (2) of the core (20) is
3) Provide spaced silver electrodes (24) (24) on the bottom surface, bend the winding end to the silver electrode (24) (24) surface, and then solder (25) (25) to the silver electrode (24) (24) It is connected to the. Such a chip inductance element is fixed to a desired electrode using solder (25) (25) on the silver electrodes (24) (24).

(C) Problems to be solved by the invention However, in the above-mentioned small inductance element and chip inductance element, it is necessary to solder them into the insulating substrate in the required number after they are individually formed as individual parts. It is necessary to prepare in advance a small-sized inductance element or the like having the above-mentioned disadvantage, and the handling thereof is extremely complicated in assembly.

Further, since it is necessary to prepare a small-sized inductance element and a chip-shaped inductance element having various kinds of values, there is a drawback that incorporating the small-sized inductance element or the like into the insulating substrate increases the cost.

(D) Means for Solving the Problems The present invention has been made in view of this point, and by forming an insulating winding directly on an insulating substrate by using an ultrasonic bonding device, the inductance elements having different values are continuously formed. , The conventional defects are completely eliminated.

(E) Action According to the present invention, focusing on the point that the insulating winding can perform ultrasonic bonding directly on the conductive path, the bonding wire is wound by the ultrasonic bonding device to directly form the inductance element and at a plurality of positions. A plurality of inductance elements are formed continuously.

(F) Embodiment An embodiment of the present invention will be described in detail with reference to FIGS. 1 (a) to 1 (g).

The first step of the present invention is to form a plurality of conductive paths (2) (2 ') (3) (3') on a circuit board (1) and to form a plurality of windings at a first position and a second position. The purpose is to arrange the frame bodies (4) and (5) (see FIG. 1 (a)).

The circuit board (1) acts as a support board, a ceramic board,
A printed circuit board made of glass epoxy resin or the like, or an aluminum substrate whose surface is anodized is used. On such a circuit board (1), a copper foil is attached to the entire one main surface, and then the copper foil is selectively etched to form a plurality of conductive paths (2) (2 ') (in a desired pattern). 3) Form (3 '). It is desirable to form not only pads for connecting the windings of the inductance element but also conductive paths necessary for forming the hybrid integrated circuit on the conductive paths (2), (2 '), (3) and (3') at the same time.

The winding frame (4) (5) has a role of winding an insulating winding forming an inductance element, and a magnetic material such as ferrite or an insulator such as plastic is used depending on the reactance value of the inductance element to be formed. Is also good. Reel (4) (5)
The shape may be the illustrated cylindrical shape, but it may be a rod shape or an I-shape. A plurality of reels (4) and (5) are fixedly arranged on the circuit board (1) close to the conductive paths (2) (2 ') (3) (3') by an adhesive (6).

In the second step of the present invention, one end of the winding wire (7) is sonicated on the one conductive path (2) at the first position where the one winding frame (4) is provided by using an ultrasonic bonding device. This is to bond (see Fig. 1 (b)).

The insulated winding used in the present invention is 50 to 8 as shown in FIG.
It is composed of a copper fine wire (8) of 00 μφ and an insulating film (9) made of urethane or ethylene fluoride for covering the surface thereof. The insulating coating (9) is made by passing the copper thin wire (8) through a solution of urethane or ethylene fluoride in a thickness of 10 to 50 μm (on average 20).
μ thickness) to insulate each winding forming an inductance element.

As shown in FIG. 3, the ultrasonic bonding apparatus used in the present invention includes a table (10), a capillary chip (11), an ultrasonic vibration source (12), a clamp (13), a reel (14) and an insulating winding.
It is composed of (7). Such an ultrasonic bonding apparatus is known and is widely used for assembling semiconductor devices. The operation will be briefly described. One end of the bonding thin wire led out from the central hole of the capillary chip (11) is connected to the electrode of the transistor or the like mounted on the table (10).
Ultrasonic vibration of K to 60 KHz is applied to fix, and then the capillary tip (11) is moved to apply ultrasonic vibration to the other end of the bonding thin wire to the other lead to fix. The ultrasonic bonding apparatus used in the present invention has several improvements to those used for assembling such a semiconductor device. First, the reel (14) stores an insulated winding (7) for forming an inductance element. Second, the ultrasonic vibration source is slightly more powerful than that used for assembling semiconductor devices. Thirdly, the table (10) is provided with an XY axis moving device (15) and a Z axis moving device (16) so that the table (10) can be freely moved in the X, Y and Z directions. Fourthly, the table (10) is provided with a rotating device (17), and the table (10) is moved in the XY direction.
You can rotate around any coordinate of.

In this step, the table (1
0) Fix the circuit board (1) on top using the vacuum suction force,
The table (10) is moved by the XY axis moving device (15) so that the one conductive path (2) at the first position provided with the one reel (4) is directly below the capillary chip (11). . Then, the capillary chip (11) is lowered to fix one end of the insulating winding (7) to the one conductive path (2) by ultrasonic vibration. Since the insulation winding (7) uses a thin copper wire with a circular cross section, the energy of ultrasonic vibrations concentrates at the contact point with the conductive path (2) and the insulating coating (9) is broken and the thin copper wire is exposed. . And copper wire and copper conductive path (2)
Ultrasonic bonding can be realized by combining the same material with.

The third step of the present invention is to rotate the circuit board (1) to wind the insulating winding (7) around one reel (4) (first).
(See Figure (c)).

In this step, the insulation winding (7) is wound around the one winding body (4) by a predetermined number of turns to form the first inductance element having a desired value. Since one end of the insulated winding (7) is fixed to the one conductive path (2) in the previous step, the circuit board (1) is moved by the XY axis moving device (15) to the winding body (4). Make sure that the insulated winding (7) is entangled. Subsequently, the XY-axis moving device (15) is used to move the reel body (4) so that the center of rotation or the center of rotation near the center is set. After that, the rotating device (17) of the ultrasonic bonding device is activated to rotate the reel (4) and reel.
The insulating winding (7) fed from the (14) is uniformly wound around the winding frame (4) by a predetermined number of turns. In order to wind the insulation winding (7) on the reel body (4) with a uniform thickness, the table is moved up and down using the Z-axis moving device (16) to move the reel body (4) up and down. A uniform winding can be realized by moving it. Further, in the present invention, the insulating winding (7) can be wound with a constant tension by rotating the winding frame (4), and even if the number of turns is large, it can be set at will.

The advantage of the present invention is that even if the reel (4) is of E type,
It is also possible to wind the insulated winding (7) even with a type. That is, in the I-shaped reel (4), the height of the capillary tip (11) may be arranged so as to correspond to the I-shaped reel (4). In addition, the E-shaped core has a capillary tip (11)
Is to be arranged in the E-shaped gap.

The fourth step of the present invention is to ultrasonically bond the other end of the insulated winding (7) to the other conductive path (2 ') at the first position provided with one winding frame (4). (See FIG. 1 (D)).

In this process, the ultrasonic bonding machine table (10)
The capillary chip (11) is moved by the Y-axis moving device (15) and brought to the other conductive path (2 ') at the first position provided with one winding frame (4). Then Capillary Chip (11)
Is lowered and brought into contact with the other conductive path (2 ') to apply ultrasonic vibration to ultrasonically bond the other end of the insulating winding (7). The insulated winding (7) is cut with a cutter or the like when the capillary tip (11) is raised.

In this step, the first inductance element is completed.

The fifth step of the present invention is to move the table (10) continuously to provide another winding frame (5) on the second conductive path (3) at the second position. Is to ultrasonically bond one end (see FIG. 1 (e)).

In this process, the ultrasonic bonding machine table (10)
It is moved by the Y-axis moving device (15) so that the capillary chip (11) is located on the one conductive path (3) at the second position where the other reel (5) is provided. Then, the capillary chip (11) is lowered to fix one end of the insulating winding (7) to the conductive path (3) by ultrasonic vibration.

The feature of this process is that the process continuously enters immediately after the completion of the first inductance element. As a result, a plurality of inductance elements can be continuously formed.

The sixth step of the present invention is to rotate the circuit board (1) to wind the insulating winding (7) around another winding body (5) (first
(See Figure (f)).

In this step, other reels (5) are used as in the third step described above.
Then, the insulating winding 7 is wound by a number of turns different from the number of turns in the third step, and a second inductance element having a value different from that of the first inductance element can be formed.

The feature of this step is that the reactance value of the second inductance element can be freely set by controlling the rotation speed of the circuit board (1). As a result, a plurality of inductance elements having different reactance values can be formed in an arbitrary arbitrary continuous manner.

In the seventh step of the present invention, the other end of the insulated winding (7) is connected to another winding frame body.
Bring it to another conductive path (3 ') at the second position provided with (5). Then, the capillary chip (11) is lowered to ultrasonically bond to the other conductive paths (3 ') (see FIG. 1 (g)).

In this step, as in the above-mentioned fourth step, the table (10) of the ultrasonic bonding apparatus is moved by the XY axis moving device (15), and the capillary chip (11) is moved to the other conductive path at the second position ( 3 ') Bring on. Then Capillary Chip (11)
Is moved up and down and brought into contact with the other conductive path (3 ') to apply ultrasonic vibration to ultrasonically bond the other end of the insulating winding (7). The insulated winding (7) is cut when the capillary tip (11) is raised.

In this step, the second inductance element is completed.

As described above in detail, according to the present invention, it is apparent that a plurality of inductance elements can be continuously formed at desired positions on the circuit board (1) by moving the table (10) of the ultrasonic bonding apparatus. Rotating device for table (10) (17)
By the control of 1), it is possible to form the inductance elements having a required value on the circuit on the circuit board (1) in any arbitrary order.

(G) Effect of the Invention The first effect of the present invention is to connect an inductance element to a circuit board.
(1) It can be formed continuously at any position above.
That is, the table (10) of the ultrasonic bonding device may be moved by the XY axis moving device (15) to select a predetermined position and the process of forming the inductance element may be repeated. As a result, the inductance element required for the circuit configuration can be directly formed on the circuit board (1).

The second effect of the present invention is that the inductance element can be set to an arbitrary value. That is, the number of turns of the insulating winding 7 may be programmed in the process of forming each inductance element. As a result, it is extremely useful in tuner circuits that require various types of inductance.

The third effect of the present invention is that the heating step is not required in the step of forming the inductance element. That is, in the present invention, since the insulating winding (7) and the conductive paths (2), (2 '), (3) and (3') are connected by ultrasonic bonding, the insulating coating (9) is melted by heating and rare shoots occur. Will never occur.

A fourth effect of the present invention is that an inductance element can be automatically formed by adding a pattern recognition and programmable memory to the ultrasonic bonding apparatus.

[Brief description of drawings]

1 (a) to 1 (g) are sectional views for explaining a method of forming an inductance element according to the present invention, FIG. 2 is a sectional view for explaining an insulated winding used in the present invention, and FIG. 3 is Block diagram illustrating an ultrasonic bonding apparatus used in the present invention, FIG.
FIG. 6 to FIG. 6 are cross-sectional views illustrating a conventional small inductance element and chip inductance element. Description of main drawing numbers (1) is a circuit board, (2) (2 ') (3) (3') is a conductive path, (4) and (5) are reels, (7) is an insulated winding, (11) is a capillary chip, (14) is a reel, and (17) is a rotating device.

Claims (1)

[Claims] 1. A reel of an ultrasonic bonding apparatus has a built-in insulating winding in which a surface of a thin metal wire is covered with an insulating film, and one end of the insulating winding is ultrasonically bonded to one conductive path provided on a circuit board. Then, after breaking the insulating film and connecting the thin metal wire and the one conductive path, the insulating winding is fed from the reel and wound to form an inductance element, and then the other end of the insulating winding is formed. By ultrasonic bonding to another conductive path on the circuit board to break the insulating film and connect the thin metal wire to the other conductive path, and to form a method for forming an inductance element directly incorporated on the circuit board. At
A plurality of the inductance elements are sequentially and continuously formed on the circuit board, and the number of turns of the insulating winding of the inductance element is made different to obtain an inductance element having a plurality of values. Method for forming an inductance element.