JPH0638988B2 - Solid phase bonding equipment - Google Patents
Solid phase bonding equipmentInfo
- Publication number
- JPH0638988B2 JPH0638988B2 JP12677086A JP12677086A JPH0638988B2 JP H0638988 B2 JPH0638988 B2 JP H0638988B2 JP 12677086 A JP12677086 A JP 12677086A JP 12677086 A JP12677086 A JP 12677086A JP H0638988 B2 JPH0638988 B2 JP H0638988B2
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- jig
- contact
- solid
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Pressure Welding/Diffusion-Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、電子部品やフアインメカニクス部品等を常
温または常温付近で接合する固相接合装置、特に接合時
に付与される接触圧力からの接合物の保護並びに接合力
の強化に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a solid-phase joining apparatus for joining electronic components, fine mechanical components, etc. at room temperature or near room temperature, and in particular, joining from contact pressure applied at the time of joining. Concerning protection of objects and strengthening of bonding strength.
材料を常温で固相接合することは例えば特開昭５４−１
２４８５３号、特開昭６０−１８７４８５号によりすで
に提案されており、第６図は特開昭５４−１２４８５３
号に記載された形式の固相接合装置の縦断面図、第７図
は第６図のものにおける接合物の保持装置を示す図であ
って、第７図（イ）は側面図、第７図（ロ）は正面図、
第８図は第７図（イ）と共に保持装置への接合物の着脱
を説明するための図である。図において、(1)は超高真
空の接合室、（２Ａ），（２Ｂ）はそれぞれ互いに接合
すべき接合物、（３Ａ），（３Ｂ）は接合物（２Ａ），
（２Ｂ）を保持するホルダー、（４Ａ），（４Ｂ）はそ
れぞれ接合物（２Ａ），（２Ｂ）の接合面（２０１
Ａ），（２０１Ｂ）（第７図および第８図）の表面被膜
を除去して清浄化する清浄装置であつて、例えばアルゴ
ンの如き不活性ガスのイオンで前記接合面（２０１
Ａ），（２０１Ｂ）をスパツタリングするスパツタエツ
チング装置を使用することができる。(5)は清浄化され
た接合面（２０１Ａ），（２０１Ｂ）が互いに接触する
ように接合物（２Ａ），（２Ｂ）を保持する治具であ
り、治具(5)とホルダー（３Ａ），（３Ｂ）とによつて
接合物（２Ａ），（２Ｂ）の保持装置が構成されてい
る。治具(5)はポスト(6)により接合室(1)の底壁（１０
１）に固定されている。(7)は油圧シリンダの如き加圧
装置にあつて、その軸（７０１）の先端には接合物（２
Ａ）を押圧して前記接触面（２０１Ａ），（２０１Ｂ）
を互いに圧接させる加圧治具(8)が設けられており、加
圧治具(8)は加圧装置(7)により上下に移動される。(9)
はベローズであつて、その一端は接合室(1)の頂壁（１
０２）に気密状に固定され他端は軸（７０１）のフラン
ジ（７０２）に気密状に固定され、軸（７０１）の頂壁
貫通部を内外気密に遮断している。（１０）は弁(V)を
有する排気ポートであつて適当な真空ポンプ（図示せ
ず）に接続されている。Solid-state joining of materials at room temperature is disclosed in, for example, Japanese Patent Laid-Open No. 54-1
24853 and JP-A-60-187485 have already been proposed, and FIG. 6 shows JP-A-54-124853.
FIG. 7 is a longitudinal sectional view of a solid-state bonding apparatus of the type described in No. 6, FIG. 7 is a view showing a holding apparatus for bonded objects in FIG. 6, and FIG. Figure (b) is a front view,
FIG. 8 is a view for explaining attachment / detachment of the bonded article to / from the holding device, together with FIG. 7 (a). In the figure, (1) is an ultrahigh vacuum bonding chamber, (2A) and (2B) are bonded products to be bonded to each other, (3A) and (3B) are bonded products (2A),
A holder for holding (2B), (4A) and (4B) are joint surfaces (201) of the joints (2A) and (2B), respectively.
A), (201B) (FIGS. 7 and 8) for removing and cleaning the surface coating, wherein the bonding surface (201) is treated with ions of an inert gas such as argon.
A sputter etching device for spattering A) and (201B) can be used. (5) is a jig for holding the bonded objects (2A), (2B) so that the cleaned bonding surfaces (201A), (201B) are in contact with each other. The jig (5) and the holder (3A) , (3B) form a holding device for the joints (2A), (2B). The jig (5) is attached to the bottom wall (10) of the bonding chamber (1) by the post (6).
It is fixed to 1). (7) is a pressurizing device such as a hydraulic cylinder, and the end of the shaft (701) has a joint (2
A) is pressed to contact the contact surfaces (201A), (201B)
A pressurizing jig (8) for pressing the two together is provided, and the pressurizing jig (8) is moved up and down by the pressurizing device (7). (9)
Is a bellows, one end of which is the top wall (1) of the joining chamber (1).
02) is airtightly fixed, and the other end is airtightly fixed to the flange (702) of the shaft (701) to shut off the top wall penetrating portion of the shaft (701) inside and outside. (10) is an exhaust port having a valve (V), which is connected to a suitable vacuum pump (not shown).
（１１）はホルダー（３Ａ），（３Ｂ）を治具(5)に着
脱するための着脱機構で、軸方向および回転方向に可動
な移動ロツド（１１１）を備えており、この移動ロツド
（１１１）の先端部にはねじ（１１２）が切られてい
る。次に第７図および第８図を参照するに、ここには保
持装置の構成並びにホルダー（３Ａ），（３Ｂ）の治具
(5)への装着の手順が示されている。ホルダー（３
Ａ），（３Ｂ）には移動ロツド（１１１）のねじ（１１
２）と螺合するねじ穴（３０１Ａ），（３０１Ｂ）が形
成されている。治具(5)にはダブテイル形の溝（５０
１）が形成され、ホルダー（３Ａ），（３Ｂ）もこれに
対応した形状になつている。Reference numeral (11) is an attachment / detachment mechanism for attaching / detaching the holders (3A), (3B) to / from the jig (5), which is provided with a movable rod (111) which is movable in the axial direction and the rotational direction. ) Is threaded (112). Next, referring to FIGS. 7 and 8, the structure of the holding device and the jigs for the holders (3A) and (3B) are shown here.
The procedure for attachment to (5) is shown. Holder (3
A) and (3B) have screws (11) of the moving rod (111).
2) The screw holes (301A) and (301B) to be screwed together are formed. The jig (5) has a dovetail groove (50
1) is formed, and the holders (3A) and (3B) are also shaped corresponding to this.
なお、（１２）は接合室(1)の内外を電気的に接続する
ための端子、（１３）は移動ロツド（１１１）にホルダ
ー（３Ａ），（３Ｂ）を着脱するための作業用気密ド
ア、（１４）は気密ドア（１３）の錠止部材である。In addition, (12) is a terminal for electrically connecting the inside and outside of the bonding chamber (1), and (13) is a working hermetic door for attaching and detaching the holders (3A) and (3B) to the moving rod (111). , (14) are lock members for the airtight door (13).
次に動作について説明する。まず気密ドア（１３）を開
いて、接合物（２Ｂ）を保持したホルダー（３Ｂ）を移
動ロツド（１１１）のねじ（１１２）に螺合させ、着脱
機構（１１）により、ホルダー（３Ｂ）を治具(5)の溝
（５０１）に第７図（イ）の位置まで押込み、次いで移
動ロツド（１１１）を回転させてホルダー（３Ｂ）から
離して元の位置に戻す。次に、接合物（２Ａ）を保持し
たホルダー（３Ａ）を前記ねじ（１１２）に螺合させ、
接合面（２０１Ａ）を下向きにして清浄装置（４Ａ）の
上方で停止させ、気密ドア（１３）を閉じる。この状態
で真空ポンプにより排気ポート（１０）を通して接合室
(1)内を１０-11トール程度の超高真空に排気する。次い
でアルゴンガスの如き不活性ガスを導入し超高真空下に
おいて清浄装置（４Ａ），（４Ｂ）により上述した如く
不活性ガスのイオンで接合物（２Ａ），（２Ｂ）の接合
面（２０１Ａ），（２０１Ｂ）をスパツタリングするな
どして清浄化し、理想的に近い清浄表面を得る。次いで
移動ロツド（１１１）によりホルダー（３Ａ）を治具
(5)の溝（５０１）に第８図の位置まで押込み、移動ロ
ツド（１１１）を元の位置まで戻し、その後加圧装置
(7)を作動させ、加圧治具(8)を接合物（２Ａ）に押当て
その接合面（２０１Ａ）を接合物（２Ｂ）の接合面（２
０１Ｂ）に微小圧力下に接触させ、両接合面（２０１
Ａ），（２０１Ｂ）において微小領域で塑性変形を生じ
させて接合面（２０１Ａ），（２０１Ｂ）間の間隙を原
子間引力が作用するまで接近させる。かくして両接合面
（２０１Ａ），（２０１Ｂ）は原子間引力により接合さ
れる。接合が完了すると再び移動ロツド（１１１）を移
動させてねじ穴（３０１Ａ），（３０１Ｂ）に螺合させ
ホルダー（３Ａ），（３Ｂ）を治具(5)から除去し、気
密ドア（１３）から取出す。Next, the operation will be described. First, the airtight door (13) is opened, and the holder (3B) holding the joined object (2B) is screwed onto the screw (112) of the moving rod (111), and the holder (3B) is attached by the attaching / detaching mechanism (11). It is pushed into the groove (501) of the jig (5) to the position shown in FIG. 7 (a), and then the moving rod (111) is rotated to separate from the holder (3B) and returned to the original position. Next, the holder (3A) holding the joined object (2A) is screwed onto the screw (112),
The joining surface (201A) is faced downward and stopped above the cleaning device (4A), and the airtight door (13) is closed. In this state, the vacuum pump pumps the exhaust port (10) through the bonding chamber.
(1) The inside is evacuated to an ultrahigh vacuum of about 10 -11 Torr. Then, an inert gas such as argon gas is introduced, and the surfaces (201A) of the joints (2A), (2B) are bonded with the ions of the inert gas by the cleaning devices (4A), (4B) under ultrahigh vacuum. , (201B) are cleaned by spattering or the like to obtain a nearly ideal clean surface. Then, the holder (3A) is jigged by the moving rod (111).
Push it into the groove (501) of (5) to the position shown in FIG. 8, return the moving rod (111) to its original position, and then pressurize the device.
(7) is actuated, the pressure jig (8) is pressed against the joint (2A), and the joint surface (201A) is joined to the joint (2B).
01B) under a slight pressure to contact both joint surfaces (201
In (A) and (201B), plastic deformation is caused in a minute region to bring the gap between the joint surfaces (201A) and (201B) close to each other until the interatomic attraction acts. Thus, the two bonding surfaces (201A) and (201B) are bonded by the interatomic attraction. When the joining is completed, the moving rod (111) is moved again and screwed into the screw holes (301A) and (301B) to remove the holders (3A) and (3B) from the jig (5), and the airtight door (13). Take out from.
従来の固相接合装置は以上のように構成され、接合面
（２０１Ａ），（２０１Ｂ）の接合すべき範囲全体に圧
力を加えて接合するようになつているため、第９図に示
すように接合物（２Ｂ）のホルダー（３Ｂ）の表面に数
μｍ程度のうねりがあるとその凸部と接触した部分に応
力が集中し、その部分において接合物（２Ｂ）が損傷を
受けたり、第１０図のように加圧治具(8)が１０μｍ程
度でも傾斜していると接合物（２Ａ）が可撓性である場
合、接合物（２Ａ）が図示の如く反つて一部分でしか接
合物（２Ｂ）と接合されず十分な接合強度が得られない
等の問題があつた。Since the conventional solid-phase bonding apparatus is configured as described above and is designed to apply pressure to the entire bonding surface (201A), (201B) to be bonded, as shown in FIG. If the surface of the holder (3B) of the bonded article (2B) has a waviness of about several μm, the stress concentrates on the portion in contact with the convex portion, and the bonded article (2B) may be damaged at that portion. As shown in the figure, when the pressure jig (8) is inclined even at about 10 μm and the bonded product (2A) is flexible, the bonded product (2A) is warped as shown in FIG. 2B) was not joined and sufficient joining strength was not obtained.
この発明は従来のもののかかる問題点を解決するために
なされたものであつて、接合物の損傷なしにかつ大きな
接合強度でもつて接合しうる固相接合装置であつて、少
なくとも接合物の一方が可撓性を有する場合に適したも
のを提供することを目的とするものである。The present invention has been made in order to solve such problems of the conventional ones, and provides a solid-state bonding apparatus capable of bonding without damage to a bonded product and with a high bonding strength, at least one of the bonded products. The purpose of the present invention is to provide a material having flexibility.
この発明に係る固相接合装置は、加圧治具の接合物との
接触面積を接合物の接合すべき面積より小さくし、前記
加圧治具を移動機構により接合面に平行した方向に移動
させるようにしたものである。In the solid-phase joining apparatus according to the present invention, the contact area of the pressing jig with the article to be joined is made smaller than the area of the article to be joined, and the pressing jig is moved in the direction parallel to the joining surface by the moving mechanism. It was made to let.
この発明においては、加圧治具は接合面に平行した方向
に移動される時に、接合面を順次局部的に接合して行
く。In the present invention, when the pressing jig is moved in the direction parallel to the joining surface, the joining surfaces are locally joined sequentially.
以下この発明の一実施例を第１図乃至第３図について説
明する。第１図はこの発明による固相接合装置の一実施
例の縦断面図、第２図は接合物の部分の拡大斜視図、第
３図は第２図の側面図であり、前記従来のものと同一部
分には同一符号を付してその説明は省略する。An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a longitudinal sectional view of an embodiment of a solid phase bonding apparatus according to the present invention, FIG. 2 is an enlarged perspective view of a part of a bonded article, and FIG. 3 is a side view of FIG. The same parts as those in FIG.
図において、（８Ａ）は前記従来のものの(8)に対応す
る加圧治具であり、この実施例では加圧治具（８Ａ）は
接合物（２Ａ）に接触する先端が丸められた棒状のもの
からなつている。In the figure, (8A) is a pressure jig corresponding to (8) of the above-mentioned conventional one, and in this embodiment, the pressure jig (8A) has a rod-like shape with a rounded tip that comes into contact with the bonded article (2A). It comes from the thing.
（１５）はＸ−Ｙテーブルであり、その一方の駆動装置
が符号（１６）で示されている。他方の駆動装置（駆動
装置（１６）の駆動方向と直角をなす方向に駆動するも
の）は図面では見えない。加圧治具（８Ａ）と接合物
（２Ａ）との接触面積は接合面（２０１Ａ），（２０１
Ｂ）の実際に接合すべき面積より小さく、１０分の１か
ら数１０分の１程度にするのが好適である。Reference numeral (15) is an XY table, and one of the driving devices is indicated by reference numeral (16). The other drive device (which drives in a direction perpendicular to the drive direction of the drive device (16)) is not visible in the drawing. The contact area between the pressing jig (8A) and the bonded object (2A) is the bonding surface (201A), (201A).
It is preferable that the area is smaller than the area to be actually joined in B) and is about one tenth to several tenths.
次に動作について説明する。まず接合面（２０１Ａ），
（２０１Ｂ）を清浄化した接合物（２Ａ），（２Ｂ）を
従来のものと同様に第１図のように配置する。なお、こ
の場合には接合物（２Ａ）が可撓性を有するものとす
る。次いで、加圧治具（８Ａ）を加圧装置(7)によつて
降下させて微小圧力で接合物（２Ａ）に押当てる。次い
でＸ−Ｙテーブル（１５）を作動させて加圧治具（８
Ａ）を接合面（２０１Ａ），（２０１Ｂ）に平行した方
向に接合物（２Ａ）に沿つて、実際に接合すべき範囲に
わたつて軌跡（１７）（第２図）で示すように移動させ
る。真空度が低い場合は、このような作業をしている間
に、接合面（２０１Ａ），（２０１Ｂ）が接合を阻害す
る吸着物で汚染されて接合できなくなるが、１０-11ト
ールのような高い真空度では問題ない。Next, the operation will be described. First, the joint surface (201A),
The joined products (2A) and (2B) obtained by cleaning (201B) are arranged as shown in FIG. In this case, the bonded article (2A) has flexibility. Then, the pressure jig (8A) is lowered by the pressure device (7) and pressed against the bonded article (2A) with a slight pressure. Then, the XY table (15) is operated to operate the pressure jig (8
A) is moved along the joint (2A) in the direction parallel to the joint surfaces (201A) and (201B), and over the range to be actually joined as shown by the locus (17) (Fig. 2). . When the degree of vacuum is low, the bonding surfaces (201A) and (201B) are contaminated with adsorbents that hinder the bonding during such work, but the bonding cannot be achieved. No problem at high vacuum.
このように、加圧治具（８Ａ）は接合物（２Ａ）が可撓
性を有することを利用して接合面（２０１Ａ），（２０
１Ｂ）を順次局部的に接合させて行くので、加圧治具
（８Ａ）が接合物（２Ａ）に与える接合圧力は極めて小
さくて良く、従つて、第９図に示すようにホルダー（３
Ｂ）の表面にうねりがあつてもその凸部と接触する接合
物（２Ｂ）の部分にかかる応力は小さく、接合物（２
Ｂ）が損傷を受けることはない。また、加圧治具（８
Ａ）が接合物（２Ａ）に接触する接触面積が小さいの
で、加圧治具（８Ａ）が傾いていても、第３図に示すよ
うに接合物（２Ａ）は加圧治具（８Ａ）が移動するにつ
れて接合物（２Ｂ）に接合され、加圧治具（８Ａ）の傾
きには係りなく確実に接合物（２Ａ），（２Ｂ）が接合
される。As described above, the pressing jig (8A) utilizes the flexibility of the bonded object (2A) to bond surfaces (201A), (20A).
1B) are sequentially locally bonded, the bonding pressure applied to the bonded product (2A) by the pressing jig (8A) may be extremely small. Therefore, as shown in FIG.
Even if the surface of (B) has undulations, the stress applied to the part of the bonded article (2B) that comes into contact with the convex portion is small, and
B) is not damaged. In addition, a pressure jig (8
Since the contact area of (A) in contact with the bonded article (2A) is small, the bonded article (2A) can be pressed by the pressure jig (8A) as shown in FIG. 3 even if the pressure jig (8A) is inclined. Is bonded to the bonded object (2B) as the moving object moves, and the bonded objects (2A) and (2B) are reliably bonded regardless of the inclination of the pressing jig (8A).
前記実施例では接合物（２Ａ）が可撓性であるとして説
明したが、接合物（２Ａ）が剛直であつても接合物（２
Ｂ）が可撓性を有すれば、上述した如く順次局部的に接
合が行なわれ上述したのと同様の効果が期待できる。即
ち、接合物（２Ａ），（２Ｂ）の少なくともいずれか一
方が可撓性を有しておれば良い。Although the bonded article (2A) is described as being flexible in the above-mentioned embodiments, the bonded article (2A) may be used even if the bonded article (2A) is rigid.
If B) has flexibility, the local bonding is sequentially performed as described above, and the same effect as described above can be expected. That is, at least one of the joints (2A) and (2B) may be flexible.
なお、前記実施例では加圧治具（８Ａ）として単純な棒
状のものを使用したが、第４図に示すように先端にロー
ラ（８０１）を備えたものとすることもできる。この実
施例は加圧治具（８Ａ）と接合物（２Ａ）の摩擦が小さ
い利点がある。Although a simple rod-shaped jig is used as the pressing jig (8A) in the above-mentioned embodiment, it may be provided with a roller (801) at the tip as shown in FIG. This embodiment has an advantage that the friction between the pressing jig (8A) and the bonded article (2A) is small.
また第１図に示された加圧治具（８Ａ）であつても第５
図に示すように傾け、この傾けた方向に引ずるように移
動させることにより加圧治具（８Ａ）の移動をスムーズ
に行なうことができる。In addition, even if the pressing jig (8A) shown in FIG.
As shown in the figure, the pressing jig (8A) can be moved smoothly by inclining and moving so as to drag in the inclined direction.
なお、加圧治具（８Ａ）は接合物（２Ａ）に連続的に接
触させても良いし、Ｘ−Ｙテーブル（１５）と加圧装置
(7)とを連動させて、間歇的に接触させても良い。ま
た、加圧治具（８Ａ）の移動軌跡は第２図に示すように
Ｓ字状を繰返えすものでなくとも他の任意の軌跡で良
く、要するに係合すべき部分をほぼ全体的に行きわたる
ように移動すれば良い。加圧治具（８Ａ）を移動させる
移動機構としてＸ−Ｙテーブル（１５）を示したが、駆
動装置（１６）によつて加圧装置(7)を直接移動させて
も良いし、他の移動機構を使用しても良い。更に加圧装
置(7)は単なる重錘のようなものであつても良い。ま
た、図示の実施例では加圧装置(7)は加圧治具（８Ａ）
を上下に移動させる機能も兼ねているが加圧装置(7)は
接合面（２０１Ａ），（２０１Ｂ）間に接触圧力を与え
るのに専用し、治具(5)を上下に移動させる移動機構を
別設しても良い。更に、清浄装置（４Ａ），（４Ｂ）は
接合室(1)内に設けるものとして示したが、特開昭６０
−１８７４８５号に記載のように超高真空の予備室を設
けてこれを仕切弁を介して接合室(1)に接続し、接合物
を前記仕切弁を通して予備室から接合室(1)へ搬入する
ようにしたものにあつては、清浄装置（４Ａ），（４
Ｂ）は前記予備室に設けてここで接合面（２０１Ａ），
（２０１Ｂ）を清浄化するようにしても良く、要するに
圧接する時に接合面（２０１Ａ），（２０１Ｂ）が清浄
な状態であれば良い。The pressing jig (8A) may be continuously brought into contact with the bonded article (2A), or the XY table (15) and the pressing device may be contacted.
You may make it contact intermittently by interlocking with (7). Further, the movement path of the pressing jig (8A) may be any other path even if it does not repeat the S-shape as shown in FIG. Just move around. Although the XY table (15) is shown as a moving mechanism for moving the pressure jig (8A), the pressure device (7) may be directly moved by the driving device (16), or another type. A moving mechanism may be used. Further, the pressure device (7) may be a simple weight. In the illustrated embodiment, the pressure device (7) is a pressure jig (8A).
The pressure device (7) is also dedicated to apply contact pressure between the joint surfaces (201A) and (201B), and also has a function to move the jig (5) up and down. May be installed separately. Further, the cleaning devices (4A) and (4B) are shown to be provided in the bonding chamber (1), but it is disclosed in JP-A-60
No. 187485, an ultra-high vacuum auxiliary chamber is provided, which is connected to the bonding chamber (1) through a sluice valve, and the joint product is transferred from the auxiliary chamber to the bonding chamber (1) through the sluice valve. The cleaning device (4A), (4
B) is provided in the preparatory chamber, where the joint surface (201A),
(201B) may be cleaned as long as the joint surfaces (201A) and (201B) are in a clean state at the time of pressure contact.
加圧治具（８Ａ）と接合物（２Ａ）との接触面積は実際
に接合すべき面積の１０分の１乃至数１０分の１が適当
であると説明したが、これは前記接触面積があまり大き
いとこの発明の効果が小さくなるし、あまり小さいと加
圧治具（８Ａ）の移動に時間を要し実用的でないためで
あるが、この発明の効果は前記接触面積が前記範囲の外
であつても得られるものである。It has been explained that the contact area between the pressing jig (8A) and the bonded article (2A) is appropriately 1/10 to several 1/10 of the area to be actually bonded. This is because if it is too large, the effect of the present invention becomes small, and if it is too small, it takes time to move the pressing jig (8A) and it is not practical. However, the effect of the present invention is that the contact area is out of the range. It can be obtained even with.
以上のようにこの発明によれば、接合面より小さい加圧
治具により接合面を順次押圧することにより、接合物に
損傷を与えることなく強大な接合力を得ることができる
効果が得られる。As described above, according to the present invention, it is possible to obtain a strong joining force without damaging the joined object by sequentially pressing the joining surfaces with a pressing jig smaller than the joining surfaces.
第１図はこの発明による固相接合装置の縦断面図、第２
図はこの発明による加圧治具の動きを示す接合物の部分
の拡大斜視図、第３図は第２図の側面図、第４図および
第５図はそれぞれこの発明の異なる実施例を示す加圧治
具の拡大図、第６図は従来の固形接合装置の縦断面図、
第７図は接合物の保持装置を示す図であり、第７図
（イ）は側面図、第７図（ロ）は正面図、第８図は第７
図（イ）と共に保持装置への接合物の着脱を説明するた
めの図、第９図および第１０図は従来の固相接合装置の
問題点を説明するための図である。 図において、(1)は超高真空接合室、（２Ａ），（２
Ｂ）は接合物、（２０１Ａ），（２０１Ｂ）は接合面、
（３Ａ），（３Ｂ），(5)は保持装置、（４Ａ），（４
Ｂ）は清浄装置、（８Ａ）は加圧治具、（８０１）はロ
ーラ、（１５）は移動機構（Ｘ−Ｙテーブル）である。 なお、各図中、同一符号は同一または相当部を示す。FIG. 1 is a longitudinal sectional view of a solid-state bonding apparatus according to the present invention, and FIG.
FIG. 4 is an enlarged perspective view of a portion of a bonded article showing the movement of the pressing jig according to the present invention, FIG. 3 is a side view of FIG. 2, and FIGS. 4 and 5 show different embodiments of the present invention. FIG. 6 is an enlarged view of the pressure jig, and FIG. 6 is a vertical cross-sectional view of a conventional solid joining device.
FIG. 7 is a view showing a device for holding a bonded article. FIG. 7 (a) is a side view, FIG. 7 (b) is a front view, and FIG. 8 is a seventh view.
FIG. 9A and FIG. 9A and FIG. 10A and FIG. 10B are views for explaining the problems of the conventional solid phase bonding apparatus together with FIG. In the figure, (1) is an ultra-high vacuum bonding chamber, (2A), (2
B) is a joint, (201A) and (201B) are joint surfaces,
(3A), (3B) and (5) are holding devices, (4A) and (4
B) is a cleaning device, (8A) is a pressure jig, (801) is a roller, and (15) is a moving mechanism (XY table). In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (4)
合すべき接合物の接合面を超高真空雰囲気中で清浄化す
る装置、超高真空接合室内に設けられて前記の清浄化さ
れた接合面が互いに接触するように接合物を保持する保
持装置および前記接合物のいずれか一方を押圧して前記
接触面を互いに圧接させる加圧治具を備えた固相接合装
置において、前記加圧治具の接合物との接触面積を接合
物の接合すべき面積より小さくし、前記加圧治具を前記
接合面に平行した方向に移動させる移動機構を設けたこ
とを特徴とする固相接合装置。1. An apparatus for cleaning a joint surface of joints to be joined to each other, at least one of which has flexibility, in an ultra-high vacuum atmosphere. In a solid-state bonding apparatus including a holding device that holds a bonded article so that surfaces thereof come into contact with each other and a pressing jig that presses one of the bonded objects to press the contact surfaces against each other, A solid-phase joining apparatus, characterized in that a contacting area of the tool with the article to be joined is smaller than an area to be joined with the article to be joined, and a moving mechanism for moving the pressing jig in a direction parallel to the joining surface is provided. .
れた棒状のものである特許請求の範囲第１項記載の固相
接合装置。2. The solid-state bonding apparatus according to claim 1, wherein the pressing jig has a rod-like shape with a rounded tip which comes into contact with the bonded object.
ている特許請求の範囲第１項記載の固相接合装置。3. The solid-state bonding apparatus according to claim 1, wherein the pressing jig includes a roller that comes into contact with the bonded object.
の範囲第１項記載の固相接合装置。4. The solid phase bonding apparatus according to claim 1, wherein the moving mechanism is an XY table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12677086A JPH0638988B2 (en) | 1986-05-29 | 1986-05-29 | Solid phase bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12677086A JPH0638988B2 (en) | 1986-05-29 | 1986-05-29 | Solid phase bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62282789A JPS62282789A (en) | 1987-12-08 |
| JPH0638988B2 true JPH0638988B2 (en) | 1994-05-25 |
Family
ID=14943492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12677086A Expired - Lifetime JPH0638988B2 (en) | 1986-05-29 | 1986-05-29 | Solid phase bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638988B2 (en) |
-
1986
- 1986-05-29 JP JP12677086A patent/JPH0638988B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62282789A (en) | 1987-12-08 |
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