JPH064340B2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH064340B2 JPH064340B2 JP10472185A JP10472185A JPH064340B2 JP H064340 B2 JPH064340 B2 JP H064340B2 JP 10472185 A JP10472185 A JP 10472185A JP 10472185 A JP10472185 A JP 10472185A JP H064340 B2 JPH064340 B2 JP H064340B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- support
- adhesive
- thermal head
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 （イ）産業上の利用分野 この発明は、サーマルヘッド、特に基板と支持体の接着
構造に特徴を有するサーマルヘッドに関する。The present invention relates to a thermal head, and more particularly to a thermal head characterized by an adhesive structure between a substrate and a support.
（ロ）従来の技術 一般に、サーマルヘッドは、発熱抵抗体、電極等の印字
部を形成する基板が、接着剤で放熱部等を形成する支持
体に貼付けられている。この種のサーマルヘッドの断面
図を第１０図に示している。ここに示すサーマルヘッド
は、基板ａと支持体ｂが接着剤ｃで全面的に接着されて
いる。基板ａの材料としてＡｌ２Ｏ３（アルミナ）、支
持体ｂの材料としてＡｌ、Ｆｅが使用されるのが通常で
あり、接着剤としては、常温硬化型接着剤や熱硬化型接
着剤が使用される。(B) Conventional Technology Generally, in a thermal head, a substrate forming a printing portion such as a heating resistor and an electrode is attached to a support forming an radiating portion with an adhesive. A sectional view of this type of thermal head is shown in FIG. In the thermal head shown here, the substrate a and the support b are entirely bonded with the adhesive c. Al 2 O 3 (alumina) is usually used as the material of the substrate a, and Al and Fe are usually used as the material of the support b, and a room temperature curable adhesive or a thermosetting adhesive is used as the adhesive. To be done.
（ハ）発明が解決しようとする問題点 上記従来のサーマルヘッドにおいて、Ａｌ２Ｏ３の基板
ａとＡｌの支持体ｂを常温硬化型接着剤で接着した場合
を想定すると、常温接着時は基板ａ、支持体ｂともフラ
ットであるが、加熱されるとＡｌ２Ｏ３とＡｌの熱膨張
係数が相違する（Ａｌ２Ｏ３：7.2×１０-6１／℃、Ａ
ｌ：23.5×１０-6１／℃）ので、基板ａ側に反りが生じ
る。(C) Problems to be Solved by the Invention In the above conventional thermal head, assuming that a substrate a of Al 2 O 3 and a support b of Al are bonded with a room temperature curable adhesive, the substrate is bonded at room temperature. Although both a and the support b are flat, the thermal expansion coefficients of Al 2 O 3 and Al are different when heated (Al 2 O 3 : 7.2 × 10 −6 1 / ° C., A
(1: 23.5 × 10 −6 1 / ° C.), a warp occurs on the substrate a side.
また、Ａｌ２Ｏ３の基板ａとＡｌの支持体ｂを熱硬化型
接着剤で接着した場合を想定すると、この場合はオーブ
ン等で接着剤を硬化させるものであるが、加熱開始当初
は、まだ接着剤が硬化していないので、基板ａと支持体
ｂはそれぞれの膨張係数に基づいて真直ぐ伸び、時間が
経過するにつれて接着剤が硬化し、基板ａと支持体ｂは
伸びた状態で接着される。そして硬化後、常温に冷却す
ると、基板ａ、支持体ｂは伸びた分縮むが、すでに基板
ａと支持体ｂは接着されており、かつ膨張した度合も相
違するので、この場合は、支持体ｂ側に向けて反りが生
じる。Further, assuming that the substrate a of Al 2 O 3 and the support b of Al are bonded by a thermosetting adhesive, in this case, the adhesive is cured by an oven or the like. Since the adhesive has not yet hardened, the substrate a and the support b straightly expand based on their respective expansion coefficients, the adhesive hardens over time, and the substrate a and the support b are bonded in the expanded state. To be done. Then, after curing, when cooled to room temperature, the substrate a and the support b contract by the expansion, but the substrate a and the support b are already bonded and the degree of expansion is different. In this case, the support a Warpage occurs toward the b side.
上記、いずれの場合でも、サーマルヘッドに反りが生じ
ると、基板表面の印字部が面一とならず、印字むらが生
じるという問題があった。In any of the above cases, when the thermal head is warped, there is a problem in that the printed portion on the surface of the substrate is not flush with each other and uneven printing occurs.
この発明は、上記に鑑み、温度変化が生じても、基板に
反りを生じないサーマルヘッドを提供することを目的と
している。In view of the above, it is an object of the present invention to provide a thermal head in which the substrate does not warp even if the temperature changes.
（ニ）問題点を解決するための手段及び作用 この発明のサーマルヘッドは、支持体表面の端縁を周回
して硬化接着剤で堤防を形成し、かつこの堤防の内側に
流動性を有する充填剤を充填し、前記堤防を塞ぐように
基板を重設し、さらに前記支持体表面の略中央部で支持
体と基板を接着剤で接着している。(D) Means and Actions for Solving Problems The thermal head according to the present invention forms a bank with a curable adhesive around the edge of the surface of the support, and has fluidity inside the bank. The base material is filled with an agent, and the substrate is placed so as to cover the embankment. Further, the support and the substrate are adhered to each other with an adhesive at a substantially central portion of the surface of the support.
このサーマルヘッドでは、支持体と基板は略中央部で接
着されているのみなので、加熱・冷却等により温度変化
が生じても、端縁部は互いにフリーなので、それぞれの
膨張係数に応じて膨張・収縮し、反りが生じない。ま
た、基板よりの熱は充填剤を介して支持体に放熱され
る。In this thermal head, the support and the substrate are only bonded at the approximately central part, so even if the temperature changes due to heating or cooling, the edge parts are free from each other, so the expansion and Shrinks and does not warp. Further, the heat from the substrate is radiated to the support through the filler.
（ホ）実施例 以下、実施例により、この発明をさらに詳細に説明す
る。(E) Examples Hereinafter, the present invention will be described in more detail with reference to Examples.
第１図は、この発明の一実施例を示すサーマルヘッドの
基板を省略した平面図であり、第２図、第３図は、同サ
ーマルヘッドの第１図の線II−II、線III−IIIで切断し
た、基板を含む断面図である。FIG. 1 is a plan view in which a substrate of a thermal head showing an embodiment of the present invention is omitted, and FIGS. 2 and 3 are line II-II and line III- of FIG. 1 of the thermal head. It is sectional drawing containing the board | substrate cut | disconnected by III.
この実施例サーマルヘッド１は、平板状の支持体２に基
板３が接着されて構成されている。The thermal head 1 of this embodiment is constructed by adhering a substrate 3 to a support 2 having a flat plate shape.
支持体２の表面には、端縁を周回して硬化接着剤で堤防
４が形成されており、この堤防４の内側には中央部分を
除いて流動性の充填剤５が充填されている。さらに、支
持体２と基板３は、中央部分で接着剤６によって接着さ
れている。基板３は、堤防４上に充填剤５を蓋するよう
に重設され、堤防４に接触しているが、接着されていな
い。A levee 4 is formed on the surface of the support 2 around the edge by a hardening adhesive, and a fluid filler 5 is filled inside the levee 4 except for the central portion. Further, the support 2 and the substrate 3 are adhered to each other by the adhesive 6 at the central portion. The substrate 3 is superposed on the bank 4 so as to cover the filler 5, and is in contact with the bank 4, but is not bonded.
堤防４は、充填剤５の流出防止及び膜厚維持のために設
けられており、支持体２とは接着されているが、上記し
たように、基板３とは接触しているのみでなる。充填剤
５は、放熱性確保と熱膨張ストレスを吸収するために設
けられている。The bank 4 is provided to prevent the filler 5 from flowing out and maintain the film thickness, and is adhered to the support 2, but as described above, is only in contact with the substrate 3. The filler 5 is provided to secure heat dissipation and absorb thermal expansion stress.
堤防４用及び貼付接着剤６用としては、シリコン系、エ
ポキシ系、アクリル系等を使用すればよい。常温硬化
型、熱硬化型は問わない。充填剤６としてはシリコン系
グリスを使用する。これら接着剤、充填剤は、いずれも
熱伝導率が１×１０-4cal/cm sec・℃〜１０×１０-3cal
/cm sec・℃のものが使用される。堤防４、充填剤５及び
接着剤６の層厚は任意でよいが、同層厚とし、層厚を１
０〜５０μとするのが望ましい。なお、支持体２はＡｌ
を、また基板３はＡｌ２Ｏ３を使用する。Silicone, epoxy, acrylic or the like may be used for the embankment 4 and the adhesive adhesive 6. It does not matter whether it is a room temperature curing type or a thermosetting type. Silicon-based grease is used as the filler 6. The thermal conductivity of these adhesives and fillers is 1 × 10 −4 cal / cm sec · ° C. to 10 × 10 −3 cal.
/ cm sec · ° C. used. The layer thickness of the bank 4, the filler 5 and the adhesive 6 may be arbitrary, but the same layer thickness is used and the layer thickness is 1
It is desirable to set it to 0 to 50 μ. The support 2 is made of Al
And the substrate 3 uses Al 2 O 3 .
支持体２と基板３が接着されたサーマルヘッド１は、温
度変化があると、支持体２と基板３の熱膨張係数が相違
するので、伸張・収縮度合が異なるが、支持体２と基板
３の接着部分は中央部分のわずかな領域であり、両端が
フリーであるから、それぞれ自由に伸張・収縮し、反り
が生じることはない。In the thermal head 1 in which the support 2 and the substrate 3 are bonded, when the temperature changes, the thermal expansion coefficient of the support 2 and the substrate 3 are different, so that the expansion / contraction degree is different, but the support 2 and the substrate 3 are different. Since the adhesive portion is a small area in the central portion and both ends are free, it can freely expand and contract, and no warpage occurs.
次に、上記サーマルヘッド１の支持体２と基板３の接着
方法の一例について説明する。Next, an example of a method of bonding the support 2 of the thermal head 1 and the substrate 3 will be described.
先ず、第４図に示すように、支持体２の表面の端縁にス
クリーン印刷で接着剤を塗布し、硬化させ、堤防４を形
成する。また、堤防４の内側に、中央部分を除いて充填
剤５を、やはりスクリーン印刷で充填する。First, as shown in FIG. 4, an adhesive is applied by screen printing to the edge of the surface of the support 2 and cured to form a bank 4. Further, the filling material 5 is also filled inside the bank 4 by screen printing except for the central portion.
一方、第５図に示すように、基板３の裏面中央部にスク
リーン印刷で接着剤６を塗布する。そして、基板３を表
裏逆にして、支持体２上に重合わせ、接着剤６を硬化さ
せて支持体２と基板３を接着する。On the other hand, as shown in FIG. 5, the adhesive 6 is applied to the center of the back surface of the substrate 3 by screen printing. Then, the substrate 3 is turned upside down, the substrate 3 is superposed on the support 2, and the adhesive 6 is cured to bond the support 2 and the substrate 3 together.
接着剤、充填剤の塗布・充填は、もちろんスクリーン印
刷以外の方法でも可能であるが、この方法を用いれば、
接着工程を簡略化することができる。Application and filling of adhesives and fillers can of course be done by methods other than screen printing, but using this method,
The bonding process can be simplified.
なお、上記実施例では、支持体２と基板３を接着する接
着剤６の塗布分のパターン形状は長方形であり、堤防４
から離隔しているが、接着剤６を塗布する部分は支持体
２の略中央部であればよく、形状は種々のものが考えら
れる。例えば第６図に示すように、堤防４の長辺４ａか
ら４ｂに至る長方形としてもよいし、第７図に示すよう
に、堤防４の長辺４ａ、４ｂに沿って平行に、２個の長
方形状の接着部分６ａ、６ｂを設けてもよいし、この接
着剤部分６ａ、６ｂのうち、一方を省略してもよい（第
９図参照）。あるいは第８図に示すように、支持体２の
中央部に円形の複数個の接着剤部分６ａ、６ｂ、６ｃ、
６ｄを設けてもよい。In the above embodiment, the pattern shape of the applied adhesive 6 for adhering the support 2 and the substrate 3 is rectangular, and the bank 4
However, the portion to which the adhesive 6 is applied may be the substantially central portion of the support 2, and various shapes are conceivable. For example, as shown in FIG. 6, it may be a rectangle extending from the long sides 4a to 4b of the embankment 4, or as shown in FIG. The rectangular adhesive portions 6a and 6b may be provided, or one of the adhesive portions 6a and 6b may be omitted (see FIG. 9). Alternatively, as shown in FIG. 8, a plurality of circular adhesive portions 6a, 6b, 6c,
6d may be provided.
（ヘ）発明の効果 この発明によれば、支持体と基板が中央部分のみで接着
され、端縁の堤防と基板は非接着であるから、熱ストレ
スが加わっても、熱膨張差による反りが発生することは
ない。例えば、Ａｌ２Ｏ３とＡｌの熱膨張の差程度でも
反りは抑えることができ、印字品質を確保した上で、サ
ーマルヘッドの高放熱性、軽量化を達成することができ
る。(F) Effect of the Invention According to the present invention, since the support and the substrate are bonded only at the central portion, and the embankment at the edge and the substrate are non-bonded, warpage due to the difference in thermal expansion does not occur even if thermal stress is applied. It never happens. For example, the warp can be suppressed even with a difference in thermal expansion between Al 2 O 3 and Al, and high heat dissipation and weight reduction of the thermal head can be achieved while ensuring print quality.
第１図は、この発明の一実施例を示すサーマルヘッドの
基板を省略した平面図、第２図は、同サーマルヘッドを
線II−IIで切断した断面図、第３図は、同サーマルヘッ
ドを線III−IIIで切断した断面図、第４図は、同サーマ
ルヘッドの接着方法を説明するための支持体の断面図、
第５図は、同基板の断面図、第６図、第７図、第８図及
び第９図は、この発明の他の接着剤パターン例を示す
図、第１０図は、従来のサーマルヘッドを説明するため
の断面図である。 １：サーマルヘッド、２：支持体、 ３：基板、４：堤防、 ５：充填剤、６：接着剤。FIG. 1 is a plan view of a thermal head showing an embodiment of the present invention with a substrate omitted, FIG. 2 is a sectional view of the thermal head taken along line II-II, and FIG. 3 is the thermal head. Is a cross-sectional view taken along line III-III in FIG. 4, and FIG. 4 is a cross-sectional view of a support for explaining the method of bonding the thermal head.
FIG. 5 is a sectional view of the substrate, FIGS. 6, 7, 8 and 9 are views showing other examples of adhesive patterns of the present invention, and FIG. 10 is a conventional thermal head. It is a sectional view for explaining. 1: Thermal head, 2: Support, 3: Substrate, 4: Levee, 5: Filler, 6: Adhesive.
Claims (1)
堤防を形成し、かつこの堤防の内側に流動性を有する充
填剤を充填し、前記堤防を塞ぐように基板を重設し、前
記支持体表面の略中央部で支持体と前記基板を接着剤で
接着したことを特徴とするサーマルヘッド。1. An embankment is formed by a curable adhesive around an edge of a surface of a support, and a fluid filler is filled inside the embankment. A substrate is superposed so as to cover the embankment. The thermal head is characterized in that the support and the substrate are adhered to each other with an adhesive at a substantially central portion of the surface of the support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10472185A JPH064340B2 (en) | 1985-05-15 | 1985-05-15 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10472185A JPH064340B2 (en) | 1985-05-15 | 1985-05-15 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61261066A JPS61261066A (en) | 1986-11-19 |
| JPH064340B2 true JPH064340B2 (en) | 1994-01-19 |
Family
ID=14388352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10472185A Expired - Lifetime JPH064340B2 (en) | 1985-05-15 | 1985-05-15 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064340B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02147350A (en) * | 1988-11-30 | 1990-06-06 | Tdk Corp | Thermal head |
| JP2003011407A (en) * | 2001-06-28 | 2003-01-15 | Kyocera Corp | Thermal head |
| JP4051262B2 (en) * | 2002-10-29 | 2008-02-20 | 京セラ株式会社 | Thermal head and thermal printer using the same |
| US7222934B2 (en) * | 2004-11-22 | 2007-05-29 | Xerox Corporation | Method and apparatus for mounting an inkjet printhead |
-
1985
- 1985-05-15 JP JP10472185A patent/JPH064340B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61261066A (en) | 1986-11-19 |
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