JPH0643635B2 - Method of forming fine grooves - Google Patents
Method of forming fine groovesInfo
- Publication number
- JPH0643635B2 JPH0643635B2 JP10620686A JP10620686A JPH0643635B2 JP H0643635 B2 JPH0643635 B2 JP H0643635B2 JP 10620686 A JP10620686 A JP 10620686A JP 10620686 A JP10620686 A JP 10620686A JP H0643635 B2 JPH0643635 B2 JP H0643635B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- forming
- etching
- fine
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
【発明の詳細な説明】 〔概要〕 本発明の微細溝の形成方法は、従来、レジスト塗布→露
光→現像→エッチングの順で行われていたノズル溝形成
工程の前に、素材上にメッキ層を積層するメッキ工程を
付加したもので、これにより理想的なノズル溝の形成が
可能となる。DETAILED DESCRIPTION OF THE INVENTION [Outline] A method of forming a fine groove of the present invention includes a method of forming a plating layer on a material before a nozzle groove forming step, which has been conventionally performed in the order of resist application → exposure → development → etching. It is possible to form an ideal nozzle groove by adding a plating process of laminating the.
本発明はインクジェットプリンタに装備されるインクジ
ェットヘッド用の微細ノズル溝の形成方法に関する。The present invention relates to a method for forming a fine nozzle groove for an inkjet head installed in an inkjet printer.
インクジェットヘッドのノズル溝は、インク噴射特性の
関係から半円形断面の溝が理想とされ、その半円形の微
細溝を高精度、且つ安価に実現するための製造法が要望
されている。The nozzle groove of the inkjet head is ideally a groove having a semicircular cross section in view of the ink ejection characteristics, and a manufacturing method for realizing the semicircular fine groove with high accuracy and at low cost is desired.
第２図(a)，(b)，(c)，(d)は従来の微細溝形成工程を示
す要部側断面図である。2 (a), (b), (c), and (d) are side sectional views of a main part showing a conventional fine groove forming step.
以下、第２図(a)〜(d)によって従来の微細溝形成方法を
説明する。Hereinafter, a conventional method for forming fine grooves will be described with reference to FIGS.
．レジスト塗布工程〔第２図(a)〕 例えばステンレス板等より成る素材１の溝形成面に、光
硬化性レジスト（以下レジストと呼ぶ）２が塗布され
る。． Resist coating step [FIG. 2 (a)] A photo-curable resist (hereinafter referred to as resist) 2 is coated on the groove forming surface of a material 1 made of, for example, a stainless steel plate or the like.
．露光工程〔第２図(b)〕 素材１上に微細溝形成用の不透明部6aと透明部6bとより
成るフィルム６が載置され、露光が行われる。． Exposure Step [FIG. 2 (b)] A film 6 composed of an opaque portion 6a for forming fine grooves and a transparent portion 6b is placed on the material 1 and exposed.
．現像工程〔第２図(c)〕 現像により、パターン幅Ａに対応するレジスト２が取り
除かれ、そこにエッチング溝2aが形成される。． Development Step [FIG. 2 (c)] By development, the resist 2 corresponding to the pattern width A is removed, and the etching groove 2a is formed therein.
．エッチング工程〔第２図(c)〕 上記エッチング溝2aからエッチング液４が流入して素材
１をエッチングし、素材１には幅W1，深さＨのノズル溝
７が形成される。． Etching Step [FIG. 2 (c)] The material 1 is etched by flowing the etching solution 4 through the etching groove 2a to form a nozzle groove 7 having a width W 1 and a depth H in the material 1.
ところが、上記従来の微細溝形成方法では、サイドエッ
チングＣが、矢印方向から流入してきたエッチング液４
の作用によって生じ、その値は深さＨに略等しい。従っ
て、この場合のノズル溝７の幅W1は、例えばパターン幅
Ａ＝50μｍ、エッチング深さＨ＝40μｍとすれば、 W1＝Ａ＋2C＝Ａ＋2H＝50μｍ＋80μｍ＝130 μｍ となり、溝の断面形状は縦寸法Ｈに対して横寸法W1の広
い偏平型となるので、インクの噴射性が良くない。However, in the above-described conventional method of forming fine grooves, the side etching C causes the etching solution 4 that has flowed in from the direction of the arrow.
Caused by the action of, and its value is approximately equal to the depth H. Therefore, if the width W 1 of the nozzle groove 7 in this case is, for example, the pattern width A = 50 μm and the etching depth H = 40 μm, then W 1 = A + 2C = A + 2H = 50 μm + 80 μm = 130 μm, and the cross-sectional shape of the groove is vertical. Since it is a wide flat type having a lateral dimension W 1 with respect to the dimension H, the ink jetting property is not good.
本発明は、ノズル溝偏平化の第１要因であるサイドエッ
チング作用を抑制するための微細溝形成方法を提供する
ものである。The present invention provides a fine groove forming method for suppressing the side etching action which is the first factor of the flattening of the nozzle groove.
本発明は第１図の実施例図に示すように、予め素材のノ
ズル溝形成面にメッキ層を形成しておき、それからエッ
チングの諸工程を実施する。According to the present invention, as shown in the embodiment of FIG. 1, a plating layer is formed in advance on the nozzle groove forming surface of a material, and then various etching steps are carried out.
前記メッキ層の存在により、微細溝エッチング時のサイ
ドエッチング現象の発生が抑制される。従って、理想に
近い半円形断面の微細溝となる。The presence of the plating layer suppresses the occurrence of the side etching phenomenon during the etching of the fine groove. Therefore, it becomes a fine groove having a semicircular cross section that is close to ideal.
以下実施例図に基づいて本発明を詳細に説明する。 The present invention will be described in detail below with reference to the accompanying drawings.
第１図(a)，(b)，(c)，(d)，(e)は本発明の微細溝の形
成方法の一実施例を工程順に示す要部側断面図である
が、前記第２図と同一部分には同一符号を付している。FIGS. 1 (a), (b), (c), (d), and (e) are side sectional views of a main part showing one embodiment of a method of forming a fine groove of the present invention in the order of steps. The same parts as those in FIG. 2 are designated by the same reference numerals.
第１図(a)に示すように、本発明の特徴は、ノズル溝形
成面に予めメッキ層５が形成された素材１を用いている
点にある。以下第１図を用いて本発明を工程順に説明す
る。As shown in FIG. 1 (a), the feature of the present invention is that the material 1 having the plating layer 5 formed in advance on the nozzle groove forming surface is used. The present invention will be described below in order of steps with reference to FIG.
．メッキ層形成工程〔第１図(a)〕 素材１のノズル溝形成面に、例えばニッケルメッキ等の
メッキ層５を形成する。． Plating Layer Forming Step [FIG. 1 (a)] On the nozzle groove forming surface of the material 1, for example, a plating layer 5 such as nickel plating is formed.
．レジスト塗布工程〔第１図(b)〕 メッキ層５の上にレジスト２を塗布する。． Resist Coating Step [FIG. 1 (b)] The resist 2 is coated on the plating layer 5.
．露光工程〔第１図(c)〕 レジスト２の上にノズル溝７形成用の不透明部6aと透明
部6bとより成るフィルム６を載置して露光を行う。． Exposure step [FIG. 1 (c)] A film 6 composed of an opaque portion 6a and a transparent portion 6b for forming a nozzle groove 7 is placed on the resist 2 and exposed.
．現像工程〔第１図(d)〕 現像により、パターン幅Ａに対応するレジスト２が取り
除かれ、そこにエッチング溝2aが形成される。． Development Step [FIG. 1 (d)] By development, the resist 2 corresponding to the pattern width A is removed, and the etching groove 2a is formed therein.
．エッチング工程〔第１図(e)〕 エッチング溝2aからエッチング液４が矢印方向に流入し
てメッキ層５と素材１とをエッチングし、素材１には幅
Ｗ，深さＨのノズル溝７が形成される。この場合のサイ
ドエッチングＤは、メッキ層５の作用で、ノズル溝の深
さＨのおよそ１／２程度の寸法となる。． Etching Step [FIG. 1 (e)] The etching liquid 4 flows in the direction of the arrow from the etching groove 2a to etch the plating layer 5 and the material 1, and the material 1 has a nozzle groove 7 with a width W and a depth H. It is formed. The side etching D in this case has a size of about 1/2 of the depth H of the nozzle groove due to the action of the plating layer 5.
従って、この場合のノズル溝７の幅Ｗは、パターン幅Ａ
＝50μｍ、深さＨ＝40μｍとすれば、 Ｗ＝Ａ＋2D＝50μｍ＋40μｍ＝90μｍとなり、ノズル溝
７の断面形状は理想に近い半円形となる。また前述した
従来方法によるノズル溝７の幅W1＝130 μｍに比べてか
なり細い溝となる。Therefore, the width W of the nozzle groove 7 in this case is equal to the pattern width A.
= 50 .mu.m and depth H = 40 .mu.m, W = A + 2D = 50 .mu.m + 40 .mu.m = 90 .mu.m, and the cross-sectional shape of the nozzle groove 7 becomes a semi-circular shape close to the ideal. In addition, the width of the nozzle groove 7 is considerably narrower than the width W 1 = 130 μm of the conventional method.
このため、インクの噴射性は従来に比して格段に良くな
る。For this reason, the ink jetting property is remarkably improved as compared with the conventional case.
本発明は以上説明したように、レジスト塗布前の素材表
面にメッキ層を形成させるといった簡単な手段によっ
て、理想的な半円形断面のノズル溝が得られるという効
果がある。As described above, the present invention has an effect that an ideal semi-circular cross-section nozzle groove can be obtained by a simple means such as forming a plating layer on the material surface before resist coating.
第１図(a)，(b)，(c)，(d)，(e)は本発明の微細溝の形
成方法の一実施例を工程順に示す要部側断面図、 第２図(a)，(b)，(c)，(d)は従来の微細溝形成工程を示
す要部側断面図である。 図中、１は素材、 ２はレジスト、 2aはエッチング溝、 ４はエッチング液、 ５はメッキ層、 ６はフィルム、 6aは不透明部、 6bは透明部、 ７はノズル溝、 Ｃ，Ｄはサイドエッチング、 をそれぞれ示す。1 (a), (b), (c), (d), and (e) are side cross-sectional views of a main part showing one embodiment of a method for forming a fine groove of the present invention in process order, and FIG. ), (B), (c), and (d) are cross-sectional views of the main part showing the conventional fine groove forming process. In the figure, 1 is a material, 2 is a resist, 2a is an etching groove, 4 is an etching liquid, 5 is a plating layer, 6 is a film, 6a is an opaque part, 6b is a transparent part, 7 is a nozzle groove, and C and D are sides. Etching is shown respectively.
Claims (1)
射用のノズル溝を形成する微細溝の形成方法であって、 前記素材(1)の溝形成面にメッキ層(5)を積層後、溝形成
のレジスト塗布，露光，現像，エッチング工程を実施す
ることを特徴とする微細溝の形成方法。1. A method for forming a fine groove for forming a nozzle groove for ink ejection on a material (1) by etching, comprising: laminating a plating layer (5) on the groove forming surface of the material (1), A method for forming fine grooves, which comprises performing resist coating, exposure, development and etching steps for forming grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10620686A JPH0643635B2 (en) | 1986-05-08 | 1986-05-08 | Method of forming fine grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10620686A JPH0643635B2 (en) | 1986-05-08 | 1986-05-08 | Method of forming fine grooves |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62263981A JPS62263981A (en) | 1987-11-16 |
| JPH0643635B2 true JPH0643635B2 (en) | 1994-06-08 |
Family
ID=14427683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10620686A Expired - Fee Related JPH0643635B2 (en) | 1986-05-08 | 1986-05-08 | Method of forming fine grooves |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0643635B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9619856D0 (en) * | 1996-09-24 | 1996-11-06 | Fotomechanix Ltd | Channel forming method |
-
1986
- 1986-05-08 JP JP10620686A patent/JPH0643635B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62263981A (en) | 1987-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |