JPH0644363B2 - Optical storage disk substrate - Google Patents
Optical storage disk substrateInfo
- Publication number
- JPH0644363B2 JPH0644363B2 JP60065634A JP6563485A JPH0644363B2 JP H0644363 B2 JPH0644363 B2 JP H0644363B2 JP 60065634 A JP60065634 A JP 60065634A JP 6563485 A JP6563485 A JP 6563485A JP H0644363 B2 JPH0644363 B2 JP H0644363B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hole
- inner diameter
- optical storage
- disk substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Optical Record Carriers And Manufacture Thereof (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光または光と磁気により情報の記録・再生を行
うメモリディスクに係る光記憶ディスク基板に関する。The present invention relates to an optical storage disk substrate for a memory disk that records / reproduces information by light or light and magnetism.
係る光記憶ディスク基板は,案内溝(情報の記録トラッ
ク)予成形になるモールド成形体とフォトポリマ樹脂と
を用いてガラス等基板の表面に案内溝パターンが転写さ
れる。この際,パターン成形体とディスク基板相互間は
ある精度内の心出しをなすことが偏心ブレの小さいトラ
ックパターン形成に不可欠の事項である。In such an optical storage disk substrate, a guide groove pattern is transferred to the surface of a substrate such as glass by using a molded body for preforming guide grooves (information recording tracks) and a photopolymer resin. At this time, centering within a certain accuracy between the pattern molded body and the disk substrate is an essential item for forming a track pattern with small eccentricity deviation.
本発明は偏心の少ないパターン転写を容易ならしめるデ
ィスク基板構造について提示するものである。The present invention provides a disk substrate structure that facilitates pattern transfer with less eccentricity.
第4図は従来の光記憶ディスク基板(以下単に基板と呼
ぶ)の斜視図である。FIG. 4 is a perspective view of a conventional optical storage disk substrate (hereinafter simply referred to as a substrate).
基板10は,ガラス,アクリル樹脂,あるいはポリカーボ
ネートを素材とする厚さ 0.6〜1.5 mm,外径が例えば 3
00mm,内径が35mmの平坦なる円盤材料から形成される。The substrate 10 is made of glass, acrylic resin, or polycarbonate and has a thickness of 0.6 to 1.5 mm and an outer diameter of, for example, 3 mm.
It is made of flat disc material with a diameter of 00 mm and an inner diameter of 35 mm.
基板10の一面に図示する一点鎖線で囲む面11は、光情報
を記録・再生するスタンパ成形になる同心円状の無数の
案内溝(案内溝は図示されない)形成面11である。図
中,12は基板の貫通孔である。A surface 11 surrounded by an alternate long and short dash line shown on one surface of the substrate 10 is an infinite number of concentric guide grooves (guide grooves not shown) forming surface 11 for stamper molding for recording / reproducing optical information. In the figure, 12 is a through hole in the substrate.
貫通孔12は前記案内溝形成をなすさいスタンパ成形型に
よるパターン転写時における特に,基板心出しをなす基
準孔となる。The through hole 12 serves as a reference hole for centering the substrate, particularly when the pattern is transferred by the stamper molding die forming the guide groove.
然し乍ら,基板素材がガラスの場合,例えば寸法公差±
50μmの基準孔加工あるいは孔内面の研磨加工は工数が
かかり加工上の観点から問題がある。However, when the substrate material is glass, for example, dimensional tolerance ±
The 50 μm reference hole processing or the polishing of the inner surface of the hole requires a lot of man-hours, which is problematic from the viewpoint of processing.
又,基板素材としてアクリル樹脂,あるいはポリカーボ
ネートを使用する場合では,係る高分子成形基板体は軟
らかくて前記寸法公差の孔加工精度が出し難いと云う問
題がある。Further, when acrylic resin or polycarbonate is used as the substrate material, there is a problem that such a polymer molded substrate is soft and it is difficult to obtain the hole machining accuracy of the dimensional tolerance.
前記加工精度の出し難い基板による心出しを容易ならし
める為,予形成の基板貫通孔を粗精度で最終内径より若
干大きめに穿設した内径r4を有する基板貫通孔とな
し,所定寸法公差に穿設した内径r1を有する前記基板
貫通孔内に挿入のメタルリングと,該メタルリング並び
に基板それぞれに跨り面連結する内径r2(r2>
r1),外径r5(r5>r4)を有する補強リングに
より,内径r1の基板孔を有するメタルリング連結構造
になる光記憶ディスク基板としたものである。In order to facilitate the centering of the substrate whose processing accuracy is difficult to obtain, the preformed substrate through-hole is coarsely formed with a substrate through-hole having an inner diameter r 4 slightly larger than the final inner diameter, and has a predetermined dimensional tolerance. A metal ring having a bored inner diameter r 1 inserted into the through hole of the substrate, and an inner diameter r 2 (r 2 > for connecting the metal ring and the substrate across the surface).
r 1 ), an outer diameter r 5 (r 5 > r 4 ), and an optical storage disk substrate having a metal ring connection structure having a substrate hole with an inner diameter r 1 by a reinforcing ring.
基板貫通孔の穿設は粗精度でよいことから作業が容易で
あること,他方,最終的の基板貫通孔内径に仕上げたメ
タルリングは所用とする寸法公差精度の加工が極めて容
易である。斯様なメタルリングと基板素材の相互を補強
リングを介して接着せしめた連結構成する為,心出しの
偏心が小さい光記憶ディスク基板が極めて容易に実現し
うる。Since the substrate through-holes can be drilled with coarse precision, the work is easy. On the other hand, the metal ring finished to the final substrate through-hole inner diameter is extremely easy to machine to the required dimensional tolerance precision. Since the metal ring and the substrate material are connected to each other via the reinforcing ring, the optical storage disc substrate with a small eccentricity can be realized very easily.
以下,実施例図に従って本発明の詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to the drawings.
第1図は基板素材に連結する基板組立前の部品構成を示
すメタルリングと補強リングの実施例斜視図である。FIG. 1 is a perspective view of an embodiment of a metal ring and a reinforcing ring showing a component structure before being assembled to a substrate and connected to a substrate material.
第2図はディスク基板組立体の実施例断面図である。FIG. 2 is a sectional view of an embodiment of the disk substrate assembly.
両図において,1は少なくとも±50μmまたはそれ以下
の指定寸法公差内に仕上加工された基板貫通孔径r1を
形成せるメタルリング,また2は補強リングである。In both figures, 1 is a metal ring for forming a finished substrate through hole diameter r 1 within a specified dimension tolerance of at least ± 50 μm or less, and 2 is a reinforcing ring.
メタルリング1は基板と同じ厚さとしその外径r3は基
板素材10に粗穿設された内径r4の貫通孔13(第2図組
立体断面図参照)より小さい内周メタルリングに形成さ
れてなる。補強リング2は厚さ 0.1mm程度,内径r2,
外径r5に形成され,前記メタルリング1と基板素材10
相互の連結部材となる平板リングである。内径r2はメ
タルリングの貫通孔径r1より若干大きい寸法とする。The metal ring 1 has the same thickness as the substrate, and its outer diameter r 3 is formed in an inner metal ring smaller than the through hole 13 (see the sectional view of the assembly in FIG. 2) of the inner diameter r 4 roughly formed in the substrate material 10. It becomes. The reinforcing ring 2 has a thickness of about 0.1 mm, an inner diameter r 2 ,
The metal ring 1 and the substrate material 10 are formed to have an outer diameter r 5.
It is a flat plate ring that serves as a mutual connecting member. The inner diameter r 2 is set to be slightly larger than the through hole diameter r 1 of the metal ring.
第2図断面図から平板状補強リング2によりリング1と
基板素材10間に跨る連結構成を説明する。A connecting structure extending between the ring 1 and the substrate material 10 by the flat plate-shaped reinforcing ring 2 will be described from the cross-sectional view of FIG.
内径r2外径r5に成形された補強リング2に先ずメタ
ルリング1を接着する(接着面5)。次いで内径r4を
成形した基板素材10と補強リング2を嫌気性付与型紫外
線硬化樹脂例えばロックタイト社製のLI298 あるいはエ
ポキシ接着剤などを用いて図示6の面接着をなす。First, the metal ring 1 is bonded to the reinforcing ring 2 formed to have the inner diameter r 2 and the outer diameter r 5 (bonding surface 5). Next, the substrate material 10 having the inner diameter r 4 and the reinforcing ring 2 are surface-bonded as shown in FIG.
前記接着剤により連結された基板は,貫通孔13の粗精度
がメタルリング1 の有する高精度加工孔r1で置き換え
られたことになる。In the substrates connected by the adhesive, the rough precision of the through hole 13 is replaced with the high precision processed hole r 1 of the metal ring 1.
メタルリング1 の貫通孔r1の精度は,指定に応じて±
10μm程度の公差内に加工することが出来る。The accuracy of the through hole r 1 of the metal ring 1 is ±
It can be processed within the tolerance of about 10 μm.
第3図は本発明の基板内周部に設けるメタルリングの他
実施例を示す断面図である。FIG. 3 is a sectional view showing another embodiment of the metal ring provided on the inner peripheral portion of the substrate of the present invention.
第2図と比較すれば明らかとなる様にメタルリング3は
貫通孔r1形成の孔高さが補強リング2の厚さ分4だけ
厚肉となるため,スタンパ成形型スピンドルとの嵌り合
う軸方位性が高まると云う利点がある。As is apparent from comparison with FIG. 2, the metal ring 3 has a hole height of the through hole r 1 that is thicker by the thickness of the reinforcing ring 2 by 4 so that the shaft that fits with the stamper molding die spindle is formed. There is an advantage that the orientation is enhanced.
以上詳細に説明した本発明の光記憶ディスク基板は基板
内周孔に装着するメタルリングにより,基板に所用とさ
れる基板心出しの寸法精度が任意に設定されると云う顕
著な効果がある。又,副次的な効果として基板内周孔が
メタルであるため光記憶ディスク装置に基板をセットす
るときその内周端を保護する効果がある。The optical storage disk substrate of the present invention described in detail above has a remarkable effect that the dimensional accuracy of the substrate centering required for the substrate is arbitrarily set by the metal ring mounted in the inner peripheral hole of the substrate. As a secondary effect, since the substrate inner peripheral hole is made of metal, it has an effect of protecting the inner peripheral edge when the substrate is set in the optical storage disk device.
第1図は本発明の基板素材に連結するメタルリングと補
助リングの実施例斜視図である。 第2図は本発明の連結構造実施例とするディスク組立体
断面図, 第3図は第2図と異なる他の実施例断面図, 第4図は従来の光記憶ディスク基板の斜視図である。 図中,1と3は孔内径r1を有するメタルリング, 6は補強リング, 10はディスク基板材料(または基板素材)FIG. 1 is a perspective view of an embodiment of a metal ring and an auxiliary ring connected to a substrate material of the present invention. 2 is a sectional view of a disk assembly as an embodiment of the connection structure of the present invention, FIG. 3 is a sectional view of another embodiment different from FIG. 2, and FIG. 4 is a perspective view of a conventional optical storage disk substrate. . In the figure, 1 and 3 are metal rings having a hole inner diameter r 1 , 6 is a reinforcing ring, and 10 is a disk substrate material (or substrate material).
Claims (1)
料,内径r4に内接する外径r3及び所定寸法公差の内
径r1を有するメタルリング,前記ディスク基板材料及
びメタルリングそれぞれに跨り面連結する内径r2(r
3>r2>r1)と外径r5(r5>r4)を有する補
強リングよりなることを特徴とする光記憶ディスク基
板。1. A disk substrate material having an inner diameter r 4 becomes preformed, metal rings having an outer diameter r 3 and the inner diameter r 1 of the predetermined dimensional tolerances inscribed to the inner diameter r 4, span each of the disk substrate material and the metal ring Inner diameter r 2 (r
3 > r 2 > r 1 ) and an outer diameter r 5 (r 5 > r 4 ), which is a reinforcing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60065634A JPH0644363B2 (en) | 1985-03-29 | 1985-03-29 | Optical storage disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60065634A JPH0644363B2 (en) | 1985-03-29 | 1985-03-29 | Optical storage disk substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61224155A JPS61224155A (en) | 1986-10-04 |
| JPH0644363B2 true JPH0644363B2 (en) | 1994-06-08 |
Family
ID=13292648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60065634A Expired - Lifetime JPH0644363B2 (en) | 1985-03-29 | 1985-03-29 | Optical storage disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644363B2 (en) |
-
1985
- 1985-03-29 JP JP60065634A patent/JPH0644363B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61224155A (en) | 1986-10-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |