JPH0644589B2 - Semiconductor device test handler - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test handler for a semiconductor device equipped with a tester for measuring the electrical characteristics of an IC.

[Conventional technology]

Conventionally, a test handler for this type of semiconductor device has been constructed as shown in FIG. This will be described with reference to FIG. 1. In FIG. 1, the reference numeral 1 indicates a table that moves in the direction of the plane 2, 2 is a board that is held on the table 1 and that houses a large number of semiconductor devices 3, and 4 is a board. Board 2
A first carrier rail 5 arranged near the carrier rail 5 for moving the semiconductor device 3 by a predetermined pitch is provided on the terminal side of the carrier rail 4 and is used to measure the electrical characteristics of the semiconductor device 3. An IC socket 7 having a lid 6 is a modifier provided between the IC socket 5 and the carrying rail 4 to position the semiconductor device 3. Further, 8 is a second for transporting the semiconductor device 3 to a sorting sorter (not shown).
2 is a transport rail, 9 is a suction head that transports the semiconductor device 3 between the transport rails 4 and 8, and 10 is a suction head that transports the semiconductor device 3 between the board 2 and the first transport rail 4. In the figure, the arrows indicate the moving directions of the table 1, both transfer rails 4, 8 and the suction heads 9, 10.

Next, a method of operating the test handler of the semiconductor device thus configured will be described.

First, the semiconductor device 3 on the board 2 is transferred to the first transport rail 4 by the suction head 10. Next, when the first transport rail 4 moves by one pitch, the suction head 9
The semiconductor device 3 on the transport rail 4 is transferred into the corrector 7 by. Then, after inserting this into the IC socket 5 and testing its electrical characteristics, it is transferred to the second transfer rail 8 and transferred to a sorting sorter (not shown).

In this way, the test handler of the semiconductor device can be operated.

[Problems to be solved by the invention]

By the way, since the conventional semiconductor device test handler is composed of a large number of parts, it is necessary to replace all the parts each time when measuring the electrical characteristics of a heterogeneous IC, and the replacement work is complicated. There was a problem to do.

Therefore, in this case, it is possible to use a dedicated machine, but there is a disadvantage that not only the cost increases but also the installation space is wide.

Further, the semiconductor device is mounted on the board 1 to the first transfer rail 4, the first transfer rail 4 to the corrector 7, the corrector 7 to the IC socket 5 and the IC socket 5 to the second transfer rail 8 by suction heads 9 and 10. The semiconductor devices 3 must be transferred one by one in a state of being exposed to the outside.
In addition to spending a great deal of time on the measurement of the electrical characteristics of, the leads 3a of the semiconductor device 3 are easily damaged by contact with other members.

The present invention has been made in view of such circumstances, and it is possible to simplify the parts replacement work, reduce the time spent for measuring the electrical characteristics of the IC, and prevent lead damage of the IC. A test handler for a semiconductor device that can be prevented.

[Means for solving problems]

A test handler for a semiconductor device according to the present invention comprises a push-up device having a support portion for supporting an IC that moves in the vertical direction, a contactor provided above the push-up device and capable of contacting an IC lead, and an IC package. An IC tester having a pusher that can be pressed, an insertion hole that is provided between the IC tester and the push-up device so that the support part can be inserted, and an IC package is supported in the insertion hole. A board having a pedestal and having the same width dimension for each of the same type of IC and the different type of IC, and a support guide arranged in a predetermined width corresponding to the width dimension of the board. And a feeding means for feeding the board along the support guide.

[Work]

In the present invention, even if the type of IC to be used is changed, it is not necessary to replace the component parts (support guide and feeding means) of the device that conveys the board, so that different types of ICs are used.
It is possible to reduce the number of parts to be replaced when measuring the electrical characteristics of the device, and to transfer a large number of ICs while they are housed in the board.

〔Example〕

FIG. 1 is a perspective view showing a test handler of a semiconductor device according to the present invention, FIGS. 2 and 3 are views taken in the directions of arrows A and B in FIG. 1, and FIG. 4 is an arrow C in FIG. It is a perspective view. In the figure, a push-up device indicated by reference numeral 11 is composed of a support part 12 having an insulating property and a drive part 13 for vertically moving the support part 12, of which the support part 12 is a pedestal capable of supporting the semiconductor device 14. 12a and semiconductor device 1
It is formed by four leads 14a and a guide portion 12b for guiding the package 14b. Reference numeral 15 denotes an IC tester for measuring the electrical characteristics of the semiconductor device 14, which has a contactor 15b attached to a block-shaped base 15a and capable of contacting the lead 14a and a presser 15c capable of pressing the package 14b. It is provided above the push-up device 11. Reference numeral 16 is a rectangular board made of a conductive material, and has an insertion hole 16a into which the support portion 12 of the push-up device 11 can be inserted and the package 14 in the insertion hole 16a.
It has a pedestal 16b that supports b, and is provided between the IC tester 15 and the push-up device 11 so as to be movable back and forth.
Reference numeral 17 is a rail as a support guide that serves as a guide when the board 16 is fed by the feed pawl 18. The feed pawl 18 constitutes the feed means according to the present invention. The rail 17 has a structure for guiding the side portion of the board 16,
The boards 16 are arranged on both sides so as to face each other with a certain width. The width of the board 16 is set so that it can be guided by the rail 17,
Even if the types of C are different, the dimensions are the same. That is, the board 16 has the same width dimension for the same type of IC and the different type of IC.

In the test handler of the semiconductor device configured as described above, the board 2 which is conventionally used as shown in FIG. 7 and the first and second transfer rails 4 and 8 are commonly used, and suction is performed. Since the semiconductor device transfer means (supporting portion 12 shown in the present embodiment) is configured by using the heads 9 and 10 in common and has the function of the conventional correction device 7, the number of components is smaller than in the prior art. . Then, as the parts to be replaced when measuring the electrical characteristics of different kinds of ICs (semiconductor devices 14), the supporting portion 12, the IC tester 15, and the board 1 are used.
The number of parts to be replaced can be reduced as compared with the conventional one. That is, the components of the drive mechanism of the support 12 and the board 16 (the drive 13, the rail 17, and the feed pawl 18 do not need to be replaced.
When C is transferred, it can be carried out while being stored in the board 16.

Next, a method of operating the above-mentioned test handler of the semiconductor device will be described.

First, as shown in FIG. 5 (a), the board 16 is conveyed to a predetermined position by the feed claw 18. Next, the supporting portion 12 of the push-up device 11 is moved upward as shown in FIG.
At this time, the guide portion 12b of the support portion 12 faces the insertion hole 16a of the board 16 and, as shown in FIG.
In order to guide 4a, the semiconductor device 14 is supported by the pedestal 12a as shown in FIG. Then, as shown in FIG. 7E, the support portion 12 is moved further upward, and the electrical characteristics of the semiconductor device 14 are measured by the IC tester 15. At this time, the lead 14a of the semiconductor device 14 and the contactor 15b of the IC tester 15 are in contact with each other. After that, as shown in FIG. 3F, the support portion 12 of the push-up device 11 is moved downward to support the semiconductor device 14 on the pedestal 16b of the board 16. Note that FIG. 5 (g) shows a state in which the board 16 has moved by one pitch after the measurement of the electrical characteristics of the semiconductor device 14.

In this way, the test handler of the semiconductor device can be operated.

In this embodiment, a flat package type IC
I showed an example to use when measuring the electrical characteristics of
The present invention is not limited to this, and FIG. 6 (a)-
As shown in (d), DIP, ZIP, PLCC (SO
J) and SOP (QUIP) type ICs can also be used as in the embodiment. As shown in FIG. 6, when changing the type of the IC, it is possible to use the same members as those in the above-mentioned embodiment except that the supporting portion 12, the IC tester 15 and the board 16 are changed to those compatible with the IC. it can. That is, the width dimension of the board 16 is different from that for the same type of IC.
By making the same as the one for use, even if the type of IC is changed, it is not necessary to replace the components of the drive mechanism when the board 16 is transported in the test handler. Further, it is not necessary to replace the drive system components of the support portion 12.

[Effects of the Invention] As described above, the test handler for the semiconductor device according to the present invention includes a push-up device having a support portion for supporting the IC that moves in the vertical direction and an IC lead provided above the push-up device. An IC tester having a contactor capable of contacting and a pressing element capable of pressing an IC package, and an insertion hole through which the supporting portion can be inserted and which is provided between the IC tester and the pushing-up device so as to be movable back and forth. A board having a cradle for supporting an IC package in the insertion hole and having the same width dimension for each of the same type of IC and the different type of IC, and a predetermined board corresponding to the width dimension of this board Since the board is provided with a support guide disposed in the width of the board and a means for feeding the board along the support guide, the components of the board transport mechanism are interleaved when measuring the electrical characteristics of different types of ICs. No need to change.

Therefore, the number of parts to be replaced can be reduced, and the parts replacement work can be simplified. In addition to this, the board used in the pre-process of the test process can be directly carried into the test handler, and after measuring the electrical characteristics, the board can be carried to the post-process device. Moreover, since the mechanism is simple, there is an advantage that it is difficult to cause a transport error.

Further, when a large number of ICs are transferred, they can be carried out in a state of being housed in a board, so that not only the time spent for measuring the electric characteristics of the ICs can be shortened but also the ICs can be shortened.
It is possible to prevent lead damage. Furthermore, since a dedicated machine is not used as in the conventional case, the cost can be reduced and the installation space can be effectively used.

[Brief description of drawings]

FIG. 1 is a perspective view showing a test handler of a semiconductor device according to the present invention, FIGS. 2 and 3 are views taken in the directions of arrows A and B in FIG. 1, and FIG. 4 is an arrow C in FIG. View, No. 5
FIGS. 6 (a) to 6 (g) are views for explaining the operation method of the test handler, and FIGS. 6 (a) to 6 (d) are cross-sectional views showing another embodiment, and FIG.
FIG. 1 is a perspective view showing a conventional test handler of a semiconductor device. 11 ... Push-up device, 12 ... Support part, 14 ... Semiconductor device, 14a ... Lead, 14b ... Package, 15 ...
... IC tester, 15b ... contactor, 15c ... presser,
16: board, 16a: insertion hole, 16b: pedestal.

Claims (1)

[Claims] 1. A pushing-up device having a supporting portion for vertically supporting an IC, and an IC provided above the pushing-up device.
An IC tester having a contactor capable of contacting the lead of the device and a presser capable of pressing the IC package, and an insertion member provided between the IC tester and the pushing-up device so as to be movable back and forth and through which the support portion can be inserted. A hole and a pedestal for supporting an IC package in the insertion hole, and for the same type of IC,
A board having the same width dimension for different types of ICs, a support guide arranged in a predetermined width corresponding to the width dimension of the board, and a feeding means for feeding the board along the support guide A test handler for a semiconductor device, comprising: