JPH0645835B2 - Heat conductor - Google Patents
Heat conductorInfo
- Publication number
- JPH0645835B2 JPH0645835B2 JP1260113A JP26011389A JPH0645835B2 JP H0645835 B2 JPH0645835 B2 JP H0645835B2 JP 1260113 A JP1260113 A JP 1260113A JP 26011389 A JP26011389 A JP 26011389A JP H0645835 B2 JPH0645835 B2 JP H0645835B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- conductor
- heat transfer
- amount
- specific heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、熱機器に使用される熱伝導体に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a heat conductor used in a thermal device.
（従来の技術） 従来、熱機器の熱伝導体としては熱伝導率が数Ｗ／cm・
Ｋ程度と大きい銅やアルミニウムを伝熱量に見合った断
面形状に加工したものが使用されている。(Prior Art) Conventionally, the thermal conductivity of a heat device is several W / cm ·
Copper or aluminum, which is as large as K, is processed into a cross-sectional shape suitable for the amount of heat transfer.
しかしながら、上記従来の構造の熱伝導体では伝導すべ
き伝熱量が大きく変動する場合には最大の伝熱量に合せ
て断面積を大きくする必要があるため、この熱伝導体を
組込んだ熱機器が大形化する問題があった。また、通常
の熱伝導率が大きい材料は電気伝導性が高いため、かか
る材料からなる熱伝導体を変動する磁場中で使用する
と、大きなジュール発熱を伴うため、余分な熱を排出し
なければならない問題があった。However, in the heat conductor of the above-mentioned conventional structure, when the amount of heat transfer to be conducted fluctuates greatly, it is necessary to increase the cross-sectional area in accordance with the maximum amount of heat transfer, so a thermal device incorporating this heat conductor. Had the problem of becoming larger. In addition, since a material having a high thermal conductivity usually has a high electric conductivity, when a heat conductor made of such a material is used in a fluctuating magnetic field, a large amount of Joule heat is generated, so that extra heat must be discharged. There was a problem.
（発明が解決しようとする課題） 本発明は、上記従来の課題を解決するためになされたも
ので、伝熱量を平均化し、効率的に熱を伝達し、しかも
ジュール損失の小さい熱伝導体を提供しようとするもの
である。(Problems to be Solved by the Invention) The present invention has been made in order to solve the above-described conventional problems, and provides a heat conductor that averages the amount of heat transfer, efficiently transfers heat, and has a small Joule loss. It is the one to be provided.
［発明の構成］ （課題を解決するための手段） 本発明は、伝熱量が変動する熱伝導部に使用される熱伝
導体において、熱伝導体が、互いに密接状態で伝熱方向
に延びる熱伝導率が40Ｗ／cm・Ｋ以上の高熱伝導材料お
よび比熱が400mJ／cm3・Ｋ以上の高比熱材料で構成さ
れ、かつ上記伝熱方向と直交する全ての断面において面
積比率が前記高熱伝導材料80〜20％および前記高比熱材
料80〜20％に設定されてなることを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The present invention relates to a heat conductor used in a heat conducting portion in which the amount of heat transfer varies, and the heat conductors extend in the heat transfer direction in close contact with each other. The high thermal conductive material is composed of a high thermal conductive material having a conductivity of 40 W / cm · K or more and a high specific heat material having a specific heat of 400 mJ / cm 3 · K or more, and the area ratio is the above-mentioned high thermal conductive material in all cross sections orthogonal to the heat transfer direction. 80 to 20% and the high specific heat material is set to 80 to 20%.
上記高熱伝導材料としては、例えば銅、アルミニウム、
銀等を挙げることができ、また上記高比熱材料としては
例えば鉛、又はＥｒＮｉ、ＥｒＣｏ、ＤｙＮｉ、ＤｙＣ
ｏなどの希土類元素と遷移金属の化合物を挙げることが
できる。Examples of the high thermal conductive material include copper, aluminum,
Examples of the high specific heat material include lead, ErNi, ErCo, DyNi, and DyC.
Examples thereof include compounds of rare earth elements such as o and a transition metal.
上記断面での面積比率を高熱伝導材料20〜80％、高比熱
材料80〜20％に限定した理由は、その範囲を逸脱する
と、熱伝達時での端面間における温度差を充分に小さく
できなくなるからである。The reason why the area ratio in the above cross section is limited to the high thermal conductive material 20 to 80% and the high specific heat material 80 to 20% is that if the range is deviated, the temperature difference between the end faces during heat transfer cannot be sufficiently reduced. Because.
本発明に係わる熱伝導体は、例えば第１図（ａ）、
（ｂ）に示すように複数本のＣｕ等の高熱伝導材料から
なる線材１を格子状に並べ、鉛等の高比熱材料で鋳込ん
で複数本の線材１を高比熱材料２に埋込んだ棒状構造、
又は高熱伝導材料と高比熱材料を層状に複数積層した角
状構造のものを挙げることができる。また、前者の構造
では高比熱材料の線材を高熱伝導材料に埋め込んでもよ
い。The heat conductor according to the present invention is, for example, as shown in FIG.
As shown in (b), a plurality of wire rods 1 made of a high heat conductive material such as Cu are arranged in a grid pattern and cast with a high specific heat material such as lead to embed the plurality of wire rods 1 in the high specific heat material 2. Rod-shaped structure,
Alternatively, it may have a prismatic structure in which a plurality of high heat conductive materials and high specific heat materials are laminated in layers. Further, in the former structure, a wire having a high specific heat material may be embedded in the high heat conductive material.
（作用） 本発明の熱伝導体は、熱伝導率が40Ｗ／cm・Ｋ以上の高
熱伝導材料と比熱が400mJ／cm3・Ｋ以上の高比熱材料か
らなり、かつ全ての断面での面積比率を高熱伝導材料20
〜80％、高比熱材料80〜20％とすることによって、伝熱
量が大きく変動する場合でも伝熱量を平均化でき、断面
を平均伝熱量に見合った大きさにすることが可能になる
ため、小型化することができる。即ち、伝熱量が大きく
変動する場合の熱伝導体での熱の流れを考える。伝熱量
が多い時には、熱の一部は前記高伝導体の一方の構成材
料である高熱伝導材料で伝えられ、残りは他方の構成材
料である高比熱材料に一時蓄えられる。伝熱量が少ない
時には、前記高比熱材料で蓄えられた熱が放出され、高
熱伝導材料に伝えられる。従って、既述のように熱伝導
体に流れる熱の伝熱量が大きく変動する場合でも伝熱量
を平均化することができる。この場合、高熱伝導材料を
複数本の線材で形成し、これら線材に高比熱材料を鋳込
んだ構造にすることによって、両者の界面の熱伝達が良
好になり、熱の伝熱量が大きく変動する場合での伝熱量
を一層良好に平均化できる。(Operation) The heat conductor of the present invention comprises a high heat conductive material having a heat conductivity of 40 W / cm · K or more and a high specific heat material having a specific heat of 400 mJ / cm 3 · K or more, and the area ratio in all cross sections. A high thermal conductive material 20
~ 80%, high specific heat material 80 ~ 20%, the amount of heat transfer can be averaged even when the amount of heat transfer fluctuates greatly, and it becomes possible to make the cross section a size commensurate with the average amount of heat transfer. It can be miniaturized. That is, consider the flow of heat in the heat conductor when the amount of heat transfer fluctuates greatly. When the amount of heat transfer is large, a part of the heat is transferred by the high heat conductive material which is one constituent material of the high conductor, and the rest is temporarily stored in the high specific heat material which is the other constituent material. When the amount of heat transfer is small, the heat stored in the high specific heat material is released and transferred to the high heat conductive material. Therefore, as described above, the heat transfer amount can be averaged even when the heat transfer amount of the heat flowing through the heat conductor largely changes. In this case, by forming a highly heat-conductive material with a plurality of wire rods and by casting a high specific heat material into these wire rods, the heat transfer at the interface between the two becomes good, and the heat transfer amount greatly fluctuates. In this case, the amount of heat transfer can be averaged even better.
また、変動する磁場中での使用を考察すると、通常の高
熱伝導材料である銅、銀などは高電気伝導材料であるた
め、かかる材料のみからなる熱伝導体からは大きなジュ
ール発熱があり、この余分な排熱のために性能が低下す
る。この発熱量は、例えば棒状の熱伝導体では半径の４
乗に比例する。一方、断面積は半径の２乗に比例するた
め、断面積が同じになるように細い棒を束ねた場合には
ジュール発熱が半径の２乗に比例することになる。従っ
て、本発明のように高熱伝導材料を線材にすることによ
って、その発熱を大幅に減少させることができる。Considering the use in a fluctuating magnetic field, copper, silver, etc., which are ordinary high heat conductive materials, are high electric conductive materials, and therefore, a heat conductor made of only such a material generates large Joule heat. Performance is reduced due to excess heat dissipation. This heat generation amount is, for example, a radius of 4 for a rod-shaped heat conductor.
Proportional to the square. On the other hand, since the cross-sectional area is proportional to the square of the radius, Joule heat generation is proportional to the square of the radius when thin rods are bundled so that the cross-sectional areas are the same. Therefore, the heat generation can be greatly reduced by using a wire having a high thermal conductivity as in the present invention.
（実施例） 以下、本発明の実施例を詳細に説明する。熱伝導率40Ｗ
／cm・Ｋ、比熱20mJ／cm3・Ｋの銅（Ｃｕ）からなる複
数本の線材を並べ、熱伝導率１Ｗ／cm・Ｋ、比熱400mJ
／cm3・Ｋの鉛（Ｐｂ）で鋳込んで全ての断面でのＰ
ｂ、Ｃｕの面積比率を異ならせた複数の棒状熱伝導体
（断面線9.80cm2、長さ82mm）を作製した。(Example) Hereinafter, the Example of this invention is described in detail. Thermal conductivity 40W
/ Cm · K, specific heat 20mJ / cm 3 · K, multiple wires made of copper (Cu) are lined up, thermal conductivity 1W / cm · K, specific heat 400mJ
/ Cm 3 · K lead (Pb) is cast and P in all cross sections
A plurality of rod-shaped heat conductors (section line 9.80 cm 2 , length 82 mm) having different area ratios of b and Cu were prepared.
しかして、上記各熱伝導体について、Ｃｕ線材の延びる
方向を熱伝導方向として、排熱量40J、排熱時間４sec
（熱流束に換算して0.1Ｗ／cm2）の条件で熱伝達を行な
い、各熱伝導体端面間での温度差（ΔＴ）を測定した。
その結果を第２図中に特性線Ａとして示した。Then, regarding each of the above heat conductors, the direction in which the Cu wire extends is the heat conduction direction, and the heat discharge amount is 40 J and the heat discharge time is 4 seconds.
Heat transfer was performed under the condition (0.1 W / cm 2 in terms of heat flux), and the temperature difference (ΔT) between the end faces of each heat conductor was measured.
The result is shown as a characteristic line A in FIG.
なお、第２図中には熱伝導率10Ｗ／cm・Ｋ、比熱20mJ／
cm3・Ｋの銅（Ｃｕ）からなる複数本の線材を並べ、熱
伝導率１Ｗ／cm・Ｋ、比熱400mJ／cm3・Ｋの鉛（Ｐｂ）
で鋳込んで全ての断面でのＣｕ、Ｐｂの面積比率を異な
らせた実施例と同様な形状の熱伝導体（比較例１）につ
いて温度差を測定した結果を特性線Ｂとした示した。In Fig. 2, the thermal conductivity is 10 W / cmK and the specific heat is 20 mJ /
A plurality of wire rods made of copper (Cu) of cm 3 · K are arranged, and the lead (Pb) has a thermal conductivity of 1 W / cm · K and a specific heat of 400 mJ / cm 3 · K.
The characteristic line B is the result of measuring the temperature difference of the heat conductor (Comparative Example 1) having the same shape as that of the example in which the area ratios of Cu and Pb in all the cross-sections were changed by casting.
また、同第２図中には熱伝導率40Ｗ／cm・Ｋ、比熱20mJ
／cm3・Ｋの同（Ｃｕ）からなる複数本の線材を並べ、
熱伝導率１Ｗ／cm・Ｋ、比熱250mJ／cm3・Ｋのインジウ
ム（Ｉｎ）で鋳込んで全ての断面でのＣｕ、Ｉｎの面積
比率を異ならせた実施例と同様な形状の熱伝導体（比較
例２）について温度差を測定した結果を特性線Ｃとして
示した。Also, in FIG. 2, the thermal conductivity is 40 W / cm · K and the specific heat is 20 mJ.
/ Cm 3 · K, multiple wires made of the same (Cu) are lined up,
A heat conductor having the same shape as that of the embodiment in which the area ratio of Cu and In in all the cross sections is made different by casting with indium (In) having a thermal conductivity of 1 W / cm · K and a specific heat of 250 mJ / cm 3 · K. The result of measuring the temperature difference for (Comparative Example 2) is shown as a characteristic line C.
第２図から明らかなように、熱伝導率40Ｗ／cm・Ｋの銅
（Ｃｕ）からなる複数本の線材を比熱400mJ／cm3・Ｋの
鉛（Ｐｂ）に断面での面積比率がＣｕ20〜80％、Ｐｂ80
〜20％の範囲となるように埋め込んだ熱伝導体（特性線
Ａ；Ｃｕ20〜80％、Ｐｂ80〜20％の範囲）は比較例１、
２の熱伝導体に比べて端面間での温度差を著しく小さく
できることがわかる。As is clear from FIG. 2, a plurality of wire rods made of copper (Cu) having a thermal conductivity of 40 W / cm · K are applied to lead (Pb) having a specific heat of 400 mJ / cm 3 · K and the area ratio in the cross section is Cu20 to 80%, Pb80
The thermal conductor (characteristic line A; Cu 20 to 80%, Pb 80 to 20%) embedded so as to be in the range of ˜20% is Comparative Example 1,
It can be seen that the temperature difference between the end faces can be made significantly smaller than that of the second heat conductor.
また、熱伝導率40Ｗ／cm・Ｋ、比熱20mJ／cm3・Ｋでの
直径２mmの78本の銅（Ｃｕ）線材１を格子状に並べ、こ
れに熱伝導率１Ｗ／cm・Ｋ、比熱400mJ／cm3・Ｋの鉛
（Ｐｂ）２をＣｕ線材１とＰｂ２の断面での面積比率を
50％、50％となるように鋳込んで前述した第１図
（ａ）、（ｂ）に示す構造を有する直径34mm、長さ82mm
の棒状熱伝導体を作製した。この熱伝導体について、10
秒間で磁場を０テスラから５テスラに変動させる条件下
でジュール熱を測定したところ、1.1Ｊであった。これ
に対し、熱伝導率40Ｗ／cm・Ｋ、比熱20mJ／cm3・Ｋの
Ｃｕのみからなる直径34mmの棒状熱伝導体について同様
な条件下でジュール熱を測定したところ、630Ｊであっ
た。これらの結果から、本発明の熱伝導体は変動する磁
場中でのジュール損失が小さいことが確認された。Also, 78 copper (Cu) wire rods 1 having a diameter of 2 mm and a thermal conductivity of 40 W / cm · K and a specific heat of 20 mJ / cm 3 · K are arranged in a grid pattern, and a thermal conductivity of 1 W / cm · K and a specific heat 400mJ / cm 3 · K lead (Pb) 2 is the area ratio in the cross section of Cu wire 1 and Pb 2
It has a structure shown in Fig. 1 (a) and (b), which was cast to 50% and 50%, and has a diameter of 34 mm and a length of 82 mm.
The rod-shaped heat conductor of was produced. For this heat conductor,
When the Joule heat was measured under the condition that the magnetic field was changed from 0 Tesla to 5 Tesla per second, it was 1.1 J. On the other hand, the Joule heat was measured under the same conditions for a rod-shaped heat conductor having a diameter of 34 mm and made of only Cu having a thermal conductivity of 40 W / cm · K and a specific heat of 20 mJ / cm 3 · K, and it was 630 J. From these results, it was confirmed that the heat conductor of the present invention has a small Joule loss in a fluctuating magnetic field.
［発明の効果］ 以上詳述した如く、本発明によれば伝熱量を平均化し、
効率的に熱を伝達し、しかもジュール損失が小さく、磁
気冷凍機の熱スイッチやセンサ冷却等に有効に利用し得
る小型の熱伝導体を提供できる。[Effects of the Invention] As described in detail above, according to the present invention, the amount of heat transfer is averaged,
It is possible to provide a small-sized heat conductor that efficiently transfers heat, has a small Joule loss, and can be effectively used for a heat switch of a magnetic refrigerator, sensor cooling, and the like.
第１図（ａ）は本発明の熱伝導体の一例を示す断面図、
同図（ｂ）は同図（ａ）下面図、第２図は本実施例及び
比較例１、２の熱伝導体に熱を伝達した時のそれらの端
面間の温度差を示す特性図である。 １……高熱伝導材料（Ｃｕ）からなる線材、２……高比
熱材料（Ｐｂ）。FIG. 1 (a) is a sectional view showing an example of the heat conductor of the present invention,
FIG. 2B is a bottom view of FIG. 1A, and FIG. 2 is a characteristic diagram showing a temperature difference between the end faces when heat is transferred to the heat conductors of this embodiment and Comparative Examples 1 and 2. is there. 1 ... Wire rod made of high heat conductive material (Cu), 2 ... High specific heat material (Pb).
───────────────────────────────────────────────────── フロントページの続き (72)発明者 沼澤 健則 茨城県つくば市千現１丁目２番１号 科学 技術庁金属材料技術研究所筑波支所内 (72)発明者 木村 秀夫 茨城県つくば市千現１丁目２番１号 科学 技術庁金属材料技術研究所筑波支所内 (72)発明者 中込 秀樹 神奈川県川崎市幸区小向東芝町１番地 株 式会社東芝総合研究所内 (72)発明者 高橋 政彦 神奈川県川崎市幸区小向東芝町１番地 株 式会社東芝総合研究所内 (72)発明者 栗山 透 神奈川県川崎市幸区小向東芝町１番地 株 式会社東芝総合研究所内 (72)発明者 袴田 龍一 神奈川県川崎市幸区小向東芝町１番地 株 式会社東芝総合研究所内 (56)参考文献 特開 昭51−43302（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takenori Numawazawa 1-2-1, Sengen, Tsukuba-shi, Ibaraki Prefectural Government, Science and Technology Agency, Materials Research Laboratory Tsukuba Branch (72) Inventor Hideo Kimura, 1-Cengen, Tsukuba-shi, Ibaraki 2-2-1, Tsukuba Branch, Institute for Materials Research, Agency for Science and Technology (72) Hideki Nakagome, 1 Komukai Toshiba Town, Komukai-ku, Kawasaki City, Kanagawa Prefecture Corporate Research Institute, Toshiba Research Institute (72) Inventor Masahiko Takahashi Kanagawa Komukai-Toshiba-cho, Saiwai-ku, Kawasaki-shi, Ltd. Inside Toshiba Research Institute Co., Ltd. (72) Inventor Toru Kuriyama 1 Komukai-Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock company Toshiba Research Institute (72) Inventor Hakada Ryuichi 1 Komukai Toshiba-cho, Sachi-ku, Kawasaki-shi, Kanagawa Prefectural Research Institute, Toshiba Research Institute (56) Reference JP-A-51-43302 (JP, A)
Claims (2)
伝導体において、互いに密接状態で伝熱方向に延びる熱
伝導率が40Ｗ／cm・Ｋ以上の高熱伝導材料および比熱が
400mJ／cm3・Ｋ以上の高比熱材料で構成され、上記伝熱
方向と直交する全ての断面において面積比率が前記高熱
伝導材料20〜80％および前記高比熱材料80〜20％に設定
されてなることを特徴とする熱伝導体。1. A heat conductor used in a heat conducting part in which the amount of heat transfer fluctuates, and a high heat conductive material having a heat conductivity of 40 W / cm · K or more and a specific heat of which are extended in the heat transfer direction in a close contact state with each other.
It is composed of a high specific heat material of 400 mJ / cm 3 · K or more, and the area ratio is set to 20 to 80% for the high thermal conductive material and 80 to 20% for the high specific heat material in all the cross sections orthogonal to the heat transfer direction. A heat conductor characterized by:
相互間に隙間を設けて配置された複数の線状体と、これ
ら線状体の間を埋めるように配置された前記高比熱材料
とを具備してなることを特徴とする請求項１に記載の熱
伝導体。2. Each is formed of the high thermal conductivity material,
2. A plurality of linear bodies arranged with a gap between each other, and the high specific heat material arranged so as to fill the spaces between the linear bodies. Heat conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1260113A JPH0645835B2 (en) | 1989-10-06 | 1989-10-06 | Heat conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1260113A JPH0645835B2 (en) | 1989-10-06 | 1989-10-06 | Heat conductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03122234A JPH03122234A (en) | 1991-05-24 |
| JPH0645835B2 true JPH0645835B2 (en) | 1994-06-15 |
Family
ID=17343465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1260113A Expired - Lifetime JPH0645835B2 (en) | 1989-10-06 | 1989-10-06 | Heat conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645835B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107923673A (en) * | 2016-03-31 | 2018-04-17 | 株式会社藤仓 | Heat exchanger and magnetic heat pump assembly |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143302A (en) * | 1974-10-11 | 1976-04-14 | Hitachi Metals Ltd | Gokinsoseibutsuno seizohoho |
-
1989
- 1989-10-06 JP JP1260113A patent/JPH0645835B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107923673A (en) * | 2016-03-31 | 2018-04-17 | 株式会社藤仓 | Heat exchanger and magnetic heat pump assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03122234A (en) | 1991-05-24 |
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