JPH0647182B2 - Laser beam joining device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] In a laser beam bonding apparatus, a pressing member used for pressing a workpiece is made of a truncated pyramidal quartz glass to reduce costs.

[Industrial application field]

The present invention relates to an improvement of a laser beam joining device.

The laser beam joining device is a device that heats a workpiece by a laser beam to perform joining such as welding and soldering, and has come to be widely used for wiring work of printed wiring boards.

Laser oscillators include those using a carbon dioxide gas laser or those using a YAG laser depending on the output and wavelength band.

Further, in an automatic wiring machine configured for a printed wiring board, for example, one provided with a relative positioning mechanism between a laser beam and a joint portion, a wire rod supply mechanism for supplying a wire rod for wiring to the joint portion, and the like. is there.

Joining is performed by placing a wiring wire material or a lead wire or lead terminal (hereinafter referred to as wire material) of an electronic component on a positioned joint (solder surface) on a printed wiring board,
It is performed by irradiating a laser beam on it.

Therefore, in the case of using a very thin wire, etc., in order to prevent damage due to overheating of the wire, etc., and in the case of using a wire thicker than the laser beam diameter, to the soldering surface on the printed wiring board. In order to help the heat conduction of the wire, it is necessary to closely adhere the wire to the soldering surface.

For this reason, the laser beam bonding apparatus used for the above-mentioned applications is usually provided with a pressing member for pressing the wire or the like positioned on the soldering surface. It is important that it does not interfere with the laser beam for irradiating the laser beam, and that the leakage of the laser beam to the outside can be reduced to prevent injury to workers.

[Conventional technology]

FIG. 3 is a constitutional view of a conventional example, 1 is a laser oscillator for emitting a laser beam, and 2b is a pressing member for pressing a wire 4b positioned on a predetermined soldering surface 3b on the printed wiring board 5.

Since the pressing member 2b does not interfere with the irradiation of the laser beam on the wire 4b, which is a workpiece, can prevent the worker from being injured by the leakage of the laser beam, and has strength and heat resistance, the requirements are satisfied. It is made of hollow frusto-conical titanium alloy, and CVD method (vapor phase growth method: chemi
Corrosion-resistant treatment is applied by cal vapor deposition.

[Problems to be solved by the invention]

In the above-mentioned conventional example, the tip of the hollow frustoconical pressing member 2b must have a shape capable of reliably crimping a wire rod, which is a workpiece, and is required so as not to hinder the laser beam irradiation. Must have a sufficient opening area.

For this reason, it is necessary to devise the design of the shape and shape of the tip, and it is difficult to process because of the use of titanium alloy from the viewpoint of strength and heat resistance, and the laser beam emitted from the laser oscillator 1. Against pressing member
Since the axis of 2b must be accurately aligned, there is a problem that man-hours are required for assembly.

That is, an object of the present invention is to eliminate the above-mentioned problems relating to the pressing member 2b and reduce the cost of the laser beam joining apparatus.

[Means for solving problems]

As shown in the principle diagram of FIG. 1, the laser beam splicer according to the present invention presses a laser oscillator 1 for emitting a laser beam and a second workpiece 4 positioned on a first workpiece 3. In a laser beam joining apparatus comprising a pressing member (2) and irradiating a laser beam through the pressing member (2) to join the first processed product (3) and the second processed product (4), It is made.

[Action]

Focusing on the laser beam transmissivity of quartz glass, quartz glass is used as a pressing member, and this is made into a non-hollow truncated cone shape, and its tip, that is, the truncated head, presses the workpiece. is there.

Therefore, it is not necessary to make it hollow as in the conventional example, so that the opening at the tip is eliminated and the shape and size of the tip can be selected relatively freely. In addition, the number of man-hours required for processing / assembly can be reduced.

〔Example〕

 FIG. 2 shows a block diagram of an embodiment of the present invention.

Reference numeral 2a is a pressing member that processes quartz glass into a truncated cone shape and forms a metal film on the conical surface by vapor deposition.

A YAG laser is used for the laser oscillator 1, and the emitted laser beam is bent at a right angle by a semi-transparent mirror 6, passes through the center of the frustoconical pressing member 2a, and illuminates just below its tip. Are arranged as follows.

The soldering surface 3a, which is the first workpiece, on the printed wiring board 5 is positioned directly below the pressing member 2a by a positioning mechanism (not shown), and the wire rod 4a is placed on the soldering surface 3a by a wire rod supplying mechanism (not shown). When the positioning is completed, the pressing member 2a presses the wire 4a on the soldering surface 3a by a pressing mechanism (not shown).

After that, the laser oscillator 1 is activated, and the emitted laser beam irradiates the wire rod 4a.

Preliminary solder is applied to the soldering surface 3a and the wire 4a, and the wire 4a is brought into close contact with the soldering surface 3a by the pressing member 2a.

Therefore, when the wire 4a is heated by the irradiation of the laser beam, the heat is transferred to the soldering surface 3a by conduction, and each solder is melted and soldering is performed.

An infrared temperature detector 7 detects the temperature of the infrared rays emitted by the wire 4a heated by the irradiation of the laser beam.

Reference numeral 8 denotes a control unit which controls the output of the laser oscillator 1 so that the temperature detected by the infrared temperature detector 7 matches the set temperature, and when a certain time has passed by a built-in timer (not shown) The oscillator 1 is stopped.

Similarly, wire rods are sequentially soldered to other soldering surfaces.

In the embodiment, by forming the metal film on the conical surface of the pressing member 2a, it is possible to more reliably prevent the laser beam from leaking.

〔The invention's effect〕

As described above, in the laser beam joining apparatus of the present invention, the design of the pressing member is easy and the man-hour required for processing and assembling can be reduced, so that the effect of cost reduction is very large.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a principle diagram of the present invention, FIG. 2 is a configuration diagram of an embodiment, and FIG. 3 is an explanatory diagram of a conventional example. In the figure, 1 is a laser oscillator, 2.2a and 2b are pressing members, 3 is a first processed part, 3a and 3b are soldering surfaces, 4 is a second processed part, 4a and 4 are wire rods, and 5 is a print. A wiring board, 6 represents a semi-transparent mirror.

Claims (2)

[Claims] 1. A laser oscillator for emitting a laser beam (1)
And a pressing member (2) for pressing the second workpiece (4) positioned on the first workpiece (3), irradiating a laser beam through the pressing member (2) A laser beam joining apparatus for joining a workpiece (3) and a second workpiece (4), characterized in that the pressing member (2) is made of truncated pyramidal quartz glass. 2. The laser beam bonding apparatus according to claim 1, wherein the pressing member (2) has a truncated cone shape and a metal film is formed on a conical surface.