JPH0647646B2 - Epoxy resin composition for laser printing - Google Patents
Epoxy resin composition for laser printingInfo
- Publication number
- JPH0647646B2 JPH0647646B2 JP2308882A JP30888290A JPH0647646B2 JP H0647646 B2 JPH0647646 B2 JP H0647646B2 JP 2308882 A JP2308882 A JP 2308882A JP 30888290 A JP30888290 A JP 30888290A JP H0647646 B2 JPH0647646 B2 JP H0647646B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy resin
- laser
- laser printing
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 31
- 229920000647 polyepoxide Polymers 0.000 title claims description 31
- 239000000203 mixture Substances 0.000 title claims description 20
- 238000007648 laser printing Methods 0.000 title claims description 7
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 10
- 239000000920 calcium hydroxide Substances 0.000 claims description 10
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 10
- 229940116318 copper carbonate Drugs 0.000 claims description 10
- 238000004040 coloring Methods 0.000 claims description 5
- OCUCCJIRFHNWBP-IYEMJOQQSA-L Copper gluconate Chemical compound [Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O OCUCCJIRFHNWBP-IYEMJOQQSA-L 0.000 claims description 2
- -1 aluminum acetylacetone Chemical compound 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- MULYSYXKGICWJF-UHFFFAOYSA-L cobalt(2+);oxalate Chemical compound [Co+2].[O-]C(=O)C([O-])=O MULYSYXKGICWJF-UHFFFAOYSA-L 0.000 claims description 2
- 229910000009 copper(II) carbonate Inorganic materials 0.000 claims description 2
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 claims description 2
- 239000011646 cupric carbonate Substances 0.000 claims description 2
- 235000019854 cupric carbonate Nutrition 0.000 claims description 2
- 239000011642 cupric gluconate Substances 0.000 claims description 2
- 235000019856 cupric gluconate Nutrition 0.000 claims description 2
- FIMTUWGINXDGCK-UHFFFAOYSA-H dibismuth;oxalate Chemical compound [Bi+3].[Bi+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O FIMTUWGINXDGCK-UHFFFAOYSA-H 0.000 claims description 2
- PILZURBRZMGGDO-UHFFFAOYSA-L lead(2+) oxido hydrogen carbonate Chemical compound [Pb+2].OC(=O)O[O-].OC(=O)O[O-] PILZURBRZMGGDO-UHFFFAOYSA-L 0.000 claims description 2
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 claims description 2
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 2
- 229940071536 silver acetate Drugs 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 11
- 238000007639 printing Methods 0.000 description 7
- 239000011342 resin composition Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229960004887 ferric hydroxide Drugs 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000004 White lead Inorganic materials 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000006114 decarboxylation reaction Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Thermal Transfer Or Thermal Recording In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気電子部品の絶縁被覆に用いられ、レーザ
ーの照射によりその絶縁被覆表面に鮮明な印字を施すこ
とのできるレーザー印字用エポキシ樹脂組成物に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is used for an insulating coating of electric and electronic parts, and an epoxy resin for laser printing capable of sharply printing on the surface of the insulating coating by laser irradiation. It relates to a composition.
従来、エポキシ樹脂組成物により絶縁被覆された電気電
子部品に特性や型番を明示するため印字をする際、熱硬
化性のインクや紫外線硬化性のインクが用いられている
が、工程の合理化を目的としてより短時間で印字できる
方法が要求されている。Conventionally, a thermosetting ink or an ultraviolet curable ink is used for printing on an electric / electronic component insulating-coated with an epoxy resin composition in order to clearly indicate the characteristics and model number, but the purpose is to rationalize the process. As a result, there is a demand for a method capable of printing in a shorter time.
この対応方法の１つとしては、レーザーの照射による印
字システムが注目されている。このレーザー印字システ
ムは、文字やパターン状にレーザーを照射された部分が
熱エネルギーにより変色する、あるいは照射された部分
が昇華し表面粗化され、光の散乱によって文字やパター
ンが識別できるものであり、この方法の印字時間は０．
０１秒以下であり、従来の熱あるいは紫外線硬化性のイ
ンクが硬化に数分〜数１０分を必要とするのに比べ、大
幅に短縮されるものである。As one of the countermeasures against this, a printing system using laser irradiation is drawing attention. In this laser marking system, the part irradiated with laser in the form of letters or patterns is discolored by thermal energy, or the part exposed is sublimed and surface roughened, and the letters or patterns can be identified by the scattering of light. , The printing time of this method is 0.
The time is 01 seconds or less, which is significantly shorter than the conventional heat-curable or ultraviolet-curable ink that requires several minutes to several tens of minutes for curing.
しかし、従来のエポキシ樹脂組成物の絶縁被覆にレーザ
ーを照射した場合、単に被覆表面を粗化するのみで、変
色がおこらず、鮮明な文字やパターンを印字することが
できなかった。However, when the insulating coating of the conventional epoxy resin composition was irradiated with a laser, the coating surface was simply roughened, discoloration did not occur, and clear characters or patterns could not be printed.
最近、従来のエポキシ樹脂組成物に黄色の水酸化第二鉄
を含有させるとレーザー照射によって黄色から褐色に変
色することが見い出された（特開昭６２−５０３６０号
公報）。Recently, it has been found that when a conventional epoxy resin composition contains yellow ferric hydroxide, the color changes from yellow to brown by laser irradiation (JP-A-62-50360).
水酸化第二鉄は黄色であるため、黄、橙色のような色相
にしか用いることができないが、塩基性炭酸銅や塩基性
炭酸鉛等を用いることによって、青や緑色の下地、特に
淡色系の下地に黒色のレーザー印字を施すことが可能に
なった。Since ferric hydroxide is yellow, it can be used only in hues such as yellow and orange, but by using basic copper carbonate, basic lead carbonate, etc., it is possible to use blue or green substrates, especially light-colored bases. It has become possible to apply black laser printing to the base of the.
本発明は、よりレーザ発色性の良好な樹脂組成物を得ん
として鋭意検討した結果、塩基性炭酸銅等のレーザ発色
材の他に水酸化カルシウムを含有させるとよりレーザ発
色性が向上することを見出し、更にこの知見に基づき種
々研究を進めて本発明を完成するに至ったものである。The present invention, as a result of intensive studies to obtain a resin composition having a better laser coloring property, the laser coloring property is further improved by containing calcium hydroxide in addition to the laser coloring material such as basic copper carbonate. Based on this finding, various studies have been carried out, and the present invention has been completed.
本発明の目的とするところは電気的特性および他の諸特
性を低下させることなく、レーザーの照射により樹脂表
面に鮮明な印字を施すことのできる硬化物を与えるエポ
キシ樹脂組成物を提供することにある。An object of the present invention is to provide an epoxy resin composition which gives a cured product capable of sharply marking a resin surface by laser irradiation without deteriorating electrical properties and other properties. is there.
本発明は、塩基性炭酸銅、グルコン酸銅（II）、炭酸銅
（II）、シュウ酸銅（II）、酢酸銀、シュウ酸ビスマ
ス、シュウ酸コバルト、ヒドロキシ炭酸鉛、ギ酸ニッケ
ル、アセチルアセトンアルミニウムから選ばれた１種又
は２種以上のレーザー発色材と水銀化カルシウムを含有
することを特徴とするレーザー印字用エポキシ樹脂組成
物、に関するものである。The present invention comprises basic copper carbonate, copper (II) gluconate, copper (II) carbonate, copper (II) oxalate, silver acetate, bismuth oxalate, cobalt oxalate, lead hydroxycarbonate, nickel formate, and acetylacetone aluminum. The present invention relates to an epoxy resin composition for laser printing, which contains one or more selected laser colorants and calcium mercuride.
本発明のエポキシ樹脂組成物に水酸化カルシウムを用い
る理由をレーザ発色材として塩基性炭酸銅を用いた場合
について、以下述べる。The reason why calcium hydroxide is used in the epoxy resin composition of the present invention will be described below in the case where basic copper carbonate is used as the laser coloring material.
塩基性炭酸銅は淡緑色の粉末であり、加熱すると２００
〜３００℃で脱炭酸し酸化銅（II）に変化し、黒色とな
る。Basic copper carbonate is a light green powder, and when heated it will reach 200
It decarboxylates at ~ 300 ° C and changes to copper (II) oxide, turning black.
従って、塩基性炭酸銅を含有したエポキシ樹脂組成物に
対し文字やパターン状にレーザーを照射すると、樹脂表
面がレーザーの熱エネルギーにより加熱され、樹脂中に
含有された塩基性炭酸銅が上記化学反応を生じ黒色とな
る。このとき、樹脂組成物中に炭酸ガスを吸収する性質
のある水酸化カルシウムが含有されていると、塩基性炭
酸銅の脱炭酸が促進され、より酸化銅（II）になる割合
が増加する。すなわちレーザーに照射された部分の黒色
度が増し、照射されない部分は淡青色のままのため、淡
青色の下地に黒色の文字やパターンをより鮮明に印字す
ることができる。Accordingly, when the epoxy resin composition containing the basic copper carbonate is irradiated with a laser in a letter or pattern, the resin surface is heated by the thermal energy of the laser, and the basic copper carbonate contained in the resin undergoes the above chemical reaction. Occurs and becomes black. At this time, if calcium hydroxide having a property of absorbing carbon dioxide gas is contained in the resin composition, decarboxylation of basic copper carbonate is promoted, and the ratio of copper oxide (II) to be increased increases. That is, the degree of blackness of the portion irradiated by the laser increases, and the portion not irradiated remains light blue, so that black characters and patterns can be more clearly printed on the light blue base.
水酸化カルシウムの含有量としては１〜２０重量％が好
ましい。この理由は、含有量が１重量％以下では、その
補助効果が小さく、一方、２０重量％を越えると、樹脂
組成物の電気絶縁性が低下し電子電気部品用絶縁材料と
しての本来の性能を満足しにくくなるためである。The content of calcium hydroxide is preferably 1 to 20% by weight. The reason for this is that if the content is 1% by weight or less, the auxiliary effect is small, while if it exceeds 20% by weight, the electrical insulation of the resin composition deteriorates, and the original performance as an insulating material for electronic and electrical parts is reduced. This is because it becomes difficult to be satisfied.
本発明に用いられるエポキシ樹脂としては、例えばビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポ
キシ樹脂等のジグリシジルエーテル型エポキシ樹脂、フ
ェノールノボラック型エポキシ樹脂、クレゾールノボラ
ック型エポキシ樹脂等のノボラック型エポキシ樹脂、グ
リシジルエステル型エポキシ樹脂、グリシジルアミン型
エポキシ樹脂、線状脂肪族型エポキシ樹脂、複素環型エ
ポキシ樹脂、ハロゲン化エポキシ樹脂等があげられる
が、これらに限定されるものではない。Examples of the epoxy resin used in the present invention include diglycidyl ether type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins, phenol novolac type epoxy resins, novolac type epoxy resins such as cresol novolac type epoxy resins, and glycidyl. Examples thereof include ester type epoxy resins, glycidyl amine type epoxy resins, linear aliphatic type epoxy resins, heterocyclic type epoxy resins, halogenated epoxy resins, and the like, but are not limited thereto.
本発明に用いられる硬化剤および硬化促進剤としては、
酸無水物、ポリアミン、ノボラック型フェノール樹脂、
第３級アミン、イミダゾール化合物等があるが、いずれ
を用いてもよい。又必要により公知の無機充填剤、たと
えばジルコン粉末、タルク粉末、結晶シリカ粉末、溶融
シリカ粉末、炭酸カルシウム粉末、マグネシア粉末、ケ
イ酸カルシウム粉末、水和アルミナ粉末、アルミナ粉末
等を配合してもよい。As the curing agent and curing accelerator used in the present invention,
Acid anhydride, polyamine, novolac type phenol resin,
There are tertiary amines, imidazole compounds and the like, but any of them may be used. If necessary, known inorganic fillers such as zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia powder, calcium silicate powder, hydrated alumina powder, and alumina powder may be added. .
本発明により得られる樹脂組成物には、赤、青、緑、
黒、白色等の顔料を併用してもよい。The resin composition obtained by the present invention includes red, blue, green,
You may use together pigments, such as black and white.
本発明の樹脂組成物は注型材料等の液状、粉体塗料等の
粉状、成型材料等の顆粒状、塊状等いずれの状態でもよ
い。The resin composition of the present invention may be in any state such as liquid such as casting material, powder such as powder coating material, granule such as molding material and lump.
本発明の樹脂組成物を製造する方法として、例えば粉体
塗料の場合をあげると、所定の割合で秤量した原料成分
をミキサーによって充分混合したのち、エキストルーダ
ー、コニーダーあるいはロール等で溶融混練し、次いで
粉砕機にて粉砕する方法等がある。上記方法により得ら
れた粉体塗料により電子電気部品の絶縁被覆を行う方法
としては、流動浸漬法、静電流動浸漬法、ころがし法、
ふりかけ法、ホットスプレー法、静電スプレー法等一般
の粉体塗装方法が用いられる。As a method for producing the resin composition of the present invention, for example, in the case of powder coating, after thoroughly mixing the raw material components weighed at a predetermined ratio with a mixer, melt kneading with an extruder, a co-kneader or a roll, Then, there is a method of crushing with a crusher. As a method for performing insulation coating of electronic and electrical parts with the powder coating obtained by the above method, a fluidized immersion method, an electrostatic fluidized immersion method, a rolling method,
A general powder coating method such as a sprinkling method, a hot spray method, or an electrostatic spray method is used.
又、注型材料、成型材料の場合についても公知の技術で
製造でき、絶縁材料として使用できる。Also, in the case of a casting material or a molding material, it can be manufactured by a known technique and can be used as an insulating material.
次に本発明を実施例により更に詳しく説明する。 Next, the present invention will be described in more detail with reference to examples.
実施例１ ビスフェノールＡ型エポキシ樹脂 （エポキシ当量９５０） ５０重量部 塩基性炭酸銅（平均粒径１０μｍ） ５重量部 結晶シリカ粉末 ５０重量部 ２メチルイミダゾール １重量部 水酸化カルシウム ５重量部 上記組成物を配合し、ヘンシェルミキサーでブレンド
し、コニーダーにて溶融混練した後、粉砕機で粉砕する
ことにより平均粒径６０〜７０μｍのエポキシ樹脂組成
物の粉体塗料を得た。Example 1 Bisphenol A type epoxy resin (epoxy equivalent 950) 50 parts by weight Basic copper carbonate (average particle size 10 μm) 5 parts by weight Crystalline silica powder 50 parts by weight 2 Methylimidazole 1 part by weight Calcium hydroxide 5 parts by weight The above composition Was blended with a Henschel mixer, melt-kneaded with a cokneader, and then pulverized with a pulverizer to obtain a powder coating material of an epoxy resin composition having an average particle diameter of 60 to 70 μm.
実施例２ 実施例１において、水酸化カルシウムの添加量を２０重
量部に替え、他は同様にして平均粒径６０〜７０μｍの
エポキシ樹脂組成物の粉体塗料を得た。Example 2 A powder coating material of an epoxy resin composition having an average particle diameter of 60 to 70 μm was obtained in the same manner as in Example 1, except that the amount of calcium hydroxide added was changed to 20 parts by weight.
比較例１ 実施例１において、水酸化カルシウムの添加量を０．５
重量部に替え、他は同様にして平均粒径６０〜７０μｍ
のエポキシ樹脂組成物の粉体塗料を得た。Comparative Example 1 In Example 1, the addition amount of calcium hydroxide was 0.5.
The average particle diameter is 60 to 70 μm in the same manner except that the weight part is replaced.
A powder coating material of the epoxy resin composition was obtained.
比較例２ 実施例１において、水酸化カルシウムの添加量を５０重
量部に替え、他は同様にして平均粒径６０〜７０μｍの
エポキシ樹脂組成物の粉体塗料を得た。Comparative Example 2 A powder coating material of an epoxy resin composition having an average particle diameter of 60 to 70 μm was obtained in the same manner as in Example 1, except that the addition amount of calcium hydroxide was changed to 50 parts by weight.
実施例１、２及び比較例１、２の樹脂組成物について硬
化物を作製した。Cured products were prepared from the resin compositions of Examples 1 and 2 and Comparative Examples 1 and 2.
この試料に炭酸ガスレーザー（ウシオ電気(株)製４００
型レーザーマーク、エネルギー密度６Joule ／cm2）を
用いて、１００万分の１秒間所定のマスクを通してレー
ザーを照射して、硬化物の表面にマーキングを施した。A carbon dioxide laser (400 Ushio Denki Co., Ltd.
The surface of the cured product was marked by irradiating the surface of the cured product with a laser through a predetermined mask for 1,000,000th of a second using a type laser mark and an energy density of 6 Joule / cm 2 .
また、上記硬化物の絶縁被覆電圧をＪＩＳＫ６９１１に
より測定した。結果を表−１に示す。The insulation coating voltage of the cured product was measured according to JIS K6911. The results are shown in Table-1.
〔発明の効果〕 本発明のレーザー印字用エポキシ樹脂組成物を絶縁被覆
材として用いた場合、電気的特性および他の特性を低下
させることなく、レーザーの照射により樹脂表面に鮮明
な印字を施すことのできる被覆を与えることができる。
従って、従来より非常に短時間で印字できるため、電気
電子部品の生産工程の合理化をはかることができる。 [Effects of the Invention] When the laser-printing epoxy resin composition of the present invention is used as an insulating coating material, it is possible to perform clear printing on the resin surface by laser irradiation without deteriorating electrical characteristics and other characteristics. It is possible to provide a coating capable of
Therefore, since printing can be performed in a much shorter time than in the past, the production process of electric and electronic parts can be rationalized.
Claims (2)
るエポキシ樹脂組成物において、塩基性炭酸銅、グルコ
ン酸銅（II）、炭酸銅（II）、シュウ酸銅（II）、酢酸
銀、シュウ酸ビスマス、シュウ酸コバルト、ヒドロキシ
炭酸鉛、ギ酸ニッケル、アセチルアセトンアルミニウム
から選ばれた１種又は２種以上のレーザー発色材と水酸
化カルシウムを含有することを特徴とするレーザー印字
用エポキシ樹脂組成物。1. An epoxy resin composition comprising an epoxy resin, a curing agent, a filler, etc., which comprises basic copper carbonate, copper (II) gluconate, copper (II) carbonate, copper (II) oxalate, silver acetate, Epoxy resin composition for laser printing, containing one or more laser coloring materials selected from bismuth oxalate, cobalt oxalate, lead hydroxycarbonate, nickel formate, and aluminum acetylacetone, and calcium hydroxide. .
０重量％含有することを特徴とする請求項１記載のレー
ザー印字用エポキシ樹脂組成物。2. Calcium hydroxide is added to the composition in an amount of 1 to 2.
The epoxy resin composition for laser printing according to claim 1, wherein the epoxy resin composition contains 0% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2308882A JPH0647646B2 (en) | 1990-11-16 | 1990-11-16 | Epoxy resin composition for laser printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2308882A JPH0647646B2 (en) | 1990-11-16 | 1990-11-16 | Epoxy resin composition for laser printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04183742A JPH04183742A (en) | 1992-06-30 |
| JPH0647646B2 true JPH0647646B2 (en) | 1994-06-22 |
Family
ID=17986399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2308882A Expired - Lifetime JPH0647646B2 (en) | 1990-11-16 | 1990-11-16 | Epoxy resin composition for laser printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0647646B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8748179B2 (en) | 2009-08-31 | 2014-06-10 | Osaka University | Method for efficient production of induced pluripotent stem cells utilizing cells derived from oral mucosa |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61110451A (en) * | 1984-11-02 | 1986-05-28 | Nitto Electric Ind Co Ltd | Semiconductor device |
| JPS61115942A (en) * | 1984-11-12 | 1986-06-03 | Adeka Argus Chem Co Ltd | Microencapsulated flame retarder having improved light resistance |
| JPS63179921A (en) * | 1987-01-21 | 1988-07-23 | Toshiba Corp | Sealing resin composition and resin-sealed type semiconductor device using said composition |
-
1990
- 1990-11-16 JP JP2308882A patent/JPH0647646B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04183742A (en) | 1992-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0618987B2 (en) | Epoxy resin composition for laser printing | |
| JPS6250360A (en) | Epoxy resin composition suitable for use in laser-beam printing | |
| JPH0647646B2 (en) | Epoxy resin composition for laser printing | |
| JP2834540B2 (en) | Epoxy resin composition suitable for laser printing | |
| JP2740616B2 (en) | Epoxy resin composition suitable for laser printing | |
| JPH0618990B2 (en) | Epoxy resin composition for laser printing | |
| JP2740617B2 (en) | Epoxy resin composition suitable for laser printing | |
| JPH0662835B2 (en) | Epoxy resin composition for laser printing | |
| JP2600029B2 (en) | Epoxy resin composition suitable for carbon dioxide laser printing | |
| JP2882851B2 (en) | Epoxy resin composition for laser marking | |
| JP2740615B2 (en) | Epoxy resin composition suitable for laser printing | |
| JPH0647647B2 (en) | Epoxy resin composition for laser printing | |
| JPH0618988B2 (en) | Epoxy resin composition for laser printing | |
| JPH068380B2 (en) | Epoxy resin composition suitable for carbon dioxide laser printing | |
| JP2600033B2 (en) | Epoxy resin composition suitable for carbon dioxide laser printing | |
| JPH0618989B2 (en) | Epoxy resin composition for laser printing | |
| JPH09194689A (en) | Epoxy resin composition for semiconductor sealing | |
| JPH0618991B2 (en) | Epoxy resin composition for laser printing | |
| JPH0428757A (en) | Epoxy resin composition suitable for laser printing | |
| JP2600033C (en) | ||
| JPH0625513A (en) | Epoxy resin composition excellent in thermal discoloration resistance and used for sealing electronic part | |
| JPH06305258A (en) | Epoxy resin composition suitable for laser printing | |
| JPH0575783B2 (en) | ||
| JPH0583582B2 (en) | ||
| JPH0575784B2 (en) |