JPH0648746B2 - Module structure using metal wiring board - Google Patents
Module structure using metal wiring boardInfo
- Publication number
- JPH0648746B2 JPH0648746B2 JP62274905A JP27490587A JPH0648746B2 JP H0648746 B2 JPH0648746 B2 JP H0648746B2 JP 62274905 A JP62274905 A JP 62274905A JP 27490587 A JP27490587 A JP 27490587A JP H0648746 B2 JPH0648746 B2 JP H0648746B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- metal wiring
- component mounting
- circuit element
- mounting surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 title claims description 30
- 229910052751 metal Inorganic materials 0.000 title claims description 30
- 238000005452 bending Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、金属製配線基板を多数回折曲げて使用するこ
とにより回路素子部品の実装の工程を簡略化すると共
に、回路素子部品を保護するためのケースを不要にした
金属製配線基板を使用したモジュール構造に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention simplifies the process of mounting circuit element components by using a metal wiring board after bending a large number of times and protects the circuit element components. The present invention relates to a module structure using a metal wiring board that does not require a case for.
パワーハイブリッドＩＣと称されるものの多くは、第９
図ないし第１１図に示されるように、金属製、アルミナ
セラミック製或いは樹脂製の配線基板２２の表面に配線
導体を形成する。例えば、金属製基板の場合は、ポリイ
ミドフィルム、エポキシ樹脂等によって絶縁層２４を形
成し、この絶縁層２４の上に銅箔を積層し、この銅箔の
不用部分をエッチングで除去して配線導体２６を形成し
ており、配線基板２２としては平板状のものを使用して
いる。Most of what are called power hybrid ICs are
As shown in FIGS. 11 to 11, wiring conductors are formed on the surface of the wiring board 22 made of metal, alumina ceramic or resin. For example, in the case of a metal substrate, an insulating layer 24 is formed of a polyimide film, an epoxy resin or the like, a copper foil is laminated on the insulating layer 24, and an unnecessary portion of the copper foil is removed by etching to form a wiring conductor. 26 is formed, and a flat board is used as the wiring board 22.
この配線基板２２の表面に形成された配線導体２６に回
路素子部品２８をはんだ付け、或いはワイヤボンディン
グして接続し、回路素子部品２８に外力が加わるのを防
止したり、或いは耐湿性を高めるために、配線基板２２
にパッケージとしての樹脂ケース３０を接着して配線基
板２２の全体を封止してモジュールとしている。なお、
第１０図及び第１１図において３２は、回路に信号を入
出力するために配線基板２２にはんだ付けされたリード
を示す。In order to prevent the external force from being applied to the circuit element component 28 or to increase the moisture resistance, the circuit element component 28 is connected to the wiring conductor 26 formed on the surface of the wiring substrate 22 by soldering or wire bonding. The wiring board 22
A resin case 30 as a package is adhered to the wiring board 22 and the entire wiring board 22 is sealed to form a module. In addition,
In FIGS. 10 and 11, reference numeral 32 denotes a lead soldered to the wiring board 22 for inputting / outputting a signal to / from the circuit.
従来のパワーハイブリッドＩＣ等のモジュールの構造
は、上記のように配線基板が平板状であるために以下の
ような問題点がある。The conventional structure of a module such as a power hybrid IC has the following problems because the wiring board is flat as described above.
（１）回路素子部品を実装できる面は、表裏二面に限ら
れ、しかも表裏二面に部品を実装する場合には、各面に
別々に部品を実装しなければならないので、段取りに要
する手間及び時間が一面使用時の二倍となる。(1) The surface on which the circuit element component can be mounted is limited to the front and back surfaces. Moreover, when mounting the components on the front and back surfaces, the components must be mounted separately on each surface. And the time is twice as long as when using one side.
（２）実装した部品に外力が加わるのを防止したり、或
いは部品を実装した部分の耐湿性を高めるためにパッケ
ージとしてのケースを使用する場合には、配線基板とは
別にケースを製作して用意しておかねばならないと共
に、配線基板にケースを接着する作業が不可欠となる。(2) When using a case as a package to prevent external force from being applied to the mounted components or to increase the moisture resistance of the parts where the components are mounted, make a case separately from the wiring board. It must be prepared, and the work of adhering the case to the wiring board is essential.
（３）機器に組込んだ場合に占有面積が大きくなる。(3) The occupied area becomes large when incorporated in a device.
本発明は、このような問題点に鑑み、三面以上の部品実
装面に部品を一工程で実装可能にすると同時に、従来別
途製作して接着していたパッケージとしてのケースを不
用にすることを目的としてなされたものである。In view of the above problems, the present invention aims to make it possible to mount components on three or more component mounting surfaces in one step, and at the same time to eliminate the need for a case as a package that has been separately manufactured and adhered conventionally. It was made as.
本発明は、表面に絶縁層を介して配線導体を施し、この
配線導体により回路素子部品を電気的に接続した金属製
配線基板を用い、少なくとも一部に互いに平行な部品実
装面が三面以上形成されるまで前記金属製配線基板を、
プレスその他の手段により前記絶縁層に損傷を与えない
程度の曲げ半径で所定回数折曲げたことを特徴とする金
属製配線基板を使用したモジュール構造である。The present invention uses a metal wiring board in which a wiring conductor is provided on the surface via an insulating layer and circuit element parts are electrically connected by the wiring conductor, and at least a part of three or more parallel component mounting surfaces are formed. Until the metal wiring board,
It is a module structure using a metal wiring board, which is bent a predetermined number of times with a bending radius that does not damage the insulating layer by pressing or other means.
第１図ないし第３図に本発明の実施例が示されている。 An embodiment of the present invention is shown in FIGS.
本発明を構成する配線基板は折曲げて使用するため、折
曲げ可能である金属製の配線基板であることが要件であ
る。Since the wiring board constituting the present invention is used after being bent, it is a requirement that the wiring board is a bendable metal wiring board.
実施例の金属製配線基板Ｐ１は、七面の部品実装面２ａ
〜２ｇを有し、従来の平板状の配線基板と同様にして上
面に絶縁層及び配線導体（図示せず）を施し、ＩＣ、コ
ンデンサ、トランジスタ、抵抗等の回路素子部品４を金
属製配線基板Ｐ１に配置して配線導体に接続する。各部
品実装面２ａ〜２ｇは同一平面となっているので、各部
品実装面２ａ〜２ｇへの回路素子部品４の実装は、一工
程で行うことができる。The metal wiring board P 1 of the embodiment has seven component mounting surfaces 2 a.
An insulating layer and a wiring conductor (not shown) are provided on the upper surface in the same manner as a conventional flat wiring board having a thickness of 2 g , and a circuit element component 4 such as an IC, a capacitor, a transistor, and a resistor is made of metal wiring. It is arranged on the substrate P 1 and connected to the wiring conductor. Since the component mounting surfaces 2 a to 2 g are flush with each other, the circuit element component 4 can be mounted on the component mounting surfaces 2 a to 2 g in one step.
回路素子部品４の実装、及びリード６を付ける場合は、
はんだ付けの終了後に、第１図で二点鎖線で示される互
いに平行な多数の折曲げ数８ａの部分で金属製配線基板
Ｐ１を同一方向に直角に多数回順次折曲げると、第２図
及び第３図に示されるように、一方方向に互いに平行な
部品実装面（２b，２d，２f）が三面形成されると共
に、これと直角な方向に互いに平行な部品実装面
（２a，２c，２e，２g）が四面形成される。但し、上記
実装面（２b，２d，２f）は基板の折曲げ加工の容易さ
等の観点から回路素子部品４並びにリード６の取付けを
省略することを妨げない。When mounting the circuit element component 4 and attaching the leads 6,
After the completion of soldering, when the metal wiring board P 1 is sequentially bent at a right angle in the same direction a number of times at a plurality of parallel bending numbers 8a indicated by a chain double-dashed line in FIG. Also, as shown in FIG. 3, three component mounting surfaces (2 b , 2 d , 2 f ) parallel to each other in one direction are formed, and component mounting surfaces (2 b , 2 d , 2 f ) parallel to each other are parallel to each other. a , 2 c , 2 e , 2 g ) are formed on all four sides. However, the mounting surfaces (2 b , 2 d , 2 f ) do not prevent the circuit element component 4 and the lead 6 from being omitted from the viewpoint of ease of bending the substrate.
回路素子部品４の実装した金属製配線基板Ｐ１を上記の
ようにして折曲げると、全体がパッケージ用のケースと
して機能して内側に実装された回路素子部品４が保護さ
れる。このため、従来別途製作して接着していたケース
が不用となる。また、機器に組込んだ場合には、各部品
実装面２ａ〜２ｇが多段状に配置された形状となるた
め、占有面積が従来の平板状の配線基板に比較して著し
く小さくなる。When the metal wiring board P 1 on which the circuit element component 4 is mounted is bent as described above, the whole functions as a case for the package and the circuit element component 4 mounted inside is protected. For this reason, the case that has been separately manufactured and adhered conventionally becomes unnecessary. Further, when incorporated in a device, the component mounting surfaces 2 a to 2 g have a shape in which they are arranged in multiple stages, so that the occupied area becomes significantly smaller than that of a conventional flat wiring board.
第４図及び第５図は、それぞれ本発明の別の実施例を示
すもので、第４図は金属製配線基板Ｐ２の折曲げ回数が
最小（四回）のものであり、第５図は、金属製配線基板
Ｐ３の折曲げ回数を多くして多数の部品実装面が縦横に
多段状に配置された状態のものである。4 and 5 each show another embodiment of the present invention. FIG. 4 shows the metal wiring board P 2 having the minimum number of bendings (four times), and FIG. Shows a state in which a large number of times the metal wiring board P 3 is bent and a large number of component mounting surfaces are arranged in a multi-tiered manner in the vertical and horizontal directions.
第６図ないし第８図に本発明の更に別の実施例が示され
ている。6 to 8 show another embodiment of the present invention.
金属製配線基板Ｐ４は、八面の部品実装面２ａ〜２ｈを
有し、部品実装面２ａ〜２ｆは折曲げ線８ａで折曲げら
れるが、部品実装面２g，２ｈは、折曲げ線８ａと直交
する折曲げ線８ｂで折曲げられる。The metal wiring board P 4 has eight component mounting surfaces 2 a to 2 h , and the component mounting surfaces 2 a to 2 f can be bent along the bending line 8 a, but the component mounting surfaces 2 g and 2 h. Is bent along a bending line 8b orthogonal to the bending line 8a.
よって、第７図に示されるように、各部品実装面２ａ〜
２ｆを折曲げ線８ａで折曲げることにより形成される四
角筒状体の両開口面が部品実装面２g，２ｈで閉塞され
るので、回路素子部品４の封止効果が大きくなるという
利点がある。また、上記したいずれの実施例において
も、金属製配線基板Ｐ１〜Ｐ４の折曲半径は、この折曲
げ部における絶縁層が損傷されない程度の大きさとする
ことが必要である。Therefore, as shown in FIG. 7, each component mounting surface 2 a-
Since both opening surfaces of the rectangular tubular body formed by bending 2 f along the bending line 8 a are closed by the component mounting surfaces 2 g and 2 h , the sealing effect of the circuit element component 4 is said to be large. There are advantages. Further, in any of the above-described embodiments, the bending radii of the metal wiring boards P 1 to P 4 need to be large enough not to damage the insulating layer at the bent portions.
本発明は、少なくとも一部に互いに平行な部品実装面が
三面以上形成されるまで金属製配線基板を所定回数折曲
げて使用するので、三面以上の複数の部品実装面に回路
素子部品を一工程で実装することができて、部品実装工
程が簡略化されると共に、金属製配線基板を折曲げるこ
とにより全体がパッケージ用のケースとして機能するた
め、従来別途製作していたケースが不用となる。In the present invention, the metal wiring board is bent and used a predetermined number of times until at least a part of three or more parallel component mounting surfaces are formed. Can be mounted, the component mounting process is simplified, and the metal wiring board is bent to function as a package case as a whole, so that a case separately manufactured in the related art is unnecessary.
また、金属製配線基板を折曲げて使用することにより、
互いに平行な部品実装面が縦横に多段状に配置された形
状となるため、機器の狭いスペースに組込むことが可能
となる。Also, by bending and using a metal wiring board,
Since the component mounting surfaces that are parallel to each other have a shape in which they are arranged vertically and horizontally in multiple stages, it is possible to install the components in a narrow space.
第１図は、本発明の実施例の金属製配線基板Ｐ１の折曲
げ前の平面図、第２図は、折曲げた状態の斜視図、第３
図は、同じく横断面図、第４図及び第５図は、それぞれ
本発明の別の実施例の金属製配線基板Ｐ2,Ｐ３を折曲げ
た状態の横断面図、第６図は、本発明の更に別の実施例
の金属製配線基板Ｐ４の折曲げ前の平面図、第７図は、
折曲げた状態の斜視図、第８図は、同じく縦断面図、第
９図は、金属製の配線基板２２の断面図、第１０図は、
従来の金属製の配線基板２２の平面図、第１１図は、こ
の金属製の配線基板２２に樹脂ケース３０を接着した状
態の斜視図である。 〔主要部分の符号の説明〕 Ｐ１〜Ｐ４：金属製の配線基板 ２ａ〜２ｈ：部品実装面、４：回路素子部品 ８ａ，８ｂ：折曲げ線 ２４：絶縁層、２６：配線導体FIG. 1 is a plan view of a metal wiring board P 1 according to an embodiment of the present invention before bending, FIG. 2 is a perspective view in a bent state, and FIG.
Figure, like cross-sectional view, FIGS. 4 and 5 is a cross-sectional view of an alternative embodiment of the metal wiring board P 2, a state in which the P 3 is bent in the present invention, respectively, Figure 6 is FIG. 7 is a plan view of a metal wiring board P 4 according to still another embodiment of the present invention before bending,
FIG. 8 is a perspective view of the bent state, FIG. 8 is a longitudinal sectional view of the same, FIG. 9 is a sectional view of the wiring board 22 made of metal, and FIG.
FIG. 11 is a plan view of a conventional metal wiring board 22, and FIG. 11 is a perspective view showing a state in which a resin case 30 is bonded to the metal wiring board 22. Description of main parts of the code] P 1 to P 4: Metal wiring board 2 a to 2 h: component mounting surface, 4: circuit element part 8a, 8b: fold lines 24: insulating layer, 26: wiring conductor
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−155585（ＪＰ，Ａ) 特開 昭63−273390（ＪＰ，Ａ) 実開 昭61−129373（ＪＰ，Ｕ) 実開 昭61−131866（ＪＰ，Ｕ) 実開 昭62−112171（ＪＰ，Ｕ) 実開 昭62−112170（ＪＰ，Ｕ) 実開 昭62−118492（ＪＰ，Ｕ) 実開 昭50−15364（ＪＰ，Ｕ) 実開 昭63−172168（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP 62-155585 (JP, A) JP 63-273390 (JP, A) Actual 61-129373 (JP, U) Actual 61- 131866 (JP, U) Actual opening 62-112171 (JP, U) Actual opening 62-112170 (JP, U) Actual opening 62-118492 (JP, U) Actual opening 50-15364 (JP, U) 63-172168 (JP, U)
Claims (1)
の配線導体により回路素子部品を電気的に接続した金属
製配線基板を用い、少なくとも一部に互いに平行な部品
実装面が三面以上形成されるまで前記金属製配線基板を
前記絶縁層に損傷を与えない程度の曲げ半径で所定回数
折曲げたことを特徴とする金属製配線基板を使用したモ
ジュール構造。1. A metal wiring board, the surface of which is provided with a wiring conductor via an insulating layer, and circuit element components are electrically connected by the wiring conductor, and at least a part of which has three or more parallel component mounting surfaces. A module structure using a metal wiring board, wherein the metal wiring board is bent a predetermined number of times with a bending radius that does not damage the insulating layer until it is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62274905A JPH0648746B2 (en) | 1987-10-30 | 1987-10-30 | Module structure using metal wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62274905A JPH0648746B2 (en) | 1987-10-30 | 1987-10-30 | Module structure using metal wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01117387A JPH01117387A (en) | 1989-05-10 |
| JPH0648746B2 true JPH0648746B2 (en) | 1994-06-22 |
Family
ID=17548164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62274905A Expired - Lifetime JPH0648746B2 (en) | 1987-10-30 | 1987-10-30 | Module structure using metal wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648746B2 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015364U (en) * | 1973-06-08 | 1975-02-18 | ||
| JPS61129373U (en) * | 1985-01-31 | 1986-08-13 | ||
| JPS61131866U (en) * | 1985-02-05 | 1986-08-18 | ||
| JPS62112171U (en) * | 1985-12-27 | 1987-07-17 | ||
| JPS62155585A (en) * | 1985-12-27 | 1987-07-10 | オムロン株式会社 | Electronic equipment |
| JPS62112170U (en) * | 1985-12-27 | 1987-07-17 | ||
| JPS62118492U (en) * | 1986-01-20 | 1987-07-28 |
-
1987
- 1987-10-30 JP JP62274905A patent/JPH0648746B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01117387A (en) | 1989-05-10 |
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