JPH0648749B2 - Substrate for manufacturing electronic parts - Google Patents

Description

Detailed Description of the Invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for manufacturing electronic parts, and more specifically, a substrate for manufacturing electronic parts such as a display device and a hybrid IC, which uses a light emitting element such as a light emitting diode (hereinafter referred to as LED). Regarding

[Prior art]

It is well known that a printed circuit board having a wiring pattern formed on its surface is used in the manufacture of electronic components such as an LED display and a hybrid IC. For example, in the case of an LED display, after bonding an LED chip to a predetermined portion of a printed circuit board, wire bonding for connecting this to a terminal pad, resin coating for the chip or the gold wire, a display board (case) for the substrate. It is manufactured through a process such as assembly. Further, the hybrid IC has a structure in which various unit electronic parts such as an IC, a resistor and a transistor are mounted on a printed circuit board.

[Problems to be Solved by the Invention]

By the way, such LED display and hybrid IC
However, it goes without saying that there are various types of models, but it is necessary to use a printed circuit board having a size, shape, and wiring pattern according to the specifications depending on the type. However, since each process of processing the printed circuit board in the LED display or the hybrid IC is performed on each printed circuit board, conventionally, in manufacturing these electronic components, one transport system is used for any type of machine. However, in order to be compatible, the transfer system must be equipped with a mechanism that can handle indefinite size and shape of the board, which complicates the transfer system mechanism. However, there is a problem in that jigs and printed circuit board storage magazines used in each manufacturing process must be prepared for each model. This is because the size and shape of the printed circuit board differ depending on the model as described above. In addition, at the final stage of manufacturing electronic components, it is necessary to apply a probe to the terminal pads on the substrate to check whether the function as a component is normally operating. For example, an LED having a plurality of LED chips mounted thereon. In the case of an electronic component such as a display unit or a hybrid IC in which a large number of electronic components are mounted on a substrate, there are many items to be inspected, which makes the final inspection process extremely impossible. There are also problems. The present invention has been devised under the circumstances described above, and it is necessary to solve the various problems described above and provide a countermeasure for manufacturing electronic components of various specifications using a certain transport system. It is an object of the present invention to provide a substrate for manufacturing an electronic component, which can be facilitated and can be subjected to a final inspection process more easily.

[Means for Solving the Problems]

In order to solve the above problems, the present invention takes the following technical means. That is, the electronic component manufacturing substrate of the present invention, a pair of left and right support frames facing each other in parallel at a predetermined interval, each integrally formed on the pair of support frames via a connecting piece, The support frame includes a plurality of unit printed boards arranged at predetermined intervals in the substrate feeding direction between the support frames, and the common wiring pattern extending from the terminal pad on each unit printed board is connected to the support frame via the connecting piece. It is characterized in that a common terminal portion for inspection is formed on the support frame so as to be electrically connected to the common wiring pattern by being routed upward.

[Operation of the invention]

The electronic component is manufactured using the board of the present invention by individually performing each process on a plurality of unit printed boards included in the board. This unit printed circuit board is
Depending on the type of electronic component, those having different sizes, shapes, and wiring patterns are used, but in the case of the present invention, the plurality of unit printed boards are arranged between a pair of support frames having a predetermined interval, and Each of the support frames is integrated through a connecting piece to form a single substrate. Therefore, even when the unit printed boards have different shapes and sizes, the outer dimensions and shapes of the entire boards can be unified and various process processes can be performed using a constant transport system. Further, in the present invention, a common wiring pattern is routed from the terminal pad of each unit board through the connecting piece on a support frame that is commonly connected to each unit printed board through the connecting piece. The common terminal for inspection is formed. Therefore, when the measurement probe is brought into contact with the board for the final inspection of electronic parts, each unit printed circuit board is kept in a state where the plus side or minus side probe is brought into contact with the inspection common terminal portion on the support frame. It is possible to easily perform a functional test of the upper electric element.

【The invention's effect】

As described above, in the present invention, the size and shape of the substrate can be standardized regardless of the model of the electronic component, and therefore, the substrate transfer system is the same for any type of electronic component. Will be able to. Further, since it is not necessary to provide the transport system with a mechanism that can cope with indefinite size and shape of the substrate, the model of the transport system can be simplified. Then, as described above, the final inspection step of each unit printed board can be performed more easily while significantly reducing the number of measurement probes. In particular, in the case of an LED display equipped with a plurality of LED chips, a hybrid IC, and the like, there are many inspection items, but the inspection items are contacted with the positive or negative probe on the common terminal portion on the side support. Since it can be performed as it is, the inspection efficiency is greatly improved.

[Explanation of Examples]

Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings. The present invention relates to a substrate for manufacturing an electronic component such as an LED display or a hybrid IC. In this example, an example in which the present invention is applied to a substrate for manufacturing an LED display is shown. Further, the illustrated example shows a manufacturing substrate for a shift mode or a control mode indicator of an electronic control transmission, which is provided in a meter display portion of an instrument panel of an automobile. The electronic component manufacturing substrate 1 is formed of, for example, a material such as glass epoxy, and as shown in FIG. 1, a pair of left and right support frames 2 and 2 facing each other in parallel at a predetermined distance, and a pair of these support frames. It is provided with a plurality of unit printed circuit boards 3 ... Arranged between the frames 2 and 2 at predetermined intervals in the substrate feeding direction. In this embodiment, one support frame 2 is provided with a model discrimination pattern 4 for discriminating the type of the substrate 1, in other words, the model of the electronic component to be manufactured. Each unit printed circuit board 3 is integrally formed with the pair of support frames 2 and 2 via a connecting piece. Further, each unit printed circuit board 3 corresponds to a conventional printed circuit board for manufacturing an electronic component, and a wiring pattern 6 is provided on the surface of each unit printed circuit board 3 and a predetermined pattern in the wiring pattern 6 is provided. Part, L
Bonding pads 7 and terminal pads 8a and 8b for bonding an ED chip (not shown) are formed. The wiring pattern 6 is formed, for example, by forming a copper film on the entire surface of the substrate and removing unnecessary portions by etching. The pads 7, 8a, 8b are plated with gold for convenience of chip bonding and wire bonding, which will be described later, and the other portions of the wiring pattern 6 are coated with a register coat. Although various patterns can be considered as the model discrimination pattern 4, in the case of this example, one of the support frames 2
By forming the coated portion 4a and the non-coated portion 4b in eight sections on the surface of the central portion of
A method of forming an 8-bit discrimination pattern by a combination of the arrangement of the coating portion 4a and the non-coating portion 4b is adopted. The coated portion 4a and the non-coated portion 4b
Can be identified by irradiating light and identifying the type of the reflected light. In addition to this, as a method for determining the model, for example, there is a method in which a pattern made of a magnetic material is formed on a support frame, and the model is identified by detecting the presence or absence of the pattern by a magnetic sensor. On the other hand, a common terminal portion 11 for inspection is provided on the support frame 2 on the opposite side of the support frame on which the model discrimination pattern 4 is provided. The common terminal portion 11 for inspection is commonly connected to a common wiring pattern 12 which is routed from a plurality of terminal pads 8b for connection with an external circuit on each unit printed circuit board 3 through a connecting piece 5. . L according to the electronic component manufacturing substrate of the present example having the above configuration
To manufacture ED display, send the substrate 1 to each process equipment,
Then, each unit printed circuit board 3 is subjected to a predetermined process in each process. This will be roughly described. First, an LED chip (not shown) is bonded to the bonding pad 7 on each unit printed board 3, and then, in a wire bonding step, one of the bonding pads 7 and 7 adjacent to each other is bonded. The LED chip and the other pad 7 and the LED element on the bonding pad and the terminal pad 8b adjacent thereto are connected via a gold wire. After the chip bonding and wire bonding are completed, the LED chip or the gold wire is coated with a small amount of epoxy resin. Further, a resin display board (case) 9 is overlaid and assembled on each unit printed board 3. In this example,
The assembling of the display board 9 is performed by inserting a pin (not shown) formed on a predetermined portion of the back surface thereof into the pin mounting hole a of the unit printed circuit board 3 and inserting a tip portion of the pin projecting on the back surface of the board 3 into the pin mounting hole a. It is performed by heat-sealing the back surface of the substrate. Further, in the display board 9, a through hole window (shown in the figure) in which a resin such as a silicon resin mixed with a light diffusing agent made of fine powder is sealed at a position corresponding to the LED chip on the unit printed board 3. (Not shown) is formed, and the temporary resin holding sheet member 10 is attached to the front surface side of the through hole window. The seat member 10 is provided with a seat position display portion 10a and a transmission control mode display portion 10b, which are formed by making the portion transparent, at a position corresponding to the through hole window, and the LED element By the light emission, predetermined portions of the shift position display portion 10a and the control mode display portion 10b are turned on to display the shift position and the transmission control mode at that time. In some cases, such as the display board 9 shown in FIG. 2, the control mode display portion 10b is not provided on the seat member 10 depending on the grade (vehicle class) even in the same vehicle type. When the display board 9 is assembled, each unit printed board 3
The probe terminals are applied to the terminal pads 8b for connection with the external circuit to check the lighting of each LED element. Then, after this quality inspection, each unit printed board 3 is cut from the connecting piece 5 and separated from the board 1 to obtain a completed individual display device. By the way, the electronic component manufacturing board 1 of the present invention, which is an assembly of a plurality of unit printed circuit boards 3, can have its outer dimensions and shapes constant regardless of the size and shape of the terminal printed circuit board 3. Therefore, the same transfer system for the board 1 can be used regardless of the model of the electronic component. Further, since it is not necessary to provide a mechanism capable of coping with the change in the size and shape of the substrate, the mechanism of the transfer system can be simplified. Further, since the substrate 1 is standardized, automation between the front and rear processes is facilitated, and it is not necessary to prepare jigs and substrate storage magazines used in each process for each model. . Further, in the present invention, one of the support frames 2 is
Common wiring patterns 12 that extend in common from the external connection terminal pads 8b of each unit printed circuit board are routed, and common terminal portions 11 that are commonly connected to these patterns are provided. Therefore, the number of probe terminals applied to the terminal pads 8b ... Can be reduced in the above-mentioned LED lighting check. When the common terminal portion 11 is not provided, in the lighting check of each LED, two probe terminals applied to the plus (+) side terminal pad 8b and the minus (−) side terminal pad 8b are used for each LED.
Although necessary for the chip, in the case of the present invention, by providing the common terminal portion 11, the probe terminal on either the plus side or the minus side is independent of the number of LED chips. Because only one is needed. In this case, the lighting check is performed on the negative side or the positive side terminal pad 8b and the common wiring pattern 12 among the wirings 13 that connect the common wiring pattern 12 on the connecting piece and each terminal pad 8b. It is carried out with the wiring that connects the wires cut. In the electronic component manufacturing substrate 1 of the embodiment shown in the drawings, the model discriminating pattern 4 is provided on one of the support frames, so that the substrate 1 of a different model may be sent to each process apparatus. However, each process device can determine the model and perform the processing on the substrate 1 according to the specifications. For example, there are two types of the display board 9; one is provided with the control mode display section 10b and the other is not provided.
For models without b, the number of chip bondings and the like is reduced, but in such a case, the model can be discriminated from the model discrimination pattern 4 and processing can be performed for each model according to this specification. That is, when manufacturing electronic components of different models, the same production equipment can be used, and it is also possible to simultaneously manufacture substrates 1 of different models. By the way, the scope of the present invention is not limited to the above-mentioned embodiments. For example, in the above-described embodiment, an example in which the unit printed boards are arranged in a line between the support frames to form the boards is shown. However, as shown in FIG.
The unit printed circuit board 3 may be arranged in a plurality of rows between the support frames 2 and 2. In the embodiment, the model discrimination pattern is provided, but whether or not to provide such a pattern is a matter of choice. Further, in the embodiment, an example in which the present invention is applied to a manufacturing substrate for an LED display is shown, but the present invention can also be applied to a manufacturing substrate for electronic parts such as hybrid ICs. Needless to say.

[Brief description of drawings]

FIG. 1 is a perspective view showing a substrate for manufacturing an electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view showing an example of a display plate of an LED display according to the embodiment, and FIG. 3 is another embodiment. It is a perspective view which shows an example. 1 ... Substrate for manufacturing electronic components, 2 ... Support frame,
3 ... Unit printed circuit board, 5 ... Connecting piece, 8b ... Terminal pad, 11 ... Common terminal part, 12 ... Common wiring pattern.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shinya Okubo, 21 Mizozaki-cho, Saiin, Ukyo-ku, Kyoto Prefecture, Japan Rome Co., Ltd. (56) References JP-A-60-149188 (JP, A) -8692 (JP, U) Actually opened 62-120373 (JP, U) Actually opened 60-111060 (JP, U)

Claims (1)

[Claims] 1. A pair of left and right support frames facing each other in parallel at a predetermined interval, and each of which is integrally formed with the pair of support frames through a connecting piece, and the substrate feed direction is provided between the pair of support frames. And a plurality of unit printed circuit boards arranged at predetermined intervals, and a common wiring pattern extending from the terminal pad on each unit printed circuit board is laid out on the support frame through the connecting piece, and the common wiring pattern is formed. A substrate for manufacturing an electronic component, wherein a common terminal portion for inspection is formed on the support frame so as to be electrically connected to a pattern in common.