JPH0649167B2 - Thin film coating method and apparatus - Google Patents
Thin film coating method and apparatusInfo
- Publication number
- JPH0649167B2 JPH0649167B2 JP63211677A JP21167788A JPH0649167B2 JP H0649167 B2 JPH0649167 B2 JP H0649167B2 JP 63211677 A JP63211677 A JP 63211677A JP 21167788 A JP21167788 A JP 21167788A JP H0649167 B2 JPH0649167 B2 JP H0649167B2
- Authority
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- Japan
- Prior art keywords
- coating
- substrate
- processing tank
- tank
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Application Of Or Painting With Fluid Materials (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は溶液を用いる湿式コーティング、特に金属アル
コキシドを出発原料とするゾル・ゲル法によりコーティ
ングする場合等において、基板に部分的に薄膜を形成す
るに好適なコーティング方法および位置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention forms a thin film partially on a substrate in wet coating using a solution, particularly in the case of coating by a sol-gel method using a metal alkoxide as a starting material. Coating method and position suitable for coating.
従来、溶液を用いて基板に塗膜する湿式コーティングに
おいては、基板を溶液中に浸漬して一定速度で引き上げ
ることにより行うディッピング法、基板の上部から溶液
を流し、拡販させるフローコート法、上、下2つのロー
ルによって基板を搬送し、どちらか一方あるいは両方の
ロールに接した溶液により塗膜するローラーコート法な
と種々の方法が知られている。Conventionally, in wet coating for coating a substrate using a solution, a dipping method performed by immersing the substrate in the solution and pulling it up at a constant speed, a flow coating method in which the solution is poured from the top of the substrate and sales are expanded, Various methods are known, such as a roller coating method in which a substrate is conveyed by two lower rolls and a film is coated with a solution in contact with either one or both rolls.
しかしながら、基板に部分的にコーティングする場合、
フローコート法、ローラーコート法にあっては不要箇所
をマスキングテープ等でマスキングする方法は実用上不
可能であるので、まず全面にコーティングしてその後不
要箇所を多量にエッチングなどの方法により除去せざる
を得ず、その上サブミクロンオーダーで微妙に制御され
た膜厚を得ることは極めて困難であった。サブミクロン
オーダーの膜厚を得るにはディッィング法が最も有効で
あるとされているが、この方法は大型の基板のコーティ
ング溶液に浸漬させて、引き上げるので、駆動する設備
が大型かつ複雑となりハンドリングが困難、コストと
なるばかりか、基板を引き上げるときに、基板自身の振
動に起因する液面の揺動がさけられないので、横縞が発
生し易く、均一厚さの薄膜を形成することは困難であっ
た。その上、部分的にコーティングする場合には、基板
の被コーティング面の不要箇所だけでなく裏面全面にマ
スキングするか、基板表裏の両面全面に一旦コーティン
グした後、裏面全部と表面の不要箇所の塗膜をエッチン
グなどの方法により除去する必要があり、多大の手間を
要するものであった。However, when partially coating the substrate,
In the flow coating method and the roller coating method, it is practically impossible to mask unnecessary portions with a masking tape or the like, so first coat the entire surface and then remove the unnecessary portions in large quantities by etching or the like. In addition, it was extremely difficult to obtain a delicately controlled film thickness on the order of submicrons. The dipping method is said to be most effective for obtaining a film thickness on the order of submicrons, but since this method is immersed in a coating solution for a large substrate and then pulled up, the driving equipment becomes large and complicated, and handling is difficult. Not only is it difficult and costly, but when pulling up the substrate, the liquid level is unavoidable due to the vibration of the substrate itself, so horizontal stripes easily occur and it is difficult to form a thin film of uniform thickness. there were. In addition, in the case of partial coating, not only unnecessary parts on the coated surface of the substrate but also the entire back surface is masked, or after coating both the front and back surfaces of the substrate once, the entire back surface and unnecessary parts on the front surface are coated. It is necessary to remove the film by a method such as etching, which requires a lot of trouble.
本出願人はこのような点に鑑みて特開平1−04336
8号公報を出願したが本発明はさらにこれを改良するも
ので、所望の薄膜を有する均質な薄膜をコーティング可
能とし、特に基板に一部にコーティングするに好適な方
法および装置を提供することを目的とする。In view of such a point, the applicant of the present invention has disclosed in Japanese Unexamined Patent Publication No. 1-04336.
However, the present invention is intended to provide a method and an apparatus which are capable of coating a homogeneous thin film having a desired thin film and particularly suitable for partially coating a substrate. To aim.
本発明の方法は、板ガラス、プラスチックなどの基板に
コーティング溶液を接触させて成膜する薄膜のコーティ
ング方法において、一側面を開口した構造の処理槽の該
開口面を基板に密着させた状態で、該処理槽にコーティ
ング溶液を所定レベルまで入れ、さらに該処理槽に設け
た小開口部から一部をオーバーフローさせ、その後基板
に接触するコーティング液のレベルが降下するように、
コーティング液を所定速度で抜きとることを特徴とし、
この方法を実施するための装置としては、基板を垂直あ
るいは傾斜して保持する保持装置と、一側面を該基板に
合致する形状に開口し、開口していない側面の上部に小
開口部を形成した処理槽と、該処理槽に付属し、前記小
開口部を含む面を一側面として構成する受槽と、昇降自
在に設けたコーティング液供給槽を具えるとともに、前
記処理層とコーティング液供給層の底面をチューブによ
り連通させる構成とするもの、あるいは基板を垂直ある
いは傾斜して保持する保持装置と、一側面を該基板に合
致する形状に開口し、開口していない側面の上部に小開
口部を設けた処理槽と、該処理槽に付属し、前記小開口
部を含む面を一側面として構成する受槽を具備するとと
もに、前記処理槽にコーティング液を供給する供給槽
と、処理槽底面からコーティング液を抜き取る回収槽を
それぞれ処理槽の上方と下方に設け、該処理槽と、それ
ぞれバルブを介してチューブにより連結させる構成とす
るものを特徴とする。The method of the present invention is a method for coating a thin film in which a coating solution is brought into contact with a substrate such as plate glass or plastic to form a thin film in a state in which the opening surface of a processing tank having an opening on one side is in close contact with the substrate. The coating solution is put into the processing tank up to a predetermined level, and a part is overflowed from a small opening provided in the processing tank so that the level of the coating solution contacting the substrate is lowered.
Characterized by extracting the coating liquid at a predetermined speed,
As a device for carrying out this method, a holding device for holding the substrate vertically or inclined, and one side surface of which is opened in a shape matching the substrate, and a small opening is formed on the upper side of the non-open side surface And a coating liquid supply tank which is attached to the processing bath and has a surface including the small opening as one side surface, and a coating liquid supply tank which can be moved up and down, and the processing layer and the coating liquid supply layer. The bottom surface of which is communicated by a tube, or a holding device for holding the substrate vertically or inclined, and one side face is opened in a shape matching the substrate, and a small opening is formed on the upper side of the non-open side face. From the bottom of the processing tank, a processing tank provided with a processing tank, and a receiving tank attached to the processing tank and having a surface including the small opening as one side surface, and a supply tank for supplying the coating liquid to the processing tank. Provided recovery tank to withdraw computing solution above and below the respective processing tank, wherein the said treatment tank, what a structure of connecting the tube respectively through the valve.
基板を静止させた状態で、基板の被コーティング面より
や大きめの面積を有し、基板に合致する形状に一側面を
開口した処理槽を基板の被コーティング面に密着させ、
その状態でコーティング溶液を被コーティング面の最大
部と同一あるいはややめのレベルまで入れることによ
り、ディッピング法における基板の浸漬に相当する作用
を行なわせ、液面が静止した後、溶液を所定速度で抜き
出すことによりディッピング法における基板の引き上げ
に相当する作用を行わせて、部分的にコーティングする
ことを可能にしたものであり、基板を静止させてコーテ
ィングするハンドリングが容易となるばかりか、膜厚の
コーティングが容易で均一の厚さの薄膜を得ることがで
きる。With the substrate stationary, a processing tank having a slightly larger area than the coated surface of the substrate and having one side opened in a shape matching the substrate is brought into close contact with the coated surface of the substrate.
In that state, the coating solution is poured to a level equal to or less than the maximum part of the surface to be coated to perform an action equivalent to dipping the substrate in the dipping method. It is possible to perform partial coating by performing an action equivalent to pulling up the substrate in the dipping method by extracting, and not only the handling of coating while the substrate is stationary is easy, but also the film thickness A thin film with a uniform thickness can be obtained by easy coating.
この場合に、処理槽の蓋を設けると空気との接触が不充
分であるので、コーティング直後の膜面の乾きが充分で
なく膜厚にむらが生じる。In this case, if the lid of the processing tank is provided, the contact with air is insufficient, so that the film surface immediately after coating is not sufficiently dried and the film thickness becomes uneven.
さらに後述の実施例1の場合には、溶液の抜取りが困難
である。Further, in the case of Example 1 described later, it is difficult to extract the solution.
したがって、処理槽上部は開口にしておく必要がある
が、その結果、塵埃が処理槽中に混入しコーティング溶
液上部に浮遊することにより、あるいは、溶液中の有機
溶媒が蒸発して、コーティング液の濃度が変わることに
より膜厚が不均一となるので本発明ではコーティング溶
液の一部をオーバーフローさせて、溶液中の浮遊物を除
去するとともに、濃度の変化を少なくさせるものであ
る。Therefore, it is necessary to keep the upper part of the processing tank open, and as a result, dust is mixed in the processing tank and floats on the upper part of the coating solution, or the organic solvent in the solution evaporates and the coating solution Since the film thickness becomes non-uniform due to the change in the concentration, a part of the coating solution is overflowed in the present invention to remove the suspended matter in the solution and reduce the change in the concentration.
以下、図面を参照しながら本発明を詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to the drawings.
第1図、第2図はそれぞれ発明の実施例1、実施例2に
おけるコーティング装置を示す概略斜視図、第3図は処
理槽を示す斜視図、第4図は処理槽切欠き部におけるオ
ーバーフローの状態を示す図である。FIG. 1 and FIG. 2 are schematic perspective views showing a coating apparatus in Example 1 and Example 2 of the invention, FIG. 3 is a perspective view showing a processing tank, and FIG. 4 is an overflow of a notch in the processing tank. It is a figure which shows a state.
実施例1 本装置は第1図、第3図に示すように板ガラスなどの基
板1を保持する保持装置2と一側面を基板1に合致する
形状に開口し、他の側面と底面を閉じるとともに、開口
していない側面の上部を鋸歯状に切欠いて小開口部3を
形成した処理槽4と、この処理槽に付属し、小開口部3
を含む面を一側面として構成する受槽5と、昇降装置6
により昇降自在に設けたコーティング液供給槽7と、処
理槽4とコーティング液供給槽7を連結させるチューブ
8とから構成するものである。保持装置2は吸着パッド
9とストッパー10を有する2本のアーム11、11か
ら構成され、駆動装置11より回動される。Example 1 As shown in FIGS. 1 and 3, the present device has a holding device 2 for holding a substrate 1 such as a plate glass, one side face of which is opened in a shape matching the substrate 1, and the other side face and bottom face are closed. , A processing tank 4 in which a small opening 3 is formed by notching the upper portion of the side surface that is not open in a sawtooth shape, and a small opening 3 attached to this processing tank.
Receiving tank 5 having a side including a side surface as one side surface, and a lifting device 6
The coating liquid supply tank 7 is provided so as to be able to move up and down by the above, and the tube 8 for connecting the processing tank 4 and the coating liquid supply tank 7 together. The holding device 2 is composed of two arms 11 and 11 having a suction pad 9 and a stopper 10, and is rotated by a drive device 11.
また、処理槽4は左右両側、底辺を中空二重構造として
独立させ、チューブ13により真空引き出来るように
し、基板との密着部分には弾性体14を設けるととも
に、エアシリンダー15に連結したロッド16の伸縮に
より前後に往復動される。Further, the processing tank 4 has a hollow double structure independent on the left and right sides and the bottom side so that the tube 13 can be evacuated, an elastic body 14 is provided in the contact portion with the substrate, and a rod 16 connected to the air cylinder 15 is provided. It is reciprocated back and forth due to the expansion and contraction of.
次に薄膜のコーティング手順を説明する。Next, a thin film coating procedure will be described.
コーティング溶液17として主原料のチタンアルコキシ
ドのイソプロピルアルコールなどの溶媒等を加えて調整
したアルコキシド溶液(ゾル溶液)を入れたコーティン
グ液供給槽7をその液面が処理槽4の底面より低くなる
ように降下させた状態で、基板1がベルトコンベア1
8で搬送され所定位置に来たときにベルトコンベア18
を停止する。静止した基板1をアーム11、11に載
置しながら第1図の位置まで回動させる。The coating solution supply tank 7 containing an alkoxide solution (sol solution) prepared by adding a solvent such as isopropyl alcohol of titanium alkoxide, which is a main material, as the coating solution 17 is adjusted so that its liquid level is lower than the bottom surface of the processing tank 4. In the lowered state, the substrate 1 is the belt conveyor 1
Belt conveyor 18 when it is conveyed by 8 and reaches a predetermined position
To stop. While the stationary substrate 1 is placed on the arms 11 and 11, the substrate 1 is rotated to the position shown in FIG.
このとき回動途中で吸着パッド9で基板1を吸着するこ
とにより、ストッパー10の作用と相俟って基板1は所
定位置に安全に保持される。処理槽4をエアーシリン
ダー15の作動により、前進させ、基板1に当接させ
る。当接後、チューブ13を介して図示しない真空ポン
プなどにより真空引き出し、密着度をめる。コーテ
ィング液供給槽7を、その液面が被コーティング面の最
上部より若干上まわるさまで昇降装置6の作動により
上昇させる。このとき処理槽4の液面は0の状態から所
定のレベルまで上昇し、一部がオーバーフローされる。
処理槽4の液面が静止した後、昇降装置6を逆作動さ
せて、供給槽7を、その液面が処理槽4の底面より低い
位置まで一定速度で降下させる。このとき処理槽4の液
面は一定速度で降下しコーティング溶液17は抜き取ら
れる。チューブ13による真空状態を解き、その後エ
アシリンダー15の逆作動により処理槽4を後退させ、
基板1から離脱せしめる。駆動装置12により保持装
置2のアーム11を水平位置まで回動させその後、吸着
パッド9の吸着を解除してベルトコンベア18に基板1
を載置する。ベルトコンベア18の逆作動により基板
1を搬出する。At this time, by sucking the substrate 1 with the suction pad 9 during the rotation, the substrate 1 is safely held at a predetermined position in combination with the action of the stopper 10. The processing tank 4 is moved forward by the operation of the air cylinder 15 and brought into contact with the substrate 1. After the contact, a vacuum pump or the like (not shown) is used to draw out a vacuum through the tube 13 to increase the degree of adhesion. The coating liquid supply tank 7 is raised by the operation of the elevating device 6 until the liquid surface thereof is slightly above the top of the surface to be coated. At this time, the liquid level of the processing tank 4 rises from a state of 0 to a predetermined level, and a part thereof overflows.
After the liquid surface of the processing tank 4 has stopped, the elevating device 6 is reversely operated to lower the supply tank 7 at a constant speed to a position where the liquid surface is lower than the bottom surface of the processing tank 4. At this time, the liquid level in the processing tank 4 descends at a constant speed, and the coating solution 17 is extracted. The vacuum state by the tube 13 is released, and then the treatment tank 4 is retracted by the reverse operation of the air cylinder 15,
It is detached from the substrate 1. The arm 11 of the holding device 2 is rotated to a horizontal position by the drive device 12, and then the suction of the suction pad 9 is released, and the substrate 1 is transferred to the belt conveyor 18.
To place. The substrate 1 is unloaded by the reverse operation of the belt conveyor 18.
この後、電気炉等により熱処理をして、均一なTiO2膜を
得る。Then, heat treatment is performed in an electric furnace or the like to obtain a uniform TiO 2 film.
なお処理槽4からオーバーフローしたコーティング溶液
は受槽5から図示しない清浄化手段を経て回収される。The coating solution overflowing from the processing tank 4 is recovered from the receiving tank 5 through a cleaning means (not shown).
実施例2 本装置は第2図、第3図に示すように板ガラスなどの基
板1を保持する保持装置2と、一側面を基板1に合致す
る形状に開口し、他の側面と底面を閉じるとともに、開
口していない側面の上部を鋸歯状に切欠いて小開口部3
を形成した構造にして架台に固定される処理槽4とこの
処理槽4に付属し、小開口部3を含む面を一側面として
構成する受槽5と、処理槽4の上方に設けられ、実施例
1と同じコーティング溶液17を供給する供給槽7と、
処理槽4の下方に設けられ、コーティング溶液を抜き取
る回収槽23と、供給槽7の底面に接続させバルブ19
を介して処理槽4に導入させるチューブ20と、処理槽
4の底面に接続させバルブ21を介して回収槽23に導
入させるチューブ22とから構成される。なお、図示し
ないがこの場合にも、処理槽4の周囲を2重構造にして
真空引きできるようにした方がよい。Embodiment 2 This apparatus has a holding device 2 for holding a substrate 1 such as a glass plate as shown in FIGS. 2 and 3, and one side surface is opened in a shape matching the substrate 1, and the other side surface and bottom surface are closed. At the same time, a small opening 3 is formed by cutting the upper portion of the side surface that is not open in a sawtooth shape.
A treatment tank 4 having a structure formed with a fixed structure and a receiving tank 5 attached to the treatment tank 4 and having a surface including the small opening 3 as one side surface; A supply tank 7 for supplying the same coating solution 17 as in Example 1,
A recovery tank 23 provided below the processing tank 4 for extracting the coating solution and a valve 19 connected to the bottom surface of the supply tank 7
It is composed of a tube 20 introduced into the treatment tank 4 through the tube 20 and a tube 22 connected to the bottom surface of the treatment tank 4 and introduced into the collection tank 23 via the valve 21. Although not shown, in this case as well, it is preferable that the periphery of the processing tank 4 has a double structure so that a vacuum can be drawn.
次に、薄膜のコーティング手順を説明する。Next, the procedure for coating a thin film will be described.
まず、板ガラス等の基板1を保持装置2に載置し、基板
1と処理槽4を密着させた状態でバルブ19を開き処理
槽にコーティング液を入れ、液面が所定レベルから一部
オーバーフローしたところでバルブ19を閉じる。処理
槽の液面が静止した後、バルブ21を開き、その開度を
液面降下速度が所望の値になるように調整して、コーテ
ィング液をほぼ一定速度で抜き出すようにするものであ
る。First, the substrate 1 such as a plate glass is placed on the holding device 2, the valve 19 is opened with the substrate 1 and the processing bath 4 in close contact with each other, and the coating liquid is poured into the processing bath, and the liquid surface partially overflows from a predetermined level. By the way, the valve 19 is closed. After the liquid level in the processing tank has stopped, the valve 21 is opened, the opening is adjusted so that the liquid level descending speed becomes a desired value, and the coating liquid is extracted at a substantially constant speed.
その後は実施例1のように熱処理槽をして均一厚さのTi
O2膜を得る。After that, a heat treatment tank is used as in Example 1 and Ti of uniform thickness is used.
Obtain an O 2 film.
以上、好適な実施例により説明したが、本発明はこれら
に限定されるものではなく、種々の応用が可能である。The preferred embodiments have been described above, but the present invention is not limited to these, and various applications are possible.
本発明により得られる薄膜はTiO2膜以外にもSiO2膜、Zr
O2膜、Al2O3あるいはこれらの混合膜などの光学薄膜、
重クロム酸ゼラチン膜などのホログラム用薄膜等種々の
ものがあり、従ってコーティング溶液も種々のものを適
用出来る。Thin SiO 2 film in addition to TiO 2 film obtained by the present invention, Zr
Optical thin film such as O 2 film, Al 2 O 3 or mixed film of these,
There are various kinds of thin films for hologram such as dichromated gelatin film, and therefore various kinds of coating solutions can be applied.
基板には板ガラス以外にも各種のプラスチック板などで
もよく、その形状も平面だけでなく曲面であっても処理
槽の開口部を基板に合致する形状にすればよいので、各
種形状の基板に適用することができる。In addition to plate glass, various plastic plates can be used for the substrate, and even if the shape is not only flat but also curved, it is enough to make the opening of the processing tank conform to the substrate, so it can be applied to substrates of various shapes can do.
処理槽に、小開口部を形成するために設けた切欠き部は
オーバーフローさせる堰として作用するが、製作上等の
理由によりコーティング液面に対して切欠き部を完全に
平行な状態にすることは困難で、この場合にオーバーフ
ロー量は第4図に示す斜線部分となりこの量を一定とす
ると、直線状にした場合よりも鋸歯状にした方が広範囲
にオーバーフローするとともに、切欠いたことによりそ
れだけ堰断面積が小さくなり、オーバーフロー液の流速
が大きくなる等の理由により、広い範囲の浮遊物を除去
できるので好ましいが、コーティング液面と切欠き部が
ほぼ平行な場合あるいはオーバーフロー量を多くした場
合など直線状にしてもよいのは勿論である。The notch provided to form the small opening in the processing tank acts as a weir for overflow, but for reasons such as manufacturing, make the notch completely parallel to the coating liquid surface. In this case, the overflow amount becomes the shaded part shown in Fig. 4, and if this amount is made constant, the sawtooth shape overflows more widely than the straight line, and the notch cuts that much. It is preferable because a wide range of suspended solids can be removed because the cross-sectional area becomes small and the flow velocity of the overflow liquid becomes large. However, when the coating liquid surface and the notch are almost parallel or when the overflow amount is large, etc. Of course, it may be linear.
また、本発明は部分コーティングに好適であるが、容器
の開口面積を大きくすれば、すなわち、容器を大型にす
れば、片面全面にコーティングすることも可能である。Further, although the present invention is suitable for partial coating, it is also possible to coat the entire surface on one side by increasing the opening area of the container, that is, by increasing the size of the container.
本発明によれば、湿式コーティングにおいて従来、困難
であった部分コーティングをマスキングすることなく、
不要膜の除去も必要ないかで、しかも、膜厚の制御が容
易で、均一な膜がえられるので、ヘッドアップディスプ
レイ用コンバイナー、反射鏡、装飾板など広く、各種の
用途に応用可能なものである。According to the present invention, without masking a partial coating, which was conventionally difficult in wet coating,
Since it is not necessary to remove unnecessary films and the film thickness is easy to control and a uniform film can be obtained, it can be applied to a wide variety of applications such as combiners for head-up displays, reflectors, and decorative plates. Is.
第1図、第2図はそれぞれ本発明の実施例1、実施例2
におけるコーティング装置を示す概略斜視図、第3図は
処理槽を示す斜視図、第4図は処理槽切欠き部における
オーバーフローの状態を示す図である。 1……基板、2……保持装置 3……小開口部、4……処理槽 7……コーティング液供給槽 8 、20、22……チューブ 23……回収槽、19、21……バルブ1 and 2 show Embodiment 1 and Embodiment 2 of the present invention, respectively.
FIG. 3 is a schematic perspective view showing the coating apparatus in FIG. 3, FIG. 3 is a perspective view showing the processing tank, and FIG. 4 is a view showing an overflow state in the processing tank notch portion. 1 …… Substrate, 2 …… Holding device 3 …… Small opening, 4 …… Treatment tank 7 …… Coating liquid supply tank 8, 20, 22 …… Tube 23 …… Collection tank, 19, 21 …… Valve
Claims (3)
る薄膜のコーティング方法において、一側面を開口した
構造の処理槽の該開口面を基板に密着させた状態で、該
処理槽にコーティング液を所定レベルまで入れ、さらに
該処理槽に形成した小開口部から一部をオーバーフロー
させ、その後、基板に接触するコーティング液のレベル
が降下するように、コーティング液を所定速度で抜きと
ることを特徴とする薄膜のコーティング方法。1. A method for coating a thin film in which a substrate is coated with a coating solution to form a coating film, the coating solution being applied to the processing tank in a state where the opening surface of a processing tank having an opening on one side is in close contact with the substrate. To a predetermined level, and then a part of the solution is overflowed from a small opening formed in the processing tank, and then the coating liquid is withdrawn at a predetermined speed so that the level of the coating liquid contacting the substrate drops. And a method of coating a thin film.
装置と、一側面を該基板に合致する形状に開口し、開口
していない側面の上部に小開口部を形成した処理槽と、
該処理槽に付属し、前記小開口部を含む面を一側面とし
て構成する受槽と、昇降自在に設けたコーティング液供
給槽を具備するとともに、前記処理槽とコーティング液
供給槽の底面をチューブにより連通させたことを特徴と
する薄膜のコーティング装置。2. A holding device for holding a substrate vertically or inclined, and a processing tank having one side face opened in a shape matching the substrate and a small opening formed on an upper side of the side face not opened.
It is equipped with a receiving tank that is attached to the processing tank and has a surface including the small opening as one side surface, and a coating liquid supply tank that is vertically movable, and a bottom surface of the processing tank and the coating liquid supply tank is formed by a tube. A thin film coating device characterized by being connected.
装置と、一側面を該基板に合致する形状に開口し、開口
していない側面の上部に小開口部を形成した処理槽と、
該処理層に付属し、前記小開口部を含む面を一側面とし
て構成する受槽を具備するとともに、前記処理槽にコー
ティング液を供給する供給槽と、処理槽底面からコーテ
ィング液を抜き取る回収槽をそれぞれ処理槽の上方と下
方に設け、該処理槽とそれぞれバルブを介してチューブ
により連結したことを特徴とする薄膜のコーティング装
置。3. A holding device for holding a substrate vertically or inclined, and a processing tank having one side face opened in a shape conforming to the substrate and a small opening formed on an upper side of the side face not opened.
The processing tank comprises a receiving tank attached to the processing layer and having a surface including the small opening as one side surface, a supply tank for supplying the coating liquid to the processing tank, and a recovery tank for extracting the coating liquid from the bottom surface of the processing tank. A thin film coating apparatus, which is provided above and below a processing tank, and is connected to the processing tank by a tube via a valve, respectively.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63211677A JPH0649167B2 (en) | 1988-08-26 | 1988-08-26 | Thin film coating method and apparatus |
| IT8921542A IT1231384B (en) | 1988-08-26 | 1989-08-22 | PROCEDURE AND DEVICE FOR COATING THE SURFACE OF A PLATE WITH A THIN LIQUID FILM. |
| US07/397,672 US5009933A (en) | 1988-08-26 | 1989-08-23 | Method and apparatus for coating thin liquid film on plate surface |
| DE3927849A DE3927849A1 (en) | 1988-08-26 | 1989-08-23 | METHOD AND DEVICE FOR APPLYING A THIN LIQUID FILM TO A SUBSTRATE SURFACE |
| KR1019890012135A KR930001507B1 (en) | 1988-08-26 | 1989-08-25 | Method and apparatus for coating thin fluid film on substrate surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63211677A JPH0649167B2 (en) | 1988-08-26 | 1988-08-26 | Thin film coating method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0259064A JPH0259064A (en) | 1990-02-28 |
| JPH0649167B2 true JPH0649167B2 (en) | 1994-06-29 |
Family
ID=16609763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63211677A Expired - Lifetime JPH0649167B2 (en) | 1988-08-26 | 1988-08-26 | Thin film coating method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0649167B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52146451A (en) * | 1976-06-01 | 1977-12-06 | Sumitomo Chem Co Ltd | Dipping apparatus |
| JPS5315095A (en) * | 1976-07-28 | 1978-02-10 | Toshiba Corp | Preparing recurrence reflector having gas layer |
| JPS58172468U (en) * | 1982-05-13 | 1983-11-17 | 野尻 健史 | Mechanical masking type plating equipment |
-
1988
- 1988-08-26 JP JP63211677A patent/JPH0649167B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0259064A (en) | 1990-02-28 |
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