JPH0649817B2 - Epoxy resin composition for semiconductor encapsulation - Google Patents
Epoxy resin composition for semiconductor encapsulationInfo
- Publication number
- JPH0649817B2 JPH0649817B2 JP61159804A JP15980486A JPH0649817B2 JP H0649817 B2 JPH0649817 B2 JP H0649817B2 JP 61159804 A JP61159804 A JP 61159804A JP 15980486 A JP15980486 A JP 15980486A JP H0649817 B2 JPH0649817 B2 JP H0649817B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- parts
- semiconductor encapsulation
- silver salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 20
- 239000003822 epoxy resin Substances 0.000 title claims description 19
- 229920000647 polyepoxide Polymers 0.000 title claims description 19
- 239000004065 semiconductor Substances 0.000 title description 6
- 238000005538 encapsulation Methods 0.000 title description 5
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は耐湿性に優れる半導体封止用エポキシ樹脂組成
物に関するものである。TECHNICAL FIELD The present invention relates to a semiconductor encapsulating epoxy resin composition having excellent moisture resistance.
従来、半導体封止用エポキシ樹脂組成物の耐湿性を向上
させる技術としてエポキシ樹脂の低塩素化が知られてお
り、この数年確実に低塩素化の技術は進み、例えば加水
分解性塩素は3000→1000→500→250ppmと確実に低減し
ており、この結果半導体封止用エポキシ樹脂組成物の耐
湿性も大幅に向上した。しかし、この低塩素化技術も頭
打ちとなり今後これ以上の向上が望めないのが現状であ
る。Conventionally, it has been known to lower the chlorine content of epoxy resins as a technology for improving the moisture resistance of epoxy resin compositions for semiconductor encapsulation. → 1000 → 500 → 250ppm, which was certainly reduced, and as a result, the moisture resistance of the epoxy resin composition for semiconductor encapsulation was also greatly improved. However, it is the current situation that this low chlorine technology has reached a ceiling and further improvement cannot be expected in the future.
本発明はエポキシ樹脂組成物の耐湿性をさらに向上させ
るため低塩素化技術を検討した結果フェノール類又はカ
ルボン酸の銀塩を添加することにより組成物の塩素を捕
捉することができる知見を得さらに研究を進め本発明を
完成するに至ったものである。In order to further improve the moisture resistance of the epoxy resin composition of the present invention, as a result of investigating a low chlorination technique, it has been found that chlorine of the composition can be captured by adding a silver salt of phenol or carboxylic acid. The present invention has been completed by conducting research.
本発明はフェノール類又はカルボン酸の銀塩を含むこと
を特徴とする半導体封止用エポキシ樹脂組成物について
述べたものである。The present invention describes an epoxy resin composition for semiconductor encapsulation, which comprises a silver salt of a phenol or a carboxylic acid.
本発明におけるエポキシ樹脂組成物はエポキシ樹脂、硬
化促進剤及び本発明のフェノール類又はカルボン酸の銀
塩を必須として必要に応じて硬化剤、充填材、難燃剤、
処理剤、顔料、離型剤その他添加剤を配合したものであ
る。半導体の封止を目的としているので不純物は少ない
ほうが好ましく、例えば試料５ｇを純水45ｇで125℃20
時間抽出した時の抽出水電導度は100μs/cm以下が望ま
しい。The epoxy resin composition of the present invention essentially comprises an epoxy resin, a curing accelerator and a silver salt of the phenol or carboxylic acid of the present invention, if necessary, a curing agent, a filler, a flame retardant,
It contains a treating agent, a pigment, a release agent and other additives. Since it is intended for semiconductor encapsulation, it is preferable that the amount of impurities is small.
It is desirable that the conductivity of the extracted water after time extraction is 100 μs / cm or less.
エポキシ樹脂とはエポキシ基を有するもの全般のことを
いい、例えばビスフェノール型エポキシ、ノボラック型
エポキシ、複素環型エポキシといった一般名を挙げるこ
とができる。Epoxy resin refers to all those having an epoxy group, and examples thereof include general names such as bisphenol type epoxy, novolac type epoxy, and heterocyclic type epoxy.
硬化促進剤とはエポキシ樹脂組成物の硬化を促進させる
触媒全般のことをいい、例えばイミダゾール類、第三級
アミン類、有機リン化合物、有機アルミニウム化合物と
いった一般名を挙げることができる。The curing accelerator refers to all catalysts that accelerate the curing of the epoxy resin composition, and examples thereof include general names such as imidazoles, tertiary amines, organic phosphorus compounds, and organic aluminum compounds.
本発明のフェノール類又はカルボン酸の銀塩水溶性であ
ることが望ましい。銀塩は水に対する溶解性を高め接触
面積を大きくするために粒径100μｍ以下がよい。また
添加量としてはコスト及びエポキシ樹脂中の塩素量から
考えて、エポキシ樹脂100重量部に対して0.05〜0.2重量
部が望ましい。少量だと塩素イオンのトラップ効果が得
られないし、必要以上に添加すると組成物の電気特性の
低下及びコストアップに結びつくからである。The silver salt of the phenol or carboxylic acid of the present invention is preferably water-soluble. The silver salt preferably has a particle size of 100 μm or less in order to increase the solubility in water and increase the contact area. Considering the cost and the amount of chlorine in the epoxy resin, the addition amount is preferably 0.05 to 0.2 parts by weight with respect to 100 parts by weight of the epoxy resin. This is because if it is a small amount, a chlorine ion trapping effect cannot be obtained, and if it is added more than necessary, it will lead to a decrease in the electrical characteristics of the composition and an increase in cost.
本発明に従うと従来の技術をそのまま利用することがで
き、且つ従来技術では到達できなかった高耐湿性を得る
ことができる。According to the present invention, the conventional technique can be used as it is, and high humidity resistance that cannot be achieved by the conventional technique can be obtained.
以下、検討例及び比較例で説明する。例で用いた部は全
て重量部である。また使用した銀塩は表−１に示した。Hereinafter, a study example and a comparative example will be described. All parts used in the examples are parts by weight. The silver salts used are shown in Table 1.
検討例(1)〜(6) 溶融シリカ（龍森製）100部にシランカップリング剤（A
-187、日本ユニカー製）を0.5部、エポキシ樹脂（EOCN-
1020、日本化薬製）20部、硬化剤（MP-120、群栄化学）
10部、硬化促進剤（TPP、北興化学製）0.2部、離型剤
（ヘキストＥ、ヘキストジャパン）0.5部、顔料（カー
ボン、電気化学）0.3部、銀塩を表−２の配合に従って
混合後、加熱ニーダーで混練しエポキシ樹脂組成物を得
た。これらの組成物を用いて模擬素子を封止し耐湿性の
評価を行なった。表−２より明らかなように本発明に従
う検討例では比較例に比べ抜群の効果があることがわか
る。 Examination Examples (1) to (6) 100 parts of fused silica (manufactured by Tatsumori) was added to the silane coupling agent (A
-187, 0.5 parts of Nippon Unicar, epoxy resin (EOCN-
1020, Nippon Kayaku) 20 parts, curing agent (MP-120, Gunei Chemical)
After mixing 10 parts, curing accelerator (TPP, manufactured by Hokuko Kagaku) 0.2 parts, release agent (Hoechst E, Hoechst Japan) 0.5 parts, pigment (carbon, electrochemical) 0.3 parts, silver salt according to the formulation of Table-2 Then, the mixture was kneaded with a heating kneader to obtain an epoxy resin composition. A simulated element was sealed using these compositions and the moisture resistance was evaluated. As is clear from Table-2, it is understood that the examination examples according to the present invention have an outstanding effect as compared with the comparative examples.
比較例(7) 溶融シリカ（龍森製）100部にシランカップリング剤（A
-187、日本ユニカー製）を0.5部、エポキシ樹脂（EOCN-
1020、日本化薬製）20部、硬化剤（MP-120、群栄化学）
10部、硬化促進剤（TPP、北興化学製）0.2部、離型剤
（ヘキストＥ、ヘキストジャパン）0.5部、顔料（カー
ボン、電気化学製）0.3部、銀塩を表−２の配合に従っ
て混合後、加熱ニーダーで混練しエポキシ樹脂組成物を
得た。この組成物を用いて模擬素子を封止し耐湿性の評
価を行なった。表−２より明らかなように検討例に比べ
大幅に劣る。Comparative Example (7) 100 parts of fused silica (manufactured by Tatsumori) was added to the silane coupling agent (A
-187, 0.5 parts of Nippon Unicar, epoxy resin (EOCN-
1020, Nippon Kayaku) 20 parts, curing agent (MP-120, Gunei Chemical)
Mix 10 parts, curing accelerator (TPP, manufactured by Hokuko Chemical Co., Ltd.) 0.2 part, release agent (Hoechst E, Hoechst Japan) 0.5 part, pigment (carbon, manufactured by Electrochemical Co., Ltd.) 0.3 part, silver salt according to the composition of Table-2 Then, the mixture was kneaded with a heating kneader to obtain an epoxy resin composition. A simulated element was sealed with this composition and the moisture resistance was evaluated. As is clear from Table-2, it is significantly inferior to the study example.
フロントページの続き (56)参考文献 特開 昭51−68181（ＪＰ，Ａ) 特開 昭61−12719（ＪＰ，Ａ) 特開 昭61−200155（ＪＰ，Ａ) 特開 昭61−268719（ＪＰ，Ａ)Continuation of the front page (56) Reference JP-A-51-68181 (JP, A) JP-A-61-12719 (JP, A) JP-A-61-200155 (JP, A) JP-A-61-268719 (JP , A)
Claims (1)
類又はカルボン酸の銀塩、充填材を必須成分とすること
を特徴とするエポキシ樹脂組成物。1. An epoxy resin composition comprising an epoxy resin, a curing accelerator, a silver salt of a phenol or a carboxylic acid, and a filler as essential components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61159804A JPH0649817B2 (en) | 1986-07-09 | 1986-07-09 | Epoxy resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61159804A JPH0649817B2 (en) | 1986-07-09 | 1986-07-09 | Epoxy resin composition for semiconductor encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6317925A JPS6317925A (en) | 1988-01-25 |
| JPH0649817B2 true JPH0649817B2 (en) | 1994-06-29 |
Family
ID=15701621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61159804A Expired - Fee Related JPH0649817B2 (en) | 1986-07-09 | 1986-07-09 | Epoxy resin composition for semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0649817B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1331079C (en) * | 1988-08-17 | 1994-08-02 | Herschel Sternlieb | White blackout fabric |
| JPH0618991B2 (en) * | 1989-07-28 | 1994-03-16 | 住友ベークライト株式会社 | Epoxy resin composition for laser printing |
| JPH03157448A (en) * | 1989-11-15 | 1991-07-05 | Mitsubishi Electric Corp | Epoxy resin composition for sealing semiconductor |
| CN116113664A (en) * | 2020-08-04 | 2023-05-12 | 纳美仕有限公司 | Conductive composition, die attach material, pressure sintering type die attach material, and electronic component |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5168181A (en) * | 1974-12-11 | 1976-06-12 | Hitachi Ltd | HANDOTAIFUSHOSOSEIBUTSU |
| JPS61200155A (en) * | 1985-02-28 | 1986-09-04 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
| JPS61268719A (en) * | 1985-05-22 | 1986-11-28 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
-
1986
- 1986-07-09 JP JP61159804A patent/JPH0649817B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317925A (en) | 1988-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |