Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPH0650264B2 - Temperature measuring method and device - Google Patents
[go: Go Back, main page]

JPH0650264B2 - Temperature measuring method and device - Google Patents

Temperature measuring method and device

Info

Publication number
JPH0650264B2
JPH0650264B2 JP63059301A JP5930188A JPH0650264B2 JP H0650264 B2 JPH0650264 B2 JP H0650264B2 JP 63059301 A JP63059301 A JP 63059301A JP 5930188 A JP5930188 A JP 5930188A JP H0650264 B2 JPH0650264 B2 JP H0650264B2
Authority
JP
Japan
Prior art keywords
temperature
wave
frequency
ultrasonic
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63059301A
Other languages
Japanese (ja)
Other versions
JPH01233337A (en
Inventor
克彦 本庄
順一 増田
義朗 富川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP63059301A priority Critical patent/JPH0650264B2/en
Publication of JPH01233337A publication Critical patent/JPH01233337A/en
Publication of JPH0650264B2 publication Critical patent/JPH0650264B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は外部から接近できない測定対象の温度を外部か
ら超音波を用いて測定する技術に関するものである。
Description: TECHNICAL FIELD The present invention relates to a technique for externally measuring the temperature of a measurement target that is inaccessible from the outside by using ultrasonic waves.

〔従来の技術〕[Conventional technology]

従来、生体たとえば人体内部の温度を測定する方法とし
て、温度測定用装置のセンサ部たとえば熱電対を人体内
部の測定対象たとえば胃、肝臓等に接触させて温度を測
定する技術がある。これを第12図に示す。第12図に
おいて、1は人体の断面、2は加熱用ヒータ、3は測定
対象、4は温度測定用熱電対である。同図から分かるよ
うに、従来は、人体内部に熱電対4を挿入して測定対象
3の温度を測定していた。
2. Description of the Related Art Conventionally, as a method for measuring the temperature inside a living body such as a human body, there is a technique in which a sensor unit such as a thermocouple of a temperature measuring device is brought into contact with a measurement target such as a stomach or liver inside the human body to measure the temperature. This is shown in FIG. In FIG. 12, 1 is a section of a human body, 2 is a heater for heating, 3 is an object to be measured, and 4 is a thermocouple for temperature measurement. As can be seen from the figure, conventionally, the temperature of the measurement target 3 was measured by inserting the thermocouple 4 inside the human body.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

しかし、上述したような従来技術においては、人体内部
に熱電対4を挿入するため、人体に痛みを伴うという欠
点や、痛み止めのため麻酔が必要であるという欠点があ
った。
However, in the above-mentioned conventional techniques, since the thermocouple 4 is inserted inside the human body, there are drawbacks that the human body is painful and that anesthesia is required to stop the pain.

また、第13図に示すように、構造物6の内部の測定対
象7の温度を測定する場合には、温度測定用熱電対8等
のセンサ部を挿入するための穴を開ける必要があり、測
定対象7の周辺の形状が実際の構造物とは異なるため、
測定部分の温度分布も実際とは異なるという欠点があっ
た。また、穴を開けるための加工費がかかるという欠点
もあった。
Further, as shown in FIG. 13, when measuring the temperature of the measuring object 7 inside the structure 6, it is necessary to make a hole for inserting a sensor unit such as a thermocouple 8 for temperature measurement. Since the shape around the measurement target 7 is different from the actual structure,
There was a drawback that the temperature distribution of the measurement part was also different from the actual one. In addition, there is also a drawback that it requires a processing cost for making a hole.

本発明はこのような点に鑑みてなれたものであり、その
目的とするところは、外部から接近できない測定対象の
温度を測定する温度測定方法および装置を提供すること
にある。
The present invention has been made in view of the above points, and an object of the present invention is to provide a temperature measuring method and apparatus for measuring the temperature of a measurement target that is inaccessible from the outside.

〔課題を解決するための手段〕[Means for Solving the Problems]

このような目的を達成するために本発明による温度測定
方法は、外部から接近できない測定対象に超音波を送信
し、測定対象からの反射波を受信し、受信した反射波を
短い時間単位で周波数解析し、周波数解析した受信波の
周波数分布の特徴を表わすピーク周波数と半値幅を用い
て測定対象の温度を算出するようにしたものである。
In order to achieve such an object, the temperature measuring method according to the present invention transmits an ultrasonic wave to a measuring object that is not accessible from the outside, receives a reflected wave from the measuring object, and frequency-tunes the received reflected wave in a short time unit. The temperature of the measurement target is calculated using the peak frequency and the half-width, which are characteristic of the frequency distribution of the received wave subjected to the analysis and frequency analysis.

また、本発明による温度測定装置は、超音波を送信し又
受信する温度測定用超音波センサと、超音波を送受信す
る超音波送受信回路と、受信波をA/D変換する受信波
A/D変換部と、信号処理部とを備え、信号処理部は、
A/D変換された受信波を短い時間に切り出して周波数
解析し、周波数解析した受信波の周波数分布からピーク
周波数、半値幅を算出し、予め求めたおいた温度対ピー
ク周波数、温度対半値幅の関係から温度を求めるように
したものである。
The temperature measuring device according to the present invention includes a temperature measuring ultrasonic sensor for transmitting and receiving ultrasonic waves, an ultrasonic transmitting / receiving circuit for transmitting / receiving ultrasonic waves, and a received wave A / D for A / D converting the received wave. The signal processing unit includes a conversion unit and a signal processing unit.
The A / D-converted received wave is cut out in a short time and frequency-analyzed. The peak frequency and half-width are calculated from the frequency distribution of the frequency-analyzed received wave, and the temperature-peak frequency and temperature-half-width obtained in advance are calculated. The temperature is calculated from the relationship of.

〔作用〕[Action]

本発明においては、外部から接近できない測定対象の温
度を測定できる。
In the present invention, it is possible to measure the temperature of the measurement target that is inaccessible from the outside.

〔実施例〕〔Example〕

第1図は本発明に係わる温度測定装置の一実施例を使用
して人体内部の温度を測定する場合の測定方法を説明す
るための説明図である。同図において、11は温度測定
用超音波センサ、12は温度測定用超音波装置本体、1
3は人体内部を伝播する超音波の伝播経路、14は人体
の胴の断面、15は加熱用ヒータ、16は測定対象であ
り、温度測定用超音波センサ11と温度測定長超音波装
置本体12とは温度測定装置を構成する。第1図の人体
の胴の断面14において、加熱用ヒータ15を用いて胴
の外部から人体を加熱すると、目的とする測定対象16
が高温度になる。その測定対象16に向かって温度測定
用超音波センサ11から超音波を送信し、その受信波を
温度測定用超音波センサ11で受信し、温度測定用超音
波装置本体12で温度を算出する。なお、第1図におけ
る超音波センサ11は送信用と受信用の両方を兼ねてい
るが、両方を別々のセンサ2つを用いても同様な効果を
得ることができる。
FIG. 1 is an explanatory view for explaining a measuring method when the temperature inside the human body is measured by using an embodiment of the temperature measuring device according to the present invention. In the figure, 11 is an ultrasonic sensor for temperature measurement, 12 is an ultrasonic device body for temperature measurement, and 1
Reference numeral 3 is a propagation path of ultrasonic waves propagating inside the human body, 14 is a cross section of the body of the human body, 15 is a heater for heating, 16 is a measuring object, and the ultrasonic sensor 11 for temperature measurement and the temperature measuring long ultrasonic device main body 12 are provided. And constitute a temperature measuring device. When the human body is heated from the outside of the body using the heating heater 15 in the cross section 14 of the body of FIG.
Becomes high temperature. An ultrasonic wave is transmitted from the temperature measuring ultrasonic sensor 11 to the measurement target 16, the received wave is received by the temperature measuring ultrasonic sensor 11, and the temperature measuring ultrasonic device main body 12 calculates the temperature. Although the ultrasonic sensor 11 in FIG. 1 has both a transmitting function and a receiving function, the same effect can be obtained by using two separate sensors.

第2図は、第1図の温度測定用超音波装置本体12を示
す系統図である。第2図において、21は超音波送受信
回路、22は受信波A/D変換部、23は信号処理部、
24はディスプレイ、25はプリンタである。超音波送
受信回路21は第1図の温度測定用超音波センサ11か
ら超音波を送信し、また受信するための回路である。受
信波A/D変換部22は、その後の信号処理のため、受
信したアナログ信号をデジタル信号に変換する部分であ
る。信号処理部23は本実施例の最も重要な部分であ
り、その動作を説明するためのフローチャートを第3図
に示す。ディスプレイ24は温度測定結果を表示するた
めのものであり、プリンタ25は同じく測定結果を印字
出力するものである。
FIG. 2 is a system diagram showing the temperature measuring ultrasonic device main body 12 of FIG. In FIG. 2, reference numeral 21 is an ultrasonic transmission / reception circuit, 22 is a received wave A / D conversion unit, 23 is a signal processing unit,
Reference numeral 24 is a display, and 25 is a printer. The ultrasonic transmission / reception circuit 21 is a circuit for transmitting and receiving ultrasonic waves from the ultrasonic sensor 11 for temperature measurement shown in FIG. The reception wave A / D conversion unit 22 is a unit that converts a received analog signal into a digital signal for subsequent signal processing. The signal processing unit 23 is the most important part of this embodiment, and a flowchart for explaining its operation is shown in FIG. The display 24 is for displaying the temperature measurement result, and the printer 25 is also for printing out the measurement result.

次に、第3図を用いて、本実施例の最も重要な部分であ
る信号処理部12の動作を説明する。受信波A/D変換
部22でA/D変換された受信波(第5図参照)は、1
波長程度の短い時間に切り出される(ステップ31、3
2)。切出し方法としては、第6図(a),(b)に示すよう
な幾つかの方法がある。その後、切り出した波を周波数
解析し(ステップ33)、周波数分布からピーク周波数
PF、半値幅WF(第4図参照)を算出する(ステップ
34)。さらに、予め求めておいた温度対ピーク周波
数、温度対半値幅の関係から温度を算出する(ステップ
34)。
Next, the operation of the signal processing unit 12, which is the most important part of this embodiment, will be described with reference to FIG. The received wave A / D converted by the received wave A / D converter 22 (see FIG. 5) is 1
It is cut out in a short time of about the wavelength (steps 31, 3
2). There are several cutting methods as shown in FIGS. 6 (a) and 6 (b). Thereafter, the cut out wave is subjected to frequency analysis (step 33), and the peak frequency PF and the half width WF (see FIG. 4) are calculated from the frequency distribution (step 34). Further, the temperature is calculated from the relationship between the temperature and the peak frequency and the temperature and the half value width which are obtained in advance (step 34).

第6図(a),(b)は1波長程度の短時間に受信波を切り出
す方法の例である。第6図(a)においてはNO.1,NO.2,
・・・というように1波長程度の間隔で互いに重なるこ
となく切り出しているが、精度を要求される場合は、第
6図(b)に示すように、わずか(Δt)ずつ位置をずら
して切り出す方が良い。
FIGS. 6 (a) and 6 (b) show an example of a method of cutting out a received wave in a short time of about one wavelength. In Fig. 6 (a), NO.1, NO.2,
.. are cut out at intervals of about 1 wavelength without overlapping each other, but when accuracy is required, the positions are cut out by slightly shifting (.DELTA.t) as shown in FIG. 6 (b). Better

なお第5図,第6図において、36は測定対象からの反
射波形である。
In FIGS. 5 and 6, reference numeral 36 denotes a reflected waveform from the measurement target.

第7図は、人体の場合の温度とピーク周波数の関係を示
すグラフである。この場合の超音波信号周波数は5MH
z、周辺温度は17℃である。第7図から分かるよう
に、温度が高くなるにつれてピーク周波数は上昇する。
これは温度が高くなるにつれて測定対象16と他の部分
の境界面において超音波に対するインピーダンスが増加
するため、測定対象との境界面における超音波の反射・
吸収による超音波の減衰が減少するためと考えられる。
FIG. 7 is a graph showing the relationship between the temperature and the peak frequency in the case of a human body. The ultrasonic signal frequency in this case is 5 MH
z, ambient temperature is 17 ° C. As can be seen from FIG. 7, the peak frequency rises as the temperature rises.
This is because the impedance for ultrasonic waves increases at the boundary between the measurement target 16 and other portions as the temperature rises, so that the reflection of ultrasonic waves at the boundary between the measurement target and
It is considered that the attenuation of ultrasonic waves due to absorption is reduced.

第8図は人体の場合の温度と半値幅の関係を示すグラフ
である。同図から分かるように、半値幅は温度が高くな
るにつれてせまくなる傾向がある。これは、上記と同様
に温度が高くなるにつれて境界面において超音波に対す
るインピーダンスが増加するため、超音波の減衰が減少
するためであると考えられる。なお、超音波信号周波数
と周辺温度は第7図の場合と同様である。
FIG. 8 is a graph showing the relationship between the temperature and the half width in the case of a human body. As can be seen from the figure, the full width at half maximum tends to become narrower as the temperature rises. It is considered that this is because the impedance of the ultrasonic wave increases at the boundary surface as the temperature rises and the attenuation of the ultrasonic wave decreases as in the above case. The ultrasonic signal frequency and the ambient temperature are the same as in the case of FIG.

これら超音波の反射・吸収に関わる減衰の要因は様々で
あり、温度測定に応用する場合には温度測定のばらつき
が大きい。このため、測定のパラメータとして超音波の
ピーク周波数および半値幅の両方を用いることで測定精
度の向上が確保される。
There are various factors of attenuation related to the reflection and absorption of these ultrasonic waves, and when applied to temperature measurement, there are large variations in temperature measurement. Therefore, improvement in measurement accuracy is ensured by using both the peak frequency and half width of ultrasonic waves as measurement parameters.

第9図は、本発明に係わる温度測定方法の一実施例を説
明するための説明図である。同図において、41は温度
測定用超音波センサ、42は温度測定用超音波装置本
体、43は構造物内部を伝播する超音波の伝播経路、4
4は構造物、45は測定対象である。第9図において、
構造物44の外部から目的とする測定対象45に向かっ
て温度測定用超音波センサ41から超音波を送信し、そ
の受信波を温度測定用超音波センサ41で受信し、温度
測定用超音波装置本体42で温度を算出する。なお、超
音波センサ41は本実施例では送信用と受信用の両方を
兼ねているが、両方を別々のセンサ2つを用いても同様
な効果を得ることができる。
FIG. 9 is an explanatory diagram for explaining one embodiment of the temperature measuring method according to the present invention. In the figure, 41 is an ultrasonic sensor for temperature measurement, 42 is an ultrasonic device main body for temperature measurement, 43 is a propagation path of ultrasonic waves propagating inside the structure, 4
4 is a structure and 45 is an object to be measured. In FIG.
An ultrasonic wave is transmitted from the temperature measuring ultrasonic sensor 41 to the target measuring object 45 from the outside of the structure 44, and the received wave is received by the temperature measuring ultrasonic sensor 41. The temperature is calculated by the main body 42. Although the ultrasonic sensor 41 has both a transmitting function and a receiving function in this embodiment, the same effect can be obtained by using two separate sensors.

第10図は、構造物の場合の温度とピーク周波数の関係
を示すグラフである。この場合の超音波信号周波数は5
MHz、周辺温度は500℃である。第10図において
は、測定対象45の温度が上昇するにつれてピーク周波
数が上昇する。
FIG. 10 is a graph showing the relationship between temperature and peak frequency in the case of a structure. The ultrasonic signal frequency in this case is 5
MHz, ambient temperature is 500 ° C. In FIG. 10, the peak frequency rises as the temperature of the measurement target 45 rises.

第11図は、構造物の場合の温度と半値幅の関係を示す
グラフである。同図においては、測定対象45の温度が
上昇するにつれて半値幅は狭くなる。この場合も、ピー
ク周波数および半値幅の両方を用いることで測定精度の
向上が図れる。なお、超音波信号周波数と周辺温度は第
10図の場合と同様である。
FIG. 11 is a graph showing the relationship between the temperature and the half-value width in the case of a structure. In the figure, the half-width narrows as the temperature of the measurement target 45 rises. Also in this case, the measurement accuracy can be improved by using both the peak frequency and the half width. The ultrasonic signal frequency and the ambient temperature are the same as in the case of FIG.

〔発明の効果〕〔The invention's effect〕

以上説明したように本発明は、外部から接近できない測
定対象に超音波を送信し、測定対象からの反射波を受信
し、受信した反射波を短い時間単位で周波数解析し、周
波数解析した受信波の周波数分布からピーク周波数と半
値幅を算出し、予め求めておいた温度対ピーク周波数、
温度対半値幅の関係から温度を求めるようにしたことに
より、外部から接近できない測定対象の温度を測定する
ことができる効果がある。
As described above, the present invention transmits an ultrasonic wave to a measurement target that is not accessible from the outside, receives a reflected wave from the measurement target, frequency-analyzes the received reflected wave in short time units, and receives the frequency-analyzed received wave. Calculate the peak frequency and half width from the frequency distribution of
By determining the temperature from the relationship between the temperature and the half-value width, there is an effect that the temperature of the measurement target that cannot be accessed from the outside can be measured.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明に係わる温度測定装置の一実施例を使用
して人体内部の温度を測定する方法を説明するための説
明図、第2図は第1図に示す温度測定用超音波装置本体
を示す系統図、第3図は第2図の温度測定用超音波装置
本体の動作を説明するためのフローチャート、第4図は
ピーク周波数と半値幅を示すグラフ、第5図はA/D変
換された受信波形をアナログ的に示す波形図、第6図は
受信波の切出し方法を説明するための波形図、第7図は
人体の場合の温度とピーク周波数の関係を示すグラフ、
第8図は人体の場合の温度と半値幅の関係を示すグラ
フ、第9図は本発明に係わる温度測定方法の一実施例を
説明するための説明図、第10図は構造物の場合の温度
とピーク周波数の関係を示すグラフ、第11図は構造物
の場合の温度と半値幅の関係を示すグラフ、第12図は
従来技術による人体内部の温度測定方法を説明するため
の説明図、第13図は従来技術による構造物内部の温度
測定方法を説明するための説明図である。 11……温度測定用超音波センサ、12……温度測定用
超音波装置本体、13……伝播経路、14……人体の胴
の断面、15……加熱用ヒータ、16……測定対象、2
1……超音波送受信回路、22……受信波A/D変換
部、23……信号処理部、24……ディスプレイ、25
……プリンタ。
FIG. 1 is an explanatory view for explaining a method of measuring the temperature inside a human body using an embodiment of the temperature measuring device according to the present invention, and FIG. 2 is an ultrasonic device for temperature measurement shown in FIG. A system diagram showing the main body, FIG. 3 is a flow chart for explaining the operation of the temperature measuring ultrasonic wave device main body of FIG. 2, FIG. 4 is a graph showing peak frequency and half width, and FIG. 5 is A / D. FIG. 6 is a waveform diagram showing the converted reception waveform in an analog manner, FIG. 6 is a waveform diagram for explaining the method of cutting out the reception wave, and FIG. 7 is a graph showing the relationship between the temperature and the peak frequency in the case of the human body,
FIG. 8 is a graph showing the relationship between the temperature and the half width in the case of a human body, FIG. 9 is an explanatory view for explaining an embodiment of the temperature measuring method according to the present invention, and FIG. 10 is a case of a structure. FIG. 11 is a graph showing the relationship between temperature and peak frequency, FIG. 11 is a graph showing the relationship between temperature and half width in the case of a structure, and FIG. 12 is an explanatory view for explaining a temperature measuring method inside a human body according to the prior art, FIG. 13 is an explanatory diagram for explaining a conventional method for measuring the temperature inside a structure. 11 ... Ultrasonic sensor for temperature measurement, 12 ... Ultrasonic device body for temperature measurement, 13 ... Propagation path, 14 ... Cross section of human body, 15 ... Heating heater, 16 ... Measurement object, 2
1 ... Ultrasonic wave transmitting / receiving circuit, 22 ... Received wave A / D conversion section, 23 ... Signal processing section, 24 ... Display, 25
...... Printer.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】外部から接近できない測定対象に超音波を
送信し、前記測定対象からの反射波を受信し、受信した
反射波を短い時間単位で周波数解析し、周波数解析した
受信波の周波数分布の特徴を表わすピーク周波数と半値
幅を用いて前記測定対象の温度を算出する温度測定方
法。
1. An ultrasonic wave is transmitted to a measurement target that is inaccessible from the outside, a reflected wave from the measurement target is received, the received reflected wave is frequency-analyzed in a short time unit, and the frequency distribution of the frequency-analyzed received wave is analyzed. The temperature measuring method for calculating the temperature of the measurement target using the peak frequency and the half-width representing the characteristics of the above.
【請求項2】超音波を送信し又受信する温度測定用超音
波センサと、超音波を送受信する超音波送受信回路と、
受信波をA/D変換する受信波A/D変換部と、信号処
理部とを備え、前記信号処理部は、前記A/D変換され
た受信波を短い時間に切り出して周波数解析し、周波数
解析した受信波の周波数分布からピーク周波数、半値幅
を算出し、予め求めておいた温度対ピーク周波数、温度
対半値幅の関係から温度を求める温度測定装置。
2. An ultrasonic sensor for temperature measurement, which transmits and receives ultrasonic waves, and an ultrasonic wave transmission / reception circuit which transmits / receives ultrasonic waves.
A reception wave A / D conversion unit that performs A / D conversion on the reception wave and a signal processing unit are provided, and the signal processing unit cuts out the reception wave that has been A / D converted in a short time and analyzes the frequency, A temperature measuring device that calculates a peak frequency and a half width from the analyzed frequency distribution of a received wave and obtains a temperature from a previously determined relationship between the temperature and the peak frequency and the half width.
JP63059301A 1988-03-15 1988-03-15 Temperature measuring method and device Expired - Fee Related JPH0650264B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63059301A JPH0650264B2 (en) 1988-03-15 1988-03-15 Temperature measuring method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63059301A JPH0650264B2 (en) 1988-03-15 1988-03-15 Temperature measuring method and device

Publications (2)

Publication Number Publication Date
JPH01233337A JPH01233337A (en) 1989-09-19
JPH0650264B2 true JPH0650264B2 (en) 1994-06-29

Family

ID=13109413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63059301A Expired - Fee Related JPH0650264B2 (en) 1988-03-15 1988-03-15 Temperature measuring method and device

Country Status (1)

Country Link
JP (1) JPH0650264B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE0203396D0 (en) * 2002-11-18 2002-11-18 Lars Sunnanvaeder Method and apparatus for non-invasive measurement of a temperature change inside a living body
JP2007178265A (en) * 2005-12-28 2007-07-12 Yamatake Corp Temperature measuring method and temperature measuring device
DE102008017426B4 (en) * 2008-04-03 2013-03-21 Gregor Brammer Method for determining the temperature at an interface of a cable or cable fitting
JP5434642B2 (en) * 2010-02-04 2014-03-05 富士通株式会社 Temperature signal transmitter and temperature information collection system
WO2024111261A1 (en) * 2022-11-21 2024-05-30 Jfeスチール株式会社 Temperature-measuring device and temperature-measuring method
EP4603603A4 (en) * 2022-11-21 2026-03-11 Jfe Steel Corp TEMPERATURE MEASURING DEVICE AND TEMPERATURE MEASURING METHOD

Also Published As

Publication number Publication date
JPH01233337A (en) 1989-09-19

Similar Documents

Publication Publication Date Title
EP0123427B1 (en) Ultrasonic medium characterization
EP0064399B1 (en) Ultrasonic measuring method
US4830015A (en) Method and system for measuring an ultrasound tissue characterization
EP0480554B1 (en) Ultrasonic densitometer device
EP0076168B1 (en) Medium characterization system using ultrasonic waves
US4936308A (en) Method and apparatus for measuring acoustic characteristics and temperature
EP0066343B1 (en) Method and apparatus for measuring ultrasonic attenuation characteristics
EP0146707B1 (en) Ultrasonic measurement method, and apparatus therefor
US6364837B1 (en) Contact digital ultrasonic densitometer
US4259870A (en) Doppler method of measuring flow
US4653505A (en) System and method for measuring sound velocity of tissue in an object being investigated
JPS61109555A (en) Method for determining skin phase frequency of ultrasonic pulse echo and skin phase frequency calculation apparatus
US4621645A (en) Method of estimating tissue attenuation using wideband ultrasonic pulse and apparatus for use therein
JPH0650264B2 (en) Temperature measuring method and device
JP2001343365A (en) Method of measuring thickness resonance spectrum of metal sheet and method of measuring electromagnetic ultrasonic wave of metal sheet
JPH048746B2 (en)
JP2001116733A (en) Ultrasonic sensor and material-measuring apparatus
US7942819B2 (en) Ultrasonic bone evaluation apparatus
Douville et al. Critical evaluation of continuous‐wave Doppler probes for carotid studies
US20060241436A1 (en) Method and apparatus for non-invasive measurement of a temperature change inside a living body
US4546772A (en) Method and means for determining ultrasonic wave attenuation in tissue using phase locked loop
JP4745871B2 (en) Ultrasonic tissue evaluation apparatus and ultrasonic tissue evaluation method
GB2188420A (en) Ultrasonic range finding
JPH02116745A (en) Ultrasonic solution density measuring apparatus
KR100642274B1 (en) Ultrasonic Beam Characteristic Analysis Device of Temperature Sensing Method Using Array Thermocouple

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees